Carrier suitable for processing ultrathin substrate

Abstract

The utility model discloses a carrier suitable for ultrathin substrate processing, which comprises a carrier main body and a plurality of supporting pieces, the carrier main body is concavely provided with a carrier plate area for placing a PNL plate, the carrier plate area is provided with a first area and a second area which is arranged outside the first area in a surrounding manner and protrudes out of the first area, and a plurality of pits are arranged in the first area at intervals; the plurality of supporting pieces are selectively inserted into the plurality of concave pits according to the structure of the PNL plate, the parts, exposed out of the plurality of concave pits, of the plurality of supporting pieces for supporting the PNL plate are spherical crown bodies, and the top ends of the parts, exposed out of the plurality of concave pits, of the plurality of supporting pieces are flush with one another. The carrier not only can be well compatible with various structure / style designs of the PNL, but also can stably and safely support the PNL, so that the product processing requirements are well met.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to a carrier suitable for ultra-thin substrate processing. Background Art

[0002] At present, the mainstream process for processing packaging substrates is the semi-additive process, which actually uses the ultra-thin seed layer on the substrate as the base, and forms the final required circuit pattern after the processing steps of "film pasting-exposure-development-electroplating-film stripping-flash etching of seed layer". Among them, the above-mentioned development and electroplating operations all adopt a vertical non-contact operation method to prevent physical contact from damaging the dry film strips after development and affecting the final product yield. However, since it is difficult to achieve consistency in the current development and electroplating processing lines to form a continuous processing line design, the substrate will be first collected into a tray by an automatic board collecting machine after development, and then taken out from the tray by an automatic board throwing machine when electroplating is required, and the post-process electroplating operation will be loaded.

[0003] At present, based on the use requirements of packaging and testing manufacturers, the substrate products shipped by substrate manufacturers have the following structural characteristics: a number of strip-shaped substrates 30 are assembled together to form a PNL board 3 (Panel board). However, due to cost factors, substrate manufacturers actively pursue the maximum utilization of materials, resulting in the PNL board having a variety of styles (see Appendix Figure 1 and attached Figure 2 As shown). Therefore, when the PNL board enters the packaging and testing manufacturer and is processed into a packaging substrate, the following problems will inevitably be encountered: Because the developed PNL board is placed in a tray, the "thin" nature of the PNL board (i.e., substrate) determines that it cannot be supported only on all sides, and the middle area also needs to be supported in a certain contact manner, and the area of ​​the PNL board that is supported in contact must also avoid its effective area to avoid the risk of the dry film strip floating or falling off due to slight displacement during the processing of the PNL board, so as to ensure the processing quality of the product. However, due to the diversity of PNL board styles, traditional fixed trays are difficult to be compatible with various styles of PNL board designs and can no longer meet processing requirements. Therefore, it is urgent to provide a carrier that can adapt to a variety of PNL board structures and can support the PNL board stably and safely.

[0004] In view of this, the present utility model is proposed. Summary of the invention

[0005] In order to overcome the above-mentioned defects, the utility model provides a carrier suitable for ultra-thin substrate processing, which has a simple and reasonable structure and is easy to process and manufacture. It is not only well compatible with various structural / style designs of PNL boards, but also can provide stable and safe support for the PNL boards, thus meeting the product processing requirements well.

[0006] The utility model adopts a technical solution to solve its technical problems: a carrier suitable for ultra-thin substrate processing, comprising a carrier body and a plurality of support members, wherein the carrier body is provided with a carrier area for placing a PNL board, the carrier area is provided with a first area and a second area surrounded outside the first area and protruding outside the first area, and a plurality of pits are provided at intervals in the first area; the plurality of support members are selectively inserted into the plurality of pits according to the PNL board structure, and the portions of the plurality of support members exposed outside the plurality of pits and used to support the PNL board are all spherical crown-shaped, and the tops of the portions of the plurality of support members exposed outside the plurality of pits are flush.

[0007] As a further improvement of the utility model, the support member is provided with a base portion that can be tightly inserted into the pit and a support portion fixedly connected to the upper end of the base portion and placed outside the pit, and the support portion is in the shape of a spherical crown.

[0008] As a further improvement of the present invention, the base portion is integrally connected to the support portion.

[0009] As a further improvement of the present invention, the cross-section of the pit is any one of circular, elliptical and rectangular, and the shape of the base portion matches the shape of the pit.

[0010] As a further improvement of the present invention, a plurality of the pits are arranged in rows and columns in the first area.

[0011] As a further improvement of the utility model, a plurality of hollow areas are provided on the first area, and the plurality of hollow areas divide the first area into a plurality of support strips connected in a criss-cross pattern; and a plurality of the pits are arranged in rows and columns on the plurality of support strips.

[0012] As a further improvement of the present invention, the second area is in a rectangular ring shape and is centrally located on one side of the carrier body;

[0013] The portion of the carrier body surrounding the board carrying area is defined as a peripheral area. Two board taking holes are provided on the peripheral area. The two board taking holes are respectively close to and penetrate a pair of diagonal corners of the second area.

[0014] As a further improvement of the present invention, two tool holes are further provided on the peripheral area, and the two tool holes are respectively arranged outside two opposite sides of the second area.

[0015] As a further improvement of the utility model, based on the horizontal placement state of the carrier, the height difference between the outer area and the second area is 2 to 5 mm, and the height difference between the second area and the first area is 1 to 3 mm; in addition, the top ends of the parts of the multiple support members exposed outside the multiple pits are respectively flush with the outer area.

[0016] The beneficial effects of the utility model are as follows: compared with the prior art, the carrier of the utility model can be well compatible with various structural / style designs of PNL boards, and can stably and safely support PNL boards, thus well meeting the product processing requirements. In addition, the carrier of the utility model has a simple and reasonable structure, is easy to process and manufacture, has a low manufacturing cost, and is easy to produce and implement. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is one of the structural schematic diagrams of the existing PNL board;

[0018] Figure 2 This is the second structural diagram of the existing PNL board;

[0019] Figure 3 This is a schematic diagram of the exploded structure of a carrier suitable for ultra-thin substrate processing shown in Example 1 of the utility model;

[0020] Figure 4 for Figure 3 A schematic diagram of the structure of the vehicle body shown;

[0021] Figure 5 for Figure 3 An enlarged structural schematic diagram of the support member shown;

[0022] Figure 6 This is a schematic structural diagram of the carrier body described in Example 2 of the utility model.

[0023] Combined with the accompanying drawings, the following description is given:

[0024] 1. Carrier body; 10. Carrier board area; 100. First area; 1000. Support bar; 101. Second area; 102. Hollow area; 11. Concave pit; 12. Peripheral area; 13. Plate removal hole; 14. Tool hole; 2. Support member; 20. Base; 21. Support part. 3. PNL board; 30. Base plate. DETAILED DESCRIPTION

[0025] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0026] Embodiment 1:

[0027] This embodiment 1 provides a carrier suitable for ultra-thin substrate processing, which can be adapted to various PNL board 3 structures and can support the PNL board 3 stably and safely.

[0028] Please refer to the attached Figure 3 To Attachment Figure 5 As shown, the carrier suitable for ultra-thin substrate processing described in this embodiment 1 mainly includes a carrier body 1 and a plurality of support members 2, the carrier body 1 is recessed with a carrier area 10 for placing the PNL board, the carrier area 10 is provided with a first area 100 and a second area 101 surrounded by the first area 100 and protruding from the first area 100, and a plurality of pits 11 are spaced apart in the first area 100; the plurality of support members 2 are selectively inserted into the plurality of pits 11 according to the PNL board structure, it can be understood that the support members 2 and the pits 11 are detachably connected, and the portions of the plurality of support members 2 exposed outside the plurality of pits 11 and used to support the PNL board are all spherical crown-shaped, and the tops of the portions of the plurality of support members 2 exposed outside the plurality of pits 11 are also flush.

[0029] From the above, it can be seen that the method of using the carrier described in this embodiment 1 is: Figure 1 and attached Figure 2 The structure of the PNL plate 3 shown in FIG. 1 is taken as an example to illustrate. First, according to the structure of the PNL plate 3, the plurality of support members 2 are selectively inserted into the plurality of the pits 11. Specifically, when the PNL plate 3 is as shown in FIG. Figure 1 In the structure shown in FIG. 1 , a plurality of the support members 2 are correspondingly inserted into the adjacent Figure 3 In the two columns of the pits 11 corresponding to the number "6"; and when the PNL plate 3 adopts the Figure 2 In the structure shown in FIG. 1 , a plurality of the support members 2 are correspondingly inserted into the adjacent Figure 3 Then, the PNL board 3 is placed in the carrier area 10. At this time, the second area 101 provides contact support to the peripheral area of ​​the PNL board 3, and the plurality of support members 2 provide point contact support to the middle area of ​​the PNL board 3 through the spherical crown-shaped parts thereon; and, because the plurality of support members 2 are arranged according to the structure of the PNL board 3, the effective area of ​​the PNL board 3 can be perfectly avoided. It is understandable that because the effective area of ​​the PNL board 3 is not in contact with the plurality of support members 2 and is in a suspended state, the processing quality of the PNL board 3 can be well ensured. In short, the carrier described in this embodiment 1 can be well compatible with various structural / style designs of the PNL board (that is, well adapted to the diversified characteristics of the PNL board structure), and can also provide stable and safe support to the PNL board, which well meets the product processing requirements.

[0030] The specific structure of the carrier described in this embodiment 1 is described in detail below.

[0031] First, regarding the carrier body 1 .

[0032] Please continue to refer to the attached Figure 3 and attached Figure 4 As shown, in this embodiment 1, according to the structure and shape design of the PNL plate, ① the carrier area 10 is designed as follows: its overall cross-section is rectangular and is centrally located on one side of the carrier body 1; that is, the second area 101 is a rectangular ring and is centrally located on one side of the carrier body 1. ② Several of the pits 11 are arranged in rows and columns in the first area 100 of the carrier area 10, and further, several of the pits 11 are integrally formed with the first area 100 (that is, the carrier area 10); and the cross-section of the pit 11 is preferably designed to be any one of a circular, elliptical and rectangular shape, and the depth of the pit 11 is preferably designed to be 5 to 10 mm. Of course, the shape and depth of the pit 11 are not limited thereto, and can be specifically determined according to processing requirements.

[0033] In addition, if the portion of the carrier body 1 surrounding the board area 10 is defined as the peripheral area 12, the peripheral area 12 is provided with two board taking holes 13 and two tool holes 14, wherein the two board taking holes 13 are respectively close to and penetrate a pair of diagonal positions of the second area 101, and the two tool holes 14 are respectively provided outside the opposite sides of the second area 101. It can be understood that the board taking holes 13 can facilitate the staff to take the PNL board and prevent the board from being damaged. And the tool holes 14 can facilitate the staff to take and hang the carrier.

[0034] In addition, according to the structural design of the PNL board and based on the horizontal placement state of the carrier, the height difference between the peripheral area 12 and the second area 101 is 2-5 mm, and the height difference between the second area 101 and the first area 100 is 1-3 mm.

[0035] Next, let us discuss the support member 2 .

[0036] Generally, when the carrier is working normally, the number of the support members 2 thereon is less than the number of the pits 11 , because the support members 2 are only used to support the inactive area of ​​the PNL plate.

[0037] In this embodiment 1, the structure of the support member 2 is preferably designed as follows: Figure 5As shown, the support member 2 is provided with a base portion 20 that can be tightly inserted into the pit 11 and a support portion 21 that is fixedly connected to the upper end of the base portion 20 and is placed outside the pit 11, and the support portion 21 is in the shape of a spherical crown. It can be understood that the structure of the support member 2 in this embodiment 1 is similar to the structure of checkers. Of course, the structure of the support member 2 in this embodiment 1 is not limited to this, and other structures can also be used, such as: the support member 2 can also adopt a spherical structure.

[0038] Furthermore, the shape of the base portion 20 matches the shape of the pit 11, so that the base portion 20 can be tightly connected with the pit 11. Note: The "tight connection" here can be understood as a slightly tight connection, that is, when the base portion 20 is inserted into the pit 11, the tightness between the base portion 20 and the pit 11 can ensure that the support member 2 is not easy to shake, but the operator can insert and remove the support member 2 with a little force.

[0039] In addition, the base portion 20 is preferably integrally connected to the support portion 21 .

[0040] Furthermore, according to the structural design of the PNL plate, the top ends of the portions of the plurality of support members 2 exposed outside the plurality of recesses 11 (ie, the top ends of the support portions 21 ) are flush with the peripheral area 12 , respectively.

[0041] Embodiment 2:

[0042] The second embodiment also provides a carrier suitable for ultra-thin substrate processing, and compared with the first embodiment, the carrier structure described in the second embodiment has the following differences: ① The structure of the carrier body 1 in the carrier described in the second embodiment is different from that in the first embodiment.

[0043] For details, please refer to the attached Figure 6 As shown, in the carrier structure described in the present embodiment 2, a carrier area 10 for placing a PNL board is recessed on the carrier body 1, and the carrier area 10 includes a first area 100, a second area 101 surrounded by the first area 100 and protruding from the first area 100, and a plurality of hollow areas 102 arranged on the first area 100, the plurality of hollow areas 102 divide the first area 100 into a plurality of support bars 1000 connected in a criss-cross pattern, and a plurality of the pits 11 are arranged in rows and columns on the plurality of the support bars 1000.

[0044] It can be understood that based on the structure of the carrier body 1 described in the second embodiment, when the PNL plate 3 is used as shown in the attached Figure 1 In the structure shown in FIG. 1 , a plurality of the support members 2 are correspondingly inserted into the adjacent Figure 6In the two columns of the pits 11 corresponding to the number "6"; and when the PNL plate 3 adopts the Figure 2 In the structure shown in FIG. 1 , a plurality of the support members 2 are correspondingly inserted into the adjacent Figure 6 In the two columns of pits 11 corresponding to the number "10".

[0045] In addition, in addition to the above-mentioned difference ①, in the carrier structure provided in this embodiment 2, the shape of the second area 101, the shape and depth of the pit 11, the structure and layout of the plate taking hole 13 and the tool hole 14, the height difference relationship between the first area 100, the second area 101 and the peripheral area 12, the structure of the support member 2 and the connection method with the pit 11, etc., can all adopt the same technical solution as in embodiment 1, so they will not be repeated here.

[0046] Note: The prefixes "first", "second", etc. (such as the first area, the second area, etc.) of the component names in this specification are only for the convenience of description and are not used to limit the scope of implementation of the utility model patent.

[0047] In summary, the carrier suitable for ultra-thin substrate processing described in the utility model can be well compatible with various structural / style designs of PNL boards, and can stably and safely support PNL boards, which well meets the product processing requirements. In addition, the structure of the carrier described in the utility model is simple and reasonable, easy to process and manufacture, and the manufacturing cost is low, and it is easy to produce and implement.

[0048] In the above description, many specific details are described to facilitate a full understanding of the present invention. However, the above description is only a preferred embodiment of the present invention. The present invention can be implemented in many other ways different from those described herein, so the present invention is not limited by the specific implementation disclosed above. At the same time, any person familiar with the technical field can make many possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the scope of the technical solution of the present invention, or modify it into an equivalent embodiment of equivalent changes. Any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of protection of the technical solution of the present invention.

Claims

1. A carrier suitable for ultra-thin substrate processing, characterized in that: The invention comprises a carrier body (1) and a plurality of supporting members (2); a carrier area (10) for placing a PNL plate is recessed on the carrier body (1); the carrier area (10) is provided with a first area (100) and a second area (101) surrounding the first area (100) and protruding from the first area (100); and a plurality of recesses (11) are arranged at intervals in the first area (100); the plurality of supporting members (2) are selectively inserted into the plurality of recesses (11) according to the structure of the PNL plate, and the portions of the plurality of supporting members (2) exposed outside the plurality of recesses (11) and used to support the PNL plate are all spherical crown-shaped, and the top ends of the portions of the plurality of supporting members (2) exposed outside the plurality of recesses (11) are flush with each other.

2. The carrier suitable for ultra-thin substrate processing according to claim 1, characterized in that: The support member (2) is provided with a base portion (20) capable of being tightly inserted into the recess (11) and a support portion (21) fixedly connected to the upper end of the base portion (20) and disposed outside the recess (11); the support portion (21) is in the shape of a spherical crown.

3. The carrier suitable for ultra-thin substrate processing according to claim 2, characterized in that: The base portion (20) is integrally connected to the support portion (21).

4. The carrier suitable for ultra-thin substrate processing according to claim 2, characterized in that: The cross section of the concave pit (11) is any one of a circular, elliptical and rectangular shape, and the shape of the base portion (20) matches the shape of the concave pit (11).

5. The carrier suitable for ultra-thin substrate processing according to claim 1, characterized in that: A plurality of the pits (11) are arranged in rows and columns in the first area (100).

6. The carrier suitable for ultra-thin substrate processing according to claim 5, characterized in that: A plurality of hollow areas (102) are provided on the first area (100), and the plurality of hollow areas (102) divide the first area (100) into a plurality of support bars (1000) connected in a crisscross pattern; and a plurality of the pits (11) are arranged in rows and columns on the plurality of support bars (1000).

7. The carrier suitable for ultra-thin substrate processing according to claim 1, characterized in that: The second area (101) is in the shape of a rectangular ring and is centrally located on one side of the carrier body (1); The portion of the carrier body (1) that is arranged outside the board carrying area (10) is defined as a peripheral area (12), and two board taking holes (13) are provided on the peripheral area (12), and the two board taking holes (13) are respectively close to and penetrate a pair of diagonal corners of the second area (101).

8. The carrier suitable for ultra-thin substrate processing according to claim 7, characterized in that: Two tool holes (14) are also provided on the peripheral area (12), and the two tool holes (14) are respectively arranged outside two opposite sides of the second area (101).

9. The carrier suitable for ultra-thin substrate processing according to claim 7, characterized in that: Taking the horizontal placement state of the carrier as a reference, the height difference between the peripheral area (12) and the second area (101) is 2 to 5 mm, and the height difference between the second area (101) and the first area (100) is 1 to 3 mm; in addition, the top ends of the portions of the plurality of support members (2) exposed outside the plurality of pits (11) are respectively flush with the peripheral area (12).

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