Edge computing mini-host with heat dissipation function

Abstract

The utility model belongs to the technical field of edge computing, and particularly relates to an edge computing mini host with a heat dissipation function. According to the edge computing mini-host, active heat dissipation is achieved, heat generated by the Jetson platform core module is efficiently dissipated out through the heat dissipation fan in the host shell, and therefore efficient operation of the edge computing mini-host is guaranteed. In addition, the device is simple in structure, convenient to disassemble and maintain, compatible with different master control PCBAs, capable of being customized according to requirements, and wide in application range.

Description

Technical Field

[0001] The utility model relates to the field of edge computing technology, and in particular to an edge computing mini host with a heat dissipation function. Background Art

[0002] This section is intended to provide a background or context to the embodiments of the utility model recited in the claims. The description herein is not admitted to be prior art by inclusion in this section.

[0003] The Jetson platform is an embedded system that often generates a lot of heat during its operation. Therefore, it needs to be cooled to keep the device running normally. The most commonly used cooling method is air cooling. Although air cooling technology can effectively control the temperature of electronic components to a certain extent, it also has some problems and disadvantages: 1) Efficiency is affected by temperature and air flow: The efficiency of air cooling is affected by multiple factors such as temperature and air flow. When the temperature is too high or the air flow is insufficient, the efficiency may be reduced, thus affecting the performance and life of the device. 2) Noise: When the fan is running, it will generate noise, which will affect the user's comfort when used for a long time. 3) Heat dissipation area limitation: The area of ​​the radiator is limited, and it is difficult to handle the heat dissipation requirements of high-power electronic components. 4) Position and space requirements: The installation location and surrounding space of the radiator and fan need to be considered. For some small devices, especially mobile devices, it may not be suitable to use air cooling technology. 5) Energy consumption: The use of fans consumes additional energy, thereby increasing the overall energy consumption of the device.

[0004] Based on the above problems, the existing technology needs to be further developed and improved. Utility Model Content

[0005] The purpose of the utility model is to provide an edge computing mini host with heat dissipation function in order to solve the above-mentioned problems, and to utilize air cooling to effectively solve the heat dissipation structural design within a limited space, thereby ensuring that the main control PCBA can work normally.

[0006] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is as follows.

[0007] An edge computing mini host with a heat dissipation function comprises a host housing and a main control PCBA located in the host housing. The host housing comprises an upper cover, a middle frame and a bottom shell connected in sequence. The upper cover is provided with a grille plate on one side facing outward for ventilation and dust prevention.

[0008] In some embodiments, the main control PCBA is equipped with a Jetson platform core module and a fan that are closely arranged to each other, the Jetson platform core module is installed on the main control PCBA through a spring clip, and the fan is located above the Jetson platform core module.

[0009] In some implementations, the Jetson platform core module and the fan are located on a side of the main control PCBA close to the upper cover.

[0010] In some embodiments, the middle frame is provided with an interface baffle for allowing an external interface to access the mini host.

[0011] In some embodiments, the interface baffle is embedded in the middle frame.

[0012] In some embodiments, the surface of the heat dissipation fan is coated with thermal grease.

[0013] In some embodiments, the bottom case and the main control PCBA are connected by studs and screws.

[0014] In some embodiments, the upper cover, the middle frame and the bottom shell are connected by screws.

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] The utility model combines passive heat dissipation and active heat dissipation, and efficiently dissipates the heat generated by the core module of the Jetson platform through the cooling fan inside the host shell, thereby ensuring the efficient operation of the edge computing mini host. In addition, the utility model has a simple structure, is easy to disassemble and repair, is compatible with different main control PCBAs, and can be customized according to needs, and has a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0018] Figure 1 This is a schematic diagram of the structure of an edge computing mini host with heat dissipation function according to an embodiment of the utility model;

[0019] Figure 2 This is another structural schematic diagram of an edge computing mini host with heat dissipation function according to an embodiment of the utility model;

[0020] Figure 3 This is an exploded view of an edge computing mini host with heat dissipation function according to an embodiment of the utility model;

[0021] Figure 4 This is a schematic diagram of the layout and assembly of an edge computing mini host with heat dissipation function according to an embodiment of the utility model.

[0022] In the attached figure, 1-host housing, 2-upper cover, 3-middle frame, 4-bottom shell, 5-interface baffle, 6-main control PCBA, 7-module, 8-fan, 9-Jetson platform core module, 10-shrapnel, 11-grid plate, 12-screw, 13-stud, 14-silicone plug. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in combination with the embodiments and drawings. The schematic implementation mode and description of the utility model are only used to explain the utility model and are not intended to limit the utility model. It should be noted that the utility model is already in the actual development and use stage.

[0024] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc., of the present invention are only used to distinguish descriptions, and cannot be understood as indicating or implying relative importance.

[0025] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time. When an element is referred to as being "provided with" another element, it may be provided on the surface or inside of the element.

[0026] Unless explicitly stated otherwise, throughout the specification and claims, the term “comprise” or variations such as “include” or “comprising”, etc., will be understood to include the stated elements or components but not to exclude other elements or components.

[0027] The utility model aims to solve the problems of the air-cooling heat dissipation structure adopted by the edge computer of the existing Jetson platform, such as the efficiency being affected by the temperature and air flow, the high noise, the limited heat dissipation area, the difficulty in meeting the location and space requirements, and the high energy consumption. The utility model provides an edge computing mini host with heat dissipation function, which utilizes air-cooling heat dissipation to effectively solve the heat dissipation structural design within a limited space, thereby ensuring that the main control PCBA can work normally.

[0028] The embodiment of the utility model solves the above technical problems through the following ideas: 1) Efficiency is affected by temperature and air flow: The problem that the efficiency of air cooling is affected by multiple factors such as temperature and air flow is that the design and matching of the radiator and the fan are not accurate enough. The solution to this problem is to design the radiator close to the heat source as an efficient heat dissipation structure and customize it according to the user's usage scenario and the characteristics of the device. 2) Noise: The problem of fan noise is the quality and speed of the fan. The solution to this problem is to use a low-noise fan and reduce the speed of the fan through intelligent control to reduce the noise as much as possible. 3) Heat dissipation area limitation: The problem of limited radiator area is the design and manufacturing cost of the radiator, and the area of ​​the radiator cannot be expanded indefinitely. The solution to this problem is to adopt a more efficient heat dissipation structure or increase the number of radiators, or to supplement it with other passive heat dissipation methods. 4) Position and space requirements: The problem of position and space requirements is that the installation position and surrounding space of the fan and radiator are not considered when the equipment is designed. The solution to this problem is to make reasonable layout and optimization in the equipment hardware design stage to ensure that the radiator and fan can be installed in a suitable position and occupy a small space. 5) Energy consumption: The problem of fans consuming extra energy is that the fans need to rotate to generate wind, which consumes extra electricity. The solution to this problem is to use intelligent fan control technology to adaptively adjust the fan speed according to the load of the equipment, thereby reducing energy consumption as much as possible. In addition to the above methods, when actually solving the problem of air cooling, it is also necessary to optimize the design and improve the technology through continuous experiments and tests to improve the heat dissipation efficiency and reduce the impact of shortcomings.

[0029] The embodiment of the utility model uses an aluminum extrusion mold to make a middle frame and a radiator, a plastic mold to make an upper cover and a bottom shell, and uses a fan, springs, screws, thermally conductive silicone sheets and other accessories to assemble them together with the main control PCBA, and ensure that the heating element and the radiator are tightly attached together; the upper cover is made into an opening design that meets safety regulations, and combined with the radiator, the heat emitted by the heating element can be exchanged with the outside air more quickly, so that it can work normally and stably for a long time in a limited space.

[0030] The mini host of the utility model combines the application scenarios of edge computing and integrates commonly used device interfaces, such as camera and display interfaces, Ethernet interfaces, M.2 interfaces and many other industrial interfaces, which can meet most industrial scenarios. At the same time, the utility model can realize the miniaturization of edge computers, save equipment volume, and can be applied to more scenarios.

[0031] Specifically, an edge computing mini host with heat dissipation function, such as Figure 1 and Figure 2As shown, it includes a host housing 1 and a main control PCBA6 located in the host housing 1. The host housing 1 includes an upper cover 2, a middle frame 3 and a bottom shell 4 connected in sequence. The upper cover 2 is provided with a grille plate 11 on the outer side for ventilation and dust prevention. Figure 1 and Figure 2 The schematic diagram of the utility model after assembly, Figure 1 The utility model is shown from the perspective of the upper cover 2 direction. Figure 2 The utility model is shown from the perspective of the bottom shell 4. The upper cover 2, the middle frame 3 and the bottom shell 4 can be connected in a detachable manner (such as screws 12, snap connections, etc.) or fixedly connected (such as bonding). In this embodiment, the detachable connection is preferred, and the three parts are connected by screws 12 to facilitate the subsequent PCBA board to add or reduce components or maintenance operations. The utility model is provided with a grille plate 11 on the outside of the upper cover 2 for ventilation and dust prevention.

[0032] In some embodiments, the utility model provides a grille plate 11 on the outer side of the upper cover 2 for ventilation and dust prevention.

[0033] To more clearly show the internal structure of the utility model, please refer to Figure 3 , Figure 3 An exploded view of the edge computing mini host with heat dissipation function in this embodiment is shown. In some implementations, in order to further enhance the heat dissipation efficiency, the main control PCBA6 is equipped with a Jetson platform core module 9 and a fan 8 that are closely arranged. The Jetson platform core module 9 is installed on the main control PCBA6 through a spring clip 10, and the fan 8 is located above the Jetson platform core module 9. The material of the spring clip 10 can be stainless steel. Optionally, the fan 8, the Jetson platform core module 9, and the spring clip 10 are assembled together into a module 7 by screws 12, as shown in FIG. Figure 4 As shown, the simulation host of this embodiment is assembled by the module 7, the left and right baffles and the bottom shell 4, which has a simple structure and is convenient for disassembly and maintenance. The heat generated by the Jetson platform core module 9 is discharged to the grille plate 11 through the fan 8 to further discharge the heat. In addition to absorbing heat and preventing dust, the grille plate 11 can also play a role in guiding the wind, regularly exporting heat, and improving the heat dissipation efficiency. Optionally, the bottom shell 4 and the main control PCBA6 are connected by studs 13 and screws 12. The upper cover 2, the middle frame 3 and the bottom shell 4 are connected by screws 12.

[0034] In some embodiments, in order to further enhance the heat dissipation efficiency, the Jetson platform core module 9 and the fan 8 are located on the side of the main control PCBA 6 close to the upper cover 2. The heat discharged by the fan 8 is further conducted out of the host housing by relaying, thereby enhancing the heat dissipation efficiency.

[0035] In some embodiments, the middle frame 3 is provided with an interface baffle 5 for connecting an external interface to the mini host. The interface baffle 5 may be one or more, for example, interface baffles 5 are respectively provided on two opposite sides of the middle frame 3, and the number and shape of the interfaces may be set as required. Optionally, the interface baffle 5 may be directly provided on the middle frame 3, or may be provided on the middle frame 3 by embedding. In addition, optionally, a plurality of through holes may be provided on the side of the middle frame 3 for external wires or plugs to pass through, which may be plugged with a silicone plug 14 when not in use to prevent dust from entering.

[0036] In some embodiments, in order to enhance the heat dissipation efficiency, thermal conductive silicone grease is coated on the surface of the heat dissipation fan 8 to further enhance the heat absorption capacity of the heat dissipation fan 8, thereby enhancing the heat dissipation efficiency.

[0037] Optionally, the copper block can be replaced according to different heating elements within a certain size range to be compatible with different main control PCBA6. The left and right baffles are made of aluminum profiles, and the side openings can also be customized.

[0038] It should be noted that, for the aforementioned embodiments, for the sake of simplicity, they are all described as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present application.

[0039] The above specific implementation methods further illustrate the purpose, technical solutions and beneficial effects of the utility model in detail. It should be understood that the above description is only the specific implementation method of the utility model and is not used to limit the protection scope of the utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. An edge computing mini host with heat dissipation function, characterized in that: It includes a host shell and a main control PCBA located in the host shell. The host shell includes an upper cover, a middle frame and a bottom shell connected in sequence. The upper cover is provided with a grille plate on the outer side for ventilation and dust prevention.

2. The edge computing mini host with heat dissipation function according to claim 1, characterized in that: The main control PCBA is equipped with a Jetson platform core module and a fan which are closely arranged with each other. The Jetson platform core module is installed on the main control PCBA through a spring sheet, and the fan is located above the Jetson platform core module.

3. The edge computing mini host with heat dissipation function according to claim 2, characterized in that: The Jetson platform core module and the fan are located on a side of the main control PCBA close to the upper cover.

4. The edge computing mini host with heat dissipation function according to claim 1, characterized in that: The middle frame is provided with an interface baffle for allowing an external interface to access the mini host.

5. The edge computing mini host with heat dissipation function according to claim 4, characterized in that: The interface baffle is arranged in the middle frame by embedding.

6. The edge computing mini host with heat dissipation function according to claim 2 or 3, characterized in that: The fan surface is coated with thermal conductive silicone grease.

7. The edge computing mini host with heat dissipation function according to claim 6, characterized in that: The bottom shell and the main control PCBA are connected by studs and screws.

8. The edge computing mini host with heat dissipation function according to claim 7, characterized in that: The upper cover, the middle frame and the bottom shell are connected by screws.

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