Protective PCB substrate

By designing a protective structure on the double-layer PCB substrate, including connectors, protective frames and rubber pads, the problem of insufficient protection of the double-layer PCB substrate is solved, effectively protecting the sides and corners of the substrate body, and providing buffering when impacted to reduce the failure rate.

CN222869226UActive Publication Date: 2025-05-13CHENGRUI CIRCUIT CO LTD
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Patent Information

Application Number
CN202421376443.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-17
Publication Date
2025-05-13
Estimated Expiration
2034-06-17

AI Technical Summary

Technical Problem

When the double-layer PCB substrate is connected through the connecting column, it is insufficiently protected and is easily invaded by collision, scratches, dust and moisture, resulting in short circuits, corrosion or functional failure. When vibration, impact or fall, the edges and corners are easily damaged, resulting in failure.

Method used

A protective PCB substrate is designed, by providing connecting parts at four corners of the substrate main body, including columns, nut sleeves and rubber pads, and opening grooves in the middle of the side of the substrate main body to set up a connecting plate; at the same time, a protective frame is set on both sides of the substrate main body, and a fastener is connected to the connecting plate to form a detachable protective structure.

Benefits of technology

By setting up a protective frame and a rubber pad, the sides and corners of the substrate body are effectively protected, and the invasion of dust and moisture is reduced. When vibration, impact or fall, the energy absorption effect of the rubber pad provides buffering and reduces the failure rate.

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Abstract

The utility model discloses a protective PCB substrate, which comprises substrate main bodies, connecting pieces, connecting plates, protective frames and buckling pieces, and is characterized in that four corners of the two substrate main bodies are respectively erected and connected through the connecting pieces with a buffering function; grooves are formed in the middles of the side edges of the two base plate bodies respectively, and the connecting plates are arranged in the grooves and connected with the two base plate bodies. The two protection frames are arranged on the two sides of the base plate body respectively and connected with the corresponding connecting plates in a clamped mode through the buckles respectively. The two sides and the corners of the base plate body of the double-layer structure can be protected through the detachable protection frames arranged on the two sides, damage to the side edges of the base plate body is reduced, in addition, when the base plate body of the double-layer structure is connected through the connecting pieces, the base plate body of the double-layer structure is vibrated or impacted or falls off, and therefore the base plate body of the double-layer structure can be protected. And energy is absorbed through the rubber pad, effective buffering is provided, impact on the substrate main body and components on the substrate main body is reduced, and the failure rate caused by the impact is reduced.
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Description

Technical Field

[0001] The utility model relates to the technical field of circuit board manufacturing, in particular to a protective PCB substrate. Background Art

[0002] PCB substrate, full name is printed circuit board substrate, is the basic material that constitutes the printed circuit board (PCB). It is one of the key components in manufacturing PCB and is responsible for carrying and interconnecting electronic components. PCB substrate is usually made of insulating material. Its core purpose is to provide physical support and realize the layout of the circuit, while ensuring the electrical connection between various electronic components.

[0003] In the related art, in designs that require stacking or overlapping double-layer circuit boards, two PCB substrates are usually connected using support columns. For example, this design is used in space-constrained electronic products, servers, data center equipment, or complex industrial control and automation systems.

[0004] However, there are some problems with the way that the double-layer PCB substrate is connected only by connecting columns. For example, the protection on both sides is insufficient. When the sides of the double-layer PCB substrate are hit, scratched, or invaded by dust and moisture, short circuits, corrosion, or functional failures may occur. In addition, when the double-layer PCB substrate is moved and subjected to vibration, impact, or falling, the corners of the double-layer PCB substrate are often the most vulnerable parts. However, due to insufficient buffering, the PCB substrate and the components thereon may be impacted, which may cause failures. Summary of the invention

[0005] The utility model aims to solve one of the technical problems in the above-mentioned technology at least to a certain extent.

[0006] To achieve the above-mentioned purpose, the first aspect of the utility model proposes a protective PCB substrate, comprising: a substrate body, a connector, a connecting plate, a protective frame and a snap-on member, wherein the four corners of the two substrate bodies are respectively connected by the connector; the connecting member comprises a column, a nut sleeve and a rubber pad, wherein the column is arranged on the substrate body at the bottom and vertically passes through the substrate body at the top; the rubber pad is sleeved on the column, and the two ends of the rubber pad are respectively abutted against the two substrate bodies; the nut sleeve is threadedly locked on the top of the column; grooves are respectively opened in the middle of the sides of the two substrate bodies, the connecting plate is arranged in the groove and connects the two substrate bodies; the two protective frames are respectively arranged on both sides of the substrate body, and are respectively snap-connected with the corresponding connecting plates through the snap-on member.

[0007] In addition, the protective PCB substrate proposed in the utility model may also have the following additional technical features:

[0008] As a further description of the above technical solution: the protection frame is a U-shaped frame, and the corners at both ends of the protection frame are respectively wrapped around the two corners on the same side of the substrate body.

[0009] The inner wall of the protection frame is coated with an antistatic coating.

[0010] Each of the connecting plates is provided with two upper and lower opposite slots, and the buckle comprises a buckle straight arm, a buckle foot and a limit block, wherein one end of the two buckle straight arms is respectively connected to the protective frame, and the other end passes through the corresponding buckle slot, and the buckle feet are respectively provided on the opposite sides of the ends of the two buckle straight arms; the limit blocks are respectively provided on the opposite sides of the two buckle straight arms to limit the depth of the buckle straight arms extending into the corresponding buckle slots.

[0011] The substrate body is provided with heat sinks or heat dissipation holes.

[0012] The height of the protection frame is greater than the distance between the two substrate bodies.

[0013] The two substrate bodies are electrically connected via a conductive path.

[0014] According to the protective PCB substrate of the utility model, the detachable protective frames arranged on both sides can protect the two sides and corners of the double-layer structure of the substrate body, reducing the impact, scratches, dust or moisture intrusion on the side of the substrate body. In addition, when the double-layer substrate body is connected by a connector, when the double-layer structure of the substrate body is vibrated, impacted or dropped, the rubber pad can absorb energy to provide effective buffering, reduce the impact on the substrate body and the components thereon, and reduce the failure rate caused by this.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0017] Figure 1 It is a schematic structural diagram of a protective PCB substrate according to an embodiment of the utility model;

[0018] Figure 2 This is a schematic diagram of the explosion structure of a protective PCB substrate according to an embodiment of the utility model;

[0019] Figure 3 It is a schematic diagram of a top view of a protective PCB substrate according to an embodiment of the utility model;

[0020] Figure 4 This is a schematic diagram of the AA cross-sectional structure of a protective PCB substrate according to an embodiment of the utility model;

[0021] Figure 5 It is a schematic diagram of the enlarged structure of a part B according to an embodiment of the utility model;

[0022] Figure 6 is a schematic structural diagram of a connecting piece according to an embodiment of the utility model;

[0023] Figure 7 It is a structural schematic diagram of a protective PCB substrate without a protective frame installed according to an embodiment of the utility model;

[0024] Figure 8 This is a schematic diagram of the connection structure of the protective frame and the buckle according to an embodiment of the utility model;

[0025] As shown in the figure:

[0026] 100, base plate body; 101, groove; 200, connector; 210, column; 220, nut sleeve; 230, rubber pad; 300, connecting plate; 301, slot; 400, protective frame; 500, buckle; 510, buckle straight arm; 520, buckle foot; 530, limit block. DETAILED DESCRIPTION

[0027] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0028] The protective PCB substrate of the embodiment of the utility model is described below with reference to the accompanying drawings.

[0029] like Figure 1 and Figure 2 As shown, the protective PCB substrate of the embodiment of the utility model may include a substrate body 100 , a connector 200 , a connecting plate 300 , a protective frame 400 and a buckle 500 .

[0030] The four corners of the two substrate bodies 100 are connected by connecting members 200 .

[0031] It should be noted that the two substrate bodies 100 are electrically connected via a conductive path, which is used to transmit signals or power between the two substrate bodies 100, thereby increasing the integration and functionality of the structure.

[0032] like Figure 6 As shown, the connecting member 200 includes a column 210 , a nut sleeve 220 and a rubber pad 230 .

[0033] Among them, the column 210 is set on the bottom substrate body 100 and vertically passes through the top substrate body 100 upward. The rubber pad 230 is sleeved on the column 210, and the two ends of the rubber pad 230 are respectively abutted against the two substrate bodies 100, and the nut sleeve 220 is threadedly locked on the top of the column 210.

[0034] It should be noted that a thread groove is provided at the top of the column 210. When the nut sleeve 220 is threadedly locked on the top of the column 210, the top substrate body 100 is pressed down by its own rotation, so that the top substrate body 100 is pressed tightly against the rubber pad 230, thereby achieving that the two ends of the rubber pad 230 are respectively in contact with the two substrate bodies 100.

[0035] like Figure 7 As shown, grooves 101 are respectively opened in the middle of the sides of the two substrate bodies 100 , and the connecting plate 300 is disposed in the groove 101 to connect the two substrate bodies 100 .

[0036] The two protection frames 400 are respectively disposed on two sides of the substrate body 100 , and are respectively connected to the corresponding connecting plates 300 through the fasteners 500 .

[0037] As a possible situation, two grooves 101 are provided on the same side of the two substrate bodies 100, and a connecting plate 300 is connected in each groove 101. Then, two snap fasteners 500 are provided on the corresponding protective frame 400 on the same side, and the two snap fasteners 500 are respectively connected to the corresponding connecting plates 300 to improve the installation stability of the protective frame 400.

[0038] Specifically, when the relevant staff installs the double-layer substrate body 100, they first connect the corners of the two substrate bodies 100 through the connecting piece 200, and then install the protective frame 400 by snapping it onto the connecting plate 300 through the snapping piece 500.

[0039] The protection frame 400 protects the sides of the two substrate bodies 100 , which can effectively prevent the substrate bodies 100 from being hit or scratched by the sides. In addition, due to the blocking of the protection frame 400 , the intrusion of dust and moisture can be reduced.

[0040] When the corners of the double-layer substrate body 100 are impacted, the corners of the two substrate bodies 100 are deformed and squeeze the rubber pads 230, so that the rubber pads 230 absorb energy and effectively buffer the corners of the substrate body 100, thereby reducing the impact on the substrate body 100 and the components thereon, and reducing the failure rate caused thereby.

[0041] It should be noted that heat sinks or heat dissipation holes are provided on the substrate body 100 to provide local enhanced heat dissipation for specific high-temperature components and ensure system stability.

[0042] In one embodiment of the present invention, the protection frame 400 is a U-shaped frame, and the two corners of the protection frame 400 are respectively wrapped around the two corners on the same side of the substrate body 100.

[0043] It should be noted that the protection frame 400 can not only protect the sides of the substrate body 100 , but also further protect the corners, thereby improving the impact resistance of the substrate body 100 .

[0044] In addition, the inner wall of the protection frame 400 is coated with an anti-static coating, which can effectively prevent static electricity accumulation and protect sensitive electronic components from being damaged by static electricity.

[0045] In another embodiment of the present invention, the height of the protection frame 400 is greater than the distance between the two substrate bodies 100, which can effectively block the intrusion of dust and moisture.

[0046] In one embodiment of the present invention, Figure 7 As shown, each connecting plate 300 is provided with two upper and lower opposite slots 301 .

[0047] like Figure 3 , Figure 4 , Figure 5 and Figure 8 As shown, the buckle 500 includes a buckle straight arm 510 , a buckle foot 520 and a limit block 530 .

[0048] Among them, one end of the two buckle straight arms 510 is respectively connected to the protective frame 400, and the other end passes through the corresponding slot 301, and buckle feet 520 are respectively provided on the opposite sides of the ends of the two buckle straight arms 510, and limiting blocks 530 are respectively provided on the opposite sides of the two buckle straight arms 510 to limit the depth of the buckle straight arms 510 extending into the corresponding slot 301.

[0049] It should be noted that when the relevant staff installs the protective frame 400, first, the relevant staff presses the two buckle straight arms 510 to deform and move closer to each other, and then pushes the buckle 500 to make the buckle feet 520 pass through the corresponding slots 301 until the limit block 530 abuts against the connecting plate 300, and then lets go, so that the two buckle straight arms 510 move away from each other and reset. At this time, the buckle feet 520 are limited by the slots 301, and due to the limiting effect of the limit block 530, the two can ensure the stability of the buckle 500 being connected to the connecting plate 300, thereby avoiding large-scale shaking of the buckle 500.

[0050] When removing the fastener 500, the relevant staff also presses the two fastener straight arms 510 so that the two fastener straight arms 510 are deformed and approach each other, and then pulls out the fastener 500 so that the fastener feet 520 are disengaged from the corresponding slots 301 to complete the disassembly. Through the installation of the fastener 500, the relevant staff can install or disassemble the protective frame 400 more quickly and conveniently.

[0051] In summary, according to the protective PCB substrate of the embodiment of the utility model, the detachable protective frame 400 arranged on both sides can protect the two sides and corners of the double-layer structure of the substrate main body 100, thereby reducing the side edges of the substrate main body 100 from collision, scratches, dust or moisture intrusion. In addition, when the double-layer substrate main body 100 is connected by the connector 200, when the double-layer substrate main body 100 is vibrated, impacted or dropped, the rubber pad 230 can absorb energy, provide effective buffering, reduce the impact on the substrate main body 100 and the components thereon, and reduce the failure rate caused thereby.

[0052] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0053] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0054] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A protective PCB substrate, characterized in that: include: A base plate body (100), a connecting piece (200), a connecting plate (300), a protective frame (400) and a buckle (500), wherein: The four corners of the two substrate bodies (100) are connected by the connecting pieces (200) respectively; The connecting member (200) comprises a column (210), a nut sleeve (220) and a rubber pad (230), wherein: The column (210) is arranged on the bottom substrate body (100) and vertically passes through the top substrate body (100); The rubber pad (230) is sleeved on the upright column (210), and two ends of the rubber pad (230) are respectively in contact with the two base plate bodies (100); The nut sleeve (220) is threadedly locked on the top of the column (210); Grooves (101) are respectively provided in the middle of the sides of the two substrate bodies (100); the connecting plate (300) is arranged in the groove (101) and connects the two substrate bodies (100); The two protection frames (400) are respectively arranged on both sides of the base plate body (100), and are respectively clamped with the corresponding connection plates (300) through the clamping members (500).

2. The protective PCB substrate according to claim 1, characterized in that: The protection frame (400) is a U-shaped frame, and the corners at both ends of the protection frame (400) are respectively wrapped around the two corners on the same side of the substrate body (100).

3. The protective PCB substrate according to claim 1, characterized in that: The inner wall of the protection frame (400) is coated with an antistatic coating.

4. The protective PCB substrate according to claim 1, characterized in that: Each of the connecting plates (300) is provided with two upper and lower opposite clamping grooves (301), and the clamping member (500) comprises a clamping straight arm (510), a clamping foot (520) and a limit block (530), wherein: One end of the two buckle straight arms (510) is respectively connected to the protective frame (400), and the other end passes through the corresponding buckle slot (301), and the buckle feet (520) are respectively arranged on the opposite sides of the ends of the two buckle straight arms (510); The limiting blocks (530) are respectively arranged on opposite sides of the two buckle straight arms (510) to limit the depth of the buckle straight arms (510) extending into the corresponding buckle slots (301).

5. The protective PCB substrate according to claim 1, characterized in that: The substrate body (100) is provided with heat dissipation fins or heat dissipation holes.

6. The protective PCB substrate according to claim 1, characterized in that: The height of the protection frame (400) is greater than the distance between the two substrate bodies (100).

7. The protective PCB substrate according to claim 1, characterized in that: The two substrate bodies (100) are electrically connected via a conductive path.