Shielding cover assembly and electronic equipment

Abstract

The utility model provides a shielding case assembly and electronic equipment, relates to the technical field of electronic equipment, and is used for solving the problem that an existing shielding case easily causes an underfill adhesive to generate adverse effects on normal operation of other electronic components. The shielding case assembly provided by the utility model comprises a shielding case and a shielding plate. The shielding plate is fixed in the shielding cover, the shielding plate is provided with a first end part and a second end part along a first direction, the first end part and the second end part are fixedly connected with the inner surface of the shielding cover, and the first direction is parallel to the inner surface of the shielding cover. The first end portion and the second end portion of the shielding plate are fixedly connected with the inner surface of the shielding cover, namely, the edge of one side of the shielding plate is continuous, the edge only needs to be completely attached and fixed to the inner surface of the shielding cover in the installation process, the shielding plate does not deflect or incline, and the installation efficiency is improved. The side edge, far away from the cover plate, of the shielding plate can be completely attached to the circuit board, and therefore the risk that the bottom filling glue makes contact with the second electronic element to generate adverse effects on the second electronic element can be reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic devices, and in particular to a shielding cover assembly and an electronic device. Background Art

[0002] With the development of electronic information technology, the electromagnetic environment of electronic equipment is becoming more and more complex. Therefore, shielding covers are set above some electronic components in electronic equipment to reduce electromagnetic interference and ensure the smooth operation of electronic components. In addition, in order to improve the quality of solder joints between some electronic components and the circuit boards of electronic equipment and enhance the reliability of solder joints, bottom filler is filled between electronic equipment and circuit boards.

[0003] However, the existing shielding cover can easily cause the bottom filling glue to have an adverse effect on the normal operation of other electronic components, thereby affecting the normal operation of the electronic equipment. Utility Model Content

[0004] The embodiments of the present application provide a shielding cover assembly and an electronic device, which are used to solve the problem that the bottom filling glue of the existing shielding cover easily causes an adverse effect on the normal operation of other electronic components.

[0005] In order to achieve the above purpose, the embodiment of the present application adopts the following technical solution:

[0006] In a first aspect, an embodiment of the present application provides a shielding cover assembly, including a shielding cover and a shielding plate. The shielding plate is fixed in the shielding cover, and the shielding plate has a first end and a second end along a first direction, and the first end to the second end are fixedly connected to the inner surface of the shielding cover. The first direction is parallel to the inner surface of the shielding cover.

[0007] The shielding cover assembly provided in the first aspect of the present application is provided by fixing a shielding plate in the shielding cover, and using the shielding plate to separate the electronic components (hereinafter referred to as the first electronic components) on the circuit board of the electronic device that need to use the bottom filling glue to improve the quality of the solder joints between the circuit board and the circuit board and the electronic components (hereinafter referred to as the second electronic components) that cannot contact the bottom filling glue, for example, when the second electronic component is a high-precision resistor, it will fail after contacting the bottom filling glue. In addition, the first end to the second end of the shielding plate are fixedly connected to the inner surface of the shielding cover, that is, one side edge of the shielding plate is continuous, and when installing, it is only necessary to completely fit and fix the edge on the inner surface of the shielding cover to complete the fixing of the shielding plate, and the shielding plate will not deflect and tilt. When the above-mentioned shielding cover assembly is set on the circuit board and filled with the bottom filling glue, the side edge of the shielding plate away from the cover plate can be completely fitted on the circuit board, that is, there is no gap between the side of the shielding plate away from the cover plate and the circuit board, thereby reducing the risk of the bottom filling glue contacting the second electronic component and causing adverse effects on it.

[0008] In combination with the first aspect, in a possible implementation, the shielding plate includes a first plate body and a second plate body, the first plate body is fitted and fixed to the inner surface of the shielding cover, and the second plate body forms an angle with the first plate body and is fixedly connected. Since the thickness of the shielding plate is relatively small, its edge is not convenient to be directly fixed on the shielding cover. Therefore, the shielding plate is composed of a first plate body and a second plate body that form a certain angle with each other. For example, the shielding plate can be formed by bending a piece of metal plate. The first plate body is mainly used to fit on the shielding cover to increase the contact area between the shielding plate and the shielding cover, which is convenient for fixing the shielding plate. The second plate body is mainly used to block the bottom filling glue to prevent the bottom filling glue from overflowing and contacting the second electronic component to cause it to fail.

[0009] In combination with the first aspect, in another possible implementation, the first plate and the second plate are perpendicular to each other. Since the first plate is in contact with the inner surface of the shielding cover, the second plate is also perpendicular to the inner surface of the shielding cover, so that the second plate can separate the first electronic component from the second electronic component while minimizing the space occupied by the second plate for arranging the electronic components in the shielding cover, which is conducive to the miniaturization of the shielding cover assembly.

[0010] In combination with the first aspect, in another possible implementation, along the first direction, the length of the first plate is greater than or equal to the length of the second plate. In this way, both ends of the second plate along the first direction are fixedly connected to the first plate, so that the second plate will not be easily deformed, thereby reducing the risk of the second electronic component failing due to contact between the second plate and the second electronic component on one side thereof.

[0011] In combination with the first aspect, in another possible implementation, the first plate body and the second plate body are integrally formed. That is, the first plate body and the second plate body form a structural component as a whole, and there is no separation fault between the two. Compared with the split structure, the integrally formed structure is more solid and easy to manufacture (for example, one-step forming by injection molding, casting, stamping and bending, etc.), thereby reducing production costs.

[0012] In combination with the first aspect, in another possible implementation, at least part of the surface of the first board body away from the shielding cover is provided with an insulating layer. In some cases, the height of the second electronic component is relatively high. After the shielding cover assembly is buckled onto the circuit board, the gap between the second electronic component with a relatively high height and the first board body is relatively small. In this case, a slight deformation of the shielding cover can easily cause the second electronic component to contact the first board body and thus cause failure. Therefore, by providing an insulating layer on the surface of the first board body away from the shielding cover, that is, by using the insulating layer to isolate the second electronic component from the first board body, the risk of failure of the second electronic component can be effectively reduced.

[0013] In combination with the first aspect, in another possible implementation, an opening is provided on the first plate body, and the opening penetrates the first plate body along the thickness direction of the first plate body. In some cases, the height of the second electronic component is relatively high. After the shielding cover assembly is buckled onto the circuit board, the gap between the second electronic component with a relatively high height and the first back plate is relatively small. In this case, a slight deformation of the shielding cover can easily cause the second electronic component to contact the first plate body and thus cause failure. Therefore, through the above-mentioned structural design, an opening is provided on the first plate body to avoid the second electronic component with a relatively high height, which is equivalent to increasing the distance between the top surface of the second electronic component and the shielding cover assembly without increasing the overall height of the shielding cover assembly, which is conducive to the thinness of the electronic device.

[0014] In combination with the first aspect, in another possible implementation, a first positioning hole is provided on the shielding cover, a second positioning hole is provided on the first plate body of the shielding plate, and the first positioning hole and the second positioning hole are arranged opposite to each other. In this way, when the shielding plate is fixed to the shielding cover, the first positioning hole and the second positioning hole can be aligned to achieve the positioning of the shielding plate on the shielding cover.

[0015] In combination with the first aspect, in another possible implementation, a plurality of first positioning holes are arranged at intervals, a plurality of second positioning holes are arranged at intervals, and a plurality of first positioning holes correspond to a plurality of second positioning holes one by one. In this way, by arranging a plurality of first positioning holes at intervals, and a plurality of second positioning holes corresponding to the first positioning holes one by one, a straight line can be determined by connecting the axes of two first positioning holes or two second positioning holes, so that not only the position of the shielding plate on the shielding cover can be determined, but also the angle between the shielding plate and the side wall of the shielding cover can be determined, thereby making the positioning of the shielding plate on the shielding cover more accurate.

[0016] In combination with the first aspect, in another possible implementation, the shielding cover includes a cover plate and a frame, the cover plate is fixed to one side of the frame, and the shielding plate is fixed to the cover plate. In this way, the structure of the shielding cover is relatively simple, which is convenient for production and processing (such as one-time stamping), and reduces costs.

[0017] In combination with the first aspect, in another possible implementation, a glue injection hole is provided on the shielding cover, so that after the shielding cover assembly is buckled onto the circuit board, bottom filling glue can be easily filled between the first electronic component and the shielding cover through the glue injection hole.

[0018] In combination with the first aspect, in another possible implementation, the shielding cover and the shielding plate are both made of metal. In this way, on the one hand, the shielding cover made of metal has good electromagnetic shielding performance and anti-interference performance, which is conducive to ensuring the stable operation of electronic components. On the other hand, the shielding plate can be fixed to the inner surface of the shielding cover by welding, which is simpler in process and convenient for the production and processing of the shielding cover assembly.

[0019] In a second aspect, the present application provides an electronic device, which includes a housing, a circuit board, a first electronic component, a second electronic component, a bottom filler, and the shielding cover assembly of the first aspect. The circuit board is arranged in the housing, and the first electronic component and the second electronic component are both electrically connected to the circuit board. The shielding cover is buckled on the circuit board, and the first electronic component and the second electronic component are respectively located on both sides of the shielding plate. The bottom filler is filled between the first electronic component and the circuit board.

[0020] It can be understood that the beneficial effects that can be achieved by the electronic device described in the second aspect and any possible implementation thereof provided above can refer to the beneficial effects in the first aspect and any possible implementation thereof, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the overall structure of an electronic device provided in an embodiment of the present application;

[0022] Figure 2 for Figure 1 Structural explosion diagram of electronic equipment;

[0023] Figure 3 A schematic diagram of a structure in which a baffle is fixed in a shielding cover provided in an embodiment of the present application;

[0024] Figure 4 for Figure 3 A cross-sectional schematic diagram of the shielding cover being buckled onto the circuit board;

[0025] Figure 5 for Figure 3 Schematic diagram of the baffle in the bending deformation;

[0026] Figure 6 A schematic diagram of another baffle provided in an embodiment of the present application being fixed on a shielding cover;

[0027] Figure 7 is a schematic diagram showing that the first pad and the second pad are not coplanar after bending;

[0028] Figure 8 for Figure 7 Schematic diagram of the baffle after it is deflected and tilted;

[0029] Fig. 9 A schematic structural diagram of a shielding cover assembly provided in an embodiment of the present application;

[0030] Fig.10 A schematic diagram of the structure of a shielding plate provided in an embodiment of the present application;

[0031] Fig.11A schematic diagram of the structure of another shielding plate provided in an embodiment of the present application;

[0032] Fig.12 A schematic diagram of the bending deformation of the first plate body of the cover plate and the shielding plate of the shielding cover;

[0033] Fig.13 A schematic structural diagram of another shielding cover assembly provided in an embodiment of the present application;

[0034] Fig.14 for Fig.13 A cross-sectional schematic diagram of the shielding cover assembly being buckled onto the circuit board;

[0035] Fig.15 A schematic structural diagram of another shielding cover assembly provided in an embodiment of the present application;

[0036] Fig.16 for Fig.15 A cross-sectional schematic diagram of the shielding cover assembly being buckled onto the circuit board;

[0037] Fig.17 A schematic structural diagram of another shielding cover assembly provided in an embodiment of the present application;

[0038] Fig.18 for Fig.17 A cross-sectional schematic diagram of the shielding cover assembly being buckled onto the circuit board;

[0039] Fig.19 An exploded view of the structure of a shielding cover assembly provided in an embodiment of the present application;

[0040] Fig. 20 A schematic structural diagram of another shielding cover assembly provided in an embodiment of the present application.

[0041] Reference numerals:

[0042] 01. electronic device; 10. display module; 11. light-transmitting cover plate; 12. display screen; 20. shell; 21. battery cover; 22. middle frame; 23. middle plate; 30. camera module; 40. circuit board; 50. camera decorative cover; 60. battery; 70. shielding cover assembly; 71. shielding cover; 711. cover plate; 712. frame; 72. shielding plate; 72a. first end; 72b. second end; 721. first plate body; 722. second plate body; 73. insulating layer; 710. first positioning hole; 720. second positioning hole; 730. glue injection hole; 740. opening; 80. electronic component; 80a. first electronic component; 80b. second electronic component; 90. bottom filling glue; 100. baffle; 101. first solder pad; 102. second solder pad; 200. gap. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solution and advantages of the application more clear, the present application is further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0044] In the description of the present application, it should be clarified that the terms "vertical", "lateral", "longitudinal", "front", "rear", "left", "right", "up", "down", "horizontal" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present application, and do not mean that the devices or elements referred to must have a specific direction or position, and therefore cannot be understood as limiting the present application. The "quantity" mentioned above cannot be understood as limiting the present application.

[0045] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0046] The embodiment of the present application provides an electronic device 01. Specifically, the electronic device 01 may be a portable electronic device or other types of electronic devices. For example, the electronic device may be a mobile phone, a tablet computer, a personal digital assistant (PDA), a monitor, a wearable device, etc. For the convenience of description, the following examples are all taken as an example of the electronic device 01 being a mobile phone.

[0047] See also Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of the overall structure of the electronic device 01 provided in the embodiment of the present application. Figure 2 For the above Figure 1 Exploded diagram of the structure of the electronic device 01. As can be seen from the above, in this embodiment, the electronic device 01 is a mobile phone, and the electronic device 01 can be in an approximately rectangular plate-shaped structure. The electronic device 01 can include a display module 10, a housing 20, a camera module 30, a circuit board 40, a camera decorative cover 50, a battery 60, and a shielding cover 71.

[0048] For the convenience of the following description, an XYZ coordinate system is established, and the width direction of the electronic device 01 is defined as the X-axis direction, the length direction of the electronic device 01 is defined as the Y-axis direction, and the thickness direction of the electronic device 01 is defined as the Z-axis direction. Therefore, this application does not make any special restrictions on this. It can be understood that Figure 1 and Figure 2 Only some components of the electronic device 10 are schematically shown, and the actual shapes, sizes, positions and structures of these components are not subject to the present invention. Figure 1 and Figure 2 restrictions.

[0049] The above-mentioned display module 10 is used to display images, videos, etc. The display module 10 may include a transparent cover plate 11 and a display screen 12 (English name: panel 1, also called a display panel), and the transparent cover plate 11 and the display screen 12 are stacked. The material of the transparent cover plate 11 includes but is not limited to glass. For example, the transparent cover plate 11 can adopt an ordinary transparent cover plate to protect the display screen to avoid damage to the display screen due to external force, and it can play a dust-proof role. Alternatively, the transparent cover plate 11 can also adopt a transparent cover plate with a touch function, so that the electronic device 01 has a touch function, which makes it more convenient for users to use. Therefore, the present application does not specifically limit the specific material of the transparent cover plate 11.

[0050] In addition, the display screen 12 may be a flexible display screen or a rigid display screen. For example, the display screen 12 may be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen, a mini light-emitting diode (MID) display screen, a micro light-emitting diode (MID) display screen, a micro organic light-emitting diode (MID) display screen, a quantum dot light-emitting diode (QLED) display screen, a liquid crystal display (LCD), etc.

[0051] The housing 20 is used to protect the electronic components inside the electronic device 01. The housing 20 may include a battery cover 21 and a middle frame 22. The battery cover 21 is located on the side of the display screen 12 away from the light-transmitting cover plate 11, and is stacked with the light-transmitting cover plate 11 and the display screen 12. The middle frame 22 is located between the light-transmitting cover plate 11 and the battery cover 21. The battery cover 21 is fixed to the middle frame 22. For example, the battery cover 21 may be fixed to the middle frame 22 by bonding, threading, welding, snapping, etc. The light-transmitting cover plate 11 may be fixed to the middle frame 22 by gluing, so that the light-transmitting cover plate 11, the battery cover 21, and the middle frame 22 enclose a storage space inside the electronic device 01. The display screen 12, the circuit board 40, and the camera module 30 are all arranged in the internal storage space.

[0052] In some embodiments, the housing 20 may further include a middle plate 23, which is disposed in the accommodating cavity, and the middle plate 23 is located on the side of the display screen 12 away from the light-transmitting cover plate 11. The middle plate 23 is fixedly connected to the middle frame 22 to form the middle frame of the electronic device 10. For example, the middle plate 23 and the middle frame 22 may be fixedly connected by gluing, threading, welding, snapping, etc.; or, the middle plate 23 and the middle frame 22 may also be an integrally formed structure, that is, the middle plate 23 and the middle frame 22 form a structural component as a whole. The middle plate 23 divides the accommodating cavity into two independent spaces, one of which is located between the light-transmitting cover plate 11 and the middle plate 23, and the display screen 12 is located in the space. The other space is located between the middle plate 23 and the battery cover 21, and the circuit board 40, the camera module 30 and the battery 60 are all arranged in the space.

[0053] The camera module 30 is used to realize video or image shooting and can realize auto focus (AF, AutoFocus), so it can be applied to various shooting scenes. Figure 1 and Figure 2 As shown, the camera module 30 is arranged near the edge of one side of the battery cover 21. Alternatively, the camera module 30 may be located at the middle position of the upper part of the battery cover 21 (not shown in the figure). Therefore, the specific position of the camera module 30 is not particularly limited in this application.

[0054] The camera decorative cover 50 is used to prevent foreign objects such as dust from outside from entering the electronic device 01 or the camera module 30, and to prevent the camera module 30 from being scratched or hit by external objects.

[0055] The circuit board 40 is used to set the electronic components 80 of the electronic device 01 and realize the electrical connection between the electronic components 80. The battery 60 is electrically connected to the circuit board 40 to provide power to the electronic components 80. Exemplarily, the electronic component 80 can be a control chip (such as a system on chip, System on Chip, SOC), a graphics control chip (Graphics processing unit, GPU), a universal storage (UFS), a filter, an inductor, a resistor, etc.

[0056] The shielding cover 71 is buckled on the circuit board 40, and the electronic components 80 on the circuit board 40 are located in the shielding cover 71. The shielding cover 71 is used to reduce the electromagnetic interference to the electronic components 80 on the circuit board 40, and ensure the good operation of the electronic components 80. It can be understood that the material of the shielding cover 71 can be copper, aluminum, aluminum alloy, stainless steel and other metal materials, so that it has good electromagnetic shielding performance and anti-interference performance, which is conducive to ensuring the stable operation of the electronic components 80.

[0057] The shielding cover 71 may include a cover plate 711 and a frame 712. The cover plate 711 is fixed to one side of the frame 712. After the shielding cover 71 is snapped onto the circuit board 40, the shielding cover 71 and the circuit board 40 are arranged to form a receiving cavity. The electronic components 80 on the circuit board 40 are located in the above-mentioned receiving cavity. The edge of the frame 712 away from the cover plate 711 is welded and fixed to the circuit board 40.

[0058] For the convenience of the following description, the height direction of the shielding cover 71 is the thickness direction of the electronic device 01, the length direction of the shielding cover 71 can be the length direction of the electronic device 01, and the width direction of the shielding cover 71 is the width direction of the electronic device 01; or, the width direction of the shielding cover 71 can be the length direction of the electronic device 01, and the length direction of the shielding cover 71 is the width direction of the electronic device 01. Therefore, this application does not make any special limitation on this.

[0059] In order to improve the quality of the solder joints between the part of the electronic component 80 (hereinafter referred to as the first electronic component 80a) under the shielding cover 71 and the circuit board 40 and to enhance the reliability of the solder joints, an underfill (UF, Underfill) glue 90 is also filled between the first electronic component 80a and the circuit board 40. In addition, a second electronic component 80b is also provided on the circuit board 40, and the second electronic component 80b cannot contact the underfill glue 90. However, since the underfill glue 90 has fluidity, when the underfill glue 90 is filled, part of the underfill glue 90 may flow to contact the second electronic component 80b, thereby causing an adverse effect on the normal operation of the second electronic component 80b (for example, when the second electronic component 80b is a high-precision resistor, it will fail after contacting the underfill glue 90). For ease of explanation, the following examples are all taken as an example of the second electronic component 80b being a high-precision resistor.

[0060] For the reasons stated above, see Figure 3 and Figure 4 As shown, Figure 3 A schematic diagram of a structure in which a baffle 100 provided in an embodiment of the present application is fixed in a shielding cover 71. Figure 4 for Figure 3 Schematic diagram of a cross section (parallel to the YZ plane) of the shielding cover 71 buckled on the circuit board 40. A baffle 100 is fixedly arranged on the cover plate 711 of the shielding cover 71, and the baffle 100 is used to separate the first electronic component 80a and the second electronic component 80b, and to block the bottom filling glue 90 when filling the bottom filling glue 90, so as to prevent the bottom filling glue 90 from flowing to contact with the second electronic component 80b (high-precision resistor) and causing its failure.

[0061] It is understandable that the extending direction of the baffle 100 depends on the distribution position of the first electronic component 80a and the second electronic component 80b, and this application does not specifically limit it. Figure 4 As shown, the first electronic component 80a and the second electronic component 80b are spaced apart in the Y-axis direction, and the blocking piece 100 is located between the first electronic component 80a and the second electronic component 80b and extends in the X-axis direction, thereby separating the first electronic component 80a and the second electronic component 80b.

[0062] The material of the baffle 100 can be metal materials such as copper, aluminum, aluminum alloy, stainless steel, etc., or non-metal materials such as plastic, ceramic, etc., and this application does not make any special limitation on this.

[0063] For ease of understanding, the following description is based on an example in which the shielding cover 71 and the blocking piece 100 are made of the same metal, so that the blocking piece 100 and the shielding cover 71 can be fixed together by welding for ease of production and processing.

[0064] For the purpose of lightweight design and to save space in the shielding cover 71, the baffle 100 is generally a thin plate structure with a small thickness (generally about 0.1 mm). This results in a small contact area between the baffle 100 and the cover 711 of the shielding cover 71, making it difficult to weld the baffle 100 to the cover 711. Figure 3 As shown, along the X-axis direction, the baffle 100 has a first end and a second end that are opposite, and a first solder pad 101 is provided on one side of the first end of the baffle 100. The baffle 100 and the first solder pad 101 are integrally formed by bending a plate, which is equivalent to increasing the contact area between the baffle 100 and the cover plate 711 by using the first solder pad 101. The baffle 100 can be fixed by fitting and welding the first solder pad 101 on the cover plate 711 of the shielding cover 71.

[0065] However, the above structure is equivalent to fixing the first end of the baffle 100, and the majority of the baffle 100 is still not fixed to the cover plate 711 and is in a suspended state. When the electronic device 01 is impacted or vibrated, Figure 5 As shown, Figure 5 for Figure 3 Schematic diagram of the baffle 100 in the figure when it is bent and deformed. The unfixed portion of the baffle 100 is prone to bend and deform in the Y-axis direction ( Figure 5 The dotted line in the middle shows the position of the baffle 100 after bending and deformation), which then contacts the second electronic component 80 b and causes a short circuit, affecting the normal operation of the electronic device 01 .

[0066] Therefore, see Figure 6 As shown, Figure 6 A schematic diagram of another blocking piece 100 provided in an embodiment of the present application being fixed on a shielding cover 71 . Figure 6 The baffle 100 is equivalent to the above Figure 3 A second solder pad 102 is added to one side of the second end of the middle baffle 100, and the first solder pad 101 and the second solder pad 102 are arranged at intervals on the same side of the baffle 100, and the baffle 100, the first solder pad 101 and the second solder pad 102 are formed as one piece by bending a plate. By respectively fitting and welding the first solder pad 101 and the second solder pad 102 on the cover plate 711 of the shielding cover 71, the two ends of the baffle 100 can be fixed, thereby reducing the risk of bending and deformation of the baffle 100.

[0067] However, when the above structure is bent, the first pad 101 and the second pad 102 need to be bent twice respectively, which may easily cause the first pad 101 and the second pad 102 to be not on the same plane, and there is a height difference between the two. Figure 7 and Figure 8 As shown, Figure 7is a schematic diagram showing that the first pad 101 and the second pad 102 are not coplanar after being bent. Figure 8 for Figure 7 Schematic diagram of the baffle 100 after deflection and tilting. After the first solder pad 101 and the second solder pad 102 are welded and fixed on the cover plate 711 of the shielding cover 71, the baffle 100 will be deflected and tilted relative to the cover plate 711. At this time, the edge of the side of the baffle 100 away from the cover plate 711 cannot be completely fitted with the circuit board 40, that is, there will be a gap 200 between the side of the baffle 100 away from the cover plate 711 and the circuit board 40, and the bottom filling glue 90 may flow from one side of the baffle 100 through the gap 200 to the other side of the baffle 100 and contact the second electronic component 80b, thereby causing the second electronic component 80b to fail.

[0068] In order to solve the above problems, the present application embodiment provides a shielding cover assembly 70, see Fig. 9 As shown, Fig. 9 A schematic structural diagram of a shielding cover assembly 70 provided in an embodiment of the present application.

[0069] The shielding cover assembly 70 may include a shielding plate 72 and the shielding cover 71. The shielding cover 71 includes a cover plate 711 and a frame 712, the cover plate 711 is fixed to one side of the frame 712, the shielding plate 72 is fixed inside the shielding cover 71, the shielding plate 72 has a first end 72a and a second end 72b along a first direction, and the first end 72a to the second end 72b of the shielding plate 72 are fixedly connected to the cover plate 711 of the shielding cover 71.

[0070] It can be understood that the first direction is the extension direction of the shielding plate 72, and the extension direction of the shielding plate 72 is affected by the distribution position of the first electronic component 80a and the second electronic component 80b. The first direction can be parallel to the X-axis direction, or parallel to the Y-axis direction, or form a certain angle with the Y-axis or the Y-axis, as long as it can be parallel to the XY plane. This application does not make any special restrictions on this. For ease of understanding, the following examples are all taken as an example of the first direction being the X-axis direction.

[0071] The material of the shielding plate 72 is the same metal as the shielding cover 71, so the shielding plate 72 can be fixed to the inner surface of the shielding cover 71 by welding, which simplifies the process and facilitates the production and processing of the shielding cover assembly 70, thereby helping to reduce costs.

[0072] In this way, by fixing the baffle plate 72 in the shielding cover 71, the baffle plate 72 is used to separate the first electronic component 80a and the second electronic component 80b on the circuit board 40 in the electronic device 01, thereby preventing the bottom filling glue 90 from overflowing and contacting the second electronic component 80b and causing its failure when filling the bottom filling glue 90. In addition, the first end 72a to the second end 72b of the baffle plate 72 are fixedly connected to the cover plate 711 of the shielding cover 71, that is, one side edge of the baffle plate 72 is continuous, and during installation, the baffle plate 72 can be fixed by simply fitting the edge completely onto the cover plate 711, and the baffle plate 72 will not deflect or tilt. When the above-mentioned shielding cover assembly 70 is set on the circuit board 40, the side edge of the baffle plate 72 away from the cover plate 711 can be completely fitted onto the circuit board 40, that is, there is no above-mentioned gap 200 between the side of the baffle plate 72 away from the cover plate 711 and the circuit board 40, thereby reducing the risk of failure caused by the bottom filling glue 90 flowing from one side of the baffle plate 72 to the other side of the baffle plate 72 and contacting the second electronic component 80b.

[0073] In some embodiments, see Fig.10 As shown, Fig.10 A schematic diagram of the structure of a shielding plate 72 provided in an embodiment of the present application. The shielding plate 72 may include a first plate 721 and a second plate 722. The first plate 721 is fitted and fixed to the inner surface of the shielding cover 71, and the second plate 722 forms an angle with the first plate 721 and is fixedly connected.

[0074] In this way, the shielding plate 72 can be formed by bending a metal plate, and the first plate body 721 is mainly used to fit on the shielding cover 71 to increase the contact area between the shielding plate 72 and the shielding cover 71, so as to facilitate the welding and fixing of the shielding plate 72. The second plate body 722 is mainly used to block the bottom filling glue 90 to prevent the bottom filling glue 90 from overflowing and contacting the second electronic component 80b to cause its failure.

[0075] For further information, please see Fig.10 As shown, the first plate 721 and the second plate 722 are perpendicular to each other. Since the first plate 721 is in contact with the cover plate 711 of the shielding cover 71, the second plate 722 is also perpendicular to the cover plate 711 of the shielding cover 71. In this way, the second plate 722 can separate the first electronic component 80a and the second electronic component 80b, while minimizing the space occupied by the second plate 722 for arranging the electronic components 80 in the shielding cover 71, which is conducive to the miniaturization of the shielding cover assembly 70. In addition, when the shielding cover assembly 70 is buckled on the circuit board 40, the second plate 722 will also be perpendicular to the circuit board 40, so that it is convenient to weld and fix the side edge of the second plate 722 away from the first plate 721 to the circuit board 40.

[0076] In some embodiments, along the first direction (parallel to the X-axis), the length L1 of the first plate 721 is greater than or equal to the length L2 of the second plate 722 .

[0077] For example, see Fig.10 As shown, in the X-axis direction, the length L1 of the first plate 721 is equal to the length L2 of the second plate 722, and the two ends of the first plate 721 are flush with the two ends of the second plate 722. At this time, the shielding plate 72 is equivalent to being bent and formed by a rectangular plate.

[0078] For another example, see Fig.11 As shown, Fig.11 A schematic diagram of the structure of another shielding plate 72 provided in an embodiment of the present application. In the X-axis direction, the length L1 of the first plate 721 is greater than the length L2 of the second plate 722, and both ends of the first plate 721 protrude from both ends of the second plate 722. At this time, one end of the first plate 721 serves as the first end 72a of the shielding plate 72, and the other end of the first plate 721 serves as the second end 72b of the shielding plate 72.

[0079] Through the above arrangement, it is equivalent to that the edge of the second plate body 722 close to the first plate body 721 is completely fixedly connected to the first plate body 721, and there is no suspended part of the second plate body 722, so that the second plate body 722 will not easily bend and deform in the Y-axis direction, thereby reducing the risk of the second electronic component 80b failing due to the contact between the second plate body 722 and the second electronic component 80b on one side.

[0080] See also Fig.12 As shown, Fig.12 Schematic diagram of the bending deformation of the cover plate 711 of the shielding cover 71 and the first plate 721 of the shielding plate 72. In some cases, the height of the second electronic component 80b along the Z-axis direction is relatively high. When the shielding cover assembly 70 is buckled onto the circuit board 40, the gap between the second electronic component 80b and the first plate 721 is relatively small. In this case, a slight deformation of the cover plate 711 of the shielding cover 71 along the Z-axis direction will cause the first plate 721 of the shielding plate 72 to bend and deform, thereby causing the second electronic component 80b to contact the first plate 721 and fail. Therefore, please refer to Fig.13 and Fig.14 As shown, Fig.13 A schematic diagram of the structure of another shielding cover assembly 70 provided in an embodiment of the present application, Fig.14 for Fig.13Schematic diagram of a cross section (parallel to the YZ plane) of the shielding cover assembly 70 buckled on the circuit board 40. An insulating layer 73 is provided on the surface of the first board 721 away from the shielding cover 71, and the insulating layer 73 can cover the vertical projection of the second electronic component 80b on the first board 721. That is, the insulating layer 73 is used to isolate the second electronic component 80b from the first board 721, thereby effectively reducing the risk of failure of the second electronic component 80b.

[0081] It is understandable that the insulating layer 73 may cover a partial area of ​​the first plate 721 , or may completely cover the surface of the first plate 721 away from the shielding cover 71 , and the present application does not make any special limitation on this.

[0082] The insulating layer 73 may be a coated insulating varnish or a pasted insulating film.

[0083] In other embodiments, in addition to using the insulating layer 73 to block and prevent the second electronic component 80 b from failing, the risk of failure of the second electronic component 80 b may be reduced by the structural design of the shielding plate 72 .

[0084] See also Fig.15 and Fig.16 As shown, Fig.15 This is a schematic diagram of the structure of another shielding cover assembly 70 provided in an embodiment of the present application. Fig.16 for Fig.15 Schematic diagram of a cross section (parallel to the YZ plane) of the shielding cover assembly 70 buckled on the circuit board 40. An opening 740 is formed on the first plate body 721 of the shielding plate 72, and the opening 740 penetrates the first plate body 721 along the thickness direction (parallel to the Z axis direction) of the first plate body 721.

[0085] In this way, the opening 740 is used to avoid the second electronic component 80b with a higher height in the Z-axis direction, and the cross-sectional area of ​​the opening 740 must be greater than or equal to the cross-sectional area of ​​the second electronic component 80b in the section parallel to the XY plane.

[0086] At this time, in the Z-axis direction, the distance between the second electronic component 80b and the shielding cover assembly 70 is equal to the sum of the thickness of the first plate 721 and the distance between the second electronic component 80b and the first plate 721. In this way, even if the cover 711 is slightly deformed in the Z-axis direction, the cover 711 will not contact the second electronic component 80b and cause it to fail.

[0087] The above embodiment describes that one of the methods of setting an insulating layer 73 on the surface of the first plate 721 away from the shielding cover 71 or opening a hole 740 on the first plate 721 prevents the second electronic component 80b from failing. In addition, the above two limiting methods can also be combined together, see Fig.17 As shown, Fig.17 This is a schematic diagram of the structure of another shielding cover assembly 70 provided in an embodiment of the present application. Fig.18 for Fig.17 The cross-sectional view (parallel to the YZ plane) of the shielding cover assembly 70 buckled on the circuit board 40 is shown in FIG. That is, while the insulating layer 73 is provided on the surface of the first board 721 away from the shielding cover 71, an opening 740 for avoiding the second electronic component 80b is provided on the first board 721, thereby further reducing the risk of the second electronic component 80b contacting with the shielding cover assembly 70 and failing.

[0088] In some embodiments, see Fig.19 As shown, Fig.19 This is an exploded view of the structure of a shielding cover assembly 70 provided in an embodiment of the present application. In order to facilitate the positioning of the shielding plate 72 on the shielding cover 71 when the shielding plate 72 is fixed to the shielding cover 71, a first positioning hole 710 is provided on the cover plate 711 of the shielding cover 71, and a second positioning hole 720 is provided on the first plate body 721 of the shielding plate 72. The first positioning hole 710 and the second positioning hole 720 are arranged opposite to each other. In this way, the positioning of the shielding plate 72 on the shielding cover 71 can be achieved by aligning the first positioning hole 710 and the second positioning hole 720.

[0089] For further information, please see Fig.19 As shown, a plurality of first positioning holes 710 are arranged at intervals, and a plurality of second positioning holes 720 are arranged at intervals, and a plurality of first positioning holes 710 and a plurality of second positioning holes 720 correspond one to one. In this way, by arranging a plurality of first positioning holes 710 at intervals, and a plurality of second positioning holes 720 corresponding one to one with the first positioning holes 710, a straight line can be determined by connecting the axes of two first positioning holes 710 or two second positioning holes 720, so that not only the position of the first plate body 721 of the shielding plate 72 on the cover plate 711 of the shielding cover 71 can be determined, but also the angle between the second plate body 722 of the shielding plate 72 and the frame 712 of the shielding cover 71 can be determined, thereby making the positioning of the shielding plate 72 on the shielding cover 71 more accurate.

[0090] In order to improve the positioning accuracy between the baffle plate 72 and the shielding cover 71, in the cross section parallel to the cover plate 711 (parallel to the XY plane), the shape and size of the above-mentioned first positioning hole 710 can also be adapted to the shape and size of the second positioning hole 720 (for example, both are circular, elliptical, rectangular, etc.).

[0091] In addition to the above positioning method, a positioning groove can be opened on the cover plate 711 of the shielding cover 71, and a positioning column is set on the surface of the first plate body 721 of the baffle plate 72 facing the cover plate 711. Positioning can also be achieved by inserting the positioning column into the positioning groove, which will not be repeated here.

[0092] On the basis of the above, see Fig. 20 As shown, Fig. 20 A schematic diagram of the structure of another shielding cover assembly 70 provided in an embodiment of the present application. A glue injection hole 730 is also provided on the cover plate 711 of the shielding cover 71. After the shielding cover assembly 70 is buckled onto the circuit board 40, the bottom filling glue 90 is conveniently filled between the first electronic component 80a and the circuit board 40 through the glue injection hole 730.

[0093] It is understandable that the cross-sectional shape of the above-mentioned glue injection hole 730 can be a regular shape such as a circle, a rectangle, etc., or can be other irregular shapes, and the present application does not make any special limitation on this.

[0094] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0095] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A shielding cover assembly, characterized in that: include: Shielding cover; A shielding plate, the shielding plate is fixed in the shielding cover, the shielding plate has a first end and a second end along a first direction, and the first end to the second end are all fixedly connected to the inner surface of the shielding cover; Wherein, the first direction is parallel to the inner surface of the shielding cover.

2. The shielding cover assembly according to claim 1, characterized in that: The shielding plate includes a first plate body and a second plate body. The first plate body is fitted and fixed to the inner surface of the shielding cover, and the second plate body forms an angle with the first plate body and is fixedly connected.

3. The shielding cover assembly according to claim 2, characterized in that: The first plate body and the second plate body are perpendicular to each other.

4. The shielding cover assembly according to claim 2, characterized in that: Along the first direction, the length of the first plate body is greater than or equal to the length of the second plate body.

5. The shielding cover assembly according to claim 2, characterized in that: The first plate body and the second plate body are integrally formed.

6. The shielding cover assembly according to any one of claims 2 to 5, characterized in that: An insulating layer is provided on at least a portion of a surface of the first plate body facing away from the shielding cover.

7. The shielding cover assembly according to any one of claims 2 to 5, characterized in that: The first plate body is provided with an opening, and the opening penetrates the first plate body along a thickness direction of the first plate body.

8. The shielding cover assembly according to any one of claims 2 to 5, characterized in that: The shielding cover is provided with a first positioning hole, the first plate body is provided with a second positioning hole, and the first positioning hole and the second positioning hole are arranged opposite to each other.

9. The shielding cover assembly according to claim 8, characterized in that: A plurality of the first positioning holes are arranged at intervals, and a plurality of the second positioning holes are arranged at intervals, and a plurality of the first positioning holes and a plurality of the second positioning holes correspond one to one.

10. The shielding cover assembly according to any one of claims 1 to 5, characterized in that: The shielding cover comprises a cover plate and a frame, the cover plate is fixed to one side of the frame, and the shielding plate is fixed to the cover plate.

11. The shielding cover assembly according to any one of claims 1 to 5, characterized in that: The shielding cover is provided with a glue injection hole.

12. The shielding cover assembly according to any one of claims 1 to 5, characterized in that: The shielding cover and the shielding plate are both made of metal.

13. An electronic device, characterized in that: include: case; A circuit board is arranged in the housing; A first electronic component and a second electronic component are both electrically connected to the circuit board; A shielding cover assembly, which is the shielding cover assembly according to any one of claims 1 to 12, wherein the shielding cover is buckled on the circuit board, and the first electronic component and the second electronic component are respectively located on both sides of the shielding plate; The bottom filling glue is filled between the first electronic component and the circuit board.

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