Computer graphics card radiator device with liquid cooling heat dissipation function

Abstract

The utility model discloses a computer graphics card radiator device with a liquid cooling heat dissipation function. The computer graphics card radiator device comprises an in-bin heat dissipation device and an out-bin heat dissipation device. The in-granary heat dissipation device and the out-granary heat dissipation device are connected through a first liquid flow pipe and a second liquid flow pipe; the heat dissipation device outside the warehouse comprises an aluminum alloy frame, an electric pump and a heat dissipation fan. The in-cabin heat dissipation device is arranged in the computer, and the out-cabin heat dissipation device is arranged outside the computer, so that the temperature heat of a computer video card is transmitted to the out-cabin heat dissipation device for cooling, and then cooled liquid is transmitted back to the in-cabin heat dissipation device. The liquid cooling radiator device not only improves the radiating efficiency and stability of a computer system, but also has obvious advantages in the aspects of noise control, space utilization and personalized design, and meets the requirements of modern computer users for high performance and high reliability.

Description

Technical Field

[0001] The utility model relates to the field of computer heat dissipation, in particular to a computer graphics card radiator device with liquid cooling. Background Art

[0002] A liquid cooler is a device used to dissipate heat from a computer graphics card. As modern computer hardware performance continues to improve, the computing power and speed of graphics cards are also increasing. These advances have led to higher power consumption and heat generation. The limitations of traditional air coolers include:

[0003] Air-cooled radiators rely on fans to remove heat from the heat sink, but as the power of graphics cards increases, the effect of air cooling becomes increasingly difficult to meet the cooling needs of high-performance graphics cards.

[0004] In order to enhance the heat dissipation effect, the air cooling system often requires a fan to run at high speed, which will generate loud noise and affect the user experience.

[0005] High-efficiency air-cooled radiators are usually large in size and take up space inside the chassis, affecting the layout and installation of other hardware.

[0006] The advantages of liquid cooling technology include:

[0007] The liquid cooling system removes heat through liquid circulation. The heat capacity of liquid is much larger than that of air, and it can absorb and conduct heat more efficiently, making it suitable for graphics cards that generate high heat.

[0008] The pumps and fans of liquid cooling systems generally run at lower speeds, which produces significantly less noise than high-speed fans.

[0009] The radiator of the liquid cooling system can be installed outside the chassis and connected through water pipes, which reduces the space occupied inside the chassis and makes the hardware layout more flexible.

[0010] Therefore, it is necessary to propose a computer graphics card radiator device with liquid cooling. Utility Model Content

[0011] In response to the above technical problems, the utility model proposes a computer graphics card radiator device with liquid cooling. Through an integrated liquid cooling system, a water pump, a water cooling head and a radiator are integrated together, which is easier to install and suitable for ordinary users. It can provide a more efficient and quieter heat dissipation effect and meet the high performance requirements of modern computer hardware.

[0012] The technical solution used in the utility model is: a computer graphics card radiator device with liquid cooling and heat dissipation, characterized in that it includes an in-bin heat dissipation device and an out-bin heat dissipation device; the in-bin heat dissipation device is connected to the out-bin heat dissipation device through a first liquid flow tube and a second liquid flow tube; the out-bin heat dissipation device includes an aluminum alloy frame, an electric pump and a cooling fan; the in-bin heat dissipation device includes a left heat dissipation bin, a right heat dissipation bin and a bin bolt; the electric pump is detachably mounted on the back side of the aluminum alloy frame; the cooling fan is detachably mounted on the front side of the aluminum alloy frame; a plurality of toothed heat dissipation fins are arranged on the front side of the aluminum alloy frame; the interior of the aluminum alloy frame is arranged as a hollow structure; the hollow structure is filled with liquid; one end of the first liquid flow tube is detachably connected to the upper side of the aluminum alloy frame; one end of the first and second liquid flow tubes is detachably connected to the north side of the aluminum alloy frame; the heat dissipation left bin includes a left bin copper tube, a left bin copper tube lower interface, a left bin copper tube upper interface, a bin lower buckle, and a bin upper buckle; the heat dissipation The right bin includes a right bin copper tube, a right bin copper tube lower interface, and a right bin copper tube upper interface; the left heat dissipation bin and the right heat dissipation bin are detachably connected through a plurality of bin bolts; the left bin copper tube is arranged inside the left heat dissipation bin; the right bin copper tube is arranged inside the right heat dissipation bin; the left bin copper tube and the right bin copper tube are in an S-winding shape; the left bin copper tube lower interface is arranged at the lower left of the left heat dissipation bin and connected to the left bin copper tube; the left bin copper tube upper interface is arranged at the upper left of the left heat dissipation bin and connected to the left bin copper tube The left bin copper tube is connected; the lower interface of the right bin copper tube is arranged at the lower right of the heat dissipation right bin and is connected to the right bin copper tube; the upper interface of the right bin copper tube is arranged at the upper right of the heat dissipation right bin and is connected to the right bin copper tube; the lower bin buckle is arranged directly below the heat dissipation left bin; the upper bin buckle is arranged at the lower left of the heat dissipation left bin; the upper interface (13-2) of the left bin copper tube and the upper interface (14-2) of the right bin copper tube are detachably connected to the other end of the first liquid flow tube (3);

[0013] The left bin copper tube lower interface (13-1) and the right bin copper tube lower interface (14-1) are detachably connected to the other end of the second liquid flow tube (4).

[0014] Furthermore, the heat generated by the heat dissipation device inside the warehouse is transmitted to the heat dissipation device outside the warehouse by the first liquid flow pipe, and after being heat-dissipated by the heat dissipation device outside the warehouse, is transmitted back to the heat dissipation device inside the warehouse by the second liquid flow pipe.

[0015] Furthermore, it also includes a power supply unit, a main control unit, an electric pump, a temperature sensor, a fan, a display unit and a communication interface; the main control unit is the core controller of the entire liquid cooling system, which is responsible for coordinating and managing the work of all other functional units; the electric pump is used to promote the circulation of coolant in the cooling system; the temperature sensor is used to measure the temperature of key parts in the system; the fan is used to assist in heat dissipation and dissipate the heat in the radiator into the air; the display unit is used to display the operating status and temperature information of the system; the communication interface is used to realize data exchange between the cooling system and the computer motherboard or user equipment; the power supply unit is used to supply power to other functional units.

[0016] Compared with the prior art, the utility model has the following beneficial effects: by arranging an internal heat dissipation device inside the computer and an external heat dissipation device outside the computer, the temperature and heat of the computer graphics card are transferred to the external heat dissipation device for cooling, and then the cooled liquid is transferred back to the internal heat dissipation device. The liquid cooling radiator device not only improves the heat dissipation efficiency and stability of the computer system, but also has obvious advantages in noise control, space utilization and personalized design, meeting the needs of modern computer users for high performance and high reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural diagram of a computer graphics card heat dissipation device with liquid cooling according to the present invention.

[0018] Figure 2 It is a structural diagram of a computer graphics card cooling device with liquid cooling according to the present invention.

[0019] Figure 3 This is a detailed diagram of the computer graphics card cooling device with liquid cooling according to the present invention.

[0020] Figure 4 This is a functional diagram of a computer graphics card cooling device with liquid cooling according to the present invention.

[0021] Figure markings: 1-heat dissipation device inside the warehouse, 2-heat dissipation device outside the warehouse, 3-first liquid flow pipe 3, 4-second liquid flow pipe, 11-1 heat dissipation left warehouse, 11-2 heat dissipation right warehouse, 12-1 left warehouse copper tube, 12-2-right warehouse copper tube, 13-1-lower interface of left warehouse copper tube, 13-2-upper interface of left warehouse copper tube, 14-1-lower interface of right warehouse copper tube, 14-2-upper interface of right warehouse copper tube, 15-1-lower buckle of warehouse position, 15-2-upper buckle of warehouse position, 16-warehouse bolt, 21-aluminum alloy frame, 22-electric pump, 23-cooling fan. DETAILED DESCRIPTION

[0022] The present invention is described in detail below in conjunction with the accompanying drawings. The technical solutions in the embodiments of the present invention are clearly and completely described below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0023] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0024] like Figure 2 As shown, a computer graphics card radiator device with liquid cooling includes an in-bin cooling device 1 and an out-bin cooling device 2.

[0025] The heat dissipation device 1 inside the warehouse is connected to the heat dissipation device 2 outside the warehouse through a first liquid flow pipe 3 and a second liquid flow pipe 4.

[0026] It should be noted that the heat generated by the heat dissipation device 1 inside the warehouse is transmitted to the heat dissipation device 2 outside the warehouse by the first liquid flow pipe 3, and after heat dissipation treatment by the heat dissipation device outside the warehouse, it is transmitted back to the heat dissipation device 1 inside the warehouse by the second liquid flow pipe 4.

[0027] like Figure 1 As shown, the external heat dissipation device 2 includes an aluminum alloy frame 21, an electric pump 22 and a heat dissipation fan 23.

[0028] The electric pump 22 is detachably mounted on the back side of the aluminum alloy frame 21 .

[0029] The heat dissipation fan 23 is detachably mounted on the front side of the aluminum alloy frame 21 .

[0030] A plurality of tooth-shaped heat sinks are provided on the front side of the aluminum alloy frame 21 .

[0031] The interior of the aluminum alloy frame 21 is configured as a hollow structure; the hollow structure is filled with liquid.

[0032] One end of the first liquid flow tube 3 is detachably connected to the upper side of the aluminum alloy frame 21 .

[0033] One end of the second liquid flow pipe 4 is detachably connected to the north side of the aluminum alloy frame 21 .

[0034] It can be understood that the first liquid flow pipe draws hot liquid from the heat dissipation device in the warehouse, and after physical heat dissipation by the toothed heat sink of the aluminum alloy frame 21 and heat extraction by the cooling fan, the heat dissipation device outside the warehouse sends the heat-dissipated liquid back to the heat dissipation device in the warehouse, and the cycle operation is carried out.

[0035] like Figure 3 As shown, the heat dissipation device 1 in the bin includes a left heat dissipation bin 11 - 1 , a right heat dissipation bin 11 - 2 and a bin bolt 16 .

[0036] The heat dissipation left bin 11 - 1 includes a left bin copper tube 12 - 1 , a left bin copper tube lower interface 13 - 1 , a left bin copper tube upper interface 13 - 2 , a bin lower buckle 15 - 1 , and a bin upper buckle 15 - 2 .

[0037] The heat dissipation right bin 11 - 2 includes a right bin copper tube 12 - 2 , a right bin copper tube lower interface 14 - 1 , and a right bin copper tube upper interface 14 - 2 .

[0038] The left heat dissipation bin 11 - 1 and the right heat dissipation bin 11 - 2 are detachably connected via a plurality of bin bolts 16 .

[0039] The left bin copper tube 12 - 1 is arranged inside the left heat dissipation bin 11 - 1 .

[0040] The right bin copper tube 12 - 2 is arranged inside the heat dissipation right bin 11 - 2 .

[0041] The left copper tube 12 - 1 and the right copper tube 12 - 2 are in an S-winding shape.

[0042] The left bin copper tube lower interface 13 - 1 is arranged at the lower left of the left heat dissipation bin 11 - 1 and is connected to the left bin copper tube 12 - 1 .

[0043] The left bin copper tube upper interface 13 - 2 is arranged at the upper left of the left heat dissipation bin 11 - 1 and is connected to the left bin copper tube 12 - 1 .

[0044] The right bin copper tube lower interface 14 - 1 is arranged at the lower right side of the heat dissipation right bin 11 - 2 and is connected to the right bin copper tube 12 - 2 .

[0045] The upper interface 14 - 2 of the right bin copper tube is arranged at the upper right of the heat dissipation right bin 11 - 2 and is connected to the right bin copper tube 12 - 2 .

[0046] The lower compartment buckle 15 - 1 is arranged directly below the left heat dissipation compartment 11 - 1 .

[0047] The upper compartment buckle 15 - 2 is arranged at the lower left of the left heat dissipation compartment 11 - 1 .

[0048] It is understandable that the bin bolt connects the left heat dissipation bin and the right heat dissipation bin, and the left heat dissipation bin and the right heat dissipation bin can be opened or closed through the bin bolt. When the left heat dissipation bin and the right heat dissipation bin are in a closed state, a heat dissipation device in the bin is formed.

[0049] It can be understood that after the left heat dissipation compartment and the right heat dissipation compartment are closed, the left heat dissipation compartment and the right heat dissipation compartment are closed and consolidated by the upper compartment buckle and the lower compartment buckle, so that it is not easy to shift or have gaps.

[0050] It should be noted that the upper interface 13 - 2 of the left bin copper tube and the upper interface 14 - 2 of the right bin copper tube are detachably connected to the other end of the first liquid flow tube 3 .

[0051] It should be noted that the left-bin copper tube lower interface 13 - 1 and the right-bin copper tube lower interface 14 - 1 are detachably connected to the other end of the second liquid flow tube 4 .

[0052] It is understood that when the left heat dissipation chamber and the right heat dissipation chamber are in a closed state, the closed interface formed by the upper interface of the left chamber copper tube and the upper interface of the right chamber copper tube can be connected to the first liquid flow tube. It is understood that the first liquid flow tube can be a double-ported liquid flow tube that can be connected to two interfaces at the same time.

[0053] It is understood that when the left heat dissipation chamber and the right heat dissipation chamber are in a closed state, the closed interface formed by the lower interface of the left chamber copper tube and the lower interface of the right chamber copper tube can be connected to the second liquid flow tube. It is understood that the second liquid flow tube can be a double-ported liquid flow tube that can be connected to two interfaces at the same time.

[0054] as follows Figure 3 As shown, a computer graphics card radiator device with liquid cooling has a specific electrical control function structure including a power supply unit, a main control unit, an electric pump, a temperature sensor, a fan, a display unit and a communication interface.

[0055] The main control unit is the core controller of the entire liquid cooling system, responsible for coordinating and managing the work of all other functional units.

[0056] It can be understood that the temperature sensor data is monitored, the operating speed of the electric pump is controlled, the fan speed is adjusted, the system fault detection and processing is managed, and data exchange and status reporting are carried out with the user or host system through the communication interface.

[0057] The electric pump is used to promote the circulation of the coolant in the heat dissipation system.

[0058] It is understood that ensuring the coolant flows within the system, taking away the heat generated by the graphics card and transferring it to the radiator (cold row) for heat dissipation. The operating speed of the electric pump is usually dynamically adjusted by the main control unit based on the data of the temperature sensor to optimize the heat dissipation efficiency and system noise.

[0059] The temperature sensor is used to measure the temperature of key parts in the system.

[0060] It is understood that providing real-time temperature data to the main control unit enables it to adjust the operating status of the electric pump and fan according to temperature changes, ensuring that the system always maintains the best heat dissipation performance under different loads. The temperature includes graphics card temperature, coolant temperature, radiator temperature, etc.

[0061] The fan is used to assist in heat dissipation and dissipate the heat in the cooling row into the air.

[0062] It is understood that the fan speed is controlled by the main control unit and adjusted according to the data of the temperature sensor to balance the heat dissipation effect and the noise level. When the system temperature is high, the fan speed increases to enhance heat dissipation; when the system temperature is low, the fan speed decreases to reduce noise.

[0063] The display unit is used to display the operating status and temperature information of the system.

[0064] Understandably, the purpose is to provide a user interface that allows users to view system parameters such as temperature, pump speed, fan speed, etc. in real time, which helps users understand the working status of the cooling system and make necessary adjustments or maintenance.

[0065] The communication interface is used to realize data exchange between the cooling system and the computer mainboard or user equipment.

[0066] It is understandable that the main control unit can receive control instructions from the host or send status reports to the host by connecting to the host system through interfaces such as USB, I2C, and UART. The communication interface can also be used for software updates and system debugging to enhance the manageability and maintainability of the system.

[0067] The power supply unit is used to supply power to other functional units.

[0068] It is understandable that the specific workflow includes:

[0069] System startup: The main control unit initializes, starts the electric pump and fan, and begins reading the data from the temperature sensor.

[0070] Temperature monitoring: The temperature sensor monitors the temperature of the graphics card and other components in real time and feeds the data back to the main control unit.

[0071] Dynamic adjustment: The main control unit adjusts the flow rate of the electric pump and the speed of the fan according to the temperature data to ensure that the cooling system maintains the best cooling effect under different loads.

[0072] User interaction: Through the display unit and communication interface, the user can view the status of the cooling system in real time and make necessary settings and adjustments.

[0073] Fault detection and handling: The main control unit continuously monitors the operating status of each part of the system. When a fault is detected (such as pump failure, fan failure or overtemperature), it will take appropriate measures (such as alarm, speed reduction or shutdown) to protect the system.

[0074] Through the coordinated work of the above functional units, the liquid cooling system can effectively maintain the low temperature operation of the computer graphics card under high load, ensuring the stability and performance of the system while providing a good user experience.

[0075] This embodiment is only a preferred technical solution of the utility model and should not be regarded as a limitation of the utility model. The protection scope of the utility model shall be the technical solution recorded in the claims, including the equivalent replacement solution of the technical features in the technical solution recorded in the claims. That is, equivalent replacement improvements within this scope are also within the protection scope of the utility model, and any changes that can be thought of by technicians in this field should fall within the protection scope of this application.

Claims

1. A computer graphics card radiator device with liquid cooling, characterized in that: It comprises an in-bin heat dissipation device (1) and an out-bin heat dissipation device (2); The heat dissipation device (1) inside the warehouse is connected to the heat dissipation device (2) outside the warehouse via a first liquid flow pipe (3) and a second liquid flow pipe (4); The external heat dissipation device (2) comprises an aluminum alloy frame (21), an electric pump (22) and a heat dissipation fan (23); The in-bin heat dissipation device (1) comprises a left heat dissipation bin (11-1), a right heat dissipation bin (11-2) and a bin bolt (16); The electric pump (22) is detachably mounted on the back side of the aluminum alloy frame (21); The heat dissipation fan (23) is detachably mounted on the front side of the aluminum alloy frame (21); A plurality of tooth-shaped heat sinks are arranged on the front side of the aluminum alloy frame (21); The interior of the aluminum alloy frame (21) is configured as a hollow structure; the hollow structure is filled with liquid; One end of the first liquid flow pipe (3) is detachably connected to the upper side of the aluminum alloy frame (21); One end of the second liquid flow pipe (4) is detachably connected to the north side of the aluminum alloy frame (21); The heat dissipation left bin (11-1) comprises a left bin copper tube (12-1), a left bin copper tube lower interface (13-1), a left bin copper tube upper interface (13-2), a bin lower buckle (15-1), and a bin upper buckle (15-2); The heat dissipation right bin (11-2) comprises a right bin copper tube (12-2), a right bin copper tube lower interface (14-1), and a right bin copper tube upper interface (14-2); The left heat dissipation bin (11-1) and the right heat dissipation bin (11-2) are detachably connected via a plurality of bin bolts (16); The left bin copper tube (12-1) is arranged inside the left heat dissipation bin (11-1); The right bin copper tube (12-2) is arranged inside the heat dissipation right bin (11-2); The left warehouse copper tube (12-1) and the right warehouse copper tube (12-2) are in an S-winding shape; The left bin copper tube lower interface (13-1) is arranged at the lower left side of the left heat dissipation bin (11-1) and is connected to the left bin copper tube (12-1); The left bin copper tube upper interface (13-2) is arranged at the upper left of the left heat dissipation bin (11-1) and is connected to the left bin copper tube (12-1); The right bin copper tube lower interface (14-1) is arranged at the lower right side of the heat dissipation right bin (11-2) and is connected to the right bin copper tube (12-2); The upper interface (14-2) of the right bin copper tube is arranged at the upper right side of the heat dissipation right bin (11-2) and is connected to the right bin copper tube (12-2); The lower compartment buckle (15-1) is arranged directly below the left heat dissipation compartment (11-1); The upper compartment buckle (15-2) is arranged at the lower left of the left heat dissipation compartment (11-1); The upper interface (13-2) of the left bin copper tube and the upper interface (14-2) of the right bin copper tube are detachably connected to the other end of the first liquid flow tube (3); The left bin copper tube lower interface (13-1) and the right bin copper tube lower interface (14-1) are detachably connected to the other end of the second liquid flow tube (4).

2. A computer graphics card radiator device with liquid cooling according to claim 1, characterized in that: The heat generated by the heat dissipation device (1) inside the warehouse is transferred to the heat dissipation device (2) outside the warehouse by the first liquid flow pipe (3), and after heat dissipation treatment by the heat dissipation device outside the warehouse, is transferred back to the heat dissipation device (1) inside the warehouse by the second liquid flow pipe (4).

3. A computer graphics card radiator device with liquid cooling according to claim 2, characterized in that: It also includes a power supply unit, a main control unit, an electric pump, a temperature sensor, a fan, a display unit and a communication interface; The main control unit is the core controller of the entire liquid cooling system, responsible for coordinating and managing the work of all other functional units; The electric pump is used to promote the circulation of the coolant in the heat dissipation system; The temperature sensor is used to measure the temperature of key parts in the system; The fan is used to assist in heat dissipation and dissipate the heat in the cooling row into the air; The display unit is used to display the operating status and temperature information of the system; The communication interface is used to realize data exchange between the cooling system and the computer motherboard or user equipment; The power supply unit is used to supply power to other functional units.

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