High-power and high-reliability LED light source
By designing multiple light emitting regions on the substrate of the LED light source and forming a series structure independent of multiple series, the problem of low utilization rate when LED chips are connected in series in the prior art is solved, and a high power and high reliability LED light source is realized.
Patent Information
- Application Number
- CN202421329808.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-12
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-06-12
AI Technical Summary
In the prior art, after a single LED chip formed by multiple arrays is damaged, the remaining LED chips in series will also be powered off, resulting in the remaining LED chips in series on the substrate being unable to emit light and the utilization rate is low.
A high power and high reliability LED light source is designed. By setting multiple light emitting regions on the substrate, each light emitting region is equipped with multiple LED chips to form a series structure arranged independently of each other in multiple series, and the multiple series structures are arranged in parallel to ensure that each light emitting region has at least one LED chip, and a series structure is formed by series welding of conductive wires.
Even if a single series structure fails, the LED light source can still emit light uniformly, which improves the reliability and utilization of the LED light source and solves the problem of low utilization of the series LED chip.
Smart Images

Figure CN222869338U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED light sources, and in particular to a high-power and high-reliability LED light source. Background Art
[0002] At present, LED is gradually replacing incandescent lamps and fluorescent lamps with its long life, pollution-free and high luminous efficiency. The LED light source in existing LED lamps is composed of an LED chip and a substrate for carrying the LED chip. The LED light source can be composed of a substrate with an LED chip welded on it, or it can be composed of substrates with multiple LED chips welded on them in series.
[0003] In the prior art, when a single LED chip of a substrate formed of multiple arrays of LED chips connected in series is damaged, the remaining LED chips connected in series will also experience power outages, thereby causing the remaining LED chips connected in series on the substrate to be unable to emit light. Utility Model Content
[0004] The utility model aims to provide a high-power and high-reliability LED light source, aiming to solve the problem of low utilization rate of series-connected LED chips in the prior art.
[0005] The utility model is implemented as follows: a high-power and high-reliability LED light source includes a substrate, a plurality of light-emitting areas are provided on the substrate, each of the light-emitting areas is provided with a plurality of LED chips, the plurality of LED chips form a plurality of series structures that are independently arranged with each other, the series structures include a plurality of LED chips connected in series with each other, the series structures contain at least one LED chip in each light-emitting area, and the plurality of series structures are arranged in parallel with each other.
[0006] Furthermore, the plurality of LED chips connected in series are arranged to cross each other or to be adjacent to each other.
[0007] Furthermore, a plurality of LED chips in the series structure are arranged in an interlaced and mixed manner in the light-emitting area.
[0008] Furthermore, the plurality of LED chips are all square chips, and the plurality of square chips are welded in series through conductive wires to form the series structure.
[0009] Furthermore, the LED chip has a positive electrode terminal and a negative electrode terminal, and the positive electrode terminal of one LED chip and the negative electrode terminal of another LED chip are welded in series via a conductive wire.
[0010] Furthermore, the series structure has a positive electrode terminal and a negative electrode terminal, and the positive electrode terminal and the negative electrode terminal of the series structure are respectively welded in the same light-emitting area through conductive wires, or the positive electrode terminal and the negative electrode terminal of the series structure are respectively welded in two light-emitting areas through conductive wires.
[0011] Furthermore, the light emitting area is covered with a fluorescent layer, and the light emitted by the plurality of LED chips is transmitted to the outside through the fluorescent layer, and the plurality of fluorescent layers form an integrated arrangement.
[0012] Furthermore, a dam is protruded upward on the substrate, and the dam is arranged in a closed loop on the substrate to form a light-emitting area, and a plurality of light-emitting areas are respectively arranged in the light-emitting area, and there is a gap between the LED chip and the dam;
[0013] The outer periphery of the fluorescent layer is butted against the inner side of the dam, an inner groove is provided on the inner side of the dam, and the inner groove is arranged around the circumference of the dam. The outer periphery of the fluorescent layer has an embedded section embedded in the inner side of the dam, and the embedded section is embedded in the inner groove.
[0014] Furthermore, a heat dissipation ring is provided on the periphery of the dam, and the heat dissipation ring is arranged circumferentially along the periphery of the dam. The bottom of the heat dissipation ring has a contact section extending outward away from the dam, and the contact section covers the substrate.
[0015] Furthermore, the outer circumference of the heat dissipation ring is protruded outward with a plurality of inclined connecting sections, and the plurality of connecting sections are arranged circumferentially around the outer circumference of the heat dissipation ring at intervals, the top of the connecting section abuts against the outer circumference of the heat dissipation ring, and the bottom of the connecting section abuts against the contact section.
[0016] Compared with the prior art, the high-power and high-reliability LED light source provided by the utility model utilizes a plurality of LED chips to form a plurality of series structures which are independently arranged from each other, and the series structure includes at least one LED chip in each light-emitting area, so that when a single series structure fails, the use of the LED light source will not be affected; even when a single series structure fails, it can still emit light uniformly, achieving the effect of high power and high reliability, and also improving the utilization rate of the LED chips in the series structure of the LED light source, solving the problem of low utilization rate of the series LED chips. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is a schematic diagram of the top view of the high-power and high-reliability LED light source provided by the utility model;
[0018] Figure 2 It is a side view cross-sectional structural schematic diagram of a high-power and high-reliability LED light source provided by the utility model.
[0019] In the figure: substrate 10, light-emitting area 20, series structure 30, fluorescent layer 40, dam 50, light-emitting area 11, LED chip 31, embedding section 41, inner groove 51, heat dissipation ring 52, contact section 53, connecting section 54. DETAILED DESCRIPTION
[0020] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.
[0021] The implementation of the present utility model is described in detail below in conjunction with specific embodiments.
[0022] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present utility model, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on the present utility model. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.
[0023] Reference Figure 1-2 As shown, it is a preferred embodiment provided by the utility model.
[0024] A high-power and high-reliability LED light source includes a substrate 10, on which a plurality of light-emitting areas 20 are provided, each light-emitting area 20 is provided with a plurality of LED chips 31, the plurality of LED chips 31 form a plurality of series structures 30 which are independently arranged from each other, the series structure 30 includes a plurality of LED chips 31 which are connected in series with each other, the series structure 30 includes at least one LED chip 31 in each light-emitting area 20, and the plurality of series structures 30 are arranged in parallel with each other.
[0025] The high-power and high-reliability LED light source provided above utilizes a plurality of LED chips 31 to form a plurality of series structures 30 that are independently arranged from each other, and the series structure 30 includes at least one LED chip 31 in each light-emitting area 20, so that when a single series structure 30 fails, the use of the LED light source is not affected; even when a single series structure 30 fails, it can still emit light uniformly, achieving a high-power and high-reliability effect, and also improving the utilization rate of the LED chips 31 of the series structure 30 of the LED light source, thereby solving the problem of low utilization rate of the series LED chips 31.
[0026] When a certain series structure 30 fails, it will not affect the light emission of the LED light source.
[0027] Realization: 1. When a single series structure 30 fails, it will not affect the use of the LED light source;
[0028] 2. Even if a single series structure 30 fails, it can emit light evenly, achieving high power and high reliability.
[0029] In this embodiment, a plurality of LED chips 31 connected in series are arranged to cross each other or to be adjacent to each other at intervals.
[0030] The LED chips 31 of the plurality of series-connected structures 30 are arranged in an interlaced and mixed manner in the light-emitting area 20 .
[0031] In this way, even if a single series structure 30 fails, the LED chips 31 of the remaining series structures 30 can still emit light, and because the LED chips 31 of multiple series structures 30 are arranged in an interlaced and mixed manner, the LED light source can emit light evenly, achieving high power and high reliability.
[0032] The plurality of LED chips 31 are all square chips, and the plurality of square chips are connected in series and welded by conductive wires to form a series structure 30 .
[0033] The LED chip 31 has a positive electrode terminal and a negative electrode terminal. The positive electrode terminal of one LED chip 31 and the negative electrode terminal of another LED chip 31 are welded in series through a conductive wire.
[0034] The series structure 30 has a positive electrode terminal and a negative electrode terminal, and the positive electrode terminal and the negative electrode terminal of the series structure 30 are respectively welded in the same light-emitting area 20 through conductive wires or the positive electrode terminal and the negative electrode terminal of the series structure 30 are respectively welded in two light-emitting areas 20 through conductive wires.
[0035] In this embodiment, the light-emitting area 20 is covered with a fluorescent layer 40, and the light emitted by the multiple LED chips 31 is transmitted to the outside through the fluorescent layer 40, and the multiple fluorescent layers 40 are arranged in an integrated manner. In this way, the fluorescent layer 40 can increase the lighting effect of the LED light source, and the fluorescent layer 40 can protect the LED chip 31 from being squeezed and damaged by the outside.
[0036] In this embodiment, a dam 50 is protruded upward on the substrate 10, and the dam 50 is arranged on the substrate 10 in a closed loop to form a light-emitting area 20, and a plurality of light-emitting areas 20 are respectively arranged in the light-emitting area 20, and there is a gap between the LED chip 31 and the dam 50;
[0037] The outer periphery of the fluorescent layer 40 is butted against the inner side of the dam 50 , and an inner groove 51 is provided on the inner side of the dam 50 . The inner groove 51 is arranged around the circumference of the dam 50 . The outer periphery of the fluorescent layer 40 has an embedded section 41 embedded in the inner side of the dam 50 , and the embedded section 41 is embedded in the inner groove 51 .
[0038] In this way, the fluorescent layer 40 structure can be firmly combined with the dam 50 and can be closely attached to the outer periphery of the dam 50, thereby providing better protection.
[0039] In this embodiment, a heat dissipation ring 52 is provided on the outer periphery of the dam 50 , and the heat dissipation ring 52 is arranged circumferentially along the outer periphery of the dam 50 . The bottom of the heat dissipation ring 52 has a contact section 53 extending outward away from the dam 50 , and the contact section 53 covers the substrate 10 .
[0040] The dam 50 dissipates the heat generated by the plurality of LED chips 31 through the heat dissipation ring 52 , while the substrate 10 dissipates the heat through the contact section 53 , thereby increasing the heat dissipation effect of the overall structure.
[0041] In this embodiment, a plurality of inclined connecting sections 54 are protruding outward from the outer periphery of the heat dissipation ring 52. The plurality of connecting sections 54 are arranged circumferentially around the outer periphery of the heat dissipation ring 52 at intervals. The top of the connecting section 54 abuts against the outer periphery of the heat dissipation ring 52, and the bottom of the connecting section 54 abuts against the contact section 53.
[0042] The connection between the heat dissipation ring 52 and the contact section 53 is reinforced by the connecting section 54 , and the heat dissipation effect is increased thereby.
[0043] The heat dissipation ring 52 , the contact section 53 and the connecting section 54 are all made of metal and can be used to dissipate heat.
[0044] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. High power and high reliability LED light source, characterized by: A substrate is provided with a plurality of light-emitting areas, each of the light-emitting areas is provided with a plurality of LED chips, the plurality of LED chips form a plurality of series structures that are independently arranged from each other, the series structures include a plurality of LED chips connected in series, the series structures include at least one LED chip in each light-emitting area, and the plurality of series structures are arranged in parallel with each other; The plurality of LED chips connected in series are arranged in a cross or adjacent interval; the plurality of LED chips are square chips, and the plurality of square chips are welded in series by conductive wires to form the series structure; the LED chip has a positive electrode end and a negative electrode end, and the positive electrode end of one LED chip is welded in series with the negative electrode end of another LED chip by conductive wires; The series structure has a positive electrode terminal and a negative electrode terminal, and the positive electrode terminal and the negative electrode terminal of the series structure are respectively welded in the same light-emitting area through conductive wires, or the positive electrode terminal and the negative electrode terminal of the series structure are respectively welded in two light-emitting areas through conductive wires.
2. The high-power and high-reliability LED light source according to claim 1, characterized in that: A plurality of LED chips in the series structure are arranged in an interlaced and mixed manner in the light emitting area.
3. The high-power and high-reliability LED light source as claimed in claim 2, characterized in that: The light emitting area is covered with a fluorescent layer, and the light emitted by the plurality of LED chips is transmitted to the outside through the fluorescent layer, and the plurality of fluorescent layers form an integrated arrangement.
4. The high-power and high-reliability LED light source as claimed in claim 3, characterized in that: A dam is protruded upward on the substrate, the dam is arranged in a closed loop on the substrate to form a light-emitting area, a plurality of light-emitting areas are arranged in the light-emitting area, and there is a gap between the LED chip and the dam; The outer periphery of the fluorescent layer is butted against the inner side of the dam, an inner groove is provided on the inner side of the dam, and the inner groove is arranged around the circumference of the dam. The outer periphery of the fluorescent layer has an embedded section embedded in the inner side of the dam, and the embedded section is embedded in the inner groove.
5. The high-power and high-reliability LED light source as claimed in claim 4, characterized in that: A heat dissipation ring is arranged on the outer periphery of the dam, and the heat dissipation ring is arranged circumferentially along the outer periphery of the dam. The bottom of the heat dissipation ring has a contact section extending outward away from the dam, and the contact section covers the substrate.
6. The high-power and high-reliability LED light source as claimed in claim 5, characterized in that: The outer circumference of the heat dissipation ring is protruded outward with a plurality of inclined connection sections, which are arranged around and spaced along the circumference of the heat dissipation ring. The top of the connection section abuts against the outer circumference of the heat dissipation ring, and the bottom of the connection section abuts against the contact section.