High-integration heat dissipation touch screen

Abstract

The utility model provides a high-integration heat dissipation touch screen applied to the field of touch screens, which comprises an ITO (indium tin oxide) layer and an LCM (liquid crystal module) layer, and a signal transmission module is fixed between the ITO layer and the LCM layer; the side, opposite to the LCM layer, of the ITO layer is provided with sealant, a liquid cooling heat dissipation module is fixed to the ITO layer through the sealant, and the liquid cooling heat dissipation module and the ITO layer are oppositely combined to wrap the LCM layer. In the actual use process, the purposes of circulating cooling and heat dissipation are achieved through reciprocating motion and swing of the first sealing plate and the second sealing plate, the heat dissipation structure is flat, operation noise is low, and the service life of the liquid cooling heat dissipation module is prolonged. And the operation heat dissipation efficiency of the LCM layer can be effectively improved, the market prospect is achieved, and application and popularization are facilitated.

Description

Technical Field

[0001] The present application relates to the field of touch screens, and in particular to a highly integrated heat dissipation touch screen. Background Art

[0002] A touch screen is a display device that can be operated by direct touch and is widely used in smart phones, tablet computers, computer monitors, many home appliances, and industrial control equipment.

[0003] Touch screens usually contain a variety of electronic components, such as display drivers, touch sensors, and other circuit components. During normal operation, these components generate heat. Excessive temperature may affect the performance of the electronic components, causing the touch screen to malfunction, respond slowly, or fail.

[0004] Traditional touch screens use self-heating or fan-heating methods, which have low heat dissipation efficiency and high operating noise. Therefore, a highly integrated heat dissipation touch screen is proposed. Utility Model Content

[0005] The purpose of the present application is to solve the technical problems of low heat dissipation efficiency and high operating noise in the existing touch screen heat dissipation method. Compared with the existing technology, a highly integrated heat dissipation touch screen is provided, including an ITO layer and an LCM layer, a signal transmission module is fixed between the ITO layer and the LCM layer, the signal transmission module includes a controller chip, the input end of the controller chip is connected to a first terminal through a flexible circuit board, the output end of the controller chip is connected to a second terminal through a flexible circuit board, an electromagnetic film is provided on the flexible circuit board, and a reinforcing steel sheet is fixed on the controller chip;

[0006] A sealant is provided on the side of the ITO layer opposite to the LCM layer, a liquid cooling and heat dissipation module is fixed to the ITO layer through the sealant, and the liquid cooling and heat dissipation module is aligned with the ITO layer and covers the LCM layer.

[0007] Furthermore, the liquid-cooled heat dissipation module includes a heat insulation plate, and two groups of separately arranged heat dissipation plates are provided on the side of the heat insulation plate away from the LCM layer, and two groups of heat dissipation grooves are provided on the side of the heat insulation plate opposite to the heat dissipation plate. A heat conductive film is glued to the side of the heat insulation plate opposite to the LCM layer, and a main liquid tank is provided between the heat conductive film and the heat insulation plate. A connecting hole connected to the main liquid tank is provided on the heat insulation plate, and a circulation mechanism matching it is provided in the connecting hole.

[0008] Furthermore, the heat-conductive film is an elastic heat-conductive silicone film structure, the heat-conductive film has a torsion force close to the heat insulation plate, and the space between the heat-conductive film and the heat insulation plate is filled with coolant.

[0009] Furthermore, the heat sink is a copper foil structure, and the heat sink is glued to the heat insulation board by thermally conductive silicone.

[0010] Furthermore, a sealing groove is provided between the heat dissipation slot group and the connecting hole, and the circulation mechanism includes a first sealing plate and a second sealing plate, a folded angle is provided between the first sealing plate and the second sealing plate, and sealing rubber strips matching the sealing groove are fixed on the first sealing plate and the second sealing plate, a first elastic sheet is fixed on one side of the first sealing plate, and a second elastic sheet is fixed on the side of the second sealing plate away from the first elastic sheet, and the first elastic sheet and the second elastic sheet are both fixed on the insulation board, a first thermistor is fixed on one side of the first elastic sheet, and a second thermistor is fixed on one side of the second elastic sheet, and the first thermistor and the second thermistor extend into the corresponding heat dissipation slot group respectively.

[0011] Furthermore, the first elastic sheet and the second elastic sheet have a torque that drives the first sealing plate to approach the connecting hole, the sealing strip on the second sealing plate has a built-in electromagnetic sheet, and the electromagnetic sheet has a magnetic attraction force on the sealing groove when power is on, and a supporting protrusion is fixed on the side of the second sealing plate opposite to the thermal conductive film.

[0012] Compared with the prior art, the advantages of this application are:

[0013] During actual use, the present application utilizes the reciprocating swinging motion of the first sealing plate and the second sealing plate to achieve the purpose of circulating cooling and heat dissipation. Since no motor fan is used for heat dissipation, the heat dissipation structure is flattened and the operating noise is low, which can effectively improve the operating heat dissipation efficiency of the LCM layer. It has market prospects and is suitable for promotion and application. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the structure of this application;

[0015] Figure 2 This is a schematic diagram of the explosion structure of this application;

[0016] Figure 3 This is a schematic diagram of the structure of the signal transmission module proposed in this application;

[0017] Figure 4 This is a schematic diagram of the structure of the liquid cooling module proposed in this application;

[0018] Figure 5 This is a schematic diagram of the exploded structure of the liquid cooling module proposed in this application;

[0019] Figure 6 It is a schematic diagram of the arrangement of the heat sink group proposed in this application;

[0020] Figure 7 It is a structural schematic diagram of the circulation mechanism proposed in this application;

[0021] Figure 8It is a schematic cross-sectional structure diagram of the liquid cooling module proposed in this application;

[0022] Fig. 9 for Figure 8 Schematic diagram of the enlarged structure of part A in the middle.

[0023] Description of the numbers in the figure:

[0024] ITO layer 1, sealant 11, signal transmission module 2, first terminal 21, second terminal 22, controller chip 23, reinforcing steel sheet 24, electromagnetic film 25, LCM layer 3, liquid cooling heat dissipation module 4, heat dissipation plate 41, heat insulation plate 42, heat dissipation slot group 43, sealing slot 431, circulation mechanism 45, first sealing plate 451, first elastic sheet 4511, first thermistor 4512, second sealing plate 452, second elastic sheet 4521, second thermistor 4522, sealing rubber strip 453, supporting bump 454, main liquid tank 46, connecting hole 461, thermal conductive film 47. DETAILED DESCRIPTION

[0025] The embodiments will be combined with the drawings in the specification to clearly and completely describe the technical solution of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making any creative work shall fall within the scope of protection of the present application.

[0026] Embodiment 1:

[0027] The utility model provides a highly integrated heat dissipation touch screen, please refer to Figure 1 - Fig. 9 , including an ITO layer 1 and an LCM layer 3, a signal transmission module 2 is fixed between the ITO layer 1 and the LCM layer 3, the signal transmission module 2 includes a controller chip 23, the model of the controller chip 23 is FT5426-003, the input end of the controller chip 23 is connected to a first terminal 21 through a flexible circuit board, the output end of the controller chip 23 is connected to a second terminal 22 through a flexible circuit board, the first terminal 21 is electrically connected to the controller chip 23 using a conductive double-sided adhesive tape, the use of a conductive double-sided adhesive tape can simplify the assembly process, reduce or eliminate the process required for traditional welding, and improve production efficiency, in order to prevent the flexible circuit board from being distorted or lost due to electromagnetic interference in a high-frequency signal transmission environment, an electromagnetic film 25 is provided on the flexible circuit board, the use of the electromagnetic film 25 can improve the stability and integrity of the signal, and a reinforcing steel sheet 24 is fixed on the controller chip 23;

[0028] A sealant 11 is provided on one side of the ITO layer 1 opposite to the LCM layer 3 , and a liquid cooling module 4 is fixed to the ITO layer 1 through the sealant 11 . The liquid cooling module 4 and the ITO layer 1 are matched to cover the LCM layer 3 .

[0029] See also Figure 1 - Fig. 9 The liquid cooling module 4 includes a heat insulation plate 42. Two groups of heat dissipation plates 41 are arranged separately on the side of the heat insulation plate 42 away from the LCM layer 3. Two groups of heat dissipation groove groups 43 are arranged on the side of the heat insulation plate 42 opposite to the heat dissipation plate 41. A heat conductive film 47 is glued to the side of the heat insulation plate 42 opposite to the LCM layer 3. A main liquid tank 46 is arranged between the heat conductive film 47 and the heat insulation plate 42. A connecting hole 461 connected to the main liquid tank 46 is arranged on the heat insulation plate 42. A circulation mechanism 45 matching with the connecting hole 461 is arranged in the connecting hole 461.

[0030] It should be noted that the thermally conductive film 47 is an elastic thermally conductive silicone film structure, the thermally conductive film 47 has a torsion close to the thermal insulation plate 42, the thermally conductive film 47 and the thermal insulation plate 42 are filled with coolant, the heat sink 41 is a copper foil structure, and the heat sink 41 is glued to the thermal insulation plate 42 by thermally conductive silicone.

[0031] Furthermore, a blocking groove 431 is further provided between the heat dissipation groove group 43 and the connecting hole 461, and the circulation mechanism 45 includes a first sealing plate 451 and a second sealing plate 452, and a folded angle is provided between the first sealing plate 451 and the second sealing plate 452, and a blocking rubber strip 453 matching the blocking groove 431 is fixed to the first sealing plate 451 and the second sealing plate 452, and a first elastic sheet 4511 is fixed to one side of the first sealing plate 451, and a second elastic sheet 4521 is fixed to the side of the second sealing plate 452 away from the first elastic sheet 4511, and the first elastic sheet 4511 and the second elastic sheet 4521 are both fixed to the heat insulation board 42, and the first A first thermistor 4512 is fixed to one side of the elastic sheet 4511, and a second thermistor 4522 is fixed to one side of the second elastic sheet 4521. The first thermistor 4512 and the second thermistor 4522 extend into corresponding heat dissipation slot groups 43 respectively, wherein the first elastic sheet 4511 and the second elastic sheet 4521 have a torque for driving the first sealing plate 451 to approach the connecting hole 461, and a sealing rubber strip 453 on the second sealing plate 452 has an electromagnetic sheet built in, which has a magnetic attraction to the sealing slot 431 when power is on, and a support protrusion 454 is fixed to the side of the second sealing plate 452 opposite to the thermal conductive film 47.

[0032] In actual use, the first sealing plate 451 is fitted into the connecting hole 461 by the torsion force of the first elastic sheet 4511 and the second elastic sheet 4521. Since there is a folded angle between the first sealing plate 451 and the second sealing plate 452, when the first sealing plate 451 fits the connecting hole 461, the second sealing plate 452 is away from the connecting hole 461, so that the heat dissipation slot group 43 on the side of the first sealing plate 451 is not connected with the main liquid tank 46, while the heat dissipation slot group 43 on the side of the second sealing plate 452 is connected with the main liquid tank 46. When the temperature of the coolant in the main liquid tank 46 rises, the first thermistor 4512 detects the temperature rise, and the controller energizes the electromagnetic sheet on one side of the second sealing plate 452, so that the second sealing plate 452 overcomes the torsion of the first elastic sheet 4511 and the second elastic sheet 4521 and approaches the connecting hole 461. At this time, the first sealing plate 451 is away from the connecting hole 461, so that the heat dissipation slot group 43 on one side of the first sealing plate 451 is connected to the main liquid tank 46, and the heat dissipation slot group 43 on one side of the second sealing plate 452 is connected to the main liquid tank 46. 43 is not connected with the main liquid tank 46. Since the coolant in the heat sink group 43 on the first sealing plate 451 side is closed at the initial node and has been cooled separately by the corresponding heat sink 41, the temperature of the coolant in the heat sink group 43 on the first sealing plate 451 side is lower than the temperature of the coolant in the main liquid tank 46. When the heat sink group 43 on the first sealing plate 451 side is connected with the main liquid tank 46, the two groups of coolants with different temperatures exchange heat. When the temperature of the coolant in the heat sink group 43 on the first sealing plate 451 side and the main liquid tank 46 increases, it is detected by the second thermistor 4522, and the electromagnetic sheet on the second sealing plate 452 is reversely controlled to cut off the power, and the torsion of the first elastic sheet 4511 and the second elastic sheet 4521 is used to fit the first sealing plate 451 again in the connecting hole 461, and this reciprocating process is performed to achieve the purpose of circulating cooling and heat dissipation. Since no motor fan is used for heat dissipation, the heat dissipation structure is flattened and the operating noise is low. It can effectively improve the operating heat dissipation efficiency of the LCM layer 3, has market prospects, and is suitable for promotion and application.

[0033] The above is only the best implementation method adopted by this application in combination with current actual needs, but the protection scope of this application is not limited to this.

Claims

1. A highly integrated heat dissipation touch screen, comprising an ITO layer (1) and an LCM layer (3), characterized in that: A signal transmission module (2) is fixed between the ITO layer (1) and the LCM layer (3), the signal transmission module (2) comprising a controller chip (23), an input end of the controller chip (23) being connected to a first terminal (21) via a flexible circuit board, an output end of the controller chip (23) being connected to a second terminal (22) via a flexible circuit board, an electromagnetic film (25) being provided on the flexible circuit board, and a reinforcing steel sheet (24) being fixed on the controller chip (23); A sealant (11) is provided on the side of the ITO layer (1) opposite to the LCM layer (3); a liquid cooling and heat dissipation module (4) is fixed to the ITO layer (1) via the sealant (11); and the liquid cooling and heat dissipation module (4) and the ITO layer (1) are coupled to cover the LCM layer (3).

2. A highly integrated heat dissipation touch screen according to claim 1, characterized in that: The liquid cooling heat dissipation module (4) comprises a heat insulation plate (42), wherein two groups of heat dissipation plates (41) are arranged separately on a side of the heat insulation plate (42) away from the LCM layer (3), and two groups of heat dissipation groove groups (43) are arranged on a side of the heat insulation plate (42) opposite to the heat dissipation plates (41). A heat conductive film (47) is glued to a side of the heat insulation plate (42) opposite to the LCM layer (3), and a main liquid tank (46) is arranged between the heat conductive film (47) and the heat insulation plate (42). A connecting hole (461) connected to the main liquid tank (46) is arranged on the heat insulation plate (42), and a circulation mechanism (45) matching the main liquid tank (46) is arranged in the connecting hole (461).

3. A highly integrated heat dissipation touch screen according to claim 2, characterized in that: The heat-conducting film (47) is an elastic heat-conducting silicone film structure, the heat-conducting film (47) has a torsion force close to the heat insulation plate (42), and the space between the heat-conducting film (47) and the heat insulation plate (42) is filled with cooling liquid.

4. The highly integrated heat dissipation touch screen according to claim 2, characterized in that: The heat dissipation plate (41) is a copper foil structure, and the heat dissipation plate (41) is bonded to the heat insulation plate (42) by means of heat-conducting silicone glue.

5. The highly integrated heat dissipation touch screen according to claim 2, characterized in that: A blocking groove (431) is further provided between the heat dissipation groove group (43) and the connecting hole (461); the circulation mechanism (45) comprises a first sealing plate (451) and a second sealing plate (452); a folding angle is provided between the first sealing plate (451) and the second sealing plate (452); a blocking rubber strip (453) matching the blocking groove (431) is fixed to both the first sealing plate (451) and the second sealing plate (452); a first elastic sheet (4511) is fixed to one side of the first sealing plate (451); and a first elastic sheet (4511) is fixed to one side of the second sealing plate (452). 2) A second elastic sheet (4521) is fixed to a side away from the first elastic sheet (4511); the first elastic sheet (4511) and the second elastic sheet (4521) are both fixed to the heat insulation board (42); a first thermistor (4512) is fixed to one side of the first elastic sheet (4511); a second thermistor (4522) is fixed to one side of the second elastic sheet (4521); the first thermistor (4512) and the second thermistor (4522) respectively extend into corresponding heat dissipation slot groups (43).

6. The highly integrated heat dissipation touch screen according to claim 5, characterized in that: The first elastic sheet (4511) and the second elastic sheet (4521) have a torque for driving the first sealing plate (451) to approach the connecting hole (461); the sealing rubber strip (453) on the second sealing plate (452) has a built-in electromagnetic sheet, and the electromagnetic sheet has a magnetic attraction force on the sealing groove (431) when power is on; a supporting protrusion (454) is fixed on the side of the second sealing plate (452) opposite to the thermal conductive film (47).

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