Storage chip direct insertion type protective storage device inner container water box

Abstract

The utility model discloses a storage chip direct insertion type protective storage device inner container water box which comprises a water box body and a water box sealing cover, the water box sealing cover comprises a sealing cover body, the sealing cover body is connected to the water box body, a closed water storage cavity is formed between the sealing cover body and the water box body, and the water storage cavity is connected with the water box body. The sealing cover body is provided with a flat cable leading-out seam, the flat cable leading-out seam is communicated with the water storage cavity, so that a memory chip is used for being accommodated and placed in the water storage cavity, and a flat cable of the memory chip penetrates through the flat cable leading-out seam to be led out. According to the storage chip direct insertion type protective storage liner water box, the storage chip is directly placed in the water storage cavity, and the flat cable is led out through the flat cable leading-out seam on the water box sealing cover, so that the internal space of the water storage cavity is not occupied, the capacity of the water storage cavity is large, and the protection effect is effectively enhanced; meanwhile, the overall structure is simple, machining and manufacturing are very convenient, and cost is reduced.

Description

Technical Field

[0001] The utility model relates to a direct-insertion protective memory liner water box of a memory chip. Background Art

[0002] At present, the main method of protecting the memory for vehicles is to "place" the memory chip in water or a phase change material containing water through a certain waterproof structure design, so as to ensure the safety of the memory chip for a certain period of time under the high temperature environment of the fire. At present, there are two main designs for realizing chip waterproofing and water box leak-proof protection memory. For example, Chinese patent CN103118509B discloses a method and device for improving the fireproof performance of a vehicle-mounted data recording device. The method is to first seal the vehicle-mounted data recording device in a waterproof shell, and then install the waterproof shell in an installation space surrounded by an upper constant temperature water shell and a lower constant temperature water shell. Another method is an automatic pressure relief valve and a data disaster recovery storage device including the same disclosed in Chinese patent CN112216313B. The method is to place the data storage device in a waterproof box and fix the waterproof box in the inner tank water box. The former is to sandwich the memory chip in the middle by using two upper and lower water boxes, and the latter is to place the memory chip in a waterproof box, and place the waterproof box in the center of the water box to achieve "placing" the memory chip inside the water. However, both structures have the disadvantages of having many structural parts and occupying a large space, resulting in a small internal water storage volume; and complex processing technology and high cost. Utility Model Content

[0003] The purpose of the utility model is to overcome the above-mentioned shortcomings of the prior art. The utility model provides a memory chip direct-insertion type protective memory liner water box.

[0004] The utility model is realized by the following technical solutions:

[0005] A protective memory liner water box with a memory chip inserted directly, comprising a water box body and a water box cover, wherein the water box cover comprises a cover body, the cover body is connected to the water box body, and a closed water storage cavity is formed between the cover body and the water box body, a cable lead-out seam is provided on the cover body, and the cable lead-out seam is communicated with the water storage cavity, so that a memory chip can be accommodated and placed in the water storage cavity, and the cable of the memory chip passes through the cable lead-out seam to be led outward.

[0006] Furthermore, the cable lead-out seam has sealant, so that the sealant is connected between the cable of the memory chip and the cover body to achieve sealing of the water storage cavity;

[0007] And / or, a sealing sleeve is provided in the cable lead-out seam, the sealing sleeve is sleeved on the cable of the memory chip, and the sealing sleeve is sealingly pressed between the cable of the memory chip and the cover body to achieve sealing of the water storage cavity.

[0008] Furthermore, the outer surfaces of the memory chip and the wiring of the memory chip located in the water storage cavity are sprayed with waterproof sealing material;

[0009] And / or, the water box body and the water box cover are injection molded separately, and the water box cover is bonded or welded to the water box body.

[0010] Furthermore, the water box cover also includes a groove structure, which is connected to the side of the cover body facing the water box body, and the groove structure is connected to the cable lead-out seam so that the cable of the memory chip passes through the cable lead-out seam and bends through the groove structure, and an elastic sealing rubber sleeve is provided on the outside of the cable in the groove structure.

[0011] Furthermore, the water box cover also includes a pressing block, which is connected to the groove structure so that the cable of the memory chip is bent and pressed between the groove structure and the pressing block to deform the elastic sealing rubber sleeve outside the cable.

[0012] Furthermore, the water box cover also includes a circuit board bracket, which is arranged on a side of the cover body facing the water box body and located in the water storage cavity, and the memory chip and / or the wiring of the memory chip are placed on or embedded in the circuit board bracket.

[0013] Further, the circuit board bracket is arranged at a central position of the cover body;

[0014] And / or, a bracket clip is provided in the water box body, and an end of the circuit board bracket away from the cover body is connected to the bracket clip.

[0015] Furthermore, a pressure relief valve cavity / pressure relief hole is provided on the water box cover, and a sealing device capable of relieving pressure under a certain temperature and pressure is provided at the pressure relief valve cavity / pressure relief hole by welding or bonding.

[0016] Further, the sealing device and the pressure relief valve cavity / pressure relief hole are cylindrical in shape, and the diameter of the sealing device is greater than the diameter of the pressure relief valve cavity / pressure relief hole;

[0017] Alternatively, the sealing device and the pressure relief valve cavity / pressure relief hole are in the shape of a cube, a cone or a sphere.

[0018] Further, the sealing device and the pressure relief valve cavity / pressure relief hole are in the shape of a stepped cylinder;

[0019] And / or, the sealing device and the pressure relief valve cavity / pressure relief hole are in the shape of a stepped cube, a cone or a sphere.

[0020] The beneficial effects of the utility model are:

[0021] The utility model discloses a memory chip direct-insertion protective memory liner water box, which places the memory chip directly in the water storage cavity, and leads the wiring to the outside through the wiring lead-out seam on the water box cover, thereby not occupying the internal space of the water storage cavity, achieving a large capacity of the water storage cavity and effectively enhancing the protective effect; at the same time, the overall structure is simple, the processing and manufacturing are very convenient, and the cost is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the exploded structure of the memory chip direct-insertion type protective memory liner water box when in use according to an embodiment of the utility model.

[0023] Figure 2 This is a schematic diagram of the exploded structure of the memory chip direct-insertion type protective memory liner water box according to an embodiment of the utility model.

[0024] Figure 3 This is a schematic diagram of the internal exploded structure of the memory chip direct-insertion type protective memory liner water box when in use according to an embodiment of the utility model.

[0025] Description of reference numerals:

[0026] Water box body 1

[0027] Bracket clip 11

[0028] Water box cover 2

[0029] Cover body 21

[0030] Cable outlet seam 211

[0031] Pressure relief hole 212

[0032] Groove structure 22

[0033] Briquetting 23

[0034] Circuit board bracket 24

[0035] Sealing device 3

[0036] Memory chip 100

[0037] Cable 101 DETAILED DESCRIPTION

[0038] The following descriptions of the embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be implemented.

[0039] like Figure 1 , Figure 2 and Figure 3 As shown, the present embodiment discloses a protective memory liner water box with a memory chip inserted directly, the protective memory liner water box with a memory chip inserted directly comprises a water box body 1 and a water box cover 2, the water box cover 2 comprises a cover body 21, the cover body 21 is connected to the water box body 1, and a closed water storage cavity is formed between the cover body 21 and the water box body 1, a cable lead-out seam 211 is provided on the cover body 21, the cable lead-out seam 211 is communicated with the water storage cavity, so that the memory chip 100 is used to be accommodated and placed in the water storage cavity, and the cable 101 of the memory chip 100 is led out through the cable lead-out seam 211.

[0040] In this embodiment, the cover body 21 is connected to the water box body 1 to form a closed whole and form a closed water storage cavity, which is used to store water. At the same time, the memory chip 100 is directly placed in the water storage cavity, and the cable 101 is led outward through the cable lead-out seam 211 on the water box cover 2. The water can be used to keep the temperature of the memory chip 100 at a safe temperature to prevent the memory chip 100 from being damaged by heat, and there is no need to set a structure for placing the memory chip 100 in the water storage cavity formed between the cover body 21 and the water box body 1, so that the internal space of the water storage cavity is not occupied, the capacity of the water storage cavity is large, and the protection effect is effectively enhanced; at the same time, the overall structure of the protective memory liner water box with direct insertion of the memory chip is simple, easy to form, small production loss, very convenient processing and manufacturing, and cost reduction.

[0041] In one embodiment, the cable lead-out slit 211 contains sealant, so that the sealant is connected between the cable 101 of the memory chip 100 and the cover body 21 to achieve sealing in the water storage cavity. The memory chip 100 is placed in the water storage cavity, and the cable 101 is led out through the cable lead-out slit 211, and then the cable lead-out slit 211 is bonded and sealed with the sealant, so that the cable 101 is connected and fixed to the water box cover 2 as a whole, and the installation and connection are convenient; and the water storage cavity is sealed by the sealant, and the sealing effect is enhanced.

[0042] In another embodiment, a sealing sleeve is provided in the cable lead-out seam 211, and the sealing sleeve is sleeved on the cable 101 of the memory chip 100, and the sealing sleeve is sealingly pressed between the cable 101 of the memory chip 100 and the cover body 21 to achieve sealing in the water storage cavity. By sealingly pressing the sealing sleeve between the cable 101 and the cover body 21, the water storage cavity is sealed and the sealing effect is enhanced. Among them, the sealing sleeve can be a rubber sleeve. The cable 101 can be made into a state of flexible crimping by a rubber sleeve or a sealant coating process, so as to further enhance the sealing performance of the structure.

[0043] In this embodiment, the outer surfaces of the memory chip 100 and the cable 101 of the memory chip 100 located in the water storage cavity are sprayed with waterproof sealing materials. The memory chip 100 and the cable 101 are sprayed with waterproof sealing materials to protect the circuit part. The cable 101 and the memory chip 100 and other parts located inside the water box body 1 and the water box cover 2 are waterproofed. The cover body 21 is connected to the water box body 1 to form a closed water storage cavity, forming a completely sealed and protective memory internal water box with circuit boards and leads configured with memory chips. The memory chip 100 and the cable 101 are in the water (containing liquid gel) in the water storage cavity. The circuit part is protected by spraying waterproof sealing materials on the outer surfaces of the memory chip 100 and the cable 101 located in the water storage cavity. Among them, the waterproof sealing material can be polytetrafluoroethylene or other waterproof materials.

[0044] In this embodiment, the water box cover 2 further includes a groove structure 22, which is connected to one side of the cover body 21 facing the water box body 1, and the groove structure 22 is connected to the cable lead-out seam 211, so that the cable 101 of the memory chip 100 passes through the cable lead-out seam 211 and bends through the groove structure 22. A groove structure 22 is provided on the inner side of the cover body 21 corresponding to the cable lead-out seam 211, and the cable 101 passes through the cable lead-out seam 211 and enters one side of the groove structure 22. After the cable 101 is bent and arranged in the groove structure 22, it extends into the water storage cavity from the other side of the groove structure 22. The groove structure 22 allows the cable 101 to be bent in the inner tank water box, effectively preventing the cable 101 from moving, and enhancing the sealing performance of the memory chip direct plug-in protective memory tank water box. At the same time, the biased outlet line is conducive to being led out from the seam of the heat insulation material during assembly.

[0045] The water box cover 2 also includes a pressing block 23, which is connected to the groove structure 22, so that the cable 101 of the memory chip 100 is bent and pressed between the groove structure 22 and the pressing block 23 to deform the elastic sealing rubber sleeve outside the cable 101. After the cable 101 is bent and set in the groove structure 22, the pressing block 23 is extended into the groove structure 22 and connected to the groove structure 22, so that the elastic sealing rubber sleeve sleeved on the outside of the cable 101 is pressed between the groove structure 22 and the pressing block 23, so that the cable 101 is always bent, and the cable 101 is further prevented from moving.

[0046] Furthermore, an elastic sealing rubber sleeve is provided outside the cable 101 in the groove structure 22, and after the pressing block 23 is pressed into the groove structure 22, the elastic sealing rubber sleeve can be deformed to further enhance the sealing effect. The pressing block 23 can be connected to the groove structure 22 by a combination of mechanical latching structure, glue bonding or welding, and the cable 101 is pressed between the two.

[0047] The water box cover 2 also includes a circuit board bracket 24, which is arranged on the side of the cover body 21 facing the water box body 1 and located in the water storage cavity. The memory chip 100 and / or the cable 101 of the memory chip 100 are placed or embedded on the circuit board bracket 24. The circuit board bracket 24 is arranged on the inner side of the cover body 21, and the cable 101 and the memory chip 100 are placed or embedded on the circuit board bracket 24, and then one or more waterproof spraying is performed, which can eliminate the shaking of the cable 101 and the memory chip 100 and effectively enhance the firmness of the waterproof spraying protective material. At the same time, when in use, the circuit board bracket 24 is located in the water storage cavity and plays a fixing role on the memory chip 100, so that the memory chip 100 is always located in the water storage cavity and in the water, so that the memory chip 100 is kept evenly heated and has higher stability.

[0048] The circuit board bracket 24 is arranged at the center of the cover body 21. One end of the circuit board bracket 24 is located at the center of the cover body 21, and the other end extends outward in the direction close to the water box body 1, so that the flat cable 101 is located in the middle of the inner tank water box and is always in the center position, which can make the internal memory chip 100 naturally centered, and further realize that the centering of the memory chip 100 can maintain uniform heating and higher stability.

[0049] In this embodiment, the circuit board bracket 24 is connected to the inner side of the cover body 21 and connected to the groove structure 22, thereby effectively strengthening the overall structural strength of the memory chip direct plug-in protective memory liner water box. The circuit board bracket 24 is connected to the center of the cover body 21, and the groove structure 22 is arranged at one end of the circuit board bracket 24 to realize the biased outlet line, which is convenient for leading out from the seam of the heat insulation material during assembly.

[0050] Of course, in other embodiments, the water box cover 2 may not include the groove structure 22, that is, the groove structure 22 is not set on the inner side of the cover body 21, and the cable lead-out seam 211 is directly set in the middle of the cover body 21. The cable 101 directly enters the inner water box from the cable lead-out seam 211 and is fixed to the cover body 21 by sealant, which can further simplify the structure and reduce costs.

[0051] The water box body 1 and the water box cover 2 can be made of metal or plastic material, and the cover body 21, the groove structure 22, the pressing block 23 and the circuit board bracket 24 can be made of metal or plastic material. The cover body 21, the groove structure 22 and the circuit board bracket 24 can be integrally formed by a one-time injection molding process, which can further simplify the structure and reduce the cost. The overall structure has high strength and high stability.

[0052] The water box body 1 has a bracket clip 11, and one end of the circuit board bracket 24 away from the cover body 21 is connected to the bracket clip 11. One end of the circuit board bracket 24 is connected to the cover body 21, and the other end is connected to the bracket clip 11, so that the circuit board bracket 24 is located in the middle of the water storage cavity, which can naturally center the internal memory chip 100. The centering of the memory chip 100 can maintain uniform heating and higher stability.

[0053] The water box body 1 and the water box cover 2 are injection molded separately, and the water box cover 2 can be bonded to the water box body 1. The water box body 1 and the water box cover 2 can be bonded to each other with a waterproof sealant, which is convenient to install and connect, and has good sealing performance.

[0054] The water box cover 2 can also be welded to the water box body 1. The water box body 1 and the water box cover 2 are sealed by ultrasonic or laser welding. This process has good sealing effect, simple process and strong product consistency.

[0055] The memory chip direct plug-in protective memory liner water box also includes a sealing device 3, and a pressure relief valve cavity / pressure relief hole 212 is provided on the water box cover 2. The sealing device 3 that can relieve pressure under a certain temperature and pressure is provided at the pressure relief valve cavity / pressure relief hole 212 by welding or bonding. The sealing device 3 is connected to the pressure relief valve cavity or the pressure relief hole 212 of the water box cover 2. The sealing device 3 has a pressure relief function. Through the sealing device 3, the hot steam in the liner water box will be discharged to the outside through the sealing device 3, thereby achieving the effect of pressure relief and temperature reduction, and ensuring the safety of the memory chip 100 in the memory chip direct plug-in protective memory liner water box.

[0056] Preferably, the sealing device 3 may be partially or entirely made of a low melting point alloy (easily fusible metal) material.

[0057] In one embodiment, the sealing device 3 and the pressure relief valve cavity / pressure relief hole 212 are in the shape of a cylinder, and the diameter of the sealing device 3 is larger than the diameter of the pressure relief valve cavity / pressure relief hole 212. The pressure relief valve cavity or the pressure relief hole 212 is optimized to be a hole in a cylinder, and the sealing device 3 is made into a cylinder that matches the pressure relief valve cavity or the pressure relief hole 212, and glue is applied on its surface, and the glue-coated sealing device 3 is inserted into the pressure relief valve cavity or the pressure relief hole 212 on the cover body 21. The uncured glue during assembly can play a lubricating role, making it easier to insert the sealing device 3 into and fill the pressure relief valve cavity or the pressure relief hole 212. After the glue is cured, the sealing performance of the contact surface between the sealing device 3 and the pressure relief valve cavity or the pressure relief hole 212 can be guaranteed. At the same time, the diameter of the sealing device 3 is designed to be slightly larger than the diameter of the pressure relief valve cavity or the pressure relief hole 212, and the elasticity of the plastic material is used to further enhance the sealing performance between the sealing device 3 and the cover body 21. The diameter of the pressure relief valve cavity or the pressure relief hole 212 can be 0.5mm to 8mm.

[0058] In another embodiment, the sealing device 3 and the pressure relief valve cavity / pressure relief hole 212 may also be in the shape of a cube, a cone or a sphere.

[0059] In this embodiment, the sealing device 3 and the pressure relief valve cavity / pressure relief hole 212 are in the shape of a stepped cylinder. The stepped cylindrical sealing device 3 will be inserted into the pressure relief valve cavity or the pressure relief hole 212 in a matching manner, which can make it easier to install and put the sealing device 3 in place. The connection strength of the sealing device 3 is higher and it is not easy to fall off. The change in diameter after the glue coating will further enhance the sealing. At the same time, this method eliminates the need for silver plating or similar processes, eliminates the pressure relief valve body components, and replaces them with alloy components. It also eliminates the production process of injecting low-melting-point metals into the pressure relief valve body, and has better sealing.

[0060] Of course, in other embodiments, the sealing device 3 and the pressure relief valve cavity / pressure relief hole 212 are in the shape of a stepped cube, a cone or a sphere.

[0061] The above disclosure is only a preferred embodiment of the present invention, and certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the claims of the present invention are still within the scope covered by the present invention.

Claims

1. A memory chip direct-insertion protective memory liner water box, characterized in that: It includes a water box body and a water box cover, wherein the water box cover includes a cover body, wherein the cover body is connected to the water box body, and a closed water storage cavity is formed between the cover body and the water box body, and a cable lead-out seam is provided on the cover body, wherein the cable lead-out seam is communicated with the water storage cavity so that a memory chip can be accommodated and placed in the water storage cavity, and the cable of the memory chip is led out through the cable lead-out seam.

2. The memory chip direct-insertion protective memory liner water box according to claim 1, characterized in that: The cable lead-out seam has a sealant therein, so that the sealant is connected between the cable of the memory chip and the cover body to achieve sealing of the water storage cavity; And / or, a sealing sleeve is provided in the cable lead-out seam, the sealing sleeve is sleeved on the cable of the memory chip, and the sealing sleeve is sealingly pressed between the cable of the memory chip and the cover body to achieve sealing of the water storage cavity.

3. The memory chip direct-insertion protective memory liner water box according to claim 1, characterized in that: The outer surfaces of the memory chip and the wiring of the memory chip located in the water storage cavity are sprayed with waterproof sealing material; And / or, the water box body and the water box cover are injection molded separately, and the water box cover is bonded or welded to the water box body.

4. The memory chip direct-insertion protective memory liner water box according to claim 1, characterized in that: The water box cover also includes a groove structure, which is connected to a side of the cover body facing the water box body, and the groove structure is connected to the cable lead-out seam so that the cable of the memory chip passes through the cable lead-out seam and bends through the groove structure, and an elastic sealing rubber sleeve is provided on the outside of the cable in the groove structure.

5. The memory chip direct-insertion protective memory liner water box according to claim 4, characterized in that: The water box cover also includes a pressing block, which is connected to the groove structure so that the cable of the memory chip is bent and pressed between the groove structure and the pressing block to deform the elastic sealing rubber sleeve outside the cable.

6. The memory chip direct-insertion protective memory liner water box according to claim 1, characterized in that: The water box cover also includes a circuit board bracket, which is arranged on a side of the cover body facing the water box body and located in the water storage cavity, and the memory chip and / or the wiring of the memory chip are placed on or embedded in the circuit board bracket.

7. The memory chip direct-insertion protective memory liner water box according to claim 6, characterized in that: The circuit board bracket is arranged at the center of the cover body; And / or, a bracket clip is provided in the water box body, and an end of the circuit board bracket away from the cover body is connected to the bracket clip.

8. The memory chip direct-insertion protective memory liner water box according to claim 1, characterized in that: The water box cover is provided with a pressure relief valve cavity / pressure relief hole, and a sealing device capable of relieving pressure under a certain temperature and pressure is provided at the pressure relief valve cavity / pressure relief hole in a welding or bonding manner.

9. The memory chip direct-insertion protective memory liner water box according to claim 8, characterized in that: The sealing device and the pressure relief valve cavity / pressure relief hole are cylindrical in shape, and the diameter of the sealing device is greater than the diameter of the pressure relief valve cavity / pressure relief hole; Alternatively, the sealing device and the pressure relief valve cavity / pressure relief hole are in the shape of a cube, a cone or a sphere.

10. The memory chip direct-insertion protective memory liner water box according to claim 8, characterized in that: The sealing device and the pressure relief valve cavity / pressure relief hole are in the shape of a stepped cylinder; And / or, the sealing device and the pressure relief valve cavity / pressure relief hole are in the shape of a stepped cube, a cone or a sphere.

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