Hard candy casting molding device

Abstract

The utility model discloses a hard candy casting forming device which comprises a base, the upper end of the base is connected with a casting assembly, the upper end of the base is connected with a mold assembly, and the upper end of the base is connected with a cooling assembly. According to the hard candy pouring mold, the mold main body and the mounting groove can be conveniently disassembled and mounted, so that mold main bodies in different shapes can be conveniently replaced, hard candies in different shapes can be poured, and the problem that hard candies in different shapes are difficult to produce due to the fact that a pouring mold in a comparative patent is difficult to replace is solved. The cooling assembly is arranged, the semiconductor chilling plate is powered on through the power line and the like, so that the heat absorption side, attached to the mounting groove, of the semiconductor chilling plate can be used for heat absorption and refrigeration, the other side can be used for heat release, the heat dissipation efficiency of the semiconductor chilling plate is improved through the heat dissipation fins, refrigeration and cooling are better facilitated, and the hard candy forming efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of hard candy pouring and molding devices, in particular to a hard candy pouring and molding device. Background Art

[0002] The hard candy casting and molding device is a device specially used for producing hard candy. Its main function is to pour the molten syrup into the mold and solidify it into a specific shape and size of hard candy.

[0003] Application number: CN201921144304.X, discloses a hard candy pouring and molding device, which can realize fully automatic pouring and molding, does not require manual labor during the molding process, saves labor costs and economic costs, and improves the production efficiency of hard candy;

[0004] However, most of the existing hard candy casting and molding equipment adopts water cooling or air cooling to cool and mold the hard candy. This cooling method is relatively simple, and it is difficult to cool the hard candy more quickly, and it is difficult to improve the efficiency of hard candy cooling and molding. In addition, the casting mold in the patent is also difficult to replace, so it is difficult to produce hard candies of different shapes. For this reason, we propose a hard candy casting and molding device. Utility Model Content

[0005] In order to overcome the shortcomings of the prior art, the purpose of the utility model is to provide a hard candy pouring and molding device. By setting a mold assembly and a threaded connecting column, the mold body and the mounting groove can be easily disassembled and installed, thereby facilitating the replacement of mold bodies of different shapes and pouring hard candies of different shapes.

[0006] The above technical objectives of the utility model are achieved through the following technical solutions:

[0007] A hard candy pouring and molding device comprises a base, the upper end of the base is connected to a pouring assembly, the upper end of the base is connected to a mold assembly, and the upper end of the base is connected to a cooling assembly;

[0008] The mold assembly comprises a mold body, the mold body is movably connected to the top of the base, and the lower end of the mold body is fixedly connected with a threaded connection column;

[0009] By setting the mold assembly and the threaded connection column, the mold body and the installation groove can be easily disassembled and installed, thereby facilitating the replacement of mold bodies of different shapes and casting hard candies of different shapes.

[0010] The cooling assembly comprises a semiconductor refrigeration sheet, the outer end of the semiconductor refrigeration sheet is fixedly connected to a power line, and the lower end of the semiconductor refrigeration sheet is fixedly connected to a plurality of heat sinks.

[0011] By setting up a cooling component and energizing the semiconductor refrigeration plate using a power cord, etc., the heat-absorbing side of the semiconductor refrigeration plate that is in contact with the mounting groove can be used for heat absorption and cooling, while the other side can be used for heat release. The heat sink improves the heat dissipation efficiency of the semiconductor refrigeration plate to facilitate better cooling.

[0012] Furthermore, the plurality of heat sinks are arranged equidistantly, the upper end of the base is fixedly connected to the outer shell one, the upper end of the outer shell one is fixedly connected to the outer shell two, the interior of the outer shell one is fixedly connected to a servo motor one, the upper end of the output end of the servo motor one is fixedly connected to a transmission shaft, the transmission shaft extends to the interior of the outer shell two and is rotatably connected to the outer shell two, and the upper end of the transmission shaft is fixedly connected to a heat dissipation fan blade.

[0013] By setting up cooling fan blades, the servo motor drives the transmission shaft to rotate, thereby driving the cooling fan blades to rotate, further cooling the heat release side of the semiconductor refrigeration plate. At the same time, the bottom of the installation groove can also be cooled by air, thereby improving the efficiency of hard candy cooling and molding.

[0014] Furthermore, ventilation slots are provided at both upper and lower ends of the second housing, and dustproof nets are fixedly connected inside the ventilation slots.

[0015] Furthermore, the upper end of the semiconductor refrigeration plate is fixedly connected with a mounting groove, the bottom of the mounting groove is provided with a threaded groove, the threaded connection column is threadedly connected inside the threaded groove, the lower end of the mounting groove is fixedly connected with a support leg, and the support leg is fixedly connected to the base.

[0016] Furthermore, the casting assembly includes a support column, which is fixedly connected to the upper end of the base, the upper end of the support column is fixedly connected to a top plate, the upper end of the top plate is fixedly connected to a mixing box, and the interior of the mixing box is fixedly connected to an annular electric heating plate.

[0017] Furthermore, the upper end of the mixing box is fixedly connected to a feed pipe, the lower end of the mixing box is fixedly connected to a pouring pipe, the outside of the pouring pipe is fixedly connected to a flow meter, and the outside of the pouring pipe is fixedly connected to a solenoid valve.

[0018] Furthermore, the upper end of the mixing box is fixedly connected to servo motor 2, the lower end of the output end of servo motor 2 is fixedly connected to a mixing shaft, the outside of the mixing shaft is fixedly connected to a mixing blade, the inner wall of the mixing box is fixedly connected to a temperature sensor, and the upper end of the base is fixedly connected to a PLC controller.

[0019] Further, the PLC controller is electrically connected to servo motor one, the PLC controller is electrically connected to servo motor two, the PLC controller is connected to temperature sensor signals, the PLC controller is connected to flow meter signals, and the PLC controller is connected to solenoid valve signals.

[0020] In summary, the utility model has the following beneficial effects:

[0021] 1. By setting the mold assembly and the threaded connection column, the mold body and the mounting groove can be easily disassembled and installed, so as to facilitate the replacement of mold bodies of different shapes and the casting of hard candies of different shapes;

[0022] 2. By setting up a cooling component and using a power cord to energize the semiconductor refrigeration sheet, the heat absorbing side of the semiconductor refrigeration sheet that fits the mounting groove can be used for heat absorption and cooling, while the other side can be used for heat release. The heat sink improves the heat dissipation efficiency of the semiconductor refrigeration sheet, so as to facilitate better cooling and temperature reduction;

[0023] 3. By setting the heat dissipation fan blades, the servo motor drives the transmission shaft to rotate, thereby driving the heat dissipation fan blades to rotate, further cooling the heat release side of the semiconductor refrigeration plate, and at the same time, the bottom of the installation groove can also be cooled by air, thereby improving the efficiency of hard candy cooling and molding. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of this embodiment;

[0025] Figure 2 It is a three-dimensional structural schematic diagram of the mold assembly and the cooling assembly in this embodiment;

[0026] Figure 3 Schematic diagram of the cross-section of the mold assembly and cooling assembly in this embodiment;

[0027] Figure 4 is a schematic diagram of the three-dimensional structure of the heat sink in this embodiment;

[0028] Figure 5 is a schematic diagram of the three-dimensional structure of the casting assembly in this embodiment;

[0029] Figure 6 It is a schematic structural diagram of the cross section of the casting assembly in this embodiment.

[0030] In the figure, 1. base; 2. casting assembly; 201. support column; 202. top plate; 203. stirring box; 204. annular electric heating plate; 205. feeding pipe; 206. casting pipe; 207. flow meter; 208. solenoid valve; 209. servo motor 2; 210. stirring shaft; 211. stirring blade; 212. temperature sensor; 213. PLC controller; 3. mold assembly; 301. mold body; 302. threaded connecting column; 303. mounting groove; 304. threaded groove; 305. supporting leg; 4. cooling assembly; 401. semiconductor cooling plate; 402. power cord; 403. heat sink; 404. shell 1; 405. shell 2; 406. servo motor 1; 407. transmission shaft; 408. heat dissipation fan blade; 409. ventilation slot; 410. dustproof net. DETAILED DESCRIPTION

[0031] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0032] The same parts are denoted by the same reference numerals. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the drawings, and the words "bottom" and "top", "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0033] Reference Figure 1 As shown, a hard candy pouring and molding device in a preferred embodiment of the utility model comprises a base 1, a pouring assembly 2 is connected to the upper end of the base 1, a mold assembly 3 is connected to the upper end of the base 1, and a cooling assembly 4 is connected to the upper end of the base 1;

[0034] Reference Figure 1-Figure 3 As shown, the mold assembly 3 includes a mold body 301, which is movably connected to the top of the base 1, and a threaded connection column 302 is fixedly connected to the lower end of the mold body 301;

[0035] By providing the mold assembly 3 and the threaded connection column 302, the mold body 301 and the mounting groove 303 can be easily disassembled and installed, thereby facilitating replacement of the mold body 301 with different shapes and casting hard candies of different shapes.

[0036] Reference Figure 1-Figure 4 As shown, the cooling assembly 4 includes a semiconductor cooling sheet 401 , an outer end of the semiconductor cooling sheet 401 is fixedly connected to a power line 402 , and a lower end of the semiconductor cooling sheet 401 is fixedly connected to a plurality of heat sinks 403 .

[0037] By setting up the cooling component 4 and energizing the semiconductor refrigeration chip 401 with the power cord 402, etc., the heat absorbing side of the semiconductor refrigeration chip 401 in contact with the mounting groove 303 can be used for heat absorption and cooling, while the other side can be used for heat release. The heat sink 403 improves the heat dissipation efficiency of the semiconductor refrigeration chip 401 to facilitate better cooling and temperature reduction.

[0038] Reference Figure 1-Figure 4 As shown, multiple heat sinks 403 are arranged at equal intervals, the upper end of the base 1 is fixedly connected to a shell 1 404, the upper end of the shell 1 404 is fixedly connected to a shell 2 405, the interior of the shell 1 404 is fixedly connected to a servo motor 1 406, the upper end of the output end of the servo motor 1 406 is fixedly connected to a transmission shaft 407, the transmission shaft 407 extends to the interior of the shell 2 405 and is rotatably connected to the shell 2 405, and the upper end of the transmission shaft 407 is fixedly connected to a heat dissipation fan blade 408.

[0039] By setting the heat dissipation fan blades 408, the servo motor 406 drives the transmission shaft 407 to rotate, thereby driving the heat dissipation fan blades 408 to rotate, further cooling the heat release side of the semiconductor refrigeration plate 401, and also cooling the bottom of the installation groove 303 by air, thereby improving the efficiency of hard candy cooling and molding.

[0040] Reference Figure 1-Figure 4 As shown, ventilation slots 409 are provided at both upper and lower ends of the second housing 405 , and a dustproof net 410 is fixedly connected inside the ventilation slots 409 .

[0041] By providing the ventilation slots 409 , the air flow of the second housing 405 can be increased, and the provision of the dustproof net 410 can prevent a large amount of external dust from entering the interior of the second housing 405 .

[0042] Reference Figure 1-Figure 3 As shown, the upper end of the semiconductor cooling plate 401 is fixedly connected with a mounting groove 303, the bottom of the mounting groove 303 is provided with a threaded groove 304, the threaded connection column 302 is threadedly connected inside the threaded groove 304, the lower end of the mounting groove 303 is fixedly connected with a support leg 305, and the support leg 305 is fixedly connected to the base 1.

[0043] Reference Figure 1 , Figure 5 and Figure 6 As shown, the casting assembly 2 includes a support column 201, which is fixedly connected to the upper end of the base 1, and the upper end of the support column 201 is fixedly connected to a top plate 202, and the upper end of the top plate 202 is fixedly connected to a mixing box 203, and the interior of the mixing box 203 is fixedly connected to an annular electric heating plate 204.

[0044] By providing an annular heating plate and using the PLC controller 213 to control the annular heating plate to be powered on and heated, and to control its heating temperature, the syrup required for the hard candy can be heated to prevent the syrup from cooling and solidifying.

[0045] Reference Figure 1 , Figure 5 and Figure 6 As shown, the upper end of the mixing box 203 is fixedly connected to a feed pipe 205, the lower end of the mixing box 203 is fixedly connected to a pouring pipe 206, the outside of the pouring pipe 206 is fixedly connected to a flow meter 207, and the outside of the pouring pipe 206 is fixedly connected to a solenoid valve 208.

[0046] By setting up the flow meter 207 and the electromagnetic valve 208, the flow rate of the syrup flowing out of the pouring pipe 206 can be detected, and the switch of the electromagnetic valve 208 can be controlled by the PLC controller 213 to control the dosage of the syrup to prevent excessive or insufficient pouring.

[0047] Reference Figure 1 , Figure 5 and Figure 6 As shown, the upper end of the stirring box 203 is fixedly connected to a servo motor 209, the lower end of the output end of the servo motor 209 is fixedly connected to a stirring shaft 210, the outside of the stirring shaft 210 is fixedly connected to a stirring blade 211, the inner wall of the stirring box 203 is fixedly connected to a temperature sensor 212, and the upper end of the base 1 is fixedly connected to a PLC controller 213.

[0048] By setting up a servo motor 209, the servo motor 209 drives the stirring shaft 210 and the stirring blade 211 to rotate, so that the syrup can be stirred to prevent the syrup from being heated unevenly. The temperature sensor 212 can detect the temperature inside the stirring box 203 to prevent the temperature from being too high or too low. The PLC controller 213 controls the electrical components of the device.

[0049] Reference Figure 1-Figure 6 As shown, the PLC controller 213 is electrically connected to the servo motor 1 406 , the PLC controller 213 is electrically connected to the servo motor 2 209 , the PLC controller 213 is signal connected to the temperature sensor 212 , the PLC controller 213 is signal connected to the flow meter 207 , and the PLC controller 213 is signal connected to the solenoid valve 208 .

[0050] Specific implementation process: syrup is added into the mixing box 203 through the feed pipe 205, and the temperature sensor 212 can detect the temperature inside the mixing box 203 to prevent the temperature from being too high or too low. The PLC controller 213 is used to control the annular heating plate to be powered on and heated, and its heating temperature is controlled, so that the syrup required for hard candy can be heated. At the same time, the servo motor 209 drives the stirring shaft 210 and the stirring blade 211 to rotate, so that the syrup can be stirred to prevent the syrup from being heated unevenly.

[0051] The solenoid valve 208 is opened by the PLC controller 213, and the flow meter 207 can detect the flow rate of the syrup flowing out of the pouring pipe 206, and the solenoid valve 208 is controlled by the PLC controller 213 to control the dosage of the syrup and pour the syrup into the mold body 301;

[0052] After pouring is completed, the semiconductor refrigeration sheet 401 is energized by using a power cord 402, etc., so that the heat-absorbing side of the semiconductor refrigeration sheet 401 that is in contact with the installation groove 303 can be used for heat absorption and cooling, and the other side can be used for heat release. The heat sink 403 improves the heat dissipation efficiency of the semiconductor refrigeration sheet 401. At the same time, the servo motor 406 drives the transmission shaft 407 to rotate, thereby driving the heat dissipation fan blades 408 to rotate, further cooling the heat-releasing side of the semiconductor refrigeration sheet 401, and also can perform air cooling on the bottom of the installation groove 303, thereby improving the efficiency of the hard candy cooling and molding.

[0053] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A hard candy depositing and molding device, characterized in that: It comprises a base (1), the upper end of the base (1) is connected to a casting assembly (2), the upper end of the base (1) is connected to a mold assembly (3), and the upper end of the base (1) is connected to a cooling assembly (4); The mold assembly (3) comprises a mold body (301), the mold body (301) is movably connected to the top of the base (1), and the lower end of the mold body (301) is fixedly connected to a threaded connection column (302); The cooling component (4) comprises a semiconductor cooling fin (401), the outer end of the semiconductor cooling fin (401) is fixedly connected to a power line (402), and the lower end of the semiconductor cooling fin (401) is fixedly connected to a plurality of heat sinks (403).

2. A hard candy depositing and molding device according to claim 1, characterized in that: The plurality of heat sinks (403) are arranged at equal intervals, the upper end of the base (1) is fixedly connected to a housing 1 (404), the upper end of the housing 1 (404) is fixedly connected to a housing 2 (405), the interior of the housing 1 (404) is fixedly connected to a servo motor 1 (406), the upper end of the output end of the servo motor 1 (406) is fixedly connected to a transmission shaft (407), the transmission shaft (407) extends to the interior of the housing 2 (405) and is rotatably connected to the housing 2 (405), and the upper end of the transmission shaft (407) is fixedly connected to a heat dissipation fan blade (408).

3. A hard candy depositing and molding device according to claim 2, characterized in that: The upper and lower ends of the second housing (405) are both provided with ventilation slots (409), and a dustproof net (410) is fixedly connected inside the ventilation slot (409).

4. A hard candy depositing and molding device according to claim 3, characterized in that: The upper end of the semiconductor cooling plate (401) is fixedly connected to a mounting groove (303), the bottom of the mounting groove (303) is provided with a threaded groove (304), the threaded connection column (302) is threadedly connected inside the threaded groove (304), the lower end of the mounting groove (303) is fixedly connected to a support leg (305), and the support leg (305) is fixedly connected to the base (1).

5. A hard candy depositing and molding device according to claim 4, characterized in that: The casting assembly (2) comprises a support column (201), wherein the support column (201) is fixedly connected to the upper end of the base (1), the upper end of the support column (201) is fixedly connected to a top plate (202), the upper end of the top plate (202) is fixedly connected to a mixing box (203), and the interior of the mixing box (203) is fixedly connected to an annular electric heating plate (204).

6. A hard candy depositing and molding device according to claim 5, characterized in that: The upper end of the mixing box (203) is fixedly connected to a feed pipe (205), the lower end of the mixing box (203) is fixedly connected to a pouring pipe (206), the outside of the pouring pipe (206) is fixedly connected to a flow meter (207), and the outside of the pouring pipe (206) is fixedly connected to a solenoid valve (208).

7. A hard candy depositing and molding device according to claim 6, characterized in that: The upper end of the stirring box (203) is fixedly connected to a servo motor 2 (209), the lower end of the output end of the servo motor 2 (209) is fixedly connected to a stirring shaft (210), the outside of the stirring shaft (210) is fixedly connected to a stirring blade (211), the inner wall of the stirring box (203) is fixedly connected to a temperature sensor (212), and the upper end of the base (1) is fixedly connected to a PLC controller (213).

8. A hard candy depositing and molding device according to claim 7, characterized in that: The PLC controller (213) is electrically connected to the servo motor 1 (406), the PLC controller (213) is electrically connected to the servo motor 2 (209), the PLC controller (213) is signal connected to the temperature sensor (212), the PLC controller (213) is signal connected to the flow meter (207), and the PLC controller (213) is signal connected to the solenoid valve (208).

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