Connector combination

Abstract

The utility model discloses a connector combination. The connector combination comprises a circuit board; the electric connector is mounted on the circuit board; the chip module is arranged on the electric connector; the sealing cover is arranged above the circuit board, the sealing cover comprises a containing space with a downward opening, a top plate formed above the containing space, a window penetrating through the top plate to be communicated with the containing space and the outside and an enclosing wall formed around the containing space, and the electric connector and the chip module are located in the containing space; defining the part, exposed out of the window, of the chip module as a heat dissipation part; compared with the prior art, in an immersed liquid cooling environment, the connector combination not only ensures good sealing performance, but also enables the heat dissipation part to be in direct contact with cooling liquid, so that the heat dissipation effect is improved, and the service life of the connector combination is prolonged. And a large amount of heat generated by the chip module during operation can be quickly taken away.

Description

[Technical field]

[0001] The utility model relates to a connector combination, in particular to a connector combination with good sealing performance and good heat dissipation performance in an immersion liquid cooling environment. [Background technology]

[0002] An immersion liquid-cooled connector assembly is currently provided, which includes a circuit board, a packaging cover, a first seal, a substrate, a connector, a chip, a heat sink, a first heat-conducting layer, and a second heat-conducting layer, wherein the connector is mounted on the circuit board. The packaging cover includes a cover plate and a side plate of a tubular structure, the cover plate and the circuit board are spaced apart up and down, the side plate is arranged between the cover plate and the circuit board, the top of the side plate is connected to the periphery of the cover plate, in the up and down direction, the first sealing member is located between the side plate and the circuit board, the packaging cover, the first sealing member and the circuit board form a first sealed cavity, the chip is located in the first sealed cavity and is arranged on the side of the substrate away from the circuit board, the connector is located in the first sealed cavity and connects the chip and the circuit board, the radiator is installed above the cover plate, the first heat-conducting layer is arranged between the inner surface of the cover plate and the chip, and the second heat-conducting layer is arranged between the outer surface of the cover plate and the radiator, when the connector assembly is immersed in coolant, the heat of the chip is conducted to the packaging cover through the first heat-conducting layer and then to the radiator through the second heat-conducting layer, so that the chip dissipates heat.

[0003] Since the heat of the chip is conducted to the packaging cover through the first heat-conducting layer and then to the heat sink through the second heat-conducting layer to dissipate the heat of the chip, the heat dissipation path of the chip becomes longer, the heat of the chip cannot be reduced quickly, and the chip is easily damaged.

[0004] Therefore, it is necessary to design a new connector combination to overcome the above-mentioned defects. [Contents of the utility model]

[0005] The invention aims to provide a connector combination with good sealing performance and heat dissipation performance in an immersion liquid cooling environment, so as to quickly take away a large amount of heat generated by a chip module during operation.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A connector combination, comprising: a circuit board; an electrical connector mounted on the circuit board; a chip module arranged on the electrical connector; a sealing cover arranged above the circuit board, the sealing cover comprising a accommodating space with an opening facing downward, a top plate formed above the accommodating space, a window penetrating the top plate and communicating with the accommodating space and the outside, and a wall formed around the accommodating space, the electrical connector and the chip module are located in the accommodating space, and the portion of the chip module exposed upward from the window is defined as a heat dissipation portion for heat dissipation; a first sealing ring sealing the gap between the wall and the circuit board; a second sealing ring surrounding the heat dissipation portion and sealing the gap between the top plate and the chip module.

[0008] Furthermore, the top plate has a stopper portion arranged around the window, and the second sealing ring is sleeved on the periphery of the stopper portion.

[0009] Furthermore, the stopping portion contacts the chip module downwardly.

[0010] Furthermore, the top plate has a raised portion arranged around the stopping portion, the raised portion and the stopping portion are spaced apart to form a receiving groove with an opening facing downward, the second sealing ring is received in the receiving groove, and the bottom surface of the raised portion is arranged higher than the bottom surface of the stopping portion.

[0011] Furthermore, a receiving groove is formed upwardly from the surrounding wall surface toward the bottom surface of the circuit board, and the first sealing ring is received in the receiving groove.

[0012] Furthermore, the enclosure is provided with a receiving groove with an opening facing downward and a blocking portion surrounding the receiving groove, the receiving groove is inwardly connected with the receiving space, the first sealing ring is accommodated in the receiving groove, and the connector assembly further includes a base plate installed on the circuit board and arranged on the outside of the electrical connector, the bottom of the blocking portion is arranged higher than the lower surface of the base plate, there is a gap between the inner side wall of the enclosure and the base plate, and the first sealing ring portion protrudes inward to just below the gap.

[0013] Furthermore, the sealing cover is provided with a plurality of mounting holes, the mounting holes penetrate the top plate up and down and are connected with the accommodating space, the connector combination further comprises a plurality of locking pieces, a bottom plate and a clamping piece for carrying the chip module and installing it on the electrical connector, the bottom plate is mounted on the circuit board and is arranged on the outside of the electrical connector, the locking pieces are arranged corresponding to the mounting holes, the locking pieces fix the sealing cover to the bottom plate, and in the up and down directions, the clamping piece is provided with a positioning hole for the locking piece to pass through.

[0014] Furthermore, the connector assembly further includes a plurality of sealing rings arranged corresponding to the plurality of locking elements, the sealing rings are sleeved on the corresponding locking elements, and the sealing rings seal the gap between the locking elements and the mounting holes in the up and down directions.

[0015] Furthermore, the sealing cover has a detection hole, the connector assembly includes a plug, the detection hole connects the accommodating space with the outside, the plug is correspondingly installed in the detection hole, and the detection hole is used to detect the airtightness of the sealing cover.

[0016] Furthermore, the connector assembly further comprises a closed ring, which is sleeved on the plug and seals the gap between the plug and the detection hole.

[0017] Compared with the prior art, the connector assembly of the utility model has the following beneficial effects:

[0018] The top plate of the sealing cover is provided with a window exposing the heat dissipation part of the chip module, the first sealing ring seals the gap between the wall and the circuit board, the second sealing ring surrounds the heat dissipation part and seals the gap between the top plate and the chip module. Compared with the prior art, in an immersion liquid cooling environment, the connector combination not only ensures good sealing performance, but also the heat dissipation part is in direct contact with the coolant, quickly taking away a large amount of heat generated by the chip module during operation.

Brief Description of the Drawings

[0019] Figure 1 It is a three-dimensional exploded view of the connector assembly of the utility model;

[0020] Figure 2 for Figure 1 Assembled stereogram;

[0021] Figure 3 for Figure 2 A perspective view of the sealing cover, the sealing ring and the plug after assembly;

[0022] Figure 4 for Figure 1 A three-dimensional view showing only the sealing cover, the first sealing ring and the second sealing ring at another angle;

[0023] Figure 5 for Figure 2 A top view of

[0024] Figure 6 for Figure 5 Section view along line AA;

[0025] Figure 7 for Figure 6A partial enlarged view of B in the middle;

[0026] Figure 8 for Figure 5 Cross-sectional view taken along line CC.

[0027] Description of the accompanying drawings for the specific implementation:

[0028] Connector combination 100 Circuit board 10 Electrical connector 11 Bottom plate 12 Cover 13 Opening 131 Clamp 14 Center hole 141 Positioning hole 142 Chip module 15 Base 151 Extension 152 Heat dissipation unit 1521 Sealing cover 16 Accommodation space 161 Top plate 162 Stopper 1621 Elevation 1622 Storage tank 1623 Window 163 Wall 164 Receiving slot 1641 Blocking part 1642 Mounting holes 165 Detection hole 166 First sealing ring 17 Second sealing ring 18 Locking parts 19 Nut 191 Bolt 192 Ring 20 Sealing ring 21 Plug 22 Packaging ring 23 Locking parts 24 Confined SpaceQ [Specific implementation method]

[0029] In order to facilitate a better understanding of the purpose, structure, features and functions of the present invention, the present invention is further described in conjunction with the accompanying drawings and specific implementation methods.

[0030] For ease of understanding, the Z-axis extension direction is defined as the up-down direction (where the positive direction of the Z-axis is the upward direction), the Y-axis extension direction is defined as the left-right direction (where the positive direction of the Y-axis is the right direction), and the X-axis extension direction is defined as the front-back direction (where the positive direction of the X-axis is the forward direction).

[0031] like Figures 1 to 8 As shown, it is a related drawing of the connector assembly 100 of the utility model, and the connector assembly 100 includes a circuit board 10, an electrical connector 11, a base plate 12, a cover plate 13, a clamp 14 and a chip module 15. The electrical connector 11 is installed on the circuit board 10, and the base plate 12 is arranged around the electrical connector 11. The base plate 12 is installed on the circuit board 10 and is fixed to a back plate (not numbered) arranged on the bottom side of the circuit board 10. The cover plate 13 is pivotally connected to one end of the base plate 12. The clamp 14 is used to carry the chip module 15 and is arranged on the electrical connector 11. The clamp 14 is located below the cover plate 13, and the chip module 15 is electrically connected to the circuit board 10 through the electrical connector 11.

[0032] like Figure 1 and Figure 3 As shown, the cover plate 13 switches between an open state and a closed state relative to the electrical connector 11. In this embodiment, the front end of the cover plate 13 is pivotally connected to the front end of the bottom plate 12. The cover plate 13 is provided with an opening 131. When the cover plate 13 is in the closed state, the chip module 15 partially protrudes upward into the opening 131.

[0033] like Figure 1 and Figure 6As shown, the clamping member 14 has a central hole 141 and a plurality of positioning holes 142 arranged around the central hole 141. The central hole 141 passes through the clamping member 14 from top to bottom. In this embodiment, the plurality of positioning holes 142 are arranged at the front and rear opposite ends of the clamping member 14. The chip module 15 partially protrudes upward from the clamping member 14 through the central hole 141, and the other part of the chip module 15 is installed under the clamping member 14 and is hooked by a hook structure (not numbered) on the clamping member 14.

[0034] like Figure 1 and Figure 6 As shown, the chip module 15 includes a base 151, which is installed below the clamp 14 and is hooked by a hook structure (not numbered) on the clamp 14. The base 151 extends upward from the approximate middle portion to form an extension portion 152, and the extension portion 152 protrudes upward from the clamp 14 through the center hole 141.

[0035] like Figure 1 , Figure 4 and Figure 6 As shown, the connector assembly 100 also includes a sealing cover 16 and a first sealing ring 17 and a second sealing ring 18 used in conjunction with the sealing cover 16, the sealing cover 16 includes a accommodating space 161 with an opening facing downward, a top plate 162 formed above the accommodating space 161, a window 163 that passes through the top plate 162 and communicates with the accommodating space 161 and the outside world, and a wall 164 formed around the accommodating space 161.

[0036] like Figure 4 , Figure 6 and Figure 7 As shown, the top plate 162 has a stopping portion 1621 arranged around the window 163 and a raised portion 1622 arranged around the stopping portion 1621, the raised portion 1622 and the stopping portion 1621 are spaced apart to form a receiving groove 1623 with an opening facing downward, the receiving groove 1641 is used to receive the second sealing ring 18, the bottom surface of the raised portion 1622 is higher than the bottom surface of the stopping portion 1621, and the bottom surface of the stopping portion 1621 and the bottom surface of the raised portion 1622 are both planar structures. In the present embodiment, the stopping portion 1621 is arranged adjacent to the window 163.

[0037] like Figure 4 , Figure 6 and Figure 7As shown, the surrounding wall 164 is provided with a receiving groove 1641 with an opening facing downward and a blocking portion 1642 surrounding the receiving groove 1641. The receiving groove 1641 is inwardly connected to the receiving space 161. The receiving groove 1641 is used to accommodate the first sealing ring 17. There is a gap between the inner wall of the surrounding wall 164 and the blocking portion 1642. The bottom of the blocking portion 1642 is higher than the lower surface of the bottom plate 12.

[0038] like Figure 1 , Figure 4 and Figure 8 As shown, the sealing cover 16 is further provided with a plurality of mounting holes 165 and a detection hole 166, and the mounting holes 165 and the detection hole 166 both penetrate the top plate 162 from top to bottom and are in communication with the accommodating space 161. In this embodiment, the number of the mounting holes 165 is the same as the number of the positioning holes 142, both of which are set to four. The four mounting holes 165 are set in pairs at the front and rear ends of the top plate 162, and the detection hole 166 is set adjacent to one of the mounting holes 165. In other embodiments, the detection hole 166 can be set at other positions, such as at the enclosure 164, and the mounting holes 165 can be set in the required number according to needs.

[0039] like Figure 1 , Figure 6 and Figure 8 As shown, the connector assembly 100 further includes a plurality of locking members 19, a plurality of collars 20, a plurality of sealing rings 21, a plug 22, a packaging ring 23 and a plurality of fasteners 24. The plurality of locking members 19 are used in conjunction with the plurality of collars 20 and the plurality of sealing rings 21, so the number of the three is the same. The packaging ring 23 is used in conjunction with the plug 22, that is, the packaging ring 23 is sleeved on the outside of the plug 22.

[0040] like Figure 1 , Figure 3 and Figure 6 As shown, a plurality of the locking members 19 and a plurality of the fasteners 24 are arranged around the electrical connector 11. In the present embodiment, four locking members 19 are provided, and two are arranged on the front and rear outer sides of the electrical connector 11. Each of the locking members 19 includes a nut 191 and a bolt 192 which are threadedly matched with each other. The nut 191 is fixed to the base plate 12, and the bolt 192 is located above the base plate 12. The bolt 192 is sequentially sleeved with a collar 20 and a sealing ring 21 from the inside to the outside. There are three fasteners 24, two of which are provided on the front side of the electrical connector 11, and one fastener 24 is provided on the rear side thereof, so as to fix the cover plate 13 and the base plate 12 together.

[0041] like Figure 3 , Figure 6 and Figure 7 As shown, when the operator holds the clamping member 14 carrying the chip module 15 and installs it downward on the electrical connector 11, the nut 191 fixed to the bottom plate 12 is aligned with the positioning hole 142, and the nut 191 protrudes upward into the corresponding positioning hole 142, so that the chip module 15 and the electrical connector 11 are positioned; then the cover plate 13 is placed on the chip module 15 in a covering state; then the ring 20 with the sealing ring 21 is installed from bottom to top correspondingly. The mounting holes 165 are provided, and the first sealing ring 17 is mounted on the receiving groove 1641 and the second sealing ring 18 is mounted on the receiving groove 1623, and then the sealing cover 16 is mounted on the circuit board 10, and the plurality of mounting holes 165 are aligned downwardly with the plurality of bolts 192 one by one, the electrical connector 11 and the bottom plate 12 are located in the receiving space 161, and the portion of the chip module 15 exposed upward from the window 163 is defined as a heat dissipation portion 1521 for heat dissipation, and the first sealing ring 17 is surrounded by Outside the bottom plate 12, there is a gap (not numbered) between the inner side wall of the surrounding wall 164 and the bottom plate 12; finally, the bolt 192 is inserted downward from the top of the sealing cover 16 into the corresponding mounting hole 165, so that the collar 20 is sleeved outside the bolt 192, and the bolt 192 is rotated to make the bolt 192 and the corresponding nut 191 threadedly connected, and the sealing cover 16 is driven to move downward, so that the first sealing ring 17 is pressed downward by the surrounding wall 164, and the first sealing ring 17 is expanded horizontally outward. , so that the first sealing ring 17 seals the gap between the wall 164 and the circuit board 10, and the first sealing ring 17 partially protrudes inward to just below the interval, and drives the stopping portion 1621 to move downward to contact the chip module 15, the second sealing ring 18 is pressed down by the top plate 162, the second sealing ring 18 abuts against the extension portion 152 and surrounds the heat dissipation portion 1521, and the second sealing ring 18 expands horizontally outward to seal the gap between the top plate 162 and the extension portion 152.

[0042] like Figure 6 and Figure 7As shown, by providing the first sealing ring 17, the second sealing ring 18, the sealing ring 21 and the packaging ring 23, the gap generated on the sealing cover 16 itself and the gap generated between the sealing cover 16 and the chip module 15 and the circuit board 10 are sealed, so that a closed space Q is formed between the sealing cover 16 and the chip module 15 and the circuit board 10, and the part of the electrical connector 11 connecting the chip module 15 and the circuit board 10 is located in the closed space Q, and in an immersion liquid cooling environment, the heat dissipation part 1521 is in contact with a coolant (not shown) outside the closed space Q.

[0043] like Figure 2 and Figure 8 As shown, the operator can detect the airtightness of the sealing cover 16 by operating the detection hole 166, such as injecting non-colored gas into the enclosed space Q through the detection hole 166 for detection. When it is detected that there is no non-colored gas leakage to the outside, it can be known that the sealing cover 16 has good sealing performance. Then the plug 22 with the packaging ring 23 is installed on the detection hole 166 to seal the detection hole 166. When it is detected that non-colored gas is leaking to the outside, the operator can detect which specific position has non-compliance with the sealing performance from the place where the non-colored gas is leaking to the outside, and make adjustments or replace components.

[0044] In other embodiments, the ring 20 does not need to be sleeved outside the locking piece 19, and the sealing ring 21 can be directly sleeved outside the bolt 192, or the sealing ring 21 can be omitted, and a waterproof filling glue (not shown) is used to fill the gap between the ring 20 and the mounting hole 165, or the sealing ring 21 and the ring 20 are not provided, and a waterproof filling glue (not shown) is used to fill the gap between the bolt 192 and the mounting hole 165; the detection hole 166 can also be provided on the wall 164, and the detection hole 166 can horizontally penetrate the wall 164 and be connected to the accommodating space 161; the cover plate 13 can also be omitted, and only the sealing cover 16 is used to cover the chip module 15.

[0045] In summary, the connector assembly of the utility model has the following beneficial effects:

[0046] (1) Compared with the prior art, the top plate 162 of the sealing cover 16 of the utility model is provided with the window 163 for exposing the heat dissipation portion 1521 of the chip module 15, the first sealing ring 17 seals the gap between the wall 164 and the circuit board 10, and the second sealing ring 18 surrounds the heat dissipation portion 1521 and seals the gap between the top plate 162 and the chip module 15. In an immersion liquid cooling environment, the connector assembly 100 not only ensures good sealing performance, but also the heat dissipation portion 1521 is in direct contact with the coolant, which quickly takes away a large amount of heat generated by the chip module 15 during operation.

[0047] (2) By providing the first sealing ring 17, the second sealing ring 18, the sealing ring 21 and the packaging ring 23, the gaps generated on the sealing cover 16 itself and the gaps generated between the sealing cover 16 and the chip module 15 and the circuit board 10 are sealed, so that the enclosed space Q is formed between the sealing cover 16 and the chip module 15 and the circuit board 10. The portion of the electrical connector 11 connecting the chip module 15 and the circuit board 10 is located in the enclosed space Q, which isolates the coolant from entering, thereby ensuring the connection stability between the electrical connector 11 and the chip module 15 and the circuit board 10.

[0048] (3) The stopping portion 1621 is arranged around the window 163, and the second sealing ring 18 is arranged around the periphery of the stopping portion, so as to prevent the coolant from penetrating through the gap between the stopping portion 1621 and the extending portion 152 and entering the enclosed space Q; further, the stopping portion 1621 contacts the chip module 15 downward, and before the second sealing ring 18, the stopping portion 1621 stops the coolant first.

[0049] (4) The raised portion 1622 is arranged around the stopping portion 1621, and the raised portion 1622 and the stopping portion 1621 are spaced apart to form the receiving groove 1623 with the opening facing downward, the second sealing ring 18 is received in the receiving groove 1623, and the bottom surface of the raised portion 1622 is higher than the bottom surface of the stopping portion 1621. The stopping portion 1621 can be used as a reference to position the chip module 15, which can reduce the manufacturing difficulty of forming a relatively large surface as a reference during injection molding of the sealing cover 16 in the process, and at the same time save the material cost of making the sealing cover 16.

[0050] (5) The bottom of the blocking portion 1642 is arranged higher than the lower surface of the bottom plate 12, thereby preventing the bottom plate 12 from being installed on the circuit board 10 and fixed to the back plate arranged on the bottom side of the circuit board 10, so that the circuit board 10 will be arched to a certain extent and the blocking portion 1642 will interfere with the circuit board 10; further, the bottom plate 12 and the blocking portion 1642 are respectively located on the inner and outer sides of the first sealing ring 17 and there is a gap between the inner side wall of the wall 164 and the bottom plate 12, and the first sealing ring 17 partially protrudes inward to just below the gap to limit the first sealing ring 17 to prevent it from excessively expanding outward. At the same time, the first sealing ring 17 enters the gap due to the expansion, thereby ensuring the sealing of the enclosed space Q.

[0051] (6) When the clamping member 14 is installed downwardly on the electrical connector 11, the nut 191 fixed to the base plate 12 is aligned with the positioning hole 142, and the nut 191 protrudes upward into the corresponding positioning hole 142, and the mounting hole 165 is aligned with the nut 191. The bolt 192 passes through the mounting hole 165 and is threadedly engaged with the nut 191 to fix the sealing cover 16 while achieving the positioning of the chip module 15 and the electrical connector 11, thereby achieving a dual-purpose effect of one lock, saving installation space, and being quick and convenient.

Claims

1. A connector assembly, characterized in that: include: a circuit board; an electrical connector mounted on the circuit board; a chip module, disposed on the electrical connector; a sealing cover, arranged above the circuit board, the sealing cover comprising a accommodating space with an opening facing downward, a top plate formed above the accommodating space, a window penetrating the top plate and communicating with the accommodating space and the outside, and a wall formed around the accommodating space, the electrical connector and the chip module are located in the accommodating space, and a portion of the chip module exposed upward from the window is defined as a heat dissipation portion for heat dissipation; a first sealing ring, sealing the gap between the enclosure and the circuit board; A second sealing ring surrounds the heat dissipation portion and seals the gap between the top plate and the chip module.

2. The connector assembly according to claim 1, characterized in that: The top plate has a stopper portion arranged around the window, and the second sealing ring is sleeved on the periphery of the stopper portion.

3. The connector assembly according to claim 2, characterized in that: The stopping portion contacts the chip module downward.

4. The connector assembly according to claim 2 or 3, characterized in that: The top plate has a raised portion arranged around the stop portion, the raised portion and the stop portion are spaced apart to form a receiving groove with an opening facing downward, the second sealing ring is received in the receiving groove, and the bottom surface of the raised portion is arranged higher than the bottom surface of the stop portion.

5. The connector assembly according to claim 1, wherein: A receiving groove is formed from the surrounding wall surface toward the bottom surface of the circuit board, and the first sealing ring is received in the receiving groove.

6. The connector assembly according to claim 1, characterized in that: The enclosure is provided with a receiving groove with an opening facing downward and a blocking portion surrounding the receiving groove, the receiving groove is inwardly connected to the receiving space, the first sealing ring is accommodated in the receiving groove, the connector assembly further includes a base plate installed on the circuit board and arranged on the outside of the electrical connector, the bottom of the blocking portion is arranged higher than the lower surface of the base plate, there is a gap between the inner side wall of the enclosure and the base plate, and the first sealing ring portion protrudes inward to just below the gap.

7. The connector assembly according to claim 1, characterized in that: The sealing cover is provided with a plurality of mounting holes, and the mounting holes penetrate the top plate up and down and communicate with the accommodating space. The connector assembly further comprises a plurality of locking pieces, a bottom plate and a clamping piece for carrying the chip module and installing it on the electrical connector. The bottom plate is mounted on the circuit board and arranged on the outside of the electrical connector. The locking pieces are arranged corresponding to the mounting holes. The locking pieces fix the sealing cover to the bottom plate. In the up and down directions, the clamping piece is provided with a positioning hole for the locking pieces to pass through.

8. The connector assembly according to claim 7, characterized in that: The connector assembly further includes a plurality of sealing rings arranged corresponding to the plurality of locking elements, wherein the sealing rings are sleeved on the corresponding locking elements, and the sealing rings seal the gaps between the locking elements and the mounting holes in the up and down directions.

9. The connector assembly according to claim 1, characterized in that: The sealing cover has a detection hole, and the connector assembly includes a plug. The detection hole connects the accommodating space with the outside world. The plug is installed corresponding to the detection hole, and the detection hole is used to detect the air tightness of the sealing cover.

10. The connector assembly according to claim 9, characterized in that: The connector assembly further comprises a closed ring, which is sleeved on the plug and seals the gap between the plug and the detection hole.

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