Heat management optimization circuit board

Abstract

The utility model discloses a thermal management optimization circuit board, which comprises a substrate, a copper foil layer arranged on one side of the substrate, a heat dissipation plate embedded on the other side of the substrate, a plurality of refrigeration mechanisms arranged on the heat dissipation plate, a first air duct arranged on each refrigeration mechanism, a piezoelectric film arranged inside each first air duct, and an electromagnetic coil arranged at an air inlet of each first air duct, and a first metal film is arranged on the other side of the electromagnetic coil. Therefore, the air flow and heat transfer process can be more flexibly and accurately controlled by utilizing the piezoelectric effect and electromagnetic control, and an excellent heat dissipation effect is achieved in a limited space.

Description

Technical Field

[0001] The utility model relates to the technical field of power electronics, in particular to a thermal management optimized circuit board. Background Art

[0002] Nowadays, efficient thermal management has become a key technical challenge in the design of electronic equipment. Traditional thermal management methods, such as adding heat sinks, using fans for forced convection, and liquid cooling, can alleviate the heat dissipation problem to a certain extent, but are often limited by factors such as volume, weight, energy consumption, and cost. Especially in the pursuit of lightweight and miniaturized modern electronic product design, these traditional solutions are stretched, especially for highly integrated circuit boards, where limited space further exacerbates the heat dissipation problem. Utility Model Content

[0003] The utility model aims to solve one of the technical problems in the above-mentioned technology at least to a certain extent.

[0004] To this end, one purpose of the utility model is to propose a thermal management optimized circuit board, which utilizes piezoelectric effect and electromagnetic control to more flexibly and accurately control the airflow and heat transfer process, and has an excellent heat dissipation effect in a limited space.

[0005] To achieve the above-mentioned objectives, the first aspect of the utility model proposes a thermal management optimized circuit board, comprising: a substrate, one side of the substrate is provided with a copper foil layer, the other side of the substrate is inlaid with a heat sink, the heat sink is provided with a plurality of refrigeration mechanisms, the refrigeration mechanism is provided with a first air duct, a piezoelectric film is provided inside the first air duct, an electromagnetic coil is provided at the air inlet of the first air duct, and a first metal film is provided on the other side of the electromagnetic coil.

[0006] According to the thermal management optimized circuit board of the embodiment of the utility model, on the one hand, it is possible to generate traveling waves on the surface of the piezoelectric film by connecting to alternating current, thereby promoting the air flow on the surface of the piezoelectric film and generating airflow; on the other hand, it is possible to generate a fixed polarity magnetic field by connecting to direct current, and to generate alternating polarity by connecting to the first metal film, so that the first metal film periodically blocks the air inlet of the first air duct, causing the airflow inside the first air duct to undergo isentropic expansion and cool down, thereby providing low-temperature airflow for the entire circuit board.

[0007] In addition, the thermal management optimized circuit board proposed in the above embodiment of the utility model may also have the following additional technical features:

[0008] In one embodiment of the present invention, the refrigeration mechanism is further provided with a second air duct, and the air outlet of the first air duct is communicated with the second air duct.

[0009] In one embodiment of the utility model, the refrigeration mechanism is further provided with a third air duct, the air inlet and the air outlet of the third air duct are both provided with a second metal film, the two opposite sides of the second metal films are both provided with piezoelectric ceramics, and the air outlet of the third air duct is connected to the second air duct.

[0010] In one embodiment of the utility model, the refrigeration mechanism comprises: two first air ducts, a second air duct and a third air duct, wherein the second air duct is provided with four vents;

[0011] Two of the first air ducts are symmetrically arranged on both sides of the second air duct, the air outlets of the two first air ducts are connected to two of the four vents of the second air duct, and the third air duct is connected to one vent of the second air duct;

[0012] The remaining one vent of the second air duct is communicated with the remaining one vent of the second air duct in another refrigeration mechanism.

[0013] In an embodiment of the present invention, the first air duct is formed by splicing two cover plates, and the piezoelectric film is disposed on each of the two cover plates.

[0014] In an embodiment of the present invention, bases are provided at both ends of the first metal film.

[0015] In one embodiment of the present invention, the base on one end of the first metal film is conductive, and the base on the other end of the first metal film is non-conductive.

[0016] In an embodiment of the utility model, a plurality of via holes are arranged on the substrate, and alumina thermal conductive ceramics are arranged inside the via holes. The alumina thermal conductive ceramics are fixed inside the via holes by a thermal conductive potting glue.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0019] Figure 1 This is a schematic diagram of the structure of a thermal management optimized circuit board according to an embodiment of the utility model;

[0020] Figure 2 A schematic diagram of the structure of a cooling mechanism for a thermal management optimized circuit board according to an embodiment of the utility model Figure 1 ;

[0021] Figure 3 A schematic diagram of the structure of a cooling mechanism for a thermal management optimized circuit board according to an embodiment of the utility model Figure 2 ;

[0022] Figure 4 This is a schematic structural diagram of a first air duct of a thermal management optimized circuit board according to an embodiment of the utility model;

[0023] Figure 5 This is a working principle diagram of the first air duct of the thermal management optimization circuit board according to one embodiment of the utility model;

[0024] Figure 6 A cross-sectional view of a third air duct of a thermal management optimized circuit board according to an embodiment of the utility model;

[0025] As shown in the figure:

[0026] 1-Substrate;

[0027] 2- copper foil layer;

[0028] 3- heat sink;

[0029] 4- Refrigeration mechanism;

[0030] 41 - first air duct, 411 - piezoelectric film, 412 - electromagnetic coil, 413 - first metal film, 414 - cover plate, 415 - base;

[0031] 42- Second air duct;

[0032] 43 - third air duct, 431 - second metal film, 432 - piezoelectric ceramic. DETAILED DESCRIPTION

[0033] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0034] The thermal management optimized circuit board according to the embodiment of the utility model is described below with reference to the accompanying drawings.

[0035] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , pictures and Figure 6As shown, a thermal management optimized circuit board includes: a substrate 1, a copper foil layer 2 is provided on one side of the substrate 1, a heat sink 3 is inlaid on the other side of the substrate 1, a plurality of cooling mechanisms 4 are provided on the heat sink 3, the cooling mechanism 4 is provided with a first air duct 41, a piezoelectric film 411 is provided inside the first air duct 41, an electromagnetic coil 412 is provided at the air inlet of the first air duct 41, and a first metal film 413 is provided on the other side of the electromagnetic coil 412.

[0036] The refrigeration mechanism 4 is further provided with a second air duct 42 , and the air outlet of the first air duct 41 is in communication with the second air duct 42 .

[0037] The refrigeration mechanism 4 is also provided with a third air duct 43 , the air inlet and the air outlet of the third air duct 43 are both provided with a second metal film 431 , the opposite sides of the two second metal films 431 are both provided with piezoelectric ceramics 432 , and the air outlet of the third air duct 43 is connected to the second air duct 42 .

[0038] The refrigeration mechanism 4 comprises: two first air ducts 41, a second air duct 42 and a third air duct 43, wherein the second air duct 42 is provided with four vents;

[0039] The two first air ducts 41 are symmetrically arranged on both sides of the second air duct 42, the air outlets of the two first air ducts 41 are connected to two of the four vents of the second air duct 42, and the third air duct 43 is connected to one vent of the second air duct 42;

[0040] The remaining one vent of the second air duct 42 is communicated with the remaining one vent of the second air duct 42 in another refrigeration mechanism 4 .

[0041] The first air duct 41 is formed by splicing two cover plates 414 , and a piezoelectric film 411 is disposed on each of the two cover plates 414 .

[0042] Bases 415 are disposed at both ends of the first metal film 413 .

[0043] The base 415 on one end of the first metal film 413 is conductive, and the base 415 on the other end of the first metal film 413 is non-conductive.

[0044] A plurality of via holes are arranged on the substrate 1 , and alumina thermal conductive ceramics are arranged inside the via holes. The alumina thermal conductive ceramics are fixed inside the via holes by a thermal conductive potting glue.

[0045] In the embodiment of the utility model, on the one hand, by connecting to alternating current, traveling wave II can be generated on the surface of the piezoelectric film 411, thereby promoting the air flow on the surface of the piezoelectric film 411 and generating airflow I; on the other hand, by connecting to direct current, the electromagnetic coil 412 can generate a fixed polarity magnetic field, and by connecting to alternating current, the first metal film 413 can generate alternating polarity, so that the first metal film 413 periodically blocks the air inlet of the first air duct 41, causing the airflow inside the first air duct 41 to undergo isentropic expansion and cool down, thereby providing low-temperature airflow for the entire circuit board.

[0046] Specifically, the relevant staff connected the piezoelectric film 411 and the first metal film 413 to alternating current, the alternating current satisfied the traveling wave equation, and the electromagnetic coil 412 was connected to direct current;

[0047] At this time, the surface of the piezoelectric film 411 generates traveling wave II, thereby driving the air flow on the surface of the piezoelectric film 411 and generating airflow I. At the same time, the polarity of the first metal film 413 changes periodically, thereby periodically closing and moving away from the air inlet of the first air duct 41.

[0048] When the first metal film 413 closes the air inlet of the first air duct 41, the air on the surface of the piezoelectric film 411 flows and generates airflow I, which will be discharged from the air outlet of the first air duct 41 under the action of inertia. At this time, the gas inside the first air duct 41 undergoes isentropic expansion and cools down. When the first metal film 413 is away from the air inlet of the first air duct 41, the external air enters the interior along the air inlet of the first air duct 41, and reciprocates in sequence.

[0049] It should be noted that the use of the second air duct 42 and the third air duct 43 can better control the flow direction of the low-temperature airflow. The relevant staff connects the two piezoelectric ceramics 432 in the third air duct 43 to alternating current with opposite polarity. At this time, the two piezoelectric ceramics 432 make periodic movements of approaching and moving away from each other. In this process, the two piezoelectric ceramics 432 continuously inhale air from the air inlet of the third air duct 43 and push the low-temperature airflow through the entire heat sink through the air outlet of the third air duct 43.

[0050] In addition, it should be noted that when the first metal film 413 is connected to AC power, any one of the two poles of the AC power source is connected to one of the two conductive bases 415, and the other of the two poles of the AC power source is grounded.

[0051] In summary, the thermal management optimized circuit board according to the embodiment of the utility model can more flexibly and accurately control the airflow and heat transfer process by using the piezoelectric effect and electromagnetic control, and has an excellent heat dissipation effect in a limited space.

[0052] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0053] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0054] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0055] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0056] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0057] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A thermal management optimized circuit board, characterized in that: include: A substrate (1), wherein a copper foil layer (2) is provided on one side of the substrate (1), a heat sink (3) is embedded on the other side of the substrate (1), a plurality of refrigeration mechanisms (4) are provided on the heat sink (3), the refrigeration mechanism (4) is provided with a first air duct (41), a piezoelectric film (411) is provided inside the first air duct (41), an electromagnetic coil (412) is provided at the air inlet of the first air duct (41), and a first metal film (413) is provided on the other side of the electromagnetic coil (412).

2. The thermal management optimized circuit board according to claim 1, characterized in that: The refrigeration mechanism (4) is also provided with a second air duct (42), and the air outlet of the first air duct (41) is connected to the second air duct (42).

3. The thermal management optimized circuit board according to claim 2, characterized in that: The refrigeration mechanism (4) is also provided with a third air duct (43); the air inlet and the air outlet of the third air duct (43) are both provided with a second metal film (431); the opposite sides of the two second metal films (431) are both provided with piezoelectric ceramics (432); and the air outlet of the third air duct (43) is connected to the second air duct (42).

4. The thermal management optimized circuit board according to claim 3, characterized in that: The refrigeration mechanism (4) comprises: two first air ducts (41), a second air duct (42) and a third air duct (43), wherein the second air duct (42) is provided with four ventilation openings; Two of the first air ducts (41) are symmetrically arranged on both sides of the second air duct (42), the air outlets of the two first air ducts (41) are connected to two of the four ventilation holes of the second air duct (42), and the third air duct (43) is connected to one ventilation hole of the second air duct (42); The remaining ventilation opening of the second air duct (42) is in communication with the remaining ventilation opening of the second air duct (42) in another refrigeration mechanism (4).

5. The thermal management optimized circuit board according to claim 4, characterized in that: The first air duct (41) is formed by splicing two cover plates (414), and the piezoelectric film (411) is arranged on each of the two cover plates (414).

6. The thermal management optimized circuit board according to claim 1, characterized in that: Bases (415) are provided at both ends of the first metal film (413).

7. The thermal management optimized circuit board according to claim 6, characterized in that: The base (415) on one end of the first metal film (413) is conductive, and the base (415) on the other end of the first metal film (413) is non-conductive.

8. The thermal management optimized circuit board according to claim 1, characterized in that: The substrate (1) is provided with a plurality of via holes, and alumina thermally conductive ceramics are provided inside the via holes, and the alumina thermally conductive ceramics are fixed inside the via holes by means of a thermally conductive potting glue.

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