Single wafer cup type electroplating equipment

Abstract

The utility model discloses single wafer cup type electroplating equipment which comprises a cathode liquid cup, and a cathode tank is formed in the cathode liquid cup; the anode liquid cup is arranged at the pool bottom of the cathode pool, an anode pool used for containing anode electrolyte is formed in the anode liquid cup, and a containing cavity is formed in the side wall of the anode liquid cup; the bearing assembly is arranged at the top of the anode liquid cup, and the bearing assembly is used for bearing a wafer; and the vibration assembly is contained in the containing cavity, and the vibration assembly is used for enabling the bearing assembly to at least partially vibrate. According to the single wafer cup type electroplating equipment, the vibration assembly is arranged on the side wall of the anode liquid cup and vibrates the electrolyte, so that the electrolyte is uniformly mixed, and the electroplating effect is improved.

Description

Technical Field

[0001] The present application relates to the field of wafer processing equipment, and in particular to a single-wafer cup-type electroplating equipment. Background Art

[0002] Wafers, that is, silicon chips used in the manufacture of silicon semiconductor integrated circuits, are made from high-purity polycrystalline silicon. During the production process, this high-purity polycrystalline silicon is melted and mixed with silicon crystal seed crystals, and then slowly pulled to form cylindrical single-crystal silicon rods. After grinding, polishing and cutting, these silicon crystal rods are converted into silicon wafers, or wafers. Wafer production lines are mainly concentrated in 8-inch and 12-inch specifications.

[0003] During the post-processing of the wafer, a metal film needs to be formed on the surface of the wafer. For 8-inch wafers, cup-type electroplating equipment is usually used for electroplating. However, when electroplating with existing cup-type electroplating equipment, it is difficult to mix the cathode electrolyte with the anode electrolyte evenly, resulting in poor electroplating effect of the wafer. Summary of the invention

[0004] The purpose of the present application is to provide a single wafer cup-type electroplating device, which solves the problem that the existing cup-type electroplating device is prone to generate bubbles during electroplating, resulting in poor electroplating effect of the wafer.

[0005] To achieve this goal, this application adopts the following technical solutions:

[0006] A single wafer cup electroplating device, comprising:

[0007] A cathode liquid cup, wherein the cathode liquid cup is provided with a cathode pool;

[0008] An anode liquid cup, the anode liquid cup is arranged at the bottom of the cathode cell, the anode liquid cup is provided with an anode cell for containing an anode electrolyte, and a side wall of the anode liquid cup is provided with a containing cavity;

[0009] A carrying component, the carrying component is arranged on the top of the anode liquid cup, and the carrying component is used to carry the wafer;

[0010] A vibration component is accommodated in the accommodating cavity, and is used to make the bearing component at least partially vibrate.

[0011] Preferably, the vibration component includes an ultrasonic generator, the ultrasonic generator is fixedly connected to the cavity wall of the accommodating cavity, the emitting surface of the ultrasonic generator faces the inner wall surface of the anode liquid cup, and the anode liquid cup is provided with an air guide passage.

[0012] Preferably, the vibration component further includes a buffer, the buffer is made of elastic material, and the ultrasonic generator is fixedly connected to the buffer.

[0013] Preferably, a sealing member is fixedly connected to a side of the ultrasonic generator away from the buffer member, and an anode plate is detachably connected to a side of the sealing member away from the ultrasonic generator.

[0014] Preferably, a receiving groove is provided on the side wall of the anode cell, the sealing member is accommodated in the receiving groove, a sealing ring is fixedly connected to a side of the sealing member close to the receiving groove, and a sealing groove for accommodating the sealing ring is provided at the bottom of the receiving groove.

[0015] Preferably, the bearing assembly comprises:

[0016] A permeable membrane, wherein the permeable membrane is fixedly connected to the top of the anode liquid cup;

[0017] A guide plate, the guide plate is arranged on the top of the permeable membrane, a liquid spraying port is opened on the guide plate, and the guide plate is used to distribute the cathode liquid;

[0018] A carrying plate is arranged on a side of the guide plate away from the permeable membrane, a plurality of liquid outlet holes are provided on the carrying plate, and the carrying plate is used for carrying wafers.

[0019] Preferably, the guide plate comprises a guide ring and a plurality of guide teeth, the plurality of guide teeth are fixedly connected to the inner ring surface of the guide ring, an outflow gap is formed between two adjacent guide teeth, and the liquid spray port is directly opposite to the outflow gap.

[0020] Preferably, it further comprises a cleaning cup, wherein the cleaning cup is connected to the cathode liquid cup;

[0021] The cleaning cup includes a cup body, a liquid storage plate and a baffle, the cup body is fixedly connected to the top of the cathode liquid cup, a plurality of cleaning holes are opened on the cup body, the liquid storage plate is fixedly connected to the inner wall surface of the cup body, the liquid storage plate and the inner wall surface of the cup body together enclose a liquid storage groove, and the baffle is fixedly connected to the top of the cup body.

[0022] Compared with the prior art, this application has the following beneficial effects:

[0023] (1) The single-wafer cup-type electroplating equipment has a vibration component disposed on the side wall of the anode liquid cup. The vibration component vibrates the electrolyte, which is beneficial for evenly mixing the electrolyte, thereby improving the electroplating effect.

[0024] (2) The single-wafer cup-type electroplating equipment sets a vibration component on the anode liquid cup and uses the vibration component to vibrate the electrolyte, so that the bubbles generated during wafer electroplating can be separated from the wafer, thus solving the problem of bubbles adhering to the wafer surface and causing poor electroplating effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0026] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which this application can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by this application, should still fall within the scope of the technical contents disclosed in this application.

[0027] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present application;

[0028] Figure 2 This is a schematic diagram of the overall structure after the cleaning cup is hidden in the embodiment of the present application;

[0029] Figure 3 This is a schematic diagram of the assembly relationship between the anode liquid cup and the supporting assembly in the embodiment of the present application;

[0030] Figure 4 It is a partial cross-sectional view of the anode liquid cup and the vibration assembly in the embodiment of the present application.

[0031] Illustrations: 1. cathode liquid cup; 11. cathode cell; 2. anode liquid cup; 21. anode cell; 22. containing cavity; 23. containing tank; 3. bearing assembly; 31. permeable membrane; 32. guide plate; 321. guide ring; 322. liquid spray port; 323. guide tooth; 324. outflow notch; 33. bearing plate; 331. liquid outlet; 4. vibration assembly; 41. ultrasonic generator; 42. buffer; 43. blocking member; 431. sealing ring; 432. sealing tank; 44. anode plate; 5. cleaning cup; 51. cup body; 511. cleaning hole; 52. liquid storage plate; 521. liquid storage tank; 53. baffle; DETAILED DESCRIPTION

[0032] In order to make the purpose, features, and advantages of the invention of this application more obvious and easy to understand, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the embodiments described below are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0033] In the description of the present application, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0034] The technical solution of the present application is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0035] See also Figure 1 and Figure 2 The embodiment of the present application provides a single wafer cup-type electroplating device, including a cathode liquid cup 1, an anode liquid cup 2, a bearing assembly 3, a vibration assembly 4 and a cleaning cup 5. The cathode liquid cup 1 is provided with a cathode pool 11, the anode liquid cup 2 is fixedly connected to the bottom of the cathode pool 11, the anode liquid cup 2 is provided with an anode pool 21 for containing an anode electrolyte, and a side wall of the anode liquid cup 2 is provided with a containing cavity 22.

[0036] See also Figure 3 and Figure 4 The vibration component 4 is used to vibrate the electrolyte so as to mix the electrolyte evenly. The vibration component 4 includes an ultrasonic generator 41, a buffer 42, a blocking member 43 and an anode plate 44. The ultrasonic generator 41 and the buffer 42 are both arranged in the accommodating chamber 22. The buffer 42 is fixedly connected to the cavity wall of the accommodating chamber 22. The ultrasonic generator 41 is fixedly connected to the side of the buffer 42 close to the inner wall surface of the anode liquid cup 2. In this embodiment, the buffer 42 is made of elastic material. The setting of the buffer 42 can reduce the transmission of the ultrasonic wave generated by the ultrasonic generator 41 to the outer wall surface of the anode liquid cup 2, thereby reducing the interference of the ultrasonic wave on other parts of the equipment.

[0037] See also Figure 3 and Figure 4, a receiving groove 23 is provided on the inner wall surface of the anode liquid cup 2, the receiving groove 23 is communicated with the receiving chamber 22, a plugging member 43 is received in the receiving groove 23 and fixedly connected to the bottom of the receiving groove 23, and the plugging member 43 is fixedly connected to the ultrasonic generator 41. A sealing ring 431 is fixedly connected to the side of the plugging member 43 close to the bottom of the receiving groove 23, and a sealing groove 432 for accommodating the sealing ring 431 is provided at the bottom of the receiving groove 23. The cooperation between the sealing ring 431 and the sealing groove 432 can improve the sealing effect of the plugging member 43 and reduce the electrolyte from flowing from the receiving groove 23 into the receiving chamber 22. The anode plate 44 is fixedly connected to the side of the plugging member 43 away from the ultrasonic generator 41. By making the anode plate 44 and the plugging member 43 fixedly connected, the anode plate 44 can not only provide metal ions for the anode electrolyte, but also improve the vibration effect of the ultrasonic wave because the anode plate 44 is in direct contact with the anode electrolyte.

[0038] See also Figure 2 and Figure 3 The supporting assembly 3 is used to achieve the mixing of the anode metal ions and the cathode electrolyte and to support the wafers. The supporting assembly 3 includes a permeable membrane 31, a guide plate 32 and a supporting plate 33. The permeable membrane 31 is fixedly connected to the top of the anode liquid cup 2. The permeable membrane 31 is arranged in a funnel shape and the tip of the permeable membrane 31 extends into the anode cell 21. The permeable membrane is used to allow the anode metal ions in the anode electrolyte to pass through. The guide plate 32 is fixedly connected to the top of the permeable membrane 31. The guide plate 32 is used to distribute the cathode liquid. The guide plate 32 includes a guide ring 321 and a plurality of guide teeth 323. The guide ring 321 is provided with a cathode liquid channel and a plurality of liquid spraying ports 322. The plurality of liquid spraying ports 322 are all connected to the cathode liquid channel. The cathode liquid channel is connected to an external cathode liquid distribution device. The plurality of guide teeth 323 are all fixedly connected to the inner ring surface of the guide ring 321. An outflow gap 324 is formed between two adjacent guide teeth 323. Each liquid spraying port 322 faces an outflow gap 324. The carrier plate 33 is arranged on the side of the guide plate 32 away from the permeable membrane 31. A plurality of liquid outlet holes 331 are arranged in an array at the center of the carrier plate 33. The carrier plate 33 is used to carry wafers.

[0039] See also Figure 1The cleaning cup 5 is used to clean the wafers that have been electroplated. The cleaning cup 5 includes a cup body 51, a liquid storage plate 52 and a baffle 53. The cup body 51 is fixedly connected to the top of the cathode liquid cup 1. The cup body 51 is provided with a plurality of cleaning holes 511 for the nozzles to extend into. The liquid storage plate 52 is fixedly connected to the inner wall of the cup body 51. The liquid storage plate 52 and the inner wall of the cup body 51 are enclosed together to form a liquid storage tank 521. The liquid storage tank 521 is connected to an external recovery device. The baffle 53 is fixedly connected to the top of the cup body 51. When the wafer is electroplated, the external clamp controls the wafer to rotate, the nozzle extends into the cleaning hole 511 and sprays the cleaning liquid onto the wafer. The cleaning liquid is thrown back into the liquid storage tank 521 under the action of centrifugal force and then recovered by the external recovery device.

[0040] In summary, the single-wafer cup-type electroplating equipment, by setting a vibration component 4 on the side wall of the anode liquid cup 2, the vibration component 4 vibrates the electrolyte, which is conducive to uniform mixing of the electrolyte, thereby improving the electroplating effect.

[0041] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A single wafer cup electroplating device, characterized in that: include: A cathode liquid cup (1), wherein a cathode pool (11) is provided on the cathode liquid cup (1); an anode liquid cup (2), the anode liquid cup (2) being arranged at the bottom of the cathode pool (11), the anode liquid cup (2) being provided with an anode pool (21) for containing an anode electrolyte, and a containing cavity (22) being provided on a side wall of the anode liquid cup (2); A carrying component (3), the carrying component (3) being arranged on the top of the anode liquid cup (2), and the carrying component (3) being used for carrying a wafer; A vibration component (4), the vibration component (4) is accommodated in the accommodation cavity (22), and the vibration component (4) is used to make the supporting component (3) at least partially vibrate.

2. The single wafer cup electroplating equipment according to claim 1, characterized in that: The vibration component (4) comprises an ultrasonic generator (41), the ultrasonic generator (41) is fixedly connected to the cavity wall of the accommodating cavity (22), the emitting surface of the ultrasonic generator (41) faces the inner wall surface of the anode liquid cup (2), and the anode liquid cup (2) is provided with an air guide passage.

3. The single wafer cup electroplating equipment according to claim 2, characterized in that: The vibration component (4) further comprises a buffer component (42), wherein the buffer component (42) is made of an elastic material, and the ultrasonic generator (41) is fixedly connected to the buffer component (42).

4. The single wafer cup electroplating equipment according to claim 3, characterized in that: A sealing member (43) is fixedly connected to a side of the ultrasonic generator (41) away from the buffer member (42), and an anode plate (44) is detachably connected to a side of the sealing member (43) away from the ultrasonic generator (41).

5. The single wafer cup electroplating equipment according to claim 4, characterized in that: A receiving groove (23) is provided on the side wall of the anode cell (21), the sealing member (43) is received in the receiving groove (23), a sealing ring (431) is fixedly connected to a side of the sealing member (43) close to the receiving groove (23), and a sealing groove (432) for receiving the sealing ring (431) is provided at the bottom of the receiving groove (23).

6. The single wafer cup electroplating equipment according to claim 1, characterized in that: The bearing assembly (3) comprises: A permeable membrane (31), wherein the permeable membrane (31) is fixedly connected to the top of the anode liquid cup (2); A guide plate (32), the guide plate (32) being arranged on the top of the permeable membrane (31), the guide plate (32) being provided with a liquid spraying port (322), and the guide plate (32) being used for distributing cathode liquid; A carrying plate (33), the carrying plate (33) being arranged on a side of the guide plate (32) away from the permeable membrane (31), the carrying plate (33) being provided with a plurality of liquid outlet holes (331), and the carrying plate (33) being used for carrying wafers.

7. The single wafer cup electroplating equipment according to claim 6, characterized in that: The guide plate (32) comprises a guide ring (321) and a plurality of guide teeth (323); the plurality of guide teeth (323) are fixedly connected to the inner ring surface of the guide ring (321); an outflow gap (324) is formed between two adjacent guide teeth (323); and the liquid spray port (322) is directly opposite to the outflow gap (324).

8. The single wafer cup electroplating equipment according to claim 1, characterized in that: It also includes a cleaning cup (5), wherein the cleaning cup (5) is connected to the cathode liquid cup (1); The cleaning cup (5) comprises a cup body (51), a liquid storage plate (52) and a baffle (53); the cup body (51) is fixedly connected to the top of the cathode liquid cup (1); a plurality of cleaning holes (511) are provided on the cup body (51); the liquid storage plate (52) is fixedly connected to the inner wall surface of the cup body (51); the liquid storage plate (52) and the inner wall surface of the cup body (51) together enclose a liquid storage groove (521); and the baffle (53) is fixedly connected to the top of the cup body (51).

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