Lamp with composite high-conductivity heat dissipation device
By adopting a composite high-conducting heat dissipation device in stage lamps, combined with the thermal conductivity of the high-conducting heat dissipation fins and metal layer, the problem of difficulty in dissipating heat from high-power light sources is solved, and more efficient heat dissipation and higher power light source support are achieved.
Patent Information
- Application Number
- CN202420949445.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-30
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-04-30
AI Technical Summary
Existing stage lamps are difficult to effectively dissipate heat under high-power light sources, resulting in problems such as aging of light sources, reduced luminous intensity and solder melting.
A composite high-conductive heat dissipation device is adopted, including a high-conductive heat dissipation fin and a metal layer covering it, and the heat dissipation effect is enhanced by combining the thermal conductivity of the high-conductive heat dissipation fins and the metal layer, and further improves the heat dissipation performance through the heat dissipation fins and heat pipes.
It achieves more efficient heat dissipation, supports the use of light sources with higher power, extends the service life of the light sources, and improves the brightness and miniaturization capabilities of the lamps.
Smart Images
Figure CN222881124U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of stage lamps, and more specifically to a lamp with a composite high-conductivity heat dissipation device. Background Art
[0002] In order to meet the demand for high brightness of stage lighting, the power of light sources has gradually increased, but at the same time, due to the trend of lightweight and miniaturization of lamps, it is more urgent to solve the heat dissipation problem of lamps. Most of the electrical energy of the light source will be converted into heat during operation. If it cannot dissipate heat normally, it will accelerate the aging of the light source, affect its luminous intensity and light conversion efficiency, and may also cause the solder inside the light source to melt and damage it.
[0003] The main heat dissipation method at present is air cooling, that is, the heat is transferred to the heat sink itself by the heat sink contacting the light source, and then the heat of the heat sink is brought to the external environment by the fan to increase convection. However, the heat conduction capacity of traditional aluminum heat sinks is limited, and it is difficult to remove heat well for high-power lighting equipment, and replacing copper plates or VC heat sinks will inevitably increase weight and cost. Utility Model Content
[0004] In order to overcome at least one defect of the above-mentioned prior art, the utility model provides a lamp with a composite high-conductivity heat dissipation device, which can dissipate heat from the light source more efficiently, facilitate the use of a higher-power light source, improve the brightness of the lamp, and facilitate the miniaturization of the lamp.
[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is: a lamp with a composite high-conductivity heat dissipation device, including a lamp head for projecting light, a light source located in the lamp head, and a composite high-conductivity heat dissipation device for dissipating heat from the light source, the composite high-conductivity heat dissipation device including a substrate for being in close contact with the light source, the substrate including a high-conductivity heat sink and a metal layer covering the high-conductivity heat sink, the lateral thermal conductivity of the high-conductivity heat sink being greater than that of the metal layer.
[0006] The lamp with the composite high-conductivity heat dissipation device enhances the thermal conductivity by combining the high-conductivity heat sink with the metal layer. It not only has the characteristics of the high-conductivity heat sink, but also can utilize the metal layer to meet the needs of diversified radiator shapes. The cost is lower than using a high-conductivity heat sink alone, the shape is more diverse, and the heat dissipation performance is better than using a metal layer alone.
[0007] Furthermore, it also includes heat dissipation fins thermally connected to the metal layer. The heat dissipation fins can increase the heat dissipation area and conduct the heat of the substrate to the far end.
[0008] Furthermore, the heat sink fins also include the high-conductivity heat sink and a metal layer covering the high-conductivity heat sink, thereby improving the heat dissipation performance of the heat sink fins and the heat dissipation performance of the entire composite high-conductivity heat sink.
[0009] Furthermore, the high-conductivity heat sink is made of graphite or diamond, which is a commonly used and mature technology with low cost and high thermal conductivity.
[0010] Furthermore, the metal layer is made of aluminum or iron, which is a common and mature technology with low cost, easy modeling and high thermal conductivity.
[0011] Furthermore, the number of the high-conductivity heat sinks is at least 2. The high-conductivity heat sinks are arranged at the heat concentration point of the composite high-conductivity heat sink, so that the heat at this point can be laterally directed to a distant place for heat dissipation, thereby avoiding heat concentration.
[0012] Furthermore, the metal layer completely covers the high-conductivity heat sink, and the high-conductivity heat sink is sealed and protected to prevent the high-conductivity heat sink from being corroded.
[0013] Furthermore, a heat pipe thermally connected to the metal layer is included, and the heat pipe also guides the heat of the substrate to a distant place, thereby enhancing the heat dissipation performance of the composite high-conductivity heat dissipation device.
[0014] Furthermore, the metal layer is provided with grooves or through holes corresponding to the heat pipe, so that the contact surface between the heat pipe and the metal layer is larger, which is beneficial to heat conduction and also convenient for fixing the heat pipe.
[0015] Furthermore, the longitudinal thermal conductivity of the high-conductivity heat sink is lower than that of the metal layer, and the high-conductivity embedded body is also included, which penetrates the high-conductivity heat sink and is tightly connected to the metal layer to conduct the heat of the high-conductivity heat sink longitudinally to the metal layer, and the thermal conductivity of the high-conductivity embedded body is greater than or equal to that of the metal layer. The high-conductivity heat sink absorbs the heat from a certain position of the metal layer and transfers it laterally to the high-conductivity embedded body, and the high-conductivity embedded body then transfers the heat longitudinally to other positions of the metal layer, which is conducive to the uniformity of the heat on the substrate and avoids heat concentration.
[0016] Furthermore, the high-conductivity embedding body is a copper block, a two-phase component or a diamond. The technology is relatively common and mature, with low cost, easy shaping and high thermal conductivity.
[0017] Furthermore, one end of the high-conductivity embedded body is exposed to form a mounting surface for being in close contact with the light source. The high-conductivity embedded body is in direct contact with the light source, and on the one hand, it quickly conducts heat to the high-conductivity heat sink, so that it conducts part of the heat laterally, and on the other hand, it directly conducts heat longitudinally to the metal layer, thereby achieving rapid heat dissipation.
[0018] Furthermore, it also includes an arm supporting the rotation of the lamp head and a chassis supporting the rotation of the arm, so that the light of the light source can be projected in any direction.
[0019] Furthermore, the lamp head is provided with an effect component for intercepting the light of the light source and changing the light effect finally projected by the lamp head, thereby making the light effect of the lamp more abundant. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 It is a schematic diagram of the overall structure of a lamp with a composite high-conductivity heat dissipation device of the utility model.
[0021] Figure 2 It is a schematic diagram of the overall structure of the composite high-conductivity heat dissipation device of the utility model.
[0022] Figure 3 It is a schematic diagram of the back structure of the substrate of the utility model.
[0023] Figure 4 yes Figure 3 Schematic diagram of the cross-sectional structure of the substrate along direction A.
[0024] In the figure:
[0025] 100. lamp holder; 110. light source; 120. composite high-conductivity heat dissipation device; 121. substrate; 1211. high-conductivity heat sink; 1212. metal layer; 12121. groove; 122. heat sink fin; 123. heat pipe; 124. high-conductivity embedded body; 1241. mounting surface; 131. magnifying lens; 132. focusing lens; 133. rotating pattern disk assembly; 134. CMY assembly; 200. arm; 300. chassis. DETAILED DESCRIPTION
[0026] The drawings are only for illustrative purposes and cannot be construed as limiting the present invention. To better illustrate the present embodiment, some parts of the drawings may be omitted, enlarged, or reduced, and do not represent the size of the actual product. For those skilled in the art, it is understandable that some well-known structures and their descriptions may be omitted in the drawings. The positional relationships described in the drawings are only for illustrative purposes and cannot be construed as limiting the present invention.
[0027] like Figures 1 to 4The utility model provides a lamp with a composite high-conductivity heat dissipation device, including a lamp head 100 for projecting light, a light source 110 located in the lamp head 100, and a composite high-conductivity heat dissipation device 120 for dissipating heat from the light source 110, wherein the composite high-conductivity heat dissipation device 120 includes a substrate 121 for being in close contact with the light source 110, wherein the substrate 121 includes a high-conductivity heat sink 1211 and a metal layer 1212 covering the high-conductivity heat sink 1211, wherein the lateral thermal conductivity of the high-conductivity heat sink 1211 is greater than that of the metal layer 1212.
[0028] The lamp with a composite high-conductivity heat dissipation device enhances thermal conductivity and strength of the high-conductivity heat sink 1211 by combining the high-conductivity heat sink 1211 with the metal layer 1212. It not only has the characteristics of the high-conductivity heat sink 1211, but also can utilize the metal layer 1212 to meet the needs of diversified radiator shapes. The cost is lower than using the high-conductivity heat sink 1211 alone, and the shape is richer to cooperate with other components. The heat dissipation performance is better than using the metal layer 1212 alone. In addition, the substrate 121 is made of a fixed material as a whole, has no reverse gravity effect, and can also function in a reverse gravity scenario.
[0029] It should be noted that the metal layer 1212 covers the high-conductivity heat sink 1211 in a partially covered manner, or covers one or two longitudinally extending surfaces thereof, or completely wraps the high-conductivity heat sink 1211 .
[0030] Optionally, the high-conductivity heat sink 1211 and the metal layer 1212 may be connected by high-temperature hot pressing, welding, gluing or sintering.
[0031] In a preferred embodiment of the present invention, a heat sink 122 is further included which is thermally connected to the metal layer 1212. The heat sink 122 can increase the heat dissipation area and conduct the heat of the substrate 121 to a remote end.
[0032] Preferably, a heat dissipation fan is further included to promote air circulation around the heat dissipation fins 122 .
[0033] In a preferred embodiment of the present invention, the heat sink 122 also includes the high-conductivity heat sink 1211 and a metal layer 1212 covering the high-conductivity heat sink 1211. The heat dissipation performance of the heat sink 122 is improved, and the heat dissipation performance of the entire composite high-conductivity heat sink 120 is also improved.
[0034] In a preferred embodiment of the present invention, the high-conductivity heat sink 1211 is made of graphite or diamond, which is a commonly used and mature technology with low cost and high thermal conductivity.
[0035] In this embodiment, the high-conductivity heat sink 1211 is made of graphene sheets, the thermal conductivity of graphene can reach more than 5000W / (mK), and its density is only about 2g / cm3; in other embodiments, the high-conductivity heat sink 1211 can also be made of graphite aluminum, graphite copper, diamond aluminum or diamond copper.
[0036] In a preferred embodiment of the present invention, the metal layer 1212 is made of aluminum or iron, which is a commonly used and mature technology with low cost, easy modeling and high thermal conductivity.
[0037] In this embodiment, the metal layer 1212 is made of aluminum. In other embodiments, the metal layer 1212 may also be made of steel.
[0038] In a preferred embodiment of the utility model, the number of the high-conductivity heat sink 1211 is at least 2. The high-conductivity heat sink 1211 is arranged at the heat concentration point of the composite high-conductivity heat dissipation device 120, so that the heat here can be laterally directed to a distant place for heat dissipation to avoid heat concentration.
[0039] In a preferred embodiment of the present invention, the metal layer 1212 completely covers the high-conductivity heat sink 1211. Since the high-conductivity heat sink 1211 generally has poor corrosion resistance, the high-conductivity heat sink 1211 is sealed and protected to prevent the high-conductivity heat sink 1211 from being corroded.
[0040] In a preferred embodiment of the present invention, a heat pipe 123 is further included which is thermally connected to the metal layer 1212. The heat pipe 123 also guides the heat of the substrate 121 to a distant place, thereby enhancing the heat dissipation performance of the composite high-conductivity heat dissipation device 120.
[0041] Optionally, the heat pipe 123 is connected to the metal layer 1212 by welding.
[0042] In this embodiment, the heat pipe 123 passes through the plurality of heat dissipation fins 122 .
[0043] Compared with the thermal connection between the heat dissipation fins 122 , the heat pipes 123 and the high-conductivity heat sink 1211 , the thermal connection between the heat dissipation fins 122 , the heat pipes 123 and the metal layer 1212 is better fixed and easier to fix.
[0044] In a preferred embodiment of the utility model, the metal layer 1212 is provided with a groove 12121 or a through hole corresponding to the heat pipe 123, so that the contact surface between the heat pipe 123 and the metal layer 1212 is larger, which is beneficial to heat conduction and also convenient for fixing the heat pipe 123.
[0045] In a preferred embodiment of the utility model, the longitudinal thermal conductivity of the high-conductivity heat sink 1211 is lower than that of the metal layer 1212, and further comprises a high-conductivity embedded body 124 that penetrates the high-conductivity heat sink 1211 and is tightly connected to the metal layer 1212 to conduct the heat of the high-conductivity heat sink 1211 longitudinally to the metal layer 1212, and the thermal conductivity of the high-conductivity embedded body 124 is greater than or equal to that of the metal layer 1212. The high-conductivity heat sink 1211 absorbs the heat from a certain position of the metal layer 1212 and transfers it laterally to the high-conductivity embedded body 124, and the high-conductivity embedded body 124 then transfers the heat longitudinally to other positions of the metal layer 1212, which is beneficial to the uniformity of the heat on the substrate 121 and avoids heat concentration.
[0046] In the preferred embodiment of the present invention, the high-conductivity embedding body 124 is a copper block, a two-phase component or a diamond, which is a relatively common and mature technology with low cost, easy modeling and high thermal conductivity.
[0047] It should be noted that the high-conductivity embedded body 124 can be of any shape or size, such as rectangular, circular or polygonal, and can be designed according to the actual process and the state of the light source 110.
[0048] In a preferred embodiment of the utility model, one end of the high-conductivity embedded body 124 is exposed to form a mounting surface 1241 for being in close contact with the light source 110. The high-conductivity embedded body 124 is in direct contact with the light source 110, and on the one hand, it quickly conducts heat to the high-conductivity heat sink 1211, so that part of the heat is conducted laterally, and on the other hand, it directly conducts heat longitudinally to the metal layer 1212, thereby achieving rapid heat dissipation.
[0049] Optionally, the number of the high-conductivity embedded bodies 124 may be one or more, at least one of which has the mounting surface 1241 to cooperate with the light source 110, and the other high-conductivity embedded bodies 124 are distributed at the other positions.
[0050] In the present application, when the high-conductivity heat sink 1211 in the substrate 121 is made of graphene sheets, the metal layer 1212 is made of aluminum, and the composite high-conductivity heat sink 120 is provided with the high-conductivity embedding body 124, the heat sink fins 122 and the heat pipe 123, the heat dissipation efficiency can be increased by more than 2-10 times that of the traditional aluminum heat sink, while the weight remains unchanged.
[0051] In a preferred embodiment of the utility model, an arm 200 for supporting the rotation of the lamp head 100 and a chassis 300 for supporting the rotation of the arm 200 are also included, so that the light of the light source 110 can be projected in any direction.
[0052] In this embodiment, the lamp head 100 rotates around the horizontal axis relative to the arm 200 , and the arm 200 rotates around the vertical axis relative to the chassis 300 .
[0053] In a preferred embodiment of the utility model, the lamp head 100 is provided with an effect component for intercepting the light of the light source 110 and changing the light effect finally projected by the lamp head 100, so as to make the light effect of the lamp more abundant.
[0054] The effect component includes one or more of a magnifying lens 131, a focusing lens 132, a CMY component 134, a cutting component, a rotating pattern plate component 133, a fixed pattern plate component, and a color plate component, respectively realizing the functions of adjusting the beam divergence angle, adjusting the light spot clarity, adjusting the beam color, cutting the beam, rotating the pattern, specifying the pattern, and dyeing the beam.
[0055] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the claims of the present invention.
Claims
1. A lamp with a composite high-conductivity heat dissipation device, characterized in that: The invention comprises a lamp head (100) for projecting light, a light source (110) located in the lamp head (100), and a composite high-conductivity heat dissipation device (120) for dissipating heat from the light source (110); the composite high-conductivity heat dissipation device (120) comprises a substrate (121) for being in close contact with the light source (110); the substrate (121) comprises a high-conductivity heat sink (1211) and a metal layer (1212) covering the outside of the high-conductivity heat sink (1211); the lateral thermal conductivity of the high-conductivity heat sink (1211) is greater than that of the metal layer (1212).
2. The lamp with a composite high-conductivity heat dissipation device according to claim 1, characterized in that: Also included is a heat sink fin (122) thermally connected to the metal layer (1212).
3. The lamp with a composite high-conductivity heat dissipation device according to claim 2, characterized in that: The heat dissipation fin (122) also includes the high-conductivity heat dissipation fin (1211) and a metal layer (1212) covering the high-conductivity heat dissipation fin (1211).
4. The lamp with a composite high-conductivity heat dissipation device according to claim 1 or 3, characterized in that: The high-conductivity heat sink (1211) is made of graphite or diamond.
5. The lamp with a composite high-conductivity heat dissipation device according to claim 1 or 3, characterized in that: The metal layer (1212) is made of aluminum or iron.
6. The lamp with a composite high-conductivity heat dissipation device according to claim 1 or 3, characterized in that: The number of the high-conductivity heat sinks (1211) is at least 2.
7. The lamp with a composite high-conductivity heat dissipation device according to claim 1 or 3, characterized in that: The metal layer (1212) completely covers the high-conductivity heat sink (1211).
8. The lamp with a composite high-conductivity heat dissipation device according to claim 1 or 2, characterized in that: Also included is a heat pipe (123) thermally connected to the metal layer (1212).
9. The lamp with a composite high-conductivity heat dissipation device according to claim 8, characterized in that: The metal layer (1212) is provided with a groove (12121) or a through hole corresponding to the heat pipe (123).
10. The lamp with a composite high-conductivity heat dissipation device according to claim 1 or 3, characterized in that: The longitudinal thermal conductivity of the high-conductivity heat sink (1211) is lower than that of the metal layer (1212), and the invention also includes a high-conductivity embedded body (124) which penetrates the high-conductivity heat sink (1211) and is tightly connected to the metal layer (1212) to conduct the heat of the high-conductivity heat sink (1211) longitudinally to the metal layer (1212), and the thermal conductivity of the high-conductivity embedded body (124) is greater than or equal to that of the metal layer (1212).
11. The lamp with a composite high-conductivity heat dissipation device according to claim 10, characterized in that: The high-conductivity embedding body (124) is a copper block, a two-phase component or diamond.
12. The lamp with a composite high-conductivity heat dissipation device according to claim 10, characterized in that: One end of the high-conductivity embedded body (124) is exposed to form a mounting surface (1241) for being in close contact with the light source (110).
13. The lamp with a composite high-conductivity heat dissipation device according to claim 1, characterized in that: It also includes an arm (200) for supporting the lamp head (100) to rotate, and a chassis (300) for supporting the arm (200) to rotate.
14. The lamp with a composite high-conductivity heat dissipation device according to claim 1, characterized in that: An effect component is arranged inside the lamp head (100) and is used to intercept the light of the light source (110) and change the light effect finally projected by the lamp head (100).