Polishing device for wafer thinning

Abstract

The utility model discloses a polishing device for wafer thinning, and relates to the technical field of wafer thinning and polishing, the polishing device comprises a base, a hydraulic cylinder, a polishing disc, an outer box main body and a turnover mechanism, the top of the base is provided with a movable groove, and the inner wall of the bottom of the movable groove is provided with a first motor. When the wafer polishing device is used, a new wafer and a wafer with one processed surface can be respectively aligned with one polishing disk and the turnover mechanism through the circular plate, so that the polishing and the turnover are respectively carried out without waiting, and meanwhile, the turned wafer can be moved to the lower part of the other polishing disk; the two polishing discs are used for polishing the two wafers correspondingly, then the other face of the machined wafer on one face is machined while a new wafer is polished, repeated movement is not needed, waiting during overturning is avoided, meanwhile, feeding and discharging can be carried out during polishing through the arrangement of the circular plate, and the machining efficiency is improved. And the polishing is prevented from being hindered during feeding.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer thinning and polishing, in particular to a wafer thinning and polishing device. Background Art

[0002] The chemical composition of quartz crystal is SiO2, which belongs to the trigonal oxide mineral, namely low-temperature quartz (a-quartz). It is the most widely distributed mineral species in the quartz family. Quartz has many variants due to different particle sizes, colors, inclusions, etc. The colorless and transparent quartz is called crystal, the smoky brown to nearly black quartz is commonly known as tea crystal or black quartz, and the rose red quartz is commonly known as rose quartz; the kidney-shaped and stalactite-shaped cryptocrystalline quartz is called chalcedony. When using quartz crystals, they need to be cut and polished.

[0003] In the prior art, a patent with publication number CN220902890U discloses a back polishing device for producing semiconductor wafers, which is provided with an outer box body, a polishing liquid recovery box, a base, a placement seat, a bottom plate, a fixed block, a hydraulic cylinder, a connecting block, a first motor, a polishing disc, a liquid spraying pipe, a flipping mechanism, a first limit block, a second motor, a fixed bearing, a threaded rod, a connecting plate, a threaded hole, a sliding rod, a sliding hole, a clamping plate, a second limit block, a third motor, a rotating block, a fourth motor, a first clamping block, a fifth motor, and a second clamping block, so that one side can be flipped after polishing. However, each time it is flipped, it is necessary to stop polishing and wait, and then polish again after flipping. Moreover, it is necessary to stop polishing each time loading, which prolongs the processing time and is inconvenient to use. In view of the shortcomings of the prior art, the utility model discloses a wafer thinning polishing device to solve the above problems. Utility Model Content

[0004] The purpose of the present application is to provide a wafer thinning polishing device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical solutions: A polishing device for wafer thinning, comprising a base, a hydraulic cylinder, a polishing disc, an outer box body and a flipping mechanism, a movable groove is provided on the top of the base, a first motor is installed on the bottom inner wall of the movable groove, a movable rod is installed on the output shaft of the first motor, a circular plate is installed on the top of the movable rod, a plurality of placement tables are installed on the top of the circular plate, the number of the placement tables is even, and the two groups of placement tables farthest apart are centrally symmetrically arranged relative to the center of the circular plate, a lifting block is installed at the output end of the hydraulic cylinder, a second motor is installed on the top of the lifting block, two rotating holes are provided at the bottom of the lifting block, rotating rods are rotatably installed in both rotating holes, the top of one of the rotating rods is installed on the output shaft of the second motor, the two rotating rods are installed through a transmission mechanism, a lifting threaded hole is provided on the top of the other rotating rod, a threaded rod is threadedly installed on the lifting threaded hole, a polishing disc is installed at the bottom end of one of the rotating rods and the bottom end of the threaded rod, and a fixing mechanism is provided on the lifting block.

[0006] Preferably, the fixing mechanism includes four fixing blocks respectively installed on both sides of the lifting block, wherein a third motor is installed on the side of one of the fixing blocks, and a bidirectional screw rod is installed on the sides of the two fixing blocks on the same side for rotation together, one end of one of the bidirectional screw rods is installed on the output shaft of the third motor, two threaded blocks are threadedly sleeved on the two bidirectional screw rods, grooves are opened on the sides of the four threaded blocks, two sliding rods are installed on the relative inner walls of the four grooves, a slider is slidably sleeved on every two matching sliding rods, and splints are installed on the sides of the four sliders, and the two bidirectional screw rods are installed through a transmission unit.

[0007] Preferably, the transmission unit comprises sprockets respectively mounted on one end of the two bidirectional lead screws, and a chain is mounted on the two sprockets in meshing relationship with each other.

[0008] Preferably, a guide rod is commonly installed on the sides of the two fixing blocks, a guide rod is opened on the sides of the two threaded blocks, and the two guide rods pass through the two guide holes in sequence.

[0009] Preferably, the transmission mechanism includes two transmission cavities opened on the lifting block, the two rotating rods are each provided with a first bevel gear, the inner walls of the two transmission cavities close to each other are jointly provided with a transmission hole, a transmission rod is rotatably installed on the transmission hole, and second bevel gears are installed at both ends of the transmission rod away from each other, and the two first bevel gears are respectively meshed with the two second bevel gears.

[0010] Preferably, a fixing threaded hole is provided on the peripheral outer wall of one of the rotating rods, a fixing bolt is threadedly installed on the fixing threaded hole, and an end of the fixing bolt is tightly pressed against the threaded rod.

[0011] Preferably, a PLC controller is installed on the side of the outer box body.

[0012] In summary, the technical effects and advantages of the utility model are:

[0013] 1. In the utility model, when in use, a new wafer can be aligned with one of the polishing discs in turn through a circular plate and a plurality of placement tables, and at the same time, a wafer processed on one side can be aligned with a flipping mechanism, so that grinding and flipping can be carried out separately without waiting, and at the same time, the flipped wafer will be moved under another polishing disc, and then the two polishing discs will be respectively contacted with two wafers through a hydraulic cylinder and a threaded rod, and after contact, they will be ground again, and then the new wafer will be ground while the other side of the wafer processed on one side is processed, without repeated movement, thereby avoiding waiting during flipping, and at the same time, through the setting of the circular plate, loading and unloading can be carried out during polishing, avoiding obstruction to polishing during loading.

[0014] 2. In the utility model, by setting the fixed block, the third motor, the bidirectional screw rod, the threaded block and the clamping plate, it is convenient to fix two of the wafers. By setting the sliding rod and the slider, when the threaded block continues to descend, the position of the clamping plate is kept stationary by the sliding rod and the slider to avoid affecting the fixation. By setting the fixing bolt, it is convenient to fix the threaded rod to avoid the threaded rod itself rotating during polishing and causing the polishing disc to move. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the first viewing angle in the embodiment of the present application;

[0017] Figure 2 for Figure 1 The enlarged structural diagram at A in the middle;

[0018] Figure 3 It is a partially cutaway three-dimensional structural schematic diagram of an embodiment of the present application;

[0019] Figure 4 for Figure 3 A schematic diagram of the partially enlarged structure;

[0020] Figure 5 It is a schematic diagram of the front view of the structure of the lifting block in the embodiment of the present application with a partial cutaway.

[0021] In the figure: 1. base; 2. movable rod; 3. first motor; 4. round plate; 5. lifting block; 6. second motor; 7. rotating rod; 8. threaded rod; 9. polishing disc; 10. first bevel gear; 11. transmission rod; 12. second bevel gear; 13. fixed block; 14. third motor; 15. bidirectional screw rod; 16. threaded block; 17. sprocket; 18. chain; 19. clamping plate; 20. fixing bolt; 21. PLC controller. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] Example: Reference Figure 1-5 The polishing device for wafer thinning shown in the figure comprises a base 1, a hydraulic cylinder, a polishing disc 9, an outer box body and a flipping mechanism. It should be noted that, in the present embodiment, the installation method of the base 1, the hydraulic cylinder, the outer box body and the flipping mechanism can refer to the technical content adopted in a semiconductor wafer backside polishing device disclosed in a Chinese patent with publication number CN220902890U in the prior art, which will not be described in detail here. A movable groove is provided on the top of the base 1, and a first motor 3 is installed on the bottom inner wall of the movable groove. A movable rod 2 is installed on the output shaft of the first motor 3, and a circular plate 4 is installed on the top of the movable rod 2. A plurality of placing The number of placement platforms is even, and the two groups of placement platforms that are farthest apart are symmetrically arranged with respect to the center of the circular plate 4. A lifting block 5 is installed at the output end of the hydraulic cylinder, and a second motor 6 is installed on the top of the lifting block 5. Two rotating holes are provided at the bottom of the lifting block 5, and rotating rods 7 are rotatably installed in the two rotating holes. The top of one of the rotating rods 7 is installed on the output shaft of the second motor 6, and the two rotating rods 7 are installed through a transmission mechanism. A lifting threaded hole is provided on the top of the other rotating rod 7, and a threaded rod 8 is threadedly installed on the lifting threaded hole. Polishing disks 9 are installed at the bottom ends of one of the rotating rods 7 and the threaded rod 8, and a fixing mechanism is provided on the lifting block 5.

[0024] By means of the above mechanism, when in use, the wafers are first placed on a plurality of placement tables in sequence, and then the first motor 3 is started. The output of the first motor 3 causes the movable rod 2 to rotate, and the rotation of the movable rod 2 causes the circular plate 4 to rotate, and the rotation of the circular plate 4 causes the placement table to move. When the placement table is aligned with one of the polishing discs 9, the first motor 3 stops outputting, and then the output of the hydraulic cylinder causes the lifting block 5 to descend, and the descent of the lifting block 5 causes the rotating rod 7 to descend, and the descent of the rotating rod 7 causes one of the polishing discs 9 to contact the wafer. At this time, the wafer is fixed by the fixing mechanism. When it is fixed, the second motor 6 is started, and the output of the second motor 6 causes the rotating rod 7 to rotate, and then the polishing process is performed. When one side is completed, the circular plate 4 is rotated, so that the other wafer is aligned. Polishing disk 9, at this time, the wafer with one side processed is aligned with the flipping mechanism, and then the polishing disk 9 grinds the wafer, and at the same time the flipping mechanism flips the wafer with one side processed, but when it is flipped, the circular plate 4 is rotated again to make the flipped wafer aligned with another polishing disk 9, and then one of the polishing disks 9 is made to contact with the new wafer, and then the threaded rod 8 is rotated again to make the other polishing disk 9 contact with the wafer with one side processed, and then the two polishing disks 9 are used to grind the wafer through the second motor 6 and the transmission mechanism, and then the new wafer and the wafer with one side processed are polished at the same time, so as to avoid waiting during flipping, and at the same time, through the setting of the circular plate 4, loading and unloading can be carried out during polishing, avoiding obstruction to polishing during loading.

[0025] like Figure 3 and Figure 4 As shown, the fixing mechanism includes four fixing blocks 13 respectively installed on both sides of the lifting block 5, a third motor 14 is installed on the side of one of the fixing blocks 13, and a bidirectional screw rod 15 is installed on the sides of the two fixing blocks 13 on the same side for common rotation, one end of which is installed on the output shaft of the third motor 14, two threaded blocks 16 are threadedly sleeved on the two bidirectional screw rods 15, grooves are provided on the sides of the four threaded blocks 16, two sliding rods are installed on the relative inner walls of the four grooves, a slider is slidably sleeved on every two matching sliding rods, a clamping plate 19 is installed on the sides of the four sliders, and the two bidirectional screw rods 15 are installed in cooperation through a transmission unit. The advantage of such an arrangement is that two of the wafers can be easily fixed by the arrangement of the fixing block 13, the third motor 14, the bidirectional screw rod 15, the threaded block 16, the sliding rod, the slider and the clamping plate 19.

[0026] Specifically, the output of the third motor 14 will cause the two bidirectional screw rods 15 to rotate through the transmission unit. The rotation of the bidirectional screw rods 15 will cause the two threaded blocks 16 to approach each other. The movement of the threaded blocks 16 will cause the clamping plate 19 to move through the sliding rod and the slider, thereby fixing the chip. At this time, the lifting block 5 continues to descend, causing the threaded block 16 to descend. At this time, the sliding rod and the slider keep the clamping plate 19 in place, thereby fixing the chip.

[0027] like Figure 3 and Figure 4 As shown, the transmission unit includes sprockets 17 respectively installed on one end of two bidirectional screw rods 15, and chains 18 are installed on the two sprockets 17 in meshing relationship. The advantage of such an arrangement is that the two bidirectional screw rods 15 can rotate simultaneously through the arrangement of the sprockets 17 and the chain 18.

[0028] Specifically, when one of the two-way screw rods 15 rotates, one of the sprockets 17 will rotate, and the rotation of one of the sprockets 17 will rotate the other sprocket 17 through the chain 18, and the rotation of the other sprocket 17 will rotate the other two-way screw rod 15, so that the two two-way screw rods 15 rotate at the same time.

[0029] like Figure 4 As shown, guide rods are installed on the sides of the two fixed blocks 13, and guide rods are opened on the sides of the two threaded blocks 16. The two guide rods pass through the two guide holes in sequence. The advantage of this arrangement is that the threaded blocks 16 can move in the horizontal direction through the setting of the guide rods.

[0030] like Figure 5 As shown, the transmission mechanism includes two transmission chambers opened on the lifting block 5, and the two rotating rods 7 are both sleeved with first bevel gears 10. The inner walls of the two transmission chambers that are close to each other are jointly provided with transmission holes, and a transmission rod 11 is rotatably installed on the transmission hole. The two ends of the transmission rod 11 that are away from each other are both installed with second bevel gears 12. The two first bevel gears 10 are respectively meshed with the two second bevel gears 12. The advantage of such an arrangement is that the two polishing discs 9 can rotate simultaneously through the arrangement of the first bevel gear 10, the transmission rod 11 and the second bevel gear 12.

[0031] Specifically, when one of the rotating rods 7 rotates, one of the first bevel gears 10 will rotate, and the rotation of one of the first bevel gears 10 will rotate one of the second bevel gears 12, and the rotation of one of the second bevel gears 12 will rotate the transmission rod 11, and the rotation of the transmission rod 11 will rotate the other second bevel gear 12, and the rotation of the other second bevel gear 12 will rotate the other first bevel gear 10, and the rotation of the other first bevel gear 10 will rotate the other rotating rod 7, so that the two rotating rods 7 rotate at the same time.

[0032] like Figure 2 As shown, a fixing threaded hole is opened on the outer wall of the peripheral side of one of the rotating rods 7, and a fixing bolt 20 is threadedly installed on the fixing threaded hole. The end of the fixing bolt 20 is tightly pressed against the threaded rod 8. The advantage of such an arrangement is that the threaded rod 8 can be easily fixed by the setting of the fixing bolt 20, so as to avoid the threaded rod 8 rotating itself during polishing and causing the polishing disk 9 to move.

[0033] like Figure 1 As shown, a PLC controller 21 is installed on the side of the outer box body. The advantage of this arrangement is that the first motor 3, the second motor 6 and the third motor 6 can be easily controlled through the setting of the PLC controller 21.

[0034] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer thinning polishing device, comprising a base (1), a hydraulic cylinder, a polishing disc (9), an outer box body and a turning mechanism, characterized in that: A movable groove is provided on the top of the base (1), a first motor (3) is installed on the inner wall of the bottom of the movable groove, a movable rod (2) is installed on the output shaft of the first motor (3), a circular plate (4) is installed on the top of the movable rod (2), a plurality of placement tables are installed on the top of the circular plate (4), the number of the placement tables is even, and the two groups of placement tables that are farthest apart are centrally symmetrically arranged relative to the center of the circular plate (4), a lifting block (5) is installed on the output end of the hydraulic cylinder, and a second motor (6) is installed on the top of the lifting block (5) The bottom of the lifting block (5) is provided with two rotating holes, and rotating rods (7) are rotatably installed in the two rotating holes. The top of one of the rotating rods (7) is installed on the output shaft of the second motor (6). The two rotating rods (7) are installed in coordination through a transmission mechanism. The top of the other rotating rod (7) is provided with a lifting threaded hole, and a threaded rod (8) is threadedly installed on the lifting threaded hole. The bottom ends of one of the rotating rods (7) and the threaded rod (8) are both installed with polishing discs (9). A fixing mechanism is provided on the lifting block (5).

2. A wafer thinning polishing device according to claim 1, characterized in that: The fixing mechanism comprises four fixing blocks (13) respectively installed on both sides of the lifting block (5), a third motor (14) is installed on the side of one of the fixing blocks (13), a bidirectional screw rod (15) is rotatably installed on the sides of the two fixing blocks (13) located on the same side, one end of the bidirectional screw rod (15) is installed on the output shaft of the third motor (14), two threaded blocks (16) are threadedly sleeved on the two bidirectional screw rods (15), grooves are provided on the sides of the four threaded blocks (16), two sliding rods are installed on the opposite inner walls of the four grooves, a slider is slidably sleeved on every two matching sliding rods, a clamping plate (19) is installed on the sides of the four sliders, and the two bidirectional screw rods (15) are installed in coordination with the transmission unit.

3. A wafer thinning polishing device according to claim 2, characterized in that: The transmission unit comprises sprockets (17) respectively mounted on one end of the two bidirectional screw rods (15), and a chain (18) is mounted on the two sprockets (17) in meshing relationship.

4. A wafer thinning polishing device according to claim 2, characterized in that: A guide rod is commonly installed on the sides of the two fixed blocks (13), and a guide rod is opened on the sides of the two threaded blocks (16), and the two guide rods pass through the two guide holes in sequence.

5. A wafer thinning polishing device according to claim 1, characterized in that: The transmission mechanism comprises two transmission chambers opened on the lifting block (5), the two rotating rods (7) are sleeved with a first bevel gear (10), the inner walls of the two transmission chambers close to each other are jointly provided with a transmission hole, a transmission rod (11) is rotatably mounted on the transmission hole, and the two ends of the transmission rod (11) away from each other are respectively mounted with a second bevel gear (12), and the two first bevel gears (10) are respectively meshed with the two second bevel gears (12).

6. A wafer thinning polishing device according to claim 1, characterized in that: A fixing threaded hole is provided on the peripheral outer wall of one of the rotating rods (7), a fixing bolt (20) is threadedly mounted on the fixing threaded hole, and the end of the fixing bolt (20) is tightly pressed against the threaded rod (8).

7. A wafer thinning polishing device according to claim 1, characterized in that: A PLC controller (21) is installed on the side of the outer box body.

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