Shell structure and electronic equipment

Abstract

The utility model provides a shell structure and electronic equipment, and relates to the technical field of electronic products, and the shell structure is beneficial to the thinning development of the electronic equipment, and also can guarantee the performance of an antenna. The shell structure comprises a shell base material and an antenna, the shell base material comprises a first surface and a second surface which are opposite to each other, the first surface faces the outside of the electronic equipment, the second surface faces the inside of the electronic equipment, and the loss factor of the shell base material is smaller than or equal to 0.02. The antenna comprises a first antenna, the first antenna comprises a first radiator and a first feed part, the first radiator is arranged on the first surface, the first radiator is electrically connected with the first feed part, and the first feed part is arranged on the second surface.

Description

[0001] This application is a divisional application of the Chinese patent application submitted to the State Intellectual Property Office on July 20, 2023, with application number 202321933209.4 and invention name “A shell structure and electronic device”. Technical Field

[0002] The present application relates to the technical field of electronic products, and in particular to a housing structure and an electronic device. Background Art

[0003] At present, antennas are usually set on the middle frame and the motherboard bracket. However, with the development of thinning electronic devices, the demand for thinning electronic devices has become stronger. The thickness of the motherboard bracket has gradually become thinner, but the motherboard bracket still needs to meet a certain structural strength to press the board-to-board (BTB) connector on the circuit board. Therefore, the metal content of the motherboard bracket is getting higher and higher to ensure that the motherboard bracket has a certain structural strength under the premise of thin thickness. However, a motherboard bracket with a high metal content will affect the performance of the antenna. Therefore, it has become a difficult problem in the industry to ensure that the performance of the antenna is not affected while facilitating the development of thin electronic devices. Utility Model Content

[0004] The present application provides a housing structure and an electronic device, wherein the housing structure is conducive to the thinning development of the electronic device and can ensure the performance of the antenna.

[0005] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0006] In a first aspect, a housing structure is provided, the housing structure comprising a housing substrate and an antenna, the housing substrate comprising a first surface and a second surface opposite to each other, and the loss factor of the housing substrate is less than or equal to 0.02. The first antenna comprises a first radiator and a first feeder, the first radiator is electrically connected to the first feeder, the first feeder is disposed on the second surface and is electrically connected to the first conductive medium.

[0007] The first radiator for transmitting and receiving signals is arranged on the first surface, that is, the outer surface of the shell substrate, to raise the setting position of the first radiator. The radiation signal of the first radiator can be directly radiated out, and can also directly receive the radiation signal from the outside. The radiation signal of the antenna does not need to pass through the shell substrate area to transmit and receive signals, which improves the antenna's gain and thus improves the radiation performance of the antenna. In addition, since the loss factor of the shell substrate material is low, the loss of some signals that pass through the shell substrate and are then transmitted and received by the antenna is also low, and the shell substrate has a low impact on the signal gain. Therefore, the shell structure of this embodiment can improve the efficiency of the antenna, the antenna performance is better, and thus improve the user experience.

[0008] In a possible implementation of the first aspect, the shell substrate further includes a first through hole that passes through the first surface and the second surface, the first antenna includes a first conductive medium, the first conductive medium is disposed in the first through hole, and the first radiator and the first feeder are electrically connected through the first conductive medium. The first conductive medium is disposed through the first through hole to avoid occupying other space of the shell for disposing the first through hole.

[0009] In a possible implementation of the first aspect, a first receiving groove is provided on the first surface, and the first radiator is received in the first receiving groove. The first radiator is received in the first receiving groove, which reduces the height of the first radiator protruding from the first surface, and the user is not easy to feel the first radiator protruding from the first surface during use, which improves the user's experience, and also reduces the part of the first radiator exposed outside the shell substrate, thereby reducing the area of ​​friction of the first radiator during use, so that the antenna can maintain a better performance for a long time. Moreover, in the thickness direction of the shell substrate, the sum of the thickness of the shell substrate and the first radiator is smaller, which is conducive to the thinning development of electronic equipment and further improves the user's experience.

[0010] In a possible implementation of the first aspect, the first receiving groove includes a first bottom wall surface, the first bottom wall surface and the first surface are oriented in the same direction, and the surface of the first radiator that is opposite to the first bottom wall surface is flush with the first surface. In this way, the first radiator is accommodated in the shell substrate, and the outer surface of the first radiator and the outer surface of the shell substrate are located in the same plane to ensure the flatness of the shell structure in appearance, which can improve the user experience on the one hand, and improve the aesthetics of the shell structure on the other hand.

[0011] In a possible implementation of the first aspect, a depth of the first accommodation groove is greater than or equal to 10 micrometers and less than or equal to 30 micrometers. The depth of the first accommodation groove within this range facilitates accommodating the first radiator therein, thereby ensuring the flatness of the shell structure in appearance, which can improve the user experience on the one hand, and improve the aesthetics of the appearance of the shell structure on the other hand.

[0012] In a possible implementation of the first aspect, the second surface is provided with a second accommodating groove, and the first feeder is accommodated in the second accommodating groove. In this way, the first feeder does not occupy the internal space of the electronic device, and a larger space is left for the installation of electronic components, which is further conducive to the development of thinner electronic devices.

[0013] In a possible implementation of the first aspect, the second accommodating groove includes a second bottom wall surface, the second bottom wall surface and the second surface are oriented in the same direction, and the surface of the first feeding portion facing away from the second bottom wall surface is flush with the second surface. In this way, the first feeding portion will not occupy the internal space of the electronic device, and the flatness of the inner surface of the shell substrate can be ensured, which is further beneficial to the arrangement of electronic components inside the electronic device and the development of thinner electronic devices.

[0014] In a possible implementation manner of the first aspect, a depth of the second containing groove is greater than or equal to 10 micrometers and less than or equal to 100 micrometers.

[0015] In a possible implementation of the first aspect, the shell substrate is a fiberboard. Specifically, the shell substrate can be a glass fiberboard, an aramid fiberboard, a basalt fiberboard, and the like. The fiber has excellent properties such as high strength, high modulus, high temperature resistance, acid and alkali resistance, and light weight, so that the shell substrate does not need to be increased in thickness to increase the strength, so the thickness of the shell substrate can be designed to be very thin. Furthermore, different weaving processes can be used to make the fiber have different patterns and designs. These patterns and designs formed by weaving are not easy to fall off from the shell substrate, nor are they easy to be worn, and the surface consistency of the shell substrate is good and more beautiful.

[0016] In a possible implementation of the first aspect, the resin is a thermoplastic resin, and the thermoplastic resin includes but is not limited to polyphenylene ether or polyimide. Thermoplastic resin has the properties of softening when heated and hardening when cooled, and does not react chemically. No matter how many times the heating and cooling are repeated, this property can be maintained. Therefore, it is easier to process and shape the shell substrate. In addition, the shell substrate made of the above-mentioned thermoplastic resin has a lower material loss factor performance, and the loss of some signals transmitted and received by the antenna after passing through the shell substrate is also lower, and the shell substrate has a lower impact on the signal gain. Therefore, the shell structure of this embodiment can improve the efficiency of the antenna, the antenna performance is better, and thus improve the user experience.

[0017] In a possible implementation of the first aspect, the resin is a thermosetting resin, and the thermosetting resin includes but is not limited to special epoxy resins, bismaleimide, and benzoxazine. The shell substrate made of the above-mentioned thermosetting resin has a low material loss factor performance, and the loss of some signals transmitted and received by the antenna after passing through the shell substrate is also low, and the shell substrate has a low impact on the signal gain. Therefore, the shell structure of this embodiment can also improve the efficiency of the antenna, the antenna performance is better, and thus improve the user experience.

[0018] In a possible implementation of the first aspect, the shell substrate also includes fillers, including but not limited to silicon dioxide, aluminum oxide, and boron nitride. The shell substrate made by adding the above-mentioned fillers also has a lower material loss factor performance, and the loss of some signals transmitted and received by the antenna after passing through the shell substrate is also lower, and the shell substrate has a lower impact on the signal gain. Therefore, the shell structure of this embodiment can also improve the efficiency of the antenna, the antenna performance is better, and thus improve the user experience.

[0019] In a possible implementation of the first aspect, the housing structure further includes an appearance portion, which is stacked on the first surface. In this way, the first radiator is wrapped between the appearance portion and the housing substrate, which prevents the first radiator from having a protrusion compared to the surface of the housing structure, thereby improving the aesthetics of the appearance of the electronic device. When using the electronic device, the user will not feel the uneven surface of the housing structure, which further improves the user experience.

[0020] In a possible implementation of the first aspect, the thermal expansion coefficient of the first conductive medium is A, and the thermal expansion coefficient of the shell substrate is B, wherein |AB| is less than or equal to 0.1A, or |AB| is less than or equal to 0.1B. In this way, the electronic device avoids the conductive medium from falling off due to the different deformation amounts of the shell substrate and the conductive medium during use, thereby avoiding the problem of functional failure of the antenna caused by the falling off of the conductive medium, thereby ensuring the performance of the antenna, as well as the stability and reliability of the electronic device during use.

[0021] In a possible implementation manner of the first aspect, a conductive medium is disposed in the first through hole, and the first end is electrically connected to the second end through the conductive medium.

[0022] In a possible implementation of the first aspect, a microporous structure is provided on the inner surface of the first through hole. Micropores or active groups are formed on the inner surface of the first through hole through surface treatment to improve the adhesion between the conductive medium and the inner surface of the first through hole. The microporous structure can increase the bonding area between the inner surface of the first through hole and the conductive medium, thereby improving the adhesion of the conductive medium connected to the first through hole. The surface treatment may include but is not limited to chemical microetching, plasma treatment or corona treatment.

[0023] In a possible implementation of the first aspect, the first through hole is a tapered hole, and the area of ​​the cross section of the first through hole located on the first surface is greater than the area of ​​the cross section of the first through hole located on the second surface, or the area of ​​the cross section of the first through hole located on the first surface is smaller than the area of ​​the cross section of the first through hole located on the second surface. The aperture of the first through hole gradually decreases or increases from the first end to the second end, and the inner surface of the first through hole is inclined relative to the vertical direction, so that the bonding area between the conductive medium and the inner surface of the first through hole is further increased, thereby improving the bonding property of the conductive medium connected to the first through hole. In addition, it is also conducive to the deposition of the conductive medium.

[0024] In a possible implementation of the first aspect, the housing substrate includes a plurality of housing parts that are stacked. In this way, the housing substrate includes a plurality of housing parts to improve the structural strength of the housing substrate, avoid deformation and damage of the housing substrate due to drilling and setting antenna texture lines, and thus improve the stability and reliability of the electronic device.

[0025] In a possible implementation of the first aspect, specifically, the shell substrate includes a first shell part and a second shell part, the second shell part is stacked with the first shell part, the surface of the first shell part facing away from the first shell part forms the first surface, and the surface of the second shell part facing away from the first shell part forms the second surface; the first through hole includes a first section and a second section, the first section is located in the first shell part, the second section is located in the second shell part, and the first section is electrically connected to the second section. In this way, the shell substrate includes multiple shell parts to improve the structural strength of the shell substrate, avoid deformation and damage of the shell substrate due to drilling and setting antenna texture lines, and thus improve the stability and reliability of the use of electronic equipment.

[0026] In a possible implementation of the first aspect, the shell substrate also includes a third shell part, which is stacked between the first shell part and the second shell part, and the third shell part includes a third surface and a fourth surface opposite to each other, the third surface faces the first shell part, and the fourth surface faces the second shell part, the first through hole also includes a third section, the third section is located in the third shell part, one end of the third section is connected to the first section and is electrically conductive, and the other end is connected to the second section and is electrically conductive.

[0027] In a possible implementation of the first aspect, the shell structure also includes a second antenna, the second antenna includes a second radiator and a second feeding part, the second radiator is electrically connected to the second feeding part, the second radiator is arranged between two adjacent shell parts, and the second feeding part is arranged on the second surface.

[0028] In this way, multiple antennas are arranged in the shell substrate. Compared with the case where the antenna is arranged inside the shell substrate, this embodiment can save more internal space of the shell substrate, which is further conducive to the development of thinner electronic equipment. In addition, the antenna is arranged at a position higher than the inside of the shell substrate, which further improves the radiation efficiency of the antenna and thus improves the working performance of the antenna.

[0029] In a possible implementation of the first aspect, the second radiator is used to couple and feed power to the second antenna transceiver module of the electronic device. In this way, the second antenna does not need complicated wiring connections, and the shell substrate does not need to be further processed and manufactured to match the wiring connections of the second antenna. The shell substrate has a simple structure and is easy to manufacture.

[0030] In a possible implementation of the first aspect, the shell substrate also includes a second through hole, the second through hole passes through the second surface, the second antenna also includes a second conductive medium, the second conductive medium is arranged in the second through hole, and the second radiator is electrically connected to the second feeding part through the second conductive medium.

[0031] In this way, the second radiator for transmitting and receiving signals is arranged between adjacent shell parts to raise the setting position of the second radiator. The radiation signal of the second radiator is radiated through the thinner shell substrate, and the radiation signal of the second radiator is also received through the thinner shell substrate, which reduces the influence of the shell substrate on the radiation signal of the second radiator, improves the antenna's benefit, and further improves the radiation performance of the antenna. In addition, the second antenna and the second antenna transceiver module are also electrically connected through a direct contact feeding method, which further ensures the radiation efficiency of the antenna. Since the loss factor of the material of the shell substrate is low, the loss of some signals transmitted and received by the antenna after passing through the shell substrate is also low, and the influence of the shell substrate on the signal benefit is also low. Therefore, the shell structure of this embodiment can improve the efficiency of the antenna, the antenna performance is better, and then improve the user experience, and multiple antennas are arranged in the shell substrate, which is also conducive to the thinning development of electronic equipment.

[0032] In a possible implementation of the first aspect, the first radiator is a metal foil structure, and the material of the metal foil structure includes but is not limited to gold, silver, copper, aluminum, nickel, titanium, gold alloy, silver alloy, copper alloy, aluminum alloy, nickel alloy, and titanium alloy, which is convenient for forming and processing of the antenna.

[0033] In a second aspect, the present application also provides a shell structure, which includes a shell substrate and a first antenna, the shell substrate includes a first surface and a second surface facing each other, and a first through hole that passes through the first surface and the second surface, the first surface faces the outside of the electronic device, and the second surface faces the inside of the electronic device. The first antenna includes a first radiator, a first feeding part and a first conductive medium, the first surface is provided with a first receiving groove, the first radiator is received in the first receiving groove and is electrically connected to the first conductive medium, the first radiator is used to transmit or receive signals, the first feeding part is provided on the second surface and is electrically connected to the first conductive medium, the first feeding part is used to contact and electrically connect with the first antenna transceiver module of the electronic device, and the first conductive medium is provided in the first through hole.

[0034] The first radiator for transmitting and receiving signals is arranged on the first surface, that is, the outer surface of the shell substrate, to raise the setting position of the first radiator. The radiation signal of the first radiator can be directly radiated out, and can also directly receive the radiation signal from the outside. The radiation signal of the antenna does not need to pass through the shell substrate area to transmit and receive signals, which improves the benefit of the antenna and thus improves the radiation performance of the antenna. In addition, the first antenna is accommodated in the first accommodating groove to avoid the outer surface of the shell from being uneven due to the setting of the antenna, thereby ensuring the flatness of the appearance of the shell structure and thus improving the user experience. Therefore, the shell structure of this embodiment can improve the efficiency of the antenna, and the antenna performance is better, thereby improving the user experience.

[0035] In a third aspect, the present application also provides an electronic device, which includes the above-mentioned shell structure and a circuit board, on which a first antenna transceiver module is provided, and the first antenna transceiver module is electrically connected to the first antenna.

[0036] In a possible implementation manner of the third aspect, the first antenna transceiver module is electrically connected to the first antenna contact.

[0037] In a possible implementation of the third aspect, the electronic device includes a back cover and a frame, the frame is arranged on the outer periphery of the back cover, and a receiving cavity is formed between the frame and the back cover. The housing structure is the back cover and / or the frame of the electronic device, that is, the housing structure can be the back cover or the frame, or can be the back cover and the frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 A perspective view of an electronic device provided for some embodiments of the present application;

[0039] Figure 2 for Figure 1 a schematic diagram of the exploded structure of the electronic device shown;

[0040] Figure 3 for Figure 2A front view of electronic components in the electronic device shown;

[0041] Figure 4 for Figure 1 A schematic diagram of the cross-sectional structure of the electronic device shown along the AA direction;

[0042] Figure 5 A schematic diagram of assembling the antenna and the back cover provided in some embodiments of the present application;

[0043] Figure 6 A schematic diagram of assembling an antenna and a back cover provided in some other embodiments of the present application;

[0044] Figure 7 for Figure 6 A schematic diagram of the stacked structure of the substrate, the protection plate and the appearance part of the back cover shown in ;

[0045] Figure 8 A schematic diagram of a housing structure provided in some embodiments of the present application;

[0046] Fig. 9 for Figure 8 A schematic structural diagram of a shell substrate of a shell structure shown in FIG.

[0047] Fig.10 A simulation diagram for representing the relationship between antenna recovery efficiency when the first radiator is respectively disposed on the first surface and the circuit board bracket;

[0048] Fig.11 A simulation diagram representing the relationship between the antenna recovery efficiency when the first radiator is disposed on a low loss factor housing substrate and an existing housing substrate;

[0049] Fig.12 A schematic diagram of a housing structure provided in some embodiments of the present application;

[0050] Fig.13 for Fig.12 A schematic structural diagram of a shell substrate of a shell structure shown in FIG.

[0051] Fig.14 for Fig.12 A schematic diagram of the structure of the first antenna shown in ;

[0052] Fig.15 A schematic diagram of a housing structure provided in some further embodiments of the present application;

[0053] Fig.16 A schematic diagram of a housing structure provided in some further embodiments of the present application;

[0054] Fig.17 for Fig.16 A schematic structural diagram of a shell structure shell substrate shown in ;

[0055] Fig.18 A schematic diagram of a housing structure provided in some further embodiments of the present application;

[0056] Fig.19 for Fig.18 A schematic structural diagram of a shell structure shell substrate shown in ;

[0057] Fig. 20 A process flow chart of a housing structure provided for some embodiments of the present application;

[0058] Fig.21 A process flow chart of a shell structure provided for some other embodiments of the present application;

[0059] Fig. 22 A process flow chart of a shell structure provided for some further embodiments of the present application.

[0060] Reference numerals

[0061] 100. Electronic equipment;

[0062] 10. Screen; 11. Translucent cover; 12. Display screen;

[0063] 20, back shell; 21, back cover; 211, first surface; 211a, first receiving groove; 211b, first bottom wall; 212, second surface; 212a, second receiving groove; 212b, second bottom wall; 213, first through hole; 213d, conductive medium; 213e, first section; 213f, second section; 213g, third section; 220, second conductive through hole;

[0064] 214, first housing portion; 215, second housing portion; 219, third housing portion; 219a, third surface; 219b, fourth surface; 221, third receiving groove; 221a, third bottom wall surface; 222, fourth receiving groove; 222a, fourth bottom wall surface;

[0065] 216, substrate; 217, protection plate; 218, appearance; 200, housing structure; 201, housing substrate;

[0066] 22. frame; 23. middle plate; 30. circuit board assembly; 31. circuit board; 32. first connector;

[0067] 40. electronic components; 41. body; 42. second connector; 43. flexible electrical connection structure;

[0068] 50, bracket; 60, antenna; 600, antenna texture circuit; 601, feeder; 61, first antenna; 611, first radiator; 611a, fifth surface; 611b, sixth surface;

[0069] 612, first feeder; 62, second antenna; 621, second radiator; 622, second feeder;

[0070] 63. Shrapnel; 70. Processor; 80. Transmitter and receiver. DETAILED DESCRIPTION

[0071] In the embodiments of the present application, the terms "first", "second", "third", "fourth", and "fifth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", "third", "fourth", and "fifth" may explicitly or implicitly include one or more of the features.

[0072] In the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0073] In the embodiments of the present application, unless otherwise specified, the description "parallel" means approximately parallel within a certain error range, and the error range may be a range of less than or equal to 5° relative to the absolute parallel deviation angle. The description "perpendicular" means approximately perpendicular within a certain error range, and the error range may be a range of less than or equal to 5° relative to the absolute perpendicular deviation angle.

[0074] In the embodiments of the present application, unless otherwise specified, the description of two objects "overlapping" includes four possible implementations: one object partially overlaps the other object as a whole, the other object partially overlaps the one object as a whole, the one object as a whole overlaps the other object as a whole, and the one object partially overlaps the other object as a part. The description of two objects "overlapping" means that the middle and edges of the two objects completely overlap.

[0075] The present application provides an electronic device, which may be a user equipment (UE) or a terminal device, etc. For example, the electronic device may be a tablet computer (portable android device, PAD), a laptop computer, a personal digital assistant (PDA), a handheld device with a wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (VR) terminal device (such as VR glasses), an augmented reality (AR) terminal device (such as AR glasses), a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medicine, a wireless terminal in smart grid, a wireless terminal in transportation safety, a wireless terminal in smart city, a wireless terminal in smart home, and other mobile terminals or fixed terminals. The embodiment of the present application does not specifically limit the form of the electronic device.

[0076] See also Figure 1 , Figure 1 A stereoscopic diagram of an electronic device 100 is provided for some embodiments of the present application. This embodiment and the following embodiments are exemplified by taking the electronic device 100 as a handheld device with a wireless communication function, which can be, for example, a mobile phone. The electronic device 100 is roughly in the shape of a rectangular plate. Based on this, in order to facilitate the description of the embodiments below, an XYZ coordinate system is established, specifically defining the width direction of the electronic device 100 as the X-axis direction, the length direction of the electronic device 100 as the Y-axis direction, and the thickness direction of the electronic device 100 as the Z-axis direction. It can be understood that the coordinate system of the electronic device 100 can be flexibly set according to actual needs, and no specific limitation is made here. When the electronic device 100 is other products, the electronic device 100 can also be roughly in the shape of a square plate, a circular plate, etc., which is not specifically limited here.

[0077] Please also read Figure 1 and Figure 2 , Figure 2 for Figure 1 The electronic device 100 is a schematic diagram of an exploded structure. The electronic device 100 includes a screen 10, a back cover 20, a circuit board assembly 30, electronic components 40, a bracket 50 and an antenna 60.

[0078] Understandably, Figure 1 and Figure 2 The electronic device 100 includes some components, and the actual shape, size, position and structure of these components are not limited to the following. Figure 1 and Figure 2 In some other examples, the electronic device 100 may not include the screen 10.

[0079] The screen 10 is used to display images, videos, etc. The screen 10 includes a light-transmitting cover plate 11 and a display screen 12. The light-transmitting cover plate 11 and the display screen 12 are stacked. The light-transmitting cover plate 11 is mainly used to protect the display screen 12 and prevent dust. The material of the light-transmitting cover plate 11 includes but is not limited to glass. The display screen 12 can be a flexible display screen or a rigid display screen. For example, the display screen 12 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen, a mini light-emitting diode (MID) display screen, a micro light-emitting diode (MID) display screen, a micro organic light-emitting diode (MID) display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD).

[0080] The back cover 20 is connected to the screen 10, and the back cover 20 is used to protect the internal electronic components of the electronic device 100. In some embodiments, please refer to Figure 1 and Figure 2 , the back shell 20 may include a back cover 21 and a frame 22. The back cover 21 is located on a side of the display screen 12 away from the light-transmitting cover plate 11, and is spaced apart from the display screen 12. The frame 22 is located between the back cover 21 and the screen 10, and is arranged along the edge of the back cover 21 and the edge of the screen 10. The frame 22 is fixed to the back cover 21. Exemplarily, the frame 22 can be fixedly connected to the back cover 21 by adhesive. The frame 22 can also be an integrally formed structure with the back cover 21, that is, the frame 22 and the back cover 21 are an integral structure. The light-transmitting cover plate 11 is fixed to the frame 22 by gluing. A accommodating cavity is provided in the back shell 20. In some embodiments, the accommodating cavity is located between the screen 10 and the back cover 21.

[0081] In some embodiments, please refer to Figure 2 The electronic device 100 further includes a middle plate 23. The middle plate 23 is fixed to the inner surface of the frame 22. For example, the middle plate 23 can be fixed to the frame 22 by welding. The middle plate 23 can also be an integrally formed structure with the frame 22. The middle plate 23 is used as a structural "skeleton" of the electronic device 100, and is used to support and fix the electronic components in the electronic device 100.

[0082] The structure composed of the middle plate 23 and the frame 22 can also be called a middle frame. On this basis, the accommodating cavity can be located between the middle frame and the back cover 21.

[0083] The circuit board assembly 30 is accommodated in the accommodating cavity. In some embodiments, the circuit board assembly 30 is fixed to the middle plate 23. In other embodiments, when the electronic device 100 does not include the middle plate 23, the circuit board assembly 30 may also be fixed to the back cover 21 or the frame 22.

[0084] Please continue reading Figure 2 The circuit board assembly 30 includes a circuit board 31 and a first connector 32. The first connector 32 includes, but is not limited to, a board-to-board (BTB) connector, a coaxial line connector, and a spring connector. This embodiment is exemplified by using the first connector 32 as a BTB connector, which cannot be considered as a special limitation of the present application. The first connector 32 can be set on the circuit board 31 using surface mount technology (SMT) or plug-in technology.

[0085] The electronic components 40 are arranged in the accommodating cavity or the back cover 21, the frame 22 and other parts, and the electronic components 40 include but are not limited to batteries, main FPC, antenna, camera module (CAM), flash, vibration motor, etc. Among them, the main FPC refers to a flexible electrical circuit connecting the main circuit board and the auxiliary circuit board in the mobile phone.

[0086] Please continue reading Figure 2 The electronic component 40 includes a body 41 and a second connector 42, and the body 41 is connected to the second connector 42. On this basis, the second connector 42 is matched and connected to the first connector 32. Thus, the electronic component 40 is connected to the circuit board 31, so as to further realize electrical connection with other electronic components or circuits by means of the circuit board 31.

[0087] In the above embodiment, the body 41 and the second connector 42 can be directly electrically connected or electrically connected via an intermediate structure. Figure 2The body 41 and the second connector 42 can be electrically connected by means of a flexible electrical connection structure 43. The flexible electrical connection structure 43 includes but is not limited to a flexible printed circuit board (FPC) and a structural member woven by wires and soft materials. In this embodiment, the flexible electrical connection structure 43 is exemplified as FPC.

[0088] In other embodiments, the body 41 and the second connector 42 may also be electrically connected via a hard printed circuit board (PCB), which is not specifically limited herein.

[0089] Please continue reading Figure 2 The bracket 50 is also called a circuit board bracket or a mainboard bracket. The bracket 50 is disposed on the side of the second connector 42 that is opposite to the first connector 32, and the bracket 50 is relatively fixed to the middle plate 23. The bracket 50 is used to limit the second connector 42 to prevent the second connector 42 from being separated from the first connector 32 when the electronic device 100 is impacted by external force or the cover is opened for maintenance, thereby ensuring the stability and reliability of the electrical connection between the electronic component 40 and the circuit board 31.

[0090] The material of the bracket 50 includes but is not limited to metals such as stainless steel, aluminum alloy, titanium alloy, or non-metals such as polycarbonate (PC), PC+glass fiber, and ABS plastic (acrylonitrile butadiene styrene).

[0091] Please also read Figure 2 Figure 3 , Figure 3 A schematic diagram of a structure in which an antenna 60 is connected to a processor 70 in some embodiments of the present application. The antenna 60 is disposed on the surface of the bracket 50 that is away from the circuit board assembly 30, and the antenna 60 is arranged in the form of an antenna texture line. The antenna 60 includes but is not limited to a low-frequency antenna, a medium-high frequency antenna, a wireless fidelity (WI FI) antenna, a Sub6G antenna, a millimeter wave antenna, etc.

[0092] The electronic device 100 further includes a transceiver 80 and a processor 70, which can be arranged on the circuit board 31. The antenna 60 is electrically connected to the transceiver 80, and the transceiver 80 is electrically connected to the processor 70. The processor 70 is used to generate a transmission signal or process a reception signal, and the processor 70 can be a baseband processor, a digital signal processor, a microprocessor or a central processing unit, etc. The transceiver 80 is also called a transceiver, a radio frequency transceiver, a radio frequency circuit or a signal transceiver circuit. The transceiver 80 is used to receive a transmission signal from the processor 70, modulate and process the transmission signal, and transmit the transmission signal to the antenna 60. At the same time, the transceiver 80 is also used to demodulate and process and transmit the reception signal received by the antenna 60 to the processor 70.

[0093] See also Figure 4 , Figure 4 for Figure 1 The schematic diagram of the cross-sectional structure of the electronic device 100 along the AA direction is shown. The Z-direction stacking thickness of the electronic device 100 may be the sum of the thickness of the screen 10, the thickness of the middle plate 23 in the middle frame, the thickness of the circuit board 31, the thickness of the assembly formed by the first connector 32 and the second connector 42, the thickness of the bracket 50, the thickness of the back cover 21, and the width of the gaps between the various parts.

[0094] As the electronic device 100 becomes thinner, the thickness of the above-mentioned parts becomes thinner and thinner. In order to ensure the pressing force of the bracket 50 on the board-to-board connector, the bracket 50 needs a certain structural strength. Therefore, the bracket 50 usually selects a material with a certain structural strength, such as a metal material. However, metal has an impact on the performance of the antenna 60. If the bracket 50 selects a non-metallic material, such as a plastic material, the plastic bracket 50 needs to reach a certain thickness to ensure the pressing force of the bracket 50 on the board-to-board connector. As a result, it is not conducive to the thinning development of the electronic device 100.

[0095] In summary, the location of the antenna 60 needs to comprehensively consider the impact on the performance of the antenna 60 and the thickness of the electronic device 100. That is, the location of the antenna 60 should not affect the performance of the antenna 60, but should be conducive to the thinning of the electronic device 100.

[0096] In order to solve the above problem, the present application further provides an electronic device 100, in which the antenna 60 is disposed on the inner surface of the back cover 21, and the inner surface of the back cover 21 refers to the surface of the back cover 21 facing the inside of the electronic device 100. For details, please refer to Figure 5 , Figure 5Schematic diagram of the assembly of the antenna 60 and the back cover 21 provided in some embodiments of the present application. The back cover 21 includes a first surface 211 and a second surface 212 facing each other, wherein the first surface 211 faces the outside of the electronic device 100, that is, the outer surface of the back cover 21. The second surface 212 faces the inside of the electronic device 100, that is, the inner surface of the electronic device 100.

[0097] The antenna 60 includes an antenna texture circuit 600, which is disposed on the second surface 212. The antenna texture circuit 600 is used to convert the transmission signal into an electromagnetic wave and radiate it into free space to transmit the signal. The antenna texture circuit 600 is also used to convert the electromagnetic wave in the free space into a receiving signal to receive the signal.

[0098] The antenna 60 further includes a feeder 601 which is electrically connected to the antenna texture circuit 600. The feeder 601 is used to feed the transmission signal output by the transceiver 80 into the radiator, and is also used to transmit the reception signal converted by the radiator to the transceiver 80.

[0099] In some embodiments, see Figure 5 , the feeding part 601 can be electrically connected to the transmitter-receiver 80 through the spring 63. Specifically, after the back cover 21 is installed on the middle frame, the spring 63 is squeezed between the antenna 60 and the transmitter-receiver 80. In this way, the antenna 60 is directly connected to the transmitter-receiver 80 through the spring 63, which can ensure the stability of the connection between the antenna 60 and the transmitter-receiver 80 and the high efficiency of the energy transmission of the antenna 60. In other embodiments, the antenna 60 can be electrically connected to the transmitter-receiver 80 by coupling feeding.

[0100] In the above embodiment, the antenna 60 is placed on the inner surface of the back cover 21 instead of the mainboard support, thus avoiding the influence of the metal mainboard support on the antenna 60. However, when the antenna 60 transmits signals, the signals still need to pass through the back cover 21 for radiation, and the back cover 21 will also reduce the signal transmission efficiency of the antenna 60.

[0101] In some embodiments, in order to make the antenna 60 transmit signals more efficiently, the embodiment of the present application further provides an electronic device 100, in which the antenna 60 is disposed on the back cover 21 in a sandwich manner. Figure 6 and Figure 7 , Figure 6 A schematic diagram of assembling the antenna 60 and the back cover 21 provided in some other embodiments of the present application; Figure 7 for Figure 6Schematic diagram of the stacked structure of the substrate 216, the protective plate 217 and the appearance part 218 of the back cover 21 shown in the figure. The back cover 21 of the electronic device 100 includes a substrate 216, a protective plate 217 and an appearance part 218 which are stacked. The substrate 216 can be a fiberglass board, the protective plate 217 can be a plastic board, and the appearance part 218 can be leather. The antenna 60 is arranged on the protective plate 217, and the appearance part 218 of the outer layer of the protective plate 217 is stacked on the protective plate 217 to cover the antenna 60, so as to avoid the antenna 60 leaving marks on the back cover 21, thereby improving the aesthetics of the electronic device 100.

[0102] However, the addition of the protective plate 217 to this embodiment brings the following effects. First, the design, production, packaging and assembly process of the back cover 21 are more complicated, which increases the difficulty of the production process of the back cover 21, and the mass production efficiency of the electronic device 100 is reduced, and the cost is also higher. Second, after the protective plate 217 is added to the back cover 21, the thickness of the back cover 21 is larger, generally reaching 3.2 mm, and the weight of the back cover 21 will also increase, reducing the user experience. Third, when the electronic device 100 is in use, the electronic components 40 in the electronic device 100 will generate heat, and the protective plate 217 will affect the heat dissipation of the electronic device 100, reduce the heat dissipation efficiency of the electronic device 100, and further affect the performance of the electronic device 100, reducing the user experience.

[0103] According to the above description, the location of the antenna 60 and the connection method of the antenna 60 in the above embodiments cannot take into account both the thinness of the back cover 21 and the high-efficiency radiation performance of the antenna.

[0104] In order to take into account both the thinness of the electronic device 100 and the high-efficiency radiation performance of the antenna 60, the embodiment of the present application further provides an electronic device 100, which includes a housing structure 200, in which the antenna 60 is arranged on the outer surface of the housing substrate 201, and the antenna 60 is directly connected to the transmitter and receiver 80. For details, please refer to Figure 8 and Fig. 9 , Figure 8 A schematic diagram of the structure of a housing structure 200 provided in some embodiments of the present application; Fig. 9 for Figure 8 The schematic diagram of the structure of the housing substrate 201 in the housing structure 200 is shown in FIG. The housing structure 200 includes the housing substrate 201 and an antenna.

[0105] The shell substrate 201 can be the back cover 21 or the frame 22 of the electronic device 100. This embodiment and the following embodiments are described by taking the shell substrate 201 as the back cover 21 as an example. The shell substrate 201 can be a square plate, a circular plate, an elliptical plate, a triangular plate, etc. This embodiment and the following embodiments are described by taking the shell substrate 201 as a square plate as an example, but this does not represent a special limitation on the present application. The shell substrate 201 includes a first surface 211 and a second surface 212 facing each other. The first surface 211 and the second surface 212 are the two largest surfaces on the shell substrate 201. Among them, the first surface 211 faces the outside of the electronic device 100, and the second surface 212 faces the inside of the electronic device 100. It can also be said that the first surface 211 is the outer surface of the shell substrate 201, and the second surface 212 is the inner surface of the shell substrate 201.

[0106] The antenna 60 includes a first antenna 61, which includes a first radiator 611, a first feeder 612 and a first conductive medium 213d. The first radiator 611 is disposed on the first surface 211 and is electrically connected to the first conductive medium 213d. The first radiator 611 is used to transmit or receive signals. The first feeder 612 is disposed on the second surface 212 and is electrically connected to the first conductive medium 213d. The first antenna 61 can be electrically connected to the first antenna transceiver module of the electronic device 100 through the first feeder 612. The first antenna 61 can also be directly coupled and fed to the first antenna transceiver module of the electronic device 100. The first radiator 611 and the first feeder 612 can be disposed on the surface of the housing substrate 201 by electroplating, chemical plating, pad printing, silk screen printing, lamination, etc.

[0107] Among them, electroplating is the process of plating a thin layer of other metals or alloys on certain surfaces using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts.

[0108] Chemical plating refers to chemical immersion plating (abbreviated as chemical plating). Chemical plating is a method that does not require electricity. It is based on the principle of redox reaction and uses a strong reducing agent in a solution containing metal ions to reduce metal ions into metals and deposit them on the surface of various materials to form a dense coating.

[0109] Lamination refers to embedding the first antenna 61 into the first surface 211 and the second surface 212 of the shell substrate 201 during the molding process of the shell substrate 201. The first antenna 61 is a metal foil structure. The concepts of electroplating, chemical plating and lamination are also applicable to the embodiments below, and the concepts of electroplating, chemical plating and lamination are not repeated in the following text.

[0110] The material of the first radiator 611 and the material of the first feeder 612 include but are not limited to gold, silver, zinc, copper, aluminum, nickel-gold alloy, silver alloy, zinc alloy, copper alloy, aluminum alloy, and nickel alloy. The material of the first radiator 611 and the material of the first feeder 612 can also be made of conductive glue, which is a mixture of a third conductive medium and the first glue, and the material of the third conductive medium includes but is not limited to gold, silver, zinc, copper, aluminum, nickel, carbon black, graphite, and carbon fiber. The material of the first glue includes but is not limited to phenolic resin, epoxy resin, acrylic resin, and polyurethane. The material of the first radiator 611 and the first feeder 612 can be the same or different.

[0111] In some embodiments, the first conductive medium 213d is a conductive medium for electrically connecting the first radiator 611 and the first feeder 612. The first conductive medium 213d can be disposed on the surface of the housing substrate 201. In this embodiment, the material of the first conductive medium 213d includes but is not limited to gold, silver, zinc, copper, aluminum, nickel, carbon black, graphite, and carbon fiber. The extension path of the first conductive medium 213d can be from the inner surface of the housing 201 to the outer surface of the housing 201 via the side surface of the housing 210. The end of the first conductive medium 213d located on the inner surface of the housing 201 is electrically connected to the first feeder 612, and one end of the first conductive medium 213d located on the outer surface of the housing 201 is electrically connected to the first radiator.

[0112] In some other embodiments, the shell substrate 201 is further provided with a first through hole 213 that passes through the first surface 211 and the second surface 212, the end of the first through hole 213 located on the first surface 211 is the first end, the end of the first through hole 213 located on the second surface 212 is the second end, and the first end is electrically connected to the second end. The first through hole 213 includes an inner wall of the through hole, and the first through hole 213 can achieve electrical conduction between the first end and the second end by vacuum evaporating a layer of the first conductive medium 213d on the inner wall of the through hole. The first through hole 213 can also achieve electrical conduction between the first end and the second end by filling the first conductive medium 213d in the first through hole 213 by silk screen printing or hole filling. The first radiator 611 is electrically connected to the first end of the first through hole 213, and the first feeding portion 612 is electrically connected to the second end of the first through hole 213.

[0113] Vacuum evaporation refers to the process of heating a material and coating it on a substrate in a vacuum environment, placing the material to be film-formed in a vacuum for evaporation or sublimation, and precipitating it on the surface of a workpiece or substrate. The substrate in this embodiment is the inner wall of the first through hole 213, and the material to be film-formed is the first conductive medium 213d. The material of the first conductive medium 213d includes, but is not limited to, gold, silver, zinc, copper, aluminum, and nickel.

[0114] Silk screen printing refers to screen printing, which uses a silk screen as a base and uses a photosensitive platemaking method to make a silk screen printing plate with images and texts. Silk screen printing consists of five major elements, a silk screen printing plate, a scraper, ink, a printing table and a substrate. Printing is performed based on the basic principle that the mesh holes of the image and text part of the silk screen printing plate can pass the ink, while the mesh holes of the non-image and text part cannot pass the ink. When printing, ink is poured into one end of the silk screen printing plate, and a certain pressure is applied to the ink part on the silk screen printing plate with a scraper, while moving at a constant speed toward the other end of the silk screen printing plate. During the movement, the ink is squeezed from the mesh holes of the image and text part to the substrate by the scraper. In this embodiment, a mesh hole opposite to the first through hole 213 is set on the silk screen, and the "relative" here means that the positive projection of the mesh hole on the first surface 211 is located in the first through hole 213. The ink may be a second conductive glue, which is a mixture of the first conductive medium 213d and the second glue. The material of the first conductive medium 213d may be a metal, including but not limited to gold, silver, zinc, copper, aluminum, and nickel. The material of the first conductive medium 213d may also be an inorganic substance, including but not limited to carbon black, graphite, and carbon fiber. The material of the second glue includes but is not limited to phenolic resin, epoxy resin, acrylic resin, and polyurethane.

[0115] Hole filling refers to filling the first conductive medium 213d in the first through hole 213. The first conductive medium 213d is consistent with the first conductive medium 213d described above. The concepts of vacuum evaporation, screen printing, and hole filling are also applicable to the embodiments below, and the concepts of vacuum evaporation, screen printing, and hole filling are not repeated in the following text.

[0116] The loss factor of the shell substrate 201 is less than or equal to 0.02. The loss factor is a parameter that describes the material medium, and refers to the energy loss caused inside the insulating material due to the hysteresis effect of the dielectric conductivity and dielectric polarization under the action of the electric field. Specifically, it refers to the energy of the electromagnetic wave absorbed by the shell substrate 201 itself during the propagation of the electromagnetic wave of the first antenna 61. In other words, the larger the loss factor, the more energy of the electromagnetic wave absorbed by the shell substrate 201 during the propagation of the electromagnetic wave of the first antenna 61, and the lower the radiation efficiency of the first antenna 61; the smaller the loss factor, the smaller the energy of the electromagnetic wave absorbed by the shell substrate 201, and the higher the radiation efficiency of the first antenna 61.

[0117] In the above-mentioned present embodiment, the first radiator 611 for transmitting and receiving signals is arranged on the first surface 211, that is, the outer surface of the shell substrate 201, so as to raise the setting position of the first radiator 611, and the radiation signal of the first radiator 611 can be directly radiated out, and can also directly receive the radiation signal from the outside. The radiation signal of the first antenna 61 does not need to pass through the shell substrate 201 to transmit and receive the signal, which improves the benefit of the first antenna 61, and thus improves the radiation performance of the first antenna 61. In addition, since the loss factor of the material of the shell substrate 201 is low, the loss of some signals transmitted and received by the first antenna 61 after passing through the shell substrate 201 is also low, and the shell substrate 201 has a low impact on the signal benefit. Therefore, the shell structure 200 of this embodiment can improve the efficiency of the first antenna 61, and the performance of the first antenna 61 is better, thereby improving the user experience. The efficiency of the first antenna 61 can be improved by 0.3dB to 0.5dB.

[0118] The first antenna 61 is disposed on the first surface 211 of the housing substrate 201. Compared with the first antenna 61 disposed on the bracket 50, this embodiment saves the height of the first antenna 61 disposed in the bracket 50, which is further conducive to the thinning of the electronic device 100. In addition, the first antenna 61 is connected to the first antenna transceiver module by direct contact, which ensures the stability of the signal transmission of the first antenna 61.

[0119] To further illustrate the effect of the first antenna 61 in the above embodiment, please refer to Fig.10 , Fig.10 The following is a simulation diagram that characterizes the relationship between the antenna recovery efficiency when the first radiator 611 is respectively arranged on the first surface 211 and the circuit board bracket 50. The horizontal axis represents the frequency band of the antenna, and the vertical axis represents the input return loss of the antenna. The curve labeled 1 is the total efficiency diagram of the first antenna 61 when the first radiator 611 is arranged on the first surface 211, and the curve labeled 2 is the total efficiency diagram of the antenna when the first radiator is arranged on the mainboard bracket. From the simulation results in the figure, when the first antenna 61 is arranged on the first surface 211 of the shell substrate 201, the recovery efficiency at the horizontal axis of 4.7Hz increases by 0.5dB.

[0120] See also Fig.11 , Fig.11The following is a simulation diagram to characterize the relationship between the recovery efficiency of the first antenna 61 when the first radiator 611 is respectively arranged on the shell substrate 201 with a low loss factor and the existing shell substrate 201. The horizontal axis represents the frequency band of the antenna, and the vertical axis represents the input return loss of the antenna. The curve marked 1 is the total efficiency diagram of the first antenna 61 when the loss factor of the first radiator 611 arranged on the shell substrate 201 is less than or equal to 0.02, and the curve marked 2 is the total efficiency diagram of the antenna when the loss factor of the first radiator arranged on the shell substrate 201 is greater than 0.02. From the simulation results in the figure, when the first antenna 61 is arranged on the surface of the shell substrate 201 with a low material loss factor, the recovery efficiency at the horizontal axis of 4.7Hz is further increased by 0.3dB.

[0121] See also Fig.12 and Fig.13 , Fig.12 A schematic structural diagram of a housing structure 200 provided in some other embodiments of the present application; Fig.13 for Fig.12 Schematic diagram of the structure of the shell substrate 201 of the shell structure shown in . In some embodiments, the first surface 211 is provided with a first receiving groove 211a, the first receiving groove 211a is recessed from the first surface 211 to the second surface 212, and the first radiator 611 is received in the first receiving groove 211a. The first radiator 611 can be fully received in the first receiving groove 211a, or at least part of the first radiator 611 can be received in the first receiving groove 211a. "At least part" means that the bottom area of ​​the first radiator 611 is arranged in the first receiving groove 211a, and the top area of ​​the first radiator 611 can protrude from the first receiving groove 211a, that is, the top area of ​​the first radiator 611 is located outside the first receiving groove 211a.

[0122] The first radiator 611 can also be completely accommodated in the first accommodation groove 211a, reducing the height of the first radiator 611 protruding from the first surface 211. When using, the user is not easy to feel the first radiator 611 protruding from the first surface 211, which improves the user's experience and reduces the part of the first radiator 611 exposed outside the shell substrate 201, thereby reducing the friction area of ​​the first radiator 611 during use, so that the first antenna 61 can maintain a good performance for a long time. In addition, in the thickness direction of the shell substrate 201, that is, in the Z-axis direction, the sum of the thickness of the shell substrate 201 and the first radiator 611 is smaller, which is conducive to the thinning development of the electronic device 100 and further improves the user's experience.

[0123] See also Fig.14 , Fig.14 for Fig.12The first radiator 611 includes a fifth surface 611a and a sixth surface 611b facing each other, the fifth surface 611a faces away from the first bottom wall 211b, and the sixth surface 611b faces the first bottom wall 211b. Fig.13 In some embodiments, the first receiving groove 211a includes a first bottom wall surface 211b, and the first bottom wall surface 211b is oriented in the same direction as the first surface 211. Fig.13 , the first radiator 611 is disposed in the first receiving groove 211a, the sixth surface 611b is in contact with the first bottom wall surface 211b, and the sixth surface 611b is flush with the first surface 211. The flush here means roughly flush, that is, the sixth surface 611b can protrude from the first surface 211 by 0.1 mm, 0.2 mm, or 0.3 mm, and the sixth surface 611b can also be lower than the first surface 211 by 0.1 mm, 0.2 mm, or 0.3 mm, and the above can all be considered that the first surface 211 is flush with the sixth surface 611b. In this way, the first radiator 611 is accommodated in the shell substrate 201, and the outer surface of the first radiator 611 and the outer surface of the shell substrate 201 are located in the same plane to ensure the flatness of the shell structure 200 in appearance, which can improve the user experience on the one hand, and improve the aesthetics of the appearance of the shell structure 200 on the other hand.

[0124] The cross-sectional shape of the first receiving groove 211a can be substantially the same as the cross-sectional shape of the first radiator 611. For example, when the cross-sectional shape of the first radiator 611 is a "T" shape, the cross-sectional shape of the first receiving groove 211a can also be a "T" shape, and the width of the first receiving groove 211a is slightly larger than the width of the first radiator 611, so as to accommodate the first radiator 611 inside the first receiving groove 211a. In this way, the cross-sectional shape of the first receiving groove 211a is substantially the same as the cross-sectional shape of the first radiator 611, so as to avoid the slotted area on the shell substrate 201 being too large, which affects the structural strength of the shell substrate 201.

[0125] In some other embodiments, the cross-sectional shape of the first containing groove 211a may also be circular, elliptical, square, triangular, etc., that is, the cross-sectional shape of the first containing groove 211a is not necessarily consistent with the cross-sectional shape of the first radiator 611. In this way, the shape of the first containing groove 211a is simpler, and the processing of the first containing groove 211a is more convenient and efficient.

[0126] See also Fig.13, further, the depth d1 of the first receiving groove 211a is greater than or equal to 10 microns and less than or equal to 30 microns. The first receiving groove 211a also includes a notch opposite to the first bottom wall 211b, and the depth d1 of the first receiving groove 211a refers to the distance from the first bottom wall 211b to the notch. In some embodiments, the first surface 211 is a plane, and the depth of the first receiving groove 211a can also be the distance from the first bottom wall 211b to the first surface 211. The depth d1 of the first receiving groove 211a in this range facilitates the accommodation of the first radiator 611 therein, thereby ensuring the flatness of the shell structure 200 in appearance, which can improve the user experience on the one hand, and on the other hand, can also improve the aesthetic appearance of the shell structure 200.

[0127] Please also read Fig.12 , Fig.13 and Fig.14 The second surface 212 is provided with a second receiving groove 212a, and the first feeding portion 612 is received in the second receiving groove 212a. In this way, the first feeding portion 612 does not occupy the internal space of the electronic device 100, and a larger space is left for the installation of the electronic components 40, which is further conducive to the thinning development of the electronic device 100.

[0128] Specifically, the second receiving groove 212a includes a second bottom wall surface 212b, the second bottom wall surface 212b is in the same direction as the second surface 212, the surface of the first feeding portion 612 facing the second bottom wall surface 212b is in contact with the second bottom wall surface 212b, and the surface of the first feeding portion 612 facing away from the second bottom wall surface 212b is flush with the second surface 212. In this way, the first feeding portion 612 will not occupy the internal space of the electronic device 100, and can ensure the flatness of the inner surface of the housing substrate 201, which is further beneficial to the arrangement of the electronic components 40 inside the electronic device 100, and is also beneficial to the development of thinness of the electronic device 100.

[0129] Furthermore, the depth d2 of the second receiving groove 212a is greater than or equal to 10 microns and less than or equal to 100 microns. The depth d2 of the second receiving groove 212a in this range is convenient for accommodating the first feeding portion 612 therein, thereby ensuring the flatness of the inner surface of the housing substrate 201, which can improve the user experience on the one hand, and on the other hand, further facilitate the arrangement of the electronic components 40 inside the electronic device 100, and also facilitate the thinning development of the electronic device 100.

[0130] In some embodiments, the shell substrate 201 is a fiberboard, specifically, the shell substrate 201 can be a glass fiberboard, an aramid fiberboard, a basalt fiberboard, etc. The shell substrate 201 can be processed from prepreg, which is composed of resin and fiber, and the fiber includes but is not limited to glass fiber, aramid fiber, and basalt. Prepreg is a composition of a resin matrix and a reinforcement made by impregnating continuous fibers or fabrics with a resin matrix under strictly controlled conditions, and is an intermediate material for manufacturing composite materials. The fiber has excellent properties such as high strength, high modulus, high temperature resistance, acid and alkali resistance, and light weight, so that the shell substrate 201 does not need to increase the strength by increasing the thickness, so the thickness of the shell substrate 201 can be designed to be very thin. Further, different weaving processes can also be used to make the fiber have different patterns and designs. These patterns and designs formed by weaving are not easy to fall off from the shell substrate 201, nor are they easy to be worn, and the surface consistency of the shell substrate 201 is good and more beautiful.

[0131] In some embodiments, the resin is a thermoplastic resin, and the thermoplastic resin includes but is not limited to polyphenylene ether or polyimide. Thermoplastic resin has the properties of softening when heated and hardening when cooled, and does not react chemically. No matter how many times the heating and cooling are repeated, this property can be maintained. Therefore, it is easier to process and shape the shell substrate 201. In addition, the shell substrate 201 made of the above-mentioned thermoplastic resin has a lower material loss factor performance, and the loss of some signals transmitted and received by the first antenna 61 after passing through the shell substrate 201 is also lower, and the shell substrate 201 has a lower impact on the signal gain. Therefore, the shell structure 200 of this embodiment can improve the efficiency of the first antenna 61, and the performance of the first antenna 61 is better, thereby improving the user experience.

[0132] In some embodiments, the resin is a thermosetting resin, and the thermosetting resin includes but is not limited to special epoxy resin, bismaleimide, and benzoxazine. The shell substrate 201 made of the above-mentioned thermosetting resin has a low material loss factor performance, and the loss of some signals transmitted and received by the first antenna 61 after passing through the shell substrate 201 is also low, and the shell substrate 201 has a low impact on the signal gain. Therefore, the shell structure 200 of this embodiment can also improve the efficiency of the first antenna 61, and the performance of the first antenna 61 is better, thereby improving the user experience.

[0133] In some embodiments, the prepreg structure further includes fillers, including but not limited to silicon dioxide, aluminum oxide, and boron nitride. The shell substrate 201 made by adding the above-mentioned fillers also has a lower material loss factor performance, and the loss of some signals transmitted and received by the first antenna 61 after passing through the shell substrate 201 is also lower, and the shell substrate 201 has a lower impact on the signal gain. Therefore, the shell structure 200 of this embodiment can also improve the efficiency of the first antenna 61, and the first antenna 61 has better performance, thereby improving the user experience.

[0134] In some embodiments, the first feeding unit 612 is connected to the first antenna transceiver module through a spring. When the housing substrate 201 is made of glass, the spring is easily squeezed to leave a film mark on the glass housing substrate 201, which affects the aesthetics of the housing structure 200. Fig.15 , Fig.15 The schematic diagram of the structure of the housing structure 200 provided in some embodiments of the present application, the housing structure 200 further includes an appearance portion 218, and the appearance portion 218 is stacked on the first surface 211. In this way, the first radiator 611 is wrapped between the appearance portion 218 and the housing substrate 201, which prevents the first radiator 611 from protruding from the surface of the housing structure 200, thereby improving the aesthetic appearance of the electronic device 100. The user will not feel the uneven surface of the housing structure 200 when using it, which further improves the user's experience. The appearance portion 218 can be made of leather, which has a good feel.

[0135] In some embodiments, the thermal expansion coefficient of the first conductive medium is A, the thermal expansion coefficient of the shell substrate is B, and |AB| is less than or equal to 0.1A, or |AB| is less than or equal to 0.1B. |AB| refers to the absolute value of the difference between A and B. In this way, the thermal expansion coefficient A of the first conductive medium is close to the thermal expansion coefficient B of the shell substrate, and the electronic device 100 avoids the conductive medium 213d from falling off due to the different deformation amounts of the shell substrate 201 and the conductive medium 213d during use, thereby avoiding the problem of functional failure of the first antenna 61 caused by the falling off of the conductive medium 213d, thereby ensuring the performance of the first antenna 61, as well as the stability and reliability of the electronic device 100 during use.

[0136] In some embodiments, the inner surface of the first through hole 213 is provided with a microporous structure. The inner surface of the first through hole 213 is subjected to surface treatment to form micropores or active groups to improve the adhesion between the conductive medium 213d and the inner surface of the first through hole 213. The microporous structure can increase the bonding area between the inner surface of the first through hole 213 and the conductive medium 213d, thereby improving the adhesion of the conductive medium 213d connected to the first through hole 213. The surface treatment may include, but is not limited to, chemical microetching, plasma treatment, or corona treatment.

[0137] Please return to Fig.13 In some embodiments, the first through hole 213 is a tapered hole, and the area of ​​the cross section of the first through hole 213 located on the first surface 211 is greater than the area of ​​the cross section of the first through hole 213 located on the second surface 212, or the area of ​​the cross section of the first through hole 213 located on the first surface 211 is smaller than the area of ​​the cross section of the first through hole 213 located on the second surface 212. The aperture of the first through hole 213 gradually decreases or increases from the first end to the second end, and the inner surface of the first through hole 213 is inclined relative to the vertical direction, that is, the Z-axis direction. In this way, the bonding area between the conductive medium 213d and the inner surface of the first through hole 213 is further increased, thereby improving the bonding property of the conductive medium 213d connected to the first through hole 213. In addition, it is also beneficial to the deposition of the conductive medium 213d.

[0138] The cross-sectional shape of the first through hole 213 can be circular, square, elliptical, irregular, etc. This embodiment and the following embodiments are described using the circular cross-sectional shape of the first through hole 213 as an example, but this does not represent a special limitation on the present application.

[0139] In some embodiments, see Fig.16 , Fig.16 The schematic diagram of the structure of the housing structure 200 provided in some embodiments of the present application. The housing substrate 201 includes a plurality of housing parts arranged in layers. "Multiple" means two or more, for example, the number of the housing parts can be two, three, four, five, etc.

[0140] In some embodiments, the shell substrate 201 includes a first shell portion 214 and a second shell portion 215. The second shell portion 215 is stacked with the first shell portion 214. The surface of the first shell portion 214 facing away from the first shell portion 214 forms a first surface 211, and the surface of the second shell portion 215 facing away from the first shell portion 214 forms a second surface 212.

[0141] See also Fig.17 , Fig.17 for Fig.16The first through hole 213 includes a first section 213e and a second section 213f. The first section 213e is located in the first shell part 214, and the second section 213f is located in the second shell part 215. The first section 213e and the second section 213f are electrically connected. In this way, the shell substrate 201 includes multiple shell parts to improve the structural strength of the shell substrate 201, avoid deformation and damage of the shell substrate 201 due to drilling and setting the antenna texture line 600, and thus improve the stability and reliability of the electronic device 100.

[0142] In some embodiments, see Fig.18 , Fig.18 The schematic diagram of the structure of the housing structure 200 provided in some embodiments of the present application. The housing substrate 201 further includes a third housing portion 219, which is stacked between the first housing portion 214 and the second housing portion 215, and includes a third surface 219a and a fourth surface 219b facing each other, the third surface 219a faces the first housing portion 214, and the fourth surface 219b faces the second housing portion 215.

[0143] See also Fig.19 , Fig.19 for Fig.18 The first through hole 213 further includes a third section 213g, which is located in the third housing portion 219, one end of the third section 213g is connected to the first section 213e and is electrically connected, and the other end of the third section 213g is connected to the second section 213f and is electrically connected.

[0144] Please continue reading Fig.18 and Fig.19 The second antenna 62 includes a second radiator 621, and the second radiator 621 is disposed between two adjacent housing parts. For example, the second radiator 621 can be disposed between the first housing part 214 and the third housing part 219, or between the third housing part 219 and the second housing part 215. In some embodiments, one antenna or multiple antennas can be disposed between adjacent housing parts.

[0145] The following description is made by taking the second radiator 621 disposed between the first housing portion 214 and the third housing portion 219 as an example. The second radiator 621 is disposed on the third surface 219a, and the second radiator 621 is used to transmit or receive signals, and the second radiator 621 is used to be electrically connected to the second antenna transceiver module of the electronic device 100. The second antenna 62 can be disposed on the surface of the housing substrate 201 by electroplating, chemical plating, pad printing, silk screen printing, lamination, etc.

[0146] The second antenna 62 may be an antenna of the same type as the first antenna 61, or an antenna of a different type from the first antenna 61. A plurality of second antennas 62 may be provided, and each second antenna 62 may be an antenna of a different type, or an antenna of the same type. In this way, the plurality of antennas are arranged in the shell substrate 201. This embodiment can save more internal space of the shell substrate 201, and is further conducive to the thinning development of the electronic device 100. In addition, the setting position of each antenna is raised to the inside of the shell substrate 201, which further improves the radiation efficiency of each antenna compared to the case where each antenna is arranged in the shell substrate 201, thereby improving the working performance of the antenna.

[0147] In some embodiments, the second antenna 61 is directly coupled and fed with the second antenna transceiver module of the electronic device 100. In this way, the second antenna 62 does not need complicated wiring connection, and the shell substrate 201 does not need to be further processed and manufactured to match the wiring connection of the second antenna 62. The shell substrate 201 has a simple structure and is easy to manufacture.

[0148] In some embodiments, see Fig.18 and Fig.19 The shell substrate 201 further includes a second conductive through hole 220 that passes through the third surface 219a and the second surface 212. The second conductive through hole 220 is spaced apart from the first through hole 213. The end of the second conductive through hole 220 located on the third surface 219a is the third end. The end of the second conductive through hole 220 located on the second surface 212 is the fourth end. The third end is electrically connected to the fourth end. The second antenna 62 further includes a second feeding portion 622. The second radiator 621 is electrically connected to the third end. The second feeding portion 622 is disposed on the second surface 212 and is electrically connected to the fourth end. The second feeding portion 622 is used to contact and electrically connect with the second antenna transceiver module of the electronic device 100.

[0149] In this way, the second radiator 621 for transmitting and receiving signals is arranged on the third surface 219a to raise the setting position of the second radiator 621. The radiation signal of the second radiator 621 is radiated through the thinner shell substrate 201, and the radiation signal of the second radiator 621 is also received through the thinner shell substrate 201. The influence of the shell substrate 201 on the radiation signal of the second radiator 621 is reduced. The radiation signal of the second antenna 62 does not need to pass through the shell substrate 201 area to transmit and receive signals, which improves the benefit of the second antenna 62 and further improves the radiation performance of the second antenna 62. In addition, the second antenna 62 is also electrically connected to the second antenna transceiver module through a direct contact feeding method, which further ensures the radiation efficiency of the second antenna 62. Since the material of the shell substrate 201 has a low loss factor, the loss of some signals transmitted and received by the second antenna 62 after passing through the shell substrate 201 is also low, and the influence of the shell substrate 201 on the signal benefit is also low. Therefore, the housing structure 200 of this embodiment can improve the efficiency of the second antenna 62 , and the second antenna 62 has better performance, thereby improving the user experience. In addition, multiple second antennas 62 are disposed in the housing substrate 201 , which is also conducive to the thinning of the electronic device 100 .

[0150] In some embodiments, the shell substrate 201 further includes a fourth shell portion, which is stacked between the third shell portion 219 and the second shell portion 215, and the first through hole 213 further includes a fourth section, which is located in the fourth shell portion, and one end of the fourth section is connected and electrically connected to the third section 213g, and the other end is connected and electrically connected to the second section 213f. The second conductive through hole 220 passes through the second shell portion 215, so that the second conductive through hole 220 passes through the third shell portion 219, the fourth shell portion and the second shell portion 215 in sequence. The second antenna 62 is directly contacted and electrically connected to the second antenna transceiver module through the second feeding portion 622, thereby ensuring the radiation efficiency of the second antenna 62. In addition, the shell substrate 201 includes multiple shell portions to improve the structural strength of the shell substrate 201, avoid deformation and damage of the shell substrate 201 due to punching and setting the antenna texture circuit 600, and thus improve the stability and reliability of the electronic device 100.

[0151] Please continue reading Fig.18 In some embodiments, the second conductive via 220 is a tapered hole, and the structural features of the second conductive via 220 are consistent with those of the first conductive via 220, which will not be described in detail here. The tapered hole increases the bonding area between the conductive medium 213d and the inner surface of the second conductive via 220, thereby improving the bonding property of the conductive medium 213d connected to the second conductive via 220. In addition, it is also beneficial to the deposition of the conductive medium 213d.

[0152] Please continue reading Fig.19 In some embodiments, the third surface 219a is provided with a third receiving groove 221, and the second radiator 621 is received in the third receiving groove 221. The fourth surface 219b is provided with a fourth receiving groove 222, and the second feeding portion 622 is received in the fourth receiving groove 222. The structural features and beneficial effects of the third receiving groove 221 and the fourth receiving groove 222 are consistent with the structural features and beneficial effects of the first receiving groove 211a and the second receiving groove 212a described above, and are not described in detail here.

[0153] In some embodiments, the first radiator 611 has a metal foil structure, and the material of the metal foil structure includes but is not limited to gold, silver, copper, aluminum, nickel, titanium, gold alloy, silver alloy, copper alloy, aluminum alloy, nickel alloy, and titanium alloy, which facilitates the molding and processing of the first antenna 61.

[0154] In some embodiments, the second radiator 621 may also be a metal foil structure. The material of the metal foil structure includes but is not limited to gold, silver, copper, aluminum, nickel, titanium, gold alloy, silver alloy, copper alloy, aluminum alloy, nickel alloy, and titanium alloy. The material of the second radiator 621 may be the same as or different from the material of the first radiator 611.

[0155] The manufacturing process of the housing structure 200 is introduced below.

[0156] Example 1 of manufacturing process of housing structure 200

[0157] See also Fig. 20 , Fig. 20 A process flow chart of a shell structure 200 provided in some embodiments of the present application. Step S101, molding step: combining glass fiber or basalt fiber and aramid fiber into one by prepreg treatment, stacking treatment and hot pressing treatment to obtain a shell substrate 201;

[0158] Typically, the prepreg treatment in step S101 includes:

[0159] The resin is used for pre-impregnation to combine the fiberboard materials that were originally separated from each other into one, and the fiberboard materials include but are not limited to glass fiber, basalt fiber, and aramid fiber to obtain the shell substrate 201.

[0160] It should be noted that the fiberboard raw material is multi-layered, and the fiberboard raw materials of the multi-layers can be of the same material or different materials. The thickness of the semi-finished shell substrate 201 is set according to the required thickness of the finished shell substrate 201, and the number of layers of the glass fiber cloth or basalt fiber cloth is adjusted.

[0161] The shape of the obtained shell substrate 201 can be changed according to actual needs, and can generally be a flat plate structure or a plate structure with a curved surface.

[0162] Step S102, drilling step: drilling the shell substrate 201 obtained in step S101 to obtain a first through hole 213 penetrating the first surface 211 and the second surface 212. Preferably, in this embodiment, a computer numerical control (CNC) machine tool can be used for drilling.

[0163] Step S103, slotting step: slotting the shell substrate 201 obtained in step S102, and slotting the shell substrate 201 to obtain a first receiving groove 211a and a second receiving groove 212a. Preferably, in this embodiment, a computer numerical control (CNC) machine tool can also be used for slotting, for example, a CNC engraving machine can be used to cut the semi-finished product to finally obtain the shell substrate 201, and laser etching can also be used for processing.

[0164] Step S104, surface treatment step: surface treatment is performed on the shell substrate 201 obtained in step S103, and the inner surface of the conductive through hole is surface treated to obtain a microporous structure or an active group. The surface treatment method may include but is not limited to chemical microetching, plasma treatment or corona treatment.

[0165] Step S105, step of carving antenna texture circuit 600: carving the first radiator 611 on the shell substrate 201 obtained in step S104. Fill the first receiving groove 211a and the second receiving groove 212a with the third conductive medium, and solidify the third conductive medium to form the first radiator 611 and the first feeding part 612. The filling method can be pad printing, silk screen printing, etc. The temperature of the filling environment is greater than or equal to 80 degrees and less than or equal to 150 degrees, and the baking curing time is greater than or equal to 30 minutes and less than or equal to 60 minutes.

[0166] Step S106, filling the conductive through hole: filling the housing substrate 201 obtained in step S105, filling the first conductive medium 213d in the first through hole 213, so that the first end and the second end of the first through hole 213 are electrically connected. The method of filling the first through hole 213 can be vacuum evaporation, silk screen printing, filling holes, etc. The temperature of the filling environment is greater than or equal to 80 degrees and less than or equal to 150 degrees, and the baking curing time is greater than or equal to 30 minutes and less than or equal to 60 minutes.

[0167] Step S107, appearance processing step: the shell substrate 201 obtained in step S106 is subjected to appearance processing. Specifically, in some embodiments, when the first radiator 611 protrudes from the first surface 211, the edge of the first radiator 611 is polished to eliminate the portion of the first radiator 611 protruding from the first receiving groove 211a. And the edge of the first feeding part 612 is polished to eliminate the portion of the first feeding part 612 protruding from the second receiving groove 212a. The appearance part 218 is attached to the first surface 211, and the appearance part 218 and the shell substrate 201 wrap the first radiator 611 inside, completely eliminating the protrusion of the first radiator 611 to improve the user experience. In some other embodiments, the first radiator 611 does not protrude from the first surface 211 after being manufactured. In this way, the process of polishing the first radiator 611 may not be set, and the appearance part 218 may be directly attached to the first surface 211. The appearance part 218 can be bonded to the first surface 211 of the shell substrate 201 by a hot melt adhesive film, and the temperature during the bonding process is greater than or equal to 120 degrees and less than or equal to 140 degrees. The pressing force during the bonding process is greater than or equal to 0.6 MPa and less than or equal to 5 MPa.

[0168] The shell structure 200 manufactured by the above process can improve the efficiency of the first antenna 61, and the performance of the first antenna 61 is better, thereby improving the user experience.

[0169] Example 2 of Manufacturing Process of Shell Structure 200

[0170] See also Fig.21 , Fig.21 The process flow chart of the housing structure 200 provided in some other embodiments of the present application. The manufacturing process of the housing structure 200 in this embodiment is different from that of the above-mentioned embodiment 1 in that:

[0171] Step S101, step of embedding the first antenna 61: through prepreg treatment and stacking treatment,

[0172] The fiberboard raw materials that were originally separated from each other are combined into one, and the fiberboard raw materials include but are not limited to glass fiber, basalt fiber, and aramid fiber to obtain the shell substrate 201. It should be noted that the fiberboard raw materials are multi-layered, and the fiberboard raw materials of the multi-layers can be of the same material or different materials. The shell substrate 201 is obtained; the first antenna 61 is directly obtained by processing the metal foil, and the processing method of the metal foil can be ultraviolet laser cutting.

[0173] Step S102, molding step: the shell substrate 201 obtained in step S101 and the first antenna 61 are molded to obtain a molded shell substrate 201. The temperature when the shell substrate 201 is molded is greater than or equal to 100 degrees and less than or equal to 190 degrees, the pressing force of the molding is greater than or equal to 0.6 MPa and less than or equal to 5 MPa, and the curing time is greater than or equal to 30 minutes and less than or equal to 90 minutes. During the molding process, the first antenna 61 made of metal foil is bonded to the surface of the shell substrate 201, and after molding, there is no height difference between the first antenna 61 and the surface of the shell substrate 201, which ensures the flatness of the surface of the shell substrate 201.

[0174] The subsequent process of this embodiment includes a drilling step, a surface treatment step, a conductive through-hole filling step and an appearance treatment step. These steps are consistent with the steps and methods in the first embodiment and will not be repeated here.

[0175] Example 3 of the manufacturing process of the housing structure 200

[0176] See also Fig. 22 , Fig. 22 A process flow chart of a shell structure 200 provided for some other embodiments of the present application. The similarity between this embodiment and the above-mentioned embodiments 1 and 2 is that the shell structure 200 of this embodiment is further processed on the basis of the step of filling the conductive through-holes in embodiment 1, and the shell structure 200 of this embodiment can also be further processed on the basis of the step of filling the conductive through-holes in embodiment 2. Take the further processing of the shell structure 200 on the basis of the step of filling the conductive through-holes in embodiment 2 as an example for explanation, that is, steps S101 to S104 in this embodiment are the same as those in embodiment 2, and will not be repeated here. After the step of filling the conductive through-holes, the following steps are performed:

[0177] Step S105, continue the molding step: on the basis of the shell substrate 201 obtained in step S104 of the above embodiment 2, a shell substrate 201 with a more stacked structure is obtained through prepreg treatment, stacking treatment and hot pressing treatment. Specifically, the second shell part 215 and the third shell part 219 stacked in the above embodiment 2 are obtained, and the fourth shell part and the first shell part 214 stacked on the third shell part 219 are obtained through this step.

[0178] Step S106, drilling step: drilling the shell substrate 201 obtained in step S105, drilling holes on the first shell part 214, the second shell part 215, the third shell part 219 and the fourth shell part to obtain conductive through holes that penetrate the first surface 211 and the second surface 212, the conductive through hole is the first through hole 213, and the conductive through hole obtained through the above-mentioned embodiment 2 is the second conductive through hole 220.

[0179] Grooving step: Grooving the shell substrate 201 to obtain a first receiving groove 211a and a second receiving groove 212a.

[0180] Surface treatment step: Surface treatment is performed on the inner surface of the first through hole 213 to obtain a microporous structure or an active group. The surface treatment method may include but is not limited to chemical microetching, plasma treatment or corona treatment.

[0181] Step S107, step of carving antenna texture circuit 600: carving antenna texture circuit 600 on shell substrate 201 obtained in step S106. Filling a third conductive medium, and curing the third conductive medium to form antenna texture circuit 600. The filling method can be pad printing, silk screen printing, etc. The temperature of the filling environment is greater than or equal to 80 degrees and less than or equal to 150 degrees, and the baking curing time is greater than or equal to 30 minutes and less than or equal to 60 minutes.

[0182] Filling conductive vias: Fill the conductive vias with a first conductive medium 213d to electrically connect the first end of the conductive vias to the second end. The conductive vias may be filled by vacuum evaporation, screen printing, or via filling. The temperature of the filling environment is greater than or equal to 80 degrees and less than or equal to 150 degrees, and the baking curing time is greater than or equal to 30 minutes and less than or equal to 60 minutes.

[0183] Step S108, appearance processing step: the shell substrate 201 obtained in step S107 is subjected to appearance processing. Specifically, in some embodiments, when the first radiator 611 protrudes from the first surface 211, the edge of the first radiator 611 is polished to eliminate the portion of the first radiator 611 protruding from the first receiving groove 211a. In some other embodiments, the first radiator 611 does not protrude from the first surface 211 after being manufactured. In this way, the process of polishing the first radiator 611 may not be set, and the appearance part 218 may be directly attached to the first surface 211.

[0184] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0185] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A housing structure, characterized in that: include: A shell substrate, the shell substrate comprising a first surface and a second surface opposite to each other, and the shell substrate further comprising a first through hole penetrating the first surface and the second surface; A first antenna, the first antenna comprises a first radiator, a first feeder and a first conductive medium, the first radiator is arranged on the first surface, the first feeder is arranged on the second surface, the first conductive medium is arranged in the first through hole, and the first radiator and the first feeder are electrically connected through the first conductive medium.

2. The housing structure according to claim 1, characterized in that: The material of the first conductive medium includes at least one of gold, silver, zinc, copper, aluminum, nickel, carbon black, graphite, and carbon fiber.

3. The housing structure according to claim 2, characterized in that: The loss factor of the shell substrate is less than or equal to 0.

02.

4. The housing structure according to claim 2 or 3, characterized in that: The first surface is provided with a first containing groove, and the first radiator is contained in the first containing groove.

5. The housing structure according to claim 4, characterized in that: The first accommodating groove includes a first bottom wall surface, the first bottom wall surface and the first surface are oriented in the same direction, and a surface of the first radiator facing away from the first bottom wall surface is flush with the first surface.

6. The housing structure according to claim 4 or 5, characterized in that: The depth of the first containing groove is greater than or equal to 10 micrometers and less than or equal to 30 micrometers.

7. The housing structure according to any one of claims 2 to 6, characterized in that: The second surface is provided with a second accommodating groove, and the first feeding part is accommodated in the second accommodating groove.

8. The housing structure according to claim 7, characterized in that: The second accommodating groove includes a second bottom wall surface, the second bottom wall surface and the second surface are oriented in the same direction, and the surface of the first feeding portion facing away from the second bottom wall surface is flush with the second surface.

9. The housing structure according to any one of claims 2 to 8, characterized in that: The shell substrate is a fiberboard.

10. The housing structure according to any one of claims 2 to 9, characterized in that: The housing structure further includes an appearance portion, and the appearance portion is stacked on the first surface.

11. The housing structure according to any one of claims 2 to 10, characterized in that: The thermal expansion coefficient of the first conductive medium is A, and the thermal expansion coefficient of the shell substrate is B, wherein |AB| is less than or equal to 0.1A, or |AB| is less than or equal to 0.1B.

12. The housing structure according to any one of claims 2 to 11, characterized in that: The inner surface of the first through hole is provided with a microporous structure.

13. The housing structure according to any one of claims 2 to 12, characterized in that: The first through hole is a tapered hole.

14. The housing structure according to any one of claims 2 to 13, characterized in that: The shell substrate includes a plurality of stacked shell parts.

15. The housing structure according to claim 14, characterized in that: The shell structure also includes a second antenna, which includes a second radiator and a second feeder, the second radiator is electrically connected to the second feeder, the second radiator is arranged between two adjacent shell parts, and the second feeder is arranged on the second surface.

16. The housing structure according to claim 15, characterized in that The shell substrate also includes a second through hole, the second through hole passes through the second surface, the second antenna also includes a second conductive medium, the second conductive medium is arranged in the second through hole, and the second radiator is electrically connected to the second feeding part through the second conductive medium.

17. The housing structure according to any one of claims 2 to 16, characterized in that: The first radiator is a metal foil structure.

18. A housing structure, characterized in that: include: A shell substrate, the shell substrate comprising a first surface and a second surface opposite to each other, and the shell substrate further comprising a first through hole penetrating the first surface and the second surface; A first antenna, the first antenna comprising a first radiator and a first feeder, the first radiator being electrically connected to the first feeder, the first surface being provided with a first receiving groove, the first radiator being received in the first receiving groove, the first feeder being provided on the second surface, and the first feeder being used to be electrically connected to a first antenna transceiver module of an electronic device; A first conductive medium is disposed in the first through hole, and the first radiator and the first feeding portion are electrically connected via the first conductive medium.

19. An electronic device, characterized in that: include: The housing structure according to any one of claims 1 to 18; A circuit board is provided with a first antenna transceiver module, and the first antenna transceiver module is electrically connected to the first antenna.

20. The electronic device according to claim 19, characterized in that The first antenna transceiver module is electrically connected to the first antenna contact.

21. The electronic device according to claim 19 or 20, characterized in that: The electronic device comprises: a back cover and a frame, wherein the frame is arranged at the periphery of the back cover, and a receiving cavity is formed between the frame and the back cover; the housing structure is the back cover and / or the frame of the electronic device.

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