Chamfering machine for silicon wafer processing

Abstract

The utility model relates to the field of silicon wafer processing, in particular to a chamfering machine for silicon wafer processing. Comprising a case, a grinding wheel and an adjusting structure, the adjusting structure is arranged on the upper surface of the case and comprises a fixing frame, the fixing frame is fixedly connected with the case, an operating rod is slidably connected to one side of the fixing frame, a movable plate is fixedly connected to the end, close to the fixing frame, of the operating rod, and a supporting plate is fixedly connected to the upper end of the movable plate; a mounting rod is fixedly connected to the upper surface of the supporting plate, the arc face of the mounting rod is slidably connected with the grinding wheel, two round rods are fixedly connected to the upper surface of the supporting plate, and a plurality of round holes are formed in the positions, corresponding to the round rods, of the surface of the grinding wheel. The chamfering machine for silicon wafer machining has the advantages that the grinding wheel can be conveniently and rapidly installed on the supporting plate through the positioning ring, the grinding wheel can be made to be close to a rotating silicon wafer body by moving the operating rod, the silicon wafer body is chamfered through the chamfering groove in the grinding wheel, overall operation is easy and convenient, and manufacturing cost is low.

Description

Technical Field

[0001] The utility model relates to the field of silicon wafer processing, in particular to a chamfering machine for silicon wafer processing. Background Art

[0002] Silicon wafer processing refers to the process of processing silicon materials into silicon wafers with specific shapes and specifications through a series of physical and chemical treatments. Silicon wafer processing includes chamfering the edges of silicon wafers after slicing, which can make the edges of silicon wafers smooth and strengthen them, reducing the probability of silicon wafers breaking during subsequent processing.

[0003] In the prior art, when a chamfering machine is used to chamfer the edge of a silicon wafer, a robotic arm in the chamfering machine sucks up the silicon wafer and places the silicon wafer in the center on a rotating suction cup. The rotating suction cup adsorbs the silicon wafer on the upper surface, and the silicon wafer is rotated by means of the rotating suction cup. The movable arm drives the grinding wheel close to the silicon wafer. During this process, the grinding wheel rotates slowly, and the silicon wafer gradually enters the chamfering groove on the grinding wheel. The inner wall of the chamfering groove chamfers the edge of the silicon wafer by friction. However, this operation method will cause the following problems. The moving distance and orientation of the robotic arm, movable arm and other devices require the user to program and input various parameters. The learning cost of the machine operation method is high, and the overall manufacturing cost of the machine is high. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the prior art that the learning cost of the use method is high and the manufacturing cost of the entire machine is high.

[0005] In order to solve the above technical problems, the utility model provides a chamfering machine for silicon wafer processing, comprising: a chassis, a grinding wheel and an adjustment structure, a rotating suction cup is installed on the upper surface of the chassis, the upper surface of the rotating suction cup abuts against the silicon wafer body, a grinding wheel is installed on the upper surface of the chassis with the help of the adjustment structure, the arc surface of the grinding wheel is provided with a chamfering groove, the upper surface of the chassis is provided with an adjustment structure, the adjustment structure comprises a fixed frame, the fixed frame is fixedly connected to the chassis, one side of the fixed frame is slidably connected to a joystick, and the end of the joystick close to the fixed frame is fixedly connected to a movable The upper end of the movable plate is fixedly connected to a supporting plate, the upper surface of the supporting plate is fixedly connected to a mounting rod, the arc surface of the mounting rod is slidably connected to a grinding wheel, the upper surface of the supporting plate is fixedly connected to two round rods, a plurality of round holes are provided on the surface of the grinding wheel corresponding to the positions of the round rods, the arc surface of the round rods is slidably connected to the round holes, a positioning ring is threadedly connected to the arc surface of the mounting rod, a fixing block is fixedly connected to the upper surface of the fixing frame, the fixing block is located on a side of the fixing frame away from the joystick, and a screw rod is threadedly inserted on a side of the fixing block away from the movable plate.

[0006] The effects achieved by the above components are: the overall use method is simple and convenient, and the overall manufacturing cost of the machine is low.

[0007] Preferably, the arc surface of the positioning ring is provided with a plurality of anti-slip grooves, and the plurality of anti-slip grooves are evenly distributed on the positioning ring.

[0008] The effect achieved by the above components is: the friction of the arc surface of the positioning ring is increased by the anti-slip grooves, making it convenient for the user to rotate the positioning ring.

[0009] Preferably, a sliding rod is fixedly connected to the inner wall of the fixed frame, and the arc surface of the sliding rod is slidably connected to the movable plate.

[0010] The effect achieved by the above components is: the movable plate is further limited by the sliding rod, so that the movable plate is more stable when moving along the fixed frame.

[0011] Preferably, the arc surface of the joystick is sleeved with a spring, and two ends of the spring are respectively fixedly connected to the moving plate and the fixed frame.

[0012] The effect achieved by the above components is that when the moving plate moves toward the direction close to the rotating suction cup, the spring always gives the moving plate an elastic force in the opposite direction, so that the moving plate moves more stably.

[0013] Preferably, an auxiliary structure is provided on the upper surface of the chassis, and the auxiliary structure includes two slide rails, the two slide rails are fixedly connected to the chassis, the two slide rails are located on both sides of the rotating suction cup, the inner wall of the slide rail is slidably connected with a slider, the upper surface of the slider is fixedly connected to a limiting frame, one side of the slider is rotatably connected with a connecting rod, the end of the connecting rod away from the slider is rotatably connected with a handle bar, the surface of the handle bar is slidably connected with a fixed plate, and the fixed plate is fixedly connected to the chassis.

[0014] The effect achieved by the above components is: pulling the handle can make the two limit frames move towards each other, and the two limit frames limit the silicon wafer body from both sides of the silicon wafer body, so that the silicon wafer body can be accurately centered on the rotating suction cup.

[0015] Preferably, two protective pads are fixedly connected to the arc surface of the limiting frame, and the protective pads are silicone pads.

[0016] The effect achieved by the above components is that the protective pad can effectively prevent the limit frame from contacting the silicon wafer body and causing damage to the silicon wafer body.

[0017] Preferably, the lower surface of the sliding block is rotatably connected to two pulleys, and the arc surfaces of the two pulleys are slidably connected to the slide rail.

[0018] The effect achieved by the above components is: the friction between the slider and the slide rail is reduced by the pulley, so that the slider moves more smoothly along the slide rail.

[0019] Compared with the related art, the chamfering machine for silicon wafer processing provided by the utility model has the following beneficial effects:

[0020] The utility model provides a chamfering machine for silicon wafer processing. When the chamfering machine is used to chamfer the edge of the silicon wafer, the mechanical arm in the chamfering machine sucks the silicon wafer and places the silicon wafer in the center on the rotating suction cup. The rotating suction cup adsorbs the silicon wafer on the upper surface, and the silicon wafer is driven to rotate by the rotating suction cup. The movable arm drives the grinding wheel close to the silicon wafer. During this process, the grinding wheel rotates slowly, and the silicon wafer gradually enters the chamfering groove on the grinding wheel. The inner wall of the chamfering groove chamfers the edge of the silicon wafer by friction. However, this operation mode will cause the following problems. The moving distance and orientation of the mechanical arm, the movable arm and other devices require the user to program and input various parameters. The learning cost of the operation method of the machine is high, and the overall manufacturing cost of the machine is high. By setting an adjustment structure, the grinding wheel can be conveniently installed on a support plate using a positioning ring. By moving the joystick, the grinding wheel can be brought close to the rotating silicon wafer body, and the chamfering groove on the grinding wheel is used to chamfer the silicon wafer body. The overall operation is simple and convenient, and the manufacturing cost is low.

[0021] The user cannot manually place the silicon wafer accurately in the center of the rotating suction cup. By setting an adjustment structure, pulling the handle can make the two limit frames move towards each other. The two limit frames limit the silicon wafer body from both sides of the silicon wafer body, so that the silicon wafer body can be accurately centered on the rotating suction cup. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of the structure of a chamfering machine for silicon wafer processing provided by the utility model;

[0023] Figure 2 for Figure 1 A schematic diagram of the structure of the regulatory structure shown;

[0024] Figure 3 for Figure 2 A partial structural schematic diagram of the regulating structure shown;

[0025] Figure 4 for Figure 1 A schematic diagram of the auxiliary structure shown.

[0026] Numbers in the figure: 1. chassis; 2. rotating suction cup; 3. silicon wafer body; 4. grinding wheel; 5. chamfering groove; 6. adjustment structure; 601. fixed frame; 602. joystick; 603. moving plate; 604. support plate; 605. mounting rod; 606. positioning ring; 607. round rod; 608. anti-slip groove; 609. fixing block; 610. screw rod; 611. sliding rod; 612. spring; 7. auxiliary structure; 71. slide rail; 72. slider; 73. limit frame; 74. protective pad; 75. connecting rod; 76. handle; 77. fixing plate; 78. pulley. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0028] The specific implementation of the present utility model is described in detail below in conjunction with specific embodiments.

[0029] See also Figures 1 to 4 The embodiment of the utility model provides a chamfering machine for silicon wafer processing, comprising: a chassis 1, a grinding wheel 4 and an adjusting structure 6. A rotating suction cup 2 is installed on the upper surface of the chassis 1, and the upper surface of the rotating suction cup 2 abuts against a silicon wafer body 3. A grinding wheel 4 is installed on the upper surface of the chassis 1 with the aid of the adjusting structure 6. A chamfering groove 5 is provided on the arc surface of the grinding wheel 4. The upper surface of the chassis 1 is provided with an adjusting structure 6, and the upper surface of the chassis 1 is provided with an auxiliary structure 7.

[0030] In the embodiments of the present invention, please refer to Figures 1 to 3The adjustment structure 6 includes a fixed frame 601, which is fixedly connected to the chassis 1. A joystick 602 is slidably connected to one side of the fixed frame 601. A movable plate 603 is fixedly connected to one end of the joystick 602 close to the fixed frame 601. A support plate 604 is fixedly connected to the upper end of the movable plate 603. A mounting rod 605 is fixedly connected to the upper surface of the support plate 604. The arc surface of the mounting rod 605 is slidably connected to the grinding wheel 4. Two round rods 607 are fixedly connected to the upper surface of the support plate 604. The grinding wheel A plurality of circular holes are provided on the surface of the support plate 604 corresponding to the position of the circular rod 607. The circular arc surface of the circular rod 607 is slidably connected to the circular hole. The circular arc surface of the mounting rod 605 is threadedly connected with a positioning ring 606. The upper surface of the fixed frame 601 is fixedly connected with a fixing block 609. The fixing block 609 is located on the side of the fixed frame 601 away from the operating rod 602. The side of the fixing block 609 away from the moving plate 603 is threadedly inserted with a screw 610. The positioning ring 606 can be used to conveniently install the grinding wheel 4 on the support plate 604. By moving the joystick 602, the grinding wheel 4 can be brought close to the rotating silicon wafer body 3, and the chamfering groove 5 on the grinding wheel 4 can be used to chamfer the silicon wafer body 3. The overall operation is simple and convenient, and the manufacturing cost is low. The arc surface of the positioning ring 606 is provided with a plurality of anti-skid grooves 608, and the plurality of anti-skid grooves 608 are evenly distributed on the positioning ring 606. The anti-skid grooves 608 increase the friction of the arc surface of the positioning ring 606, so that the user can rotate the positioning ring 606 conveniently. The inner wall of the fixed frame 601 is fixedly connected with a slide bar 611, and the slide bar The arc surface of 611 is slidably connected with the moving plate 603, and the moving plate 603 is further limited by the sliding rod 611, so that the moving plate 603 is more stable when moving along the fixed frame 601. The arc surface of the joystick 602 is sleeved with a spring 612, and the two ends of the spring 612 are respectively fixedly connected to the moving plate 603 and the fixed frame 601. When the moving plate 603 moves toward the direction close to the rotating suction cup 2, the spring 612 always gives the moving plate 603 an elastic force in the opposite direction, so that the moving plate 603 is more stable when moving.

[0031] In the embodiments of the present invention, please refer to Figure 4The auxiliary structure 7 includes two slide rails 71, which are fixedly connected to the chassis 1. The two slide rails 71 are located on both sides of the rotating suction cup 2. The inner wall of the slide rail 71 is slidably connected with a slider 72. The upper surface of the slider 72 is fixedly connected with a limit frame 73. One side of the slider 72 is rotatably connected with a connecting rod 75. The end of the connecting rod 75 away from the slider 72 is rotatably connected with a handle 76. The surface of the handle 76 is slidably connected with a fixed plate 77. The fixed plate 77 is fixedly connected to the chassis 1. Pulling the handle 76 can make the two limit frames 73 move in a direction close to each other. The two limit frames 73 move away from the The two sides of the silicon wafer body 3 limit the silicon wafer body 3 so that the silicon wafer body 3 can be accurately placed in the center of the rotating suction cup 2. The arc surface of the limit frame 73 is fixedly connected with two protective pads 74, and the protective pads 74 are silicone pads. The protective pads 74 can effectively prevent the limit frame 73 from contacting the silicon wafer body 3 and causing damage to the silicon wafer body 3. The lower surface of the slider 72 is rotatably connected with two pulleys 78. The arc surfaces of the two pulleys 78 are slidably connected with the slide rail 71. The pulleys 78 reduce the friction between the slider 72 and the slide rail 71, so that the slider 72 moves more smoothly along the slide rail 71.

[0032] The working principle of a chamfering machine for silicon wafer processing provided by the utility model is as follows: by setting an adjustment structure 6, the silicon wafer body 3 is first placed in the center on the rotating suction cup 2, and then the grinding wheel 4 is installed, and the positioning ring 606 is rotated, and the positioning ring 606 moves upward along the mounting rod 605 with the help of a thread, and after the positioning ring 606 moves away from the mounting rod 605, the grinding wheel 4 is slidably sleeved on the mounting rod 605, and the two round rods 607 are slid into the round holes on the grinding wheel 4, and then the positioning ring 606 is rotated in the opposite direction to make the positioning ring 60 6 squeezes the grinding wheel 4 downward along the mounting rod 605, and then operates the screw rod 610 to limit the moving distance of the grinding wheel 4, which plays a role of insurance, and rotates the screw rod 610. The screw rod 610 moves along the fixed block 609 toward the direction close to the moving plate 603 with the help of the thread. After the screw rod 610 moves to a suitable distance, the rotating suction cup 2 is started. The rotating suction cup 2 first absorbs the silicon wafer body 3 and then drives the silicon wafer body 3 to rotate. The joystick 602 is moved in the direction close to the rotating suction cup 2, and the joystick 602 slides along the fixed frame 601. The operating rod 602 drives the movable plate 603 to slide along the inner wall of the fixed frame 601. The movable plate 603 drives the grinding wheel 4 to approach the silicon wafer body 3 through the support plate 604, the round rod 607 and the mounting rod 605. The silicon wafer body 3 slides into the chamfering groove 5 on the grinding wheel 4. The operating rod 602 continues to move until the movable plate 603 is blocked by the screw rod 610. The inner wall of the chamfering groove 5 frictionally chamfers the edge of the grinding wheel 4 body. When the grinding wheel 4 is installed, the grinding wheel 4 is rotated in advance relative to the angle of the silicon wafer so that the round rod 607 is 7 is slid into the corresponding circular hole on the grinding wheel 4, the contact position between the grinding wheel 4 and the silicon wafer body 3 can be adjusted, the friction of the arc surface of the positioning ring 606 is increased by the anti-slip groove 608, and the user is convenient to rotate the positioning ring 606. The movable plate 603 is further limited by the sliding rod 611, so that the movable plate 603 is more stable when moving along the fixed frame 601. When the movable plate 603 moves toward the direction close to the rotating suction cup 2, the spring 612 always gives the movable plate 603 an elastic force in the opposite direction, so that the movable plate 603 is more stable when moving.

[0033] By setting the adjustment structure 6, the silicon wafer body 3 is first placed roughly in the center of the rotating suction cup 2, and then the handle rod 76 is moved in the direction away from the rotating suction cup 2, and the handle rod 76 slides along the fixed plate 77, and the handle rod 76 drives the two connecting rods 75 to move and rotate, and the other end of the connecting rod 75 drives the slider 72 to move, and the two sliders 72 move along the slide rail 71 in the direction of approaching each other, and the slider 72 drives the limit frame 73 to move, and the arc surfaces of the two limit frames 73 limit the silicon wafer body 3 from both sides of the silicon wafer body 3 until the center of the silicon wafer body 3 moves to the center of the rotating suction cup 2, and then the handle rod 76 is moved in the opposite direction to make the two limit frames 73 move and reset in the direction away from each other, wherein the protective pad 74 can effectively prevent the limit frame 73 from causing damage to the silicon wafer body 3 when it contacts the silicon wafer body 3, and the pulley 78 can reduce the friction between the slider 72 and the slide rail 71, so that the slider 72 can move more smoothly along the slide rail 71.

[0034] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.

[0035] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A chamfering machine for silicon wafer processing, characterized in that: include: A chassis (1), a grinding wheel (4) and an adjustment structure (6), wherein a rotating suction cup (2) is mounted on the upper surface of the chassis (1), the upper surface of the rotating suction cup (2) abuts against a silicon wafer body (3), a grinding wheel (4) is mounted on the upper surface of the chassis (1) with the aid of the adjustment structure (6), the circular arc surface of the grinding wheel (4) is provided with a chamfering groove (5), the upper surface of the chassis (1) is provided with an adjustment structure (6), the adjustment structure (6) comprises a fixed frame (601), the fixed frame (601) is fixedly connected to the chassis (1), a joystick (602) is slidably connected to one side of the fixed frame (601), a movable plate (603) is fixedly connected to one end of the joystick (602) close to the fixed frame (601), and a support plate (603) is fixedly connected to the upper end of the movable plate (603). 04), a mounting rod (605) is fixedly connected to the upper surface of the support plate (604), the arc surface of the mounting rod (605) is slidably connected to the grinding wheel (4), two round rods (607) are fixedly connected to the upper surface of the support plate (604), a plurality of round holes are opened on the surface of the grinding wheel (4) at positions corresponding to the round rods (607), the arc surface of the round rods (607) is slidably connected to the round holes, a positioning ring (606) is threadedly connected to the arc surface of the mounting rod (605), a fixing block (609) is fixedly connected to the upper surface of the fixing frame (601), the fixing block (609) is located on a side of the fixing frame (601) away from the joystick (602), and a screw rod (610) is threadedly inserted on a side of the fixing block (609) away from the moving plate (603).

2. A chamfering machine for silicon wafer processing according to claim 1, characterized in that: The arc surface of the positioning ring (606) is provided with a plurality of anti-slip grooves (608), and the plurality of anti-slip grooves (608) are evenly distributed on the positioning ring (606).

3. The chamfering machine for silicon wafer processing according to claim 1, characterized in that: A sliding rod (611) is fixedly connected to the inner wall of the fixed frame (601), and the arc surface of the sliding rod (611) is slidably connected to the movable plate (603).

4. The chamfering machine for silicon wafer processing according to claim 1, characterized in that: The arc surface of the joystick (602) is sleeved with a spring (612), and two ends of the spring (612) are respectively fixedly connected to the moving plate (603) and the fixed frame (601).

5. The chamfering machine for silicon wafer processing according to claim 1, characterized in that: An auxiliary structure (7) is provided on the upper surface of the chassis (1), and the auxiliary structure (7) comprises two slide rails (71), the two slide rails (71) are fixedly connected to the chassis (1), the two slide rails (71) are located on both sides of the rotating suction cup (2), the inner wall of the slide rail (71) is slidably connected to a slider (72), the upper surface of the slider (72) is fixedly connected to a limiting frame (73), one side of the slider (72) is rotatably connected to a connecting rod (75), the end of the connecting rod (75) away from the slider (72) is rotatably connected to a handle bar (76), the surface of the handle bar (76) is slidably connected to a fixing plate (77), and the fixing plate (77) is fixedly connected to the chassis (1).

6. The chamfering machine for silicon wafer processing according to claim 5, characterized in that: The arc surface of the limiting frame (73) is fixedly connected to two protection pads (74), and the protection pads (74) are silicone pads.

7. The chamfering machine for silicon wafer processing according to claim 5, characterized in that: The lower surface of the sliding block (72) is rotatably connected to two pulleys (78), and the arc surfaces of the two pulleys (78) are slidably connected to the slide rail (71).

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