Multilayer electronic circuit board
By setting through holes smaller than their diameter between the blind holes of the multi-layer electronic circuit board and filling the blind holes with metal ion layers, the problem of residual glue at the bottom of the blind holes is solved, and the interconnection performance and reliability of the circuit board are improved.
Patent Information
- Application Number
- CN202420643711.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-29
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-03-29
AI Technical Summary
In the traditional multi-layer soft board blind hole design, residual glue is prone to residuals at the bottom of the blind hole, resulting in black lines appearing, affecting the interconnection performance and product quality of the circuit board.
A multi-layer electronic circuit board is designed to prevent residual glue from remaining and fill a metal ion layer in the blind hole to enhance reliability by providing a through hole smaller than its diameter between the first blind hole and the second blind hole.
Effectively prevent residual glue from remaining at the bottom of the blind hole, enhance the interconnection performance and reliability of the circuit board, and avoid internal corrosion and poor internal shrinkage.
Smart Images
Figure CN222884855U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to a multi-layer electronic circuit board. Background Art
[0002] At present, in the production process of multi-layer flexible circuit boards, it is usually necessary to design blind holes in the flexible circuit boards to achieve double-sided interconnection of the circuit boards. For example, in the traditional three-layer flexible circuit board production process, when making blind holes, it is usually necessary to use UV operation, that is, to use ultraviolet light to etch the blind hole pattern. However, during the blind hole etching process, due to uneven UV light irradiation, residual glue is easily left at the bottom of the blind hole. These residual glue may cause black lines to appear at the bottom of the blind hole, thereby affecting the interconnection performance of the circuit board and affecting product quality and stability. Utility Model Content
[0003] The utility model aims to provide a multi-layer electronic circuit board to solve the technical problem that in the design of blind holes in traditional multi-layer flexible boards, residual glue black lines are easily left at the bottom of the blind holes, which affects the interconnection performance of the circuit board.
[0004] To achieve the above-mentioned purpose, the utility model provides a multi-layer electronic circuit board, including a main board body, a first blind hole, a second blind hole and a through hole, wherein the main board body is a multi-layer structure, the first blind hole is arranged on one side of the main board body, the second blind hole is arranged on the other side of the main board body and is symmetrically arranged with the first blind hole, and the through hole is arranged between the first blind hole and the second blind hole and the diameter of the through hole is smaller than the first blind hole and the second blind hole.
[0005] Furthermore, the first blind holes, the second blind holes and the through holes are provided in a plurality of groups, and the plurality of groups of the first blind holes, the second blind holes and the through holes are arranged at intervals along the main board body.
[0006] Furthermore, the apertures of the first blind hole and the second blind hole are consistent, and the apertures of the first blind hole and the second blind hole are 80 μm-120 μm.
[0007] Furthermore, the through hole has a diameter of 30 μm-50 μm.
[0008] Furthermore, the first blind hole and the second blind hole are filled with a metal ion layer.
[0009] Furthermore, the main board body is provided with at least three metal layer structures.
[0010] Furthermore, the main board body includes a first metal layer, a first insulating layer, an adhesive layer, a second metal layer, a second insulating layer and a third metal layer which are connected in sequence.
[0011] Furthermore, the first blind hole is arranged on one side of the second metal layer, and the second blind hole is arranged on a side of the second metal layer away from the first blind hole.
[0012] Furthermore, the first blind hole is arranged in a trapezoidal shape.
[0013] Furthermore, the through hole is arranged at the center of the second metal layer.
[0014] The beneficial effects of the utility model include:
[0015] 1. The utility model provides a multi-layer electronic circuit board, which solves the problem that residual glue is likely to remain at the bottom of the blind hole during the blind hole etching process, resulting in black lines at the bottom of the blind hole that affect the interconnection performance of the circuit board; by setting the through hole, when the first blind hole and the second blind hole are filled with metal ions in the manufacturing process, the problem of interconnection failure of the multi-layer electronic circuit board caused by the residual glue black lines after filling can be prevented, the reliability of the stacked blind holes is enhanced, and the blind holes are prevented from failing; on the other hand, the design of the through hole can also ensure that the residual glue of the multi-layer electronic circuit board overflows well during the degumming process, and the adverse effect of shrinkage caused by internal corrosion is prevented. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments of the utility model will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0017] Figure 1 A top view of the overall structure of a multi-layer electronic circuit board provided by an embodiment of the utility model;
[0018] Figure 2 A schematic diagram of a multi-layer structure arrangement of a multi-layer electronic circuit board is provided for an embodiment of the utility model;
[0019] Icon: 1-main board, 11-first metal layer, 12-first insulating layer, 13-adhesive layer, 14-second metal layer, 15-second insulating layer, 16-third metal layer, 2-first blind hole, 3-second blind hole, 4-through hole, 5-metal ion layer. DETAILED DESCRIPTION
[0020] The technical solutions in the embodiments of the present invention will be described below in conjunction with the accompanying drawings in the embodiments of the present invention.
[0021] It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. It should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the utility model product is usually placed when in use. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0022] See also Figure 1 to Figure 2 As shown, at least one embodiment of the present disclosure provides a multi-layer electronic circuit board, comprising a main board body 1, a first blind hole 2, a second blind hole 3 and a through hole 4, wherein the main board body 1 is a multi-layer structure, wherein the first blind hole 2 is provided on one side of the main board body 1, and the second blind hole 3 is provided on the other side of the main board body 1 and is symmetrically provided with the first blind hole 2, and the through hole 4 is provided between the first blind hole 2 and the second blind hole 3, and the through hole 4 has a smaller diameter than the first blind hole 2 and the second blind hole 3; the multi-layer electronic circuit board provided in this embodiment is provided by providing a through hole 4 between the first blind hole 2 and the second blind hole 3, which is smaller than the first blind hole 2 and the through hole 4 with the diameter of the first blind hole 2 and the second blind hole 3; it solves the problem that residual glue is likely to remain at the bottom of the blind hole during the blind hole etching process, resulting in black lines at the bottom of the blind hole affecting the interconnection performance of the circuit board; by setting the through hole 4, when the first blind hole 2 and the second blind hole 3 are filled with metal ions in the manufacturing process, the problem of failure of the interconnection of the multi-layer electronic circuit board caused by the residual glue black lines after filling can be prevented, the reliability of the stacked blind holes is enhanced, and the failure of the blind holes is prevented; on the other hand, the design of the through hole 4 can also ensure that the residual glue of the multi-layer electronic circuit board is well overflowed during the degumming process, thereby preventing the adverse effect of shrinkage caused by internal corrosion.
[0023] Furthermore, the first blind holes 2, the second blind holes 3, and the through holes 4 are provided in a plurality of groups, and the plurality of groups of the first blind holes 2, the second blind holes 3, and the through holes 4 are arranged at intervals along the main board body 1; the plurality of groups of the first blind holes 2, the second blind holes 3, and the through holes 4 arranged at intervals can effectively increase the interconnection performance of the circuit board, and by unevenly distributing the plurality of groups at intervals on the circuit board, a more uniform and stable circuit connection structure can be formed on the entire circuit board, thereby improving the overall performance of the circuit board, and the specific number can be set according to actual needs.
[0024] Furthermore, the apertures of the first blind hole 2 and the second blind hole 3 are consistent, the apertures of the first blind hole 2 and the second blind hole 3 are 80 μm-120 μm, and the through hole 4 has a through diameter of 30 μm-50 μm; wherein the specific sizes of the first blind hole 2, the second blind hole 3, and the through hole 4 can be selected and adjusted within the above size range according to needs;
[0025] Furthermore, the first blind hole 2 and the second blind hole 3 are filled with a metal ion layer 5; in this embodiment, copper metal particles are preferably filled in the first blind hole 2 and the second blind hole 3, which can be achieved by a physical deposition method, and the metal ion layer 5 is used to provide electrical connection between the multi-layer electronic circuit boards;
[0026] like Figure 2 As shown, further, the main board body 1 is provided with at least three metal layer structures, for example, the main board body 1 includes a first metal layer 11, a first insulating layer 12, an adhesive layer 13, a second metal layer 14, a second insulating layer 15 and a third metal layer 16 connected in sequence, the first blind hole 2 is provided on one side of the second metal layer 14, and the second blind hole 3 is provided on the side of the second metal layer 14 away from the first blind hole 2; wherein the first and second insulating layers can be PI insulating layers, the first, second and third metals can be copper metal layers, and the number of metal layers of the main board body 1 can also be set to a multi-layer structure such as four layers or five layers, and its implementation principle is consistent with the structure of the three metal layers, which will not be repeated here;
[0027] Furthermore, the first blind hole 2 is arranged in a trapezoidal shape, and the through hole 4 is arranged at the center of the second metal layer 14; specifically, the first blind hole 2 and the second blind hole 3 of the trapezoidal structure can enhance the structural stability of the circuit board while facilitating the deposition of the metal ion layer 5, thereby avoiding incomplete filling of the metal ion layer 5 and improving the performance and reliability of the multi-layer electronic circuit board.
[0028] In addition to the above description, there are a few points to note:
[0029] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design;
[0030] (2) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.
[0031] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.
Claims
1. A multi-layer electronic circuit board, characterized in that: The invention comprises a main board body (1), a first blind hole (2), a second blind hole (3) and a through hole (4); the main board body (1) is a multi-layer structure; the first blind hole (2) is arranged on one side of the main board body (1); the second blind hole (3) is arranged on the other side of the main board body (1) and is symmetrical with the first blind hole (2); the through hole (4) is arranged between the first blind hole (2) and the second blind hole (3); and the diameter of the through hole (4) is smaller than that of the first blind hole (2) and the second blind hole (3).
2. A multilayer electronic circuit board according to claim 1, characterized in that: The first blind holes (2), the second blind holes (3), and the through holes (4) are provided in a plurality of groups, and the plurality of groups of the first blind holes (2), the second blind holes (3), and the through holes (4) are arranged at intervals along the main board body (1).
3. A multi-layer electronic circuit board according to claim 1, characterized in that: The apertures of the first blind hole (2) and the second blind hole (3) are consistent, and the apertures of the first blind hole (2) and the second blind hole (3) are 80 μm-120 μm.
4. A multi-layer electronic circuit board according to claim 3, characterized in that: The through hole (4) has a diameter of 30 μm-50 μm.
5. A multi-layer electronic circuit board according to claim 1, characterized in that: The first blind hole (2) and the second blind hole (3) are filled with a metal ion layer (5).
6. A multilayer electronic circuit board according to any one of claims 1 to 5, characterized in that: The main board body (1) is provided with at least three metal layer structures.
7. A multi-layer electronic circuit board according to claim 6, characterized in that: The main board body (1) comprises a first metal layer (11), a first insulating layer (12), an adhesive layer (13), a second metal layer (14), a second insulating layer (15) and a third metal layer (16) which are connected in sequence.
8. A multi-layer electronic circuit board according to claim 7, characterized in that: The first blind hole (2) is arranged on one side of the second metal layer (14), and the second blind hole (3) is arranged on a side of the second metal layer (14) away from the first blind hole (2).
9. A multi-layer electronic circuit board according to claim 8, characterized in that: The first blind hole (2) is arranged in a trapezoidal shape.
10. A multi-layer electronic circuit board according to claim 8, characterized in that: The through hole (4) is arranged at the center of the second metal layer (14).