Supporting and fixing device for photoelectric pod
By designing a compact support fixture, the problems of low space utilization, difficulty in disassembly and assembly, and poor heat dissipation performance of the photoelectric pod are solved, and more efficient space utilization, simplified assembly and maintenance processes, and better heat dissipation performance are achieved.
Patent Information
- Application Number
- CN202421838602.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-07-31
AI Technical Summary
The existing photoelectric pods have low space utilization, difficulty in disassembly and assembly, and poor heat dissipation performance, resulting in high maintenance costs.
A support fixing device is designed, using a support frame and a hollow space structure, connecting various components through screws or plugs to ensure a tight connection and a compact overall structure. The device is equipped with a pitch motor support frame and a positioning sleeve support frame inside to form a hollow space like a cube, improving heat dissipation efficiency.
It improves the space utilization efficiency in the photoelectric pod, simplifies the assembly and maintenance process, reduces the maintenance cost, and improves the heat dissipation performance of the equipment.
Smart Images

Figure CN222876294U_ABST
Abstract
Description
Technical field:
[0001] The utility model relates to the technical field of optoelectronic pod manufacturing, in particular to a supporting and fixing device for an optoelectronic pod which has a compact structure, is easy to assemble, can improve the space utilization efficiency in the optoelectronic pod, and simplifies the complexity of repair and maintenance. Background technology:
[0002] In the process of performing reconnaissance and strike missions, drones need to be equipped with various optoelectronic payloads, such as visible light cameras, infrared thermal imagers, laser rangefinders and other equipment. Optoelectronic pod technology and its pods are important components of optoelectronic reconnaissance and warning technology and its equipment, and are also the core equipment for drone reconnaissance. It will fill the tactical reconnaissance role of specialized manned aircraft. For this reason, various countries are vigorously developing optoelectronic pods for various purposes. Optoelectronic pods can be widely used in reconnaissance on land, sea, air and space, and their carriers are vehicles, ships, aircraft and satellites. The optoelectronic pod is generally installed on a detection carrier (such as a drone). When in use, when the detection carrier reaches the set position, the motor in the optoelectronic pod is controlled to rotate to control the direction of the optoelectronic equipment inside it, thereby realizing the reconnaissance or detection of the target object.
[0003] Existing optoelectronic pod products, such as patent document CN202310526229.8, mention a lightweight spherical optoelectronic pod, which has a complex internal fixed structure and a large waste of space layout, which is not conducive to miniaturization design. In addition, the structure in the prior art causes the equipment to be disassembled and assembled as a whole during subsequent maintenance, which is complicated and inefficient. Its overly complex internal fixed structure is also not conducive to equipment heat dissipation. Summary of the invention:
[0004] In view of the problems in the prior art such as low space utilization, difficulty in disassembly and assembly, poor heat dissipation performance, and high maintenance costs, the utility model proposes a supporting and fixing device for an optoelectronic pod which has a compact structure, is easy to assemble, can improve the space utilization efficiency in the optoelectronic pod, and simplifies the complexity of repair and maintenance.
[0005] The utility model achieves this through the following measures:
[0006] A supporting and fixing device for an optoelectronic pod, characterized in that a supporting frame is provided, wherein the supporting frame is composed of a front supporting component, a top supporting component, a back supporting component and a bottom supporting component which are spliced and connected together; the front supporting component is connected to an infrared thermal imaging module, the top supporting component is connected to a laser ranging module, and the bottom supporting component is connected to a visible light module; the front supporting component, the top supporting component, the back supporting component and the bottom supporting component are connected to each other via screws or buckles.
[0007] The two sides of the support frame described in the utility model are respectively provided with a pitch motor support frame and a positioning shaft sleeve support frame which are arranged oppositely. The pitch motor support frame and the positioning shaft sleeve support frame are respectively connected to the support frame by screws or buckles to form an internal cube-shaped hollow space, and a mainboard fixing plate is further provided in the hollow space, and corresponding screw holes for connecting with the support frame or the positioning shaft sleeve support frame are opened on the mainboard fixing plate.
[0008] The front supporting component of the supporting frame of the utility model is an infrared thermal imaging module fixing plate, and a round hole for embedding the infrared thermal imaging module is provided on the infrared thermal imaging module fixing plate to improve the stability of fixing the infrared thermal imaging module.
[0009] The top supporting component of the utility model is a supporting beam, the front end of which is connected to the top of the infrared thermal imaging module fixing plate via screws, a screw hole is also provided on the supporting beam, and is arranged corresponding to the screw hole on the laser ranging module, and the laser ranging module is fixed to the top supporting beam via screws. Furthermore, the supporting beam in the top supporting component adopts a Y-shaped supporting beam, including a horizontal beam, a connecting beam vertically connected to the horizontal beam, and two symmetrically arranged branch beams respectively vertically connected to the two ends of the connecting beam and extending toward a side away from the horizontal beam, thereby ensuring maximum heat dissipation space while providing sufficient support stability.
[0010] The rear end of the top support component of the utility model is connected to the back support component via screws, and the back support component can adopt an H-shaped support beam. Furthermore, the upper width of the H-shaped support beam is adapted to the width of the top support component, and the lower width of the H-shaped support beam is adapted to the width of the infrared thermal imaging module fixing plate.
[0011] The bottom supporting component of the utility model is provided with an I-shaped support beam, the length of the I-shaped support beam is adapted to the lower width of the H-shaped support beam, one end of the I-shaped support beam is connected to the pitch motor support frame via screws, and the other end is connected to the mainboard fixing plate, the front side of the I-shaped support beam is connected to the infrared thermal imaging module fixing plate, and the rear side is connected to the lower end of the H-shaped support beam, the visible light module is connected to the I-shaped support beam, further, the visible light module is connected to the bottom of the I-shaped support beam via a fixing plate, and the visible light module fixing plate is provided with an engaging slot hole adapted to the visible light module.
[0012] The mainboard fixing plate of the utility model is made of a metal plate with good heat dissipation to improve the heat dissipation efficiency of the main control chip; the back of the H-shaped support beam is connected to the rectangular support frame by screws, and the connection and fixation of the external control board is completed through the rectangular support frame; the positioning sleeve support frame includes two symmetrically arranged U-shaped brackets, and the open ends of the U-shaped brackets are respectively connected to the upper end face and the lower end face of the vertically arranged mainboard fixing plate by screws, and the closed end of the U-shaped bracket has a straight section, and a screw hole matching the positioning sleeve is opened on the straight section, and the positioning sleeve is respectively connected to the two U-shaped brackets by screws.
[0013] The utility model can adapt to the spherical shell of the optoelectronic pod, and the various components are tightly connected, the overall structure is compact, the assembly difficulty is simplified, and the assembly process is saved. At the same time, it can be assembled separately, which simplifies the disassembly and maintenance process. The interior of the entire pod can be disassembled according to each module, so that when the pod is disassembled, some parts can be removed separately for maintenance and replacement. When the frequently disassembled parts are damaged, the parts can be replaced separately, which reduces the overall cost. Description of the drawings:
[0014] Attached Figure 1 It is a structural schematic diagram of the utility model.
[0015] Attached Figure 2 It is a schematic diagram of the exploded structure of the utility model.
[0016] Attached Figure 3 This is another structural diagram of the utility model from another angle
[0017] Attached Figure 4 It is a structural schematic diagram of a fixing plate of a mid-infrared thermal imaging module of the utility model.
[0018] Attached Figure 5 It is a structural schematic diagram of the pitch motor support frame in the utility model.
[0019] Attached Figure 6 It is a structural schematic diagram of a visible light module fixing plate in the utility model.
[0020] Attached Figure 7 It is a usage state diagram of the utility model.
[0021] Figure markings: infrared thermal imaging module 1, 101-infrared thermal imaging module bracket, 102-pitch motor seat, 103-pitch direct drive motor, 104-H-type bracket, 105-control board fixing part, 2-laser ranging module, 201-Y-type bracket, 3-visible light module, 301-visible light fixing part, 302-visible light connecting bracket, 4-positioning sleeve, 401-U-type bracket, 402-mainboard base, 5-nacelle front cover, 6-nacelle rear cover. Specific implementation method:
[0022] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0023] Example 1
[0024] As attached Figure 1 As shown, this example provides an internal fixing device of an optoelectronic pod body, wherein the optoelectronic pod is provided with an infrared thermal imaging module 1, a laser ranging module 2, a visible light module 3, and a pitch direct drive motor 103, and all are fixed in a pod shell, and the pod shell is composed of a pod front cover 5 and a pod rear cover 6; the internal fixing device includes an infrared module fixing plate 101, a pitch motor seat 102, an H-shaped bracket 104, a control board fixing part 105, a Y-shaped bracket 201, a positioning shaft sleeve 4, a U-shaped bracket 401, and a mainboard fixing plate 402;
[0025] In this example, the visible light module 3 is composed of two visible light modules with different focal lengths. In this example, an infrared thermal imaging module 1, a laser ranging module 2, and two visible light modules 3 are provided, and four sets of lenses form a four-light type optoelectronic pod. The position relationship of the above module components is: the infrared thermal imaging module 1 is in the middle, and the laser ranging module 2 and the visible light module are respectively on both sides of the infrared thermal imaging module 1, which can save the internal space of the optoelectronic pod;
[0026] As attached Figure 2 As shown, there is a screw hole at the rear end of the infrared thermal imaging module 1, the H-shaped bracket 104 is connected to the infrared thermal imaging module 1 by screws, and the infrared module fixing plate 101 has a circular opening, which can fix the lens part of the infrared thermal imaging module 1 to prevent shaking during imaging and deformation of the lens part due to force when the drone is suspended and flying;
[0027] The laser distance measuring module 2 has screw holes, and the laser distance measuring module 2 is fixed to the Y-shaped bracket 201 by screws. One end of the Y-shaped bracket 201 is fixedly connected to the infrared module fixing plate 101, and the other end is fixed to the H-shaped bracket 104;
[0028] The bottom of the visible light module 3 has threads, the visible light fixing piece 301 has screw holes matching the visible light module 3, the visible light fixing piece 301 is fixed on the visible light connecting bracket 302, the positioning sleeve 4 has a through hole, and the U-shaped bracket 401 is connected to the positioning sleeve 4 by screws;
[0029] As attached Figure 1The figure shows the front view of the internal structure of the pod. The components are tightly connected and the overall structure is compact, which simplifies the assembly difficulty and saves assembly procedures. At the same time, the components can be assembled separately, which simplifies the disassembly and maintenance process. The entire pod can be disassembled according to each module, so that when the pod is disassembled, some parts can be disassembled separately for maintenance and replacement. When the frequently disassembled parts are damaged, the parts can be replaced separately, which reduces the overall cost. The internal structural parts have been simulated and analyzed, and the thickness of the weak positions has been increased, and the reinforcing rib structure has been added.
[0030] As attached Figure 7 As shown, in this example, the pod front cover 5 is provided with five circular holes, which can fix the lens parts of the infrared thermal imaging module 1, the laser ranging module 2, and the visible light module 3 to prevent shaking during imaging and deformation of the lens parts due to force when the drone is suspended and flying.
[0031] The optoelectronic pod in this example dissipates heat by heat conduction. The main control board is fixed on the mainboard fixing plate 402. There is a chip with relatively high heat generation on the main control board. The chip is tightly connected to the mainboard fixing plate 402. The connection position is coated with heat-conducting material. The mainboard fixing plate 402 increases the heat dissipation surface area and is fixedly connected to multiple components such as the infrared module fixing plate 101, the U-shaped bracket 401, and the control board fixing 105. The heat can be transferred to the pod front cover 5 and the pod rear cover 6. When the UAV is suspended and flying, the air circulation reduces the surface temperature of the optoelectronic pod In addition, the infrared module fixing plate 101, the H-shaped bracket 104, the control panel fixing part 105, the Y-shaped bracket 201, and the visible light fixing part 301 are fixedly connected, which is beneficial to the heat dissipation of the pod. The infrared module fixing plate 101 is provided with a plurality of through holes for fixing the structural parts connected thereto. The pitch motor seat 102 fixes the pitch direct drive motor 103, and is fixedly connected to the pod front cover 5 and the pod rear cover 6. The visible light fixing bracket 302 can fix the visible light module 3 and is fixed to the visible light connection bracket 302 by screws.
[0032] The supporting and fixing device provided in this example can be used on a three-axis rotating mechanism, and can be used on a two-axis optoelectronic pod by simply replacing the two-axis rotating mechanism.
[0033] The utility model can adapt to the spherical shell of the optoelectronic pod, and the various components are tightly connected, the overall structure is compact, the assembly difficulty is simplified, and the assembly process is saved. At the same time, it can be assembled separately, which simplifies the disassembly and maintenance process. The interior of the entire pod can be disassembled according to each module, so that when the pod is disassembled, some parts can be removed separately for maintenance and replacement. When the frequently disassembled parts are damaged, the parts can be replaced separately, which reduces the overall cost.
Claims
1. A supporting and fixing device for an optoelectronic pod, characterized in that: A support frame is provided, which is composed of a front support component, a top support component, a back support component and a bottom support component. The front support component is connected to an infrared thermal imaging module, the top support component is connected to a laser ranging module, and the bottom support component is connected to a visible light module. The front support component, the top support component, the back support component and the bottom support component are connected via screws or buckles.
2. A supporting and fixing device for an optoelectronic pod according to claim 1, characterized in that: The support frame is provided with a pitch motor support frame and a positioning sleeve support frame arranged oppositely on both sides thereof. The pitch motor support frame and the positioning sleeve support frame are connected to the support frame via screws or buckles respectively to form an internal cube-shaped hollow space. A mainboard fixing plate is provided in the hollow space, and corresponding screw holes for connecting with the support frame or the positioning sleeve support frame are provided on the mainboard fixing plate.
3. The supporting and fixing device for an optoelectronic pod according to claim 1, characterized in that: The front supporting component of the supporting frame is an infrared thermal imaging module fixing plate, and a round hole for embedding the infrared thermal imaging module is provided on the infrared thermal imaging module fixing plate.
4. The supporting and fixing device for an optoelectronic pod according to claim 1, characterized in that: The top supporting component is a supporting beam, the front end of which is connected to the top of the infrared thermal imaging module fixing plate via screws. Screw holes are also provided on the supporting beam and are arranged corresponding to the screw holes on the laser ranging module. The laser ranging module is fixed to the top supporting beam via screws.
5. The supporting and fixing device for an optoelectronic pod according to claim 4, characterized in that: The support beam in the top support component adopts a Y-shaped support beam, which includes a horizontal beam, a connecting beam vertically connected to the horizontal beam, and two symmetrically arranged branch beams that are respectively vertically connected to the two ends of the connecting beam and extend toward a side away from the horizontal beam.
6. The supporting and fixing device for an optoelectronic pod according to claim 2, characterized in that: The rear end of the top support component is connected to the back support component via screws. The back support component adopts an H-shaped support beam. The upper width of the H-shaped support beam is adapted to the width of the top support component, and the lower width of the H-shaped support beam is adapted to the width of the infrared thermal imaging module fixing plate.
7. The supporting and fixing device for an optoelectronic pod according to claim 6, characterized in that: The bottom supporting component is provided with an I-shaped support beam, the length of the I-shaped support beam is adapted to the lower width of the H-shaped support beam, one end of the I-shaped support beam is connected to the pitch motor support frame via screws, and the other end is connected to the mainboard fixing plate, the front side of the I-shaped support beam is connected to the infrared thermal imaging module fixing plate, and the rear side is connected to the lower end of the H-shaped support beam, and the visible light module is connected to the I-shaped support beam.
8. The supporting and fixing device for an optoelectronic pod according to claim 6, characterized in that: The mainboard fixing plate is made of a metal plate with good heat dissipation to improve the heat dissipation efficiency of the main control chip; the back of the H-shaped support beam is connected to the rectangular support frame by screws, and the connection and fixation of the external control board is completed through the rectangular support frame.
9. The supporting and fixing device for an optoelectronic pod according to claim 2, characterized in that: The positioning sleeve support frame includes two symmetrically arranged U-shaped brackets, the open ends of the U-shaped brackets are respectively connected to the upper end surface and the lower end surface of the vertically arranged mainboard fixing plate by screws, the closed end of the U-shaped bracket has a straight section, and the straight section is provided with screw holes matching the positioning sleeves, and the positioning sleeves are respectively connected to the two U-shaped brackets by screws.
Citation Information
Patent Citations
A lightweight spherical optoelectronic pod
CN116252984B