Lead frame with pre-sealed bowl-cup structure

Abstract

The utility model relates to the technical field of chip carriers, and particularly discloses a lead frame with a pre-sealing bowl-cup structure, which comprises a frame body and a plurality of pre-sealing bowl-cup units arranged on the frame body and connected with the frame body through reserved ends on two sides, each pre-sealing bowl-cup unit comprises a carrier, a plastic layer and a plurality of pins, a bowl-shaped groove is formed in the top of the plastic layer, the bowl-shaped groove is of a double-layer structure, and a plurality of positioning protrusions are further arranged on the second layer in the bowl-shaped groove; according to the utility model, through the arrangement of the frame structure, the process steps in the packaging process are simplified, the electroplating process is omitted, the plastic packaging process is replaced by the dispensing process, the rib cutting forming process is replaced by the AOI blanking process, the asset investment of a packaging factory is reduced, the product packaging period is shortened, and the efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip carriers, and in particular relates to a pre-sealed cup-structured lead frame. Background Art

[0002] As the chip carrier of integrated circuits, the lead frame is a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit lead ends of the chip and the external leads to form an electrical circuit. It acts as a bridge to connect to external wires. Lead frames are required in most semiconductor integrated blocks.

[0003] There are many existing integrated circuit packaging process processes, and the investment in plastic molding equipment, electroplating equipment, and cutting, forming and separation equipment is large. In addition, the electroplating line has high environmental impact assessment requirements and the process is difficult to control. The lead frame has certain limitations in production and use. Utility Model Content

[0004] The purpose of the utility model is to provide a pre-sealed cup structure lead frame to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A pre-sealed cup-shaped lead frame, comprising:

[0007] Framework body;

[0008] If the pre-sealed bowl and cup unit is arranged on the frame body and connected to the frame body through the reserved ends on both sides, the pre-sealed bowl and cup unit includes a carrier, a plastic layer and a plurality of pins, a bowl-shaped groove is arranged on the top of the plastic layer, and the bowl-shaped groove is arranged as a double-layer structure, and a plurality of positioning protrusions are also arranged on the second layer inside.

[0009] Preferably, the plastic layer is wrapped around the outer surface of the carrier.

[0010] Preferably, the plurality of pins are evenly distributed on the other two sides of the carrier, and each of the pins is fixedly connected to the carrier.

[0011] Preferably, the number of the pins is one of 3, 5, 6, 7, 8, 16, 20, and 24.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] (1) By pre-sealing the cup and bending the pins on the flat carrier in advance, the downstream end does not need to change the corresponding configuration due to changes in the appearance while maintaining consistency with the existing IC package size and reliability. It is also low-cost and easier to promote.

[0014] (2) By setting the positioning protrusion inside the bowl-shaped groove, the contact area between the glue and the bowl-shaped groove is increased, ensuring the stability of the glue after curing, making it more stable.

[0015] (3) By setting up the frame structure, the process steps in the packaging process are simplified, the electroplating process is eliminated, the plastic sealing process is replaced by the dispensing process, and the rib cutting and forming process is replaced by the AOI blanking process, which reduces the asset investment of the packaging plant, shortens the product packaging cycle, and improves efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a partial structural schematic diagram of the utility model;

[0017] Figure 2 It is a cross-sectional view of the utility model;

[0018] Figure 3 It is a three-dimensional diagram of the overall structure of the utility model;

[0019] In the figure: 1. frame body; 2. reserved end; 3. plastic layer; 4. positioning protrusion; 5. pin; 6. bowl-shaped groove; 7. carrier. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] Embodiment 1:

[0022] See also Figure 1-Figure 3 As shown, a pre-sealed cup structure lead frame includes:

[0023] Frame body 1;

[0024] The pre-sealed bowl and cup unit is arranged on the frame body 1 and connected to the frame body 1 through the reserved ends 2 on both sides. The pre-sealed bowl and cup unit includes a carrier 7, a plastic layer 3 and a plurality of pins 5. A bowl-shaped groove 6 is arranged on the top of the plastic layer 3. The bowl-shaped groove 6 is arranged as a double-layer structure, and a plurality of positioning protrusions 4 are also arranged on the second layer inside.

[0025] Depend on Figure 3 It can be seen that the plastic layer 3 is wrapped around the outer surface of the carrier 7, and a number of pins 5 are evenly distributed on the other two sides of the carrier 7. Each pin 5 is fixedly connected to the carrier 7, and the number of pins 5 is one of 3, 5, 6, 7, 8, 16, 20, and 24.

[0026] As can be seen from the above, the lead frame factory performs the cup pre-sealing and pin bending process on the frame body 1 in advance, and keeps the size and reliability consistent with the existing IC package. The downstream user does not need to change the corresponding configuration due to the change in the shape, and the cost is low, which is easier to promote.

[0027] By providing a plurality of positioning protrusions 4 inside the bowl-shaped groove 6, when the glue is dispensed inside the bowl-shaped groove 6 by a glue dispenser, the contact area between the glue and the bowl-shaped groove 6 is increased, thereby ensuring the stability of the glue after curing;

[0028] Through the setting of this structure, the process steps of the packaging process can be simplified during the production process, and the original integrated circuit packaging process flow: thinning-slicing-core loading-pressure welding-plastic sealing-electroplating-rib cutting and molding is separated into: thinning-slicing-core loading-pressure welding-glue dispensing-AOI blanking, eliminating the electroplating process, reducing the asset investment of the packaging plant, shortening the product packaging cycle, and improving efficiency;

[0029] The plastic encapsulation process can be replaced by the dispensing process to reduce the equipment investment cost. The efficiency of the dispensing machine is higher than that of the plastic encapsulation equipment. In addition, the dispensing process avoids the problem of wire collapse, improves the packaging yield, reduces the error rate, and greatly improves the packaging yield.

[0030] The rib cutting and forming process can be replaced by the AOI blanking process. The price of rib cutting and forming equipment and molds is several times that of AOI blanking equipment and blanking molds, and the efficiency is lower than the latter. It can reduce the equipment investment of the packaging plant, improve production efficiency, and save packaging costs.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A pre-sealed cup structure lead frame, characterized in that: include: Frame body (1); The pre-sealed bowl and cup unit is arranged on the frame body (1) and connected to the frame body (1) through the reserved ends (2) on both sides. The pre-sealed bowl and cup unit comprises a carrier (7), a plastic layer (3) and a plurality of pins (5). A bowl-shaped groove (6) is arranged on the top of the plastic layer (3). The bowl-shaped groove (6) is arranged as a double-layer structure, and a plurality of positioning protrusions (4) are also arranged on the second layer inside.

2. The pre-sealed cup-shaped lead frame according to claim 1, characterized in that: The plastic layer (3) is wrapped around the outer surface of the carrier (7).

3. The pre-sealed cup structure lead frame according to claim 1, characterized in that: A plurality of pins (5) are evenly distributed on the other two sides of the carrier (7), and each of the pins (5) is fixedly connected to the carrier (7).

4. The pre-sealed cup structure lead frame according to claim 1, characterized in that: The number of the pins (5) is one of 3, 5, 6, 7, 8, 16, 20, and 24.

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