Tray processing mechanism of peak plate plastic vacuum forming machine

Abstract

The utility model discloses a tray processing mechanism of a peak plate plastic vacuum forming machine, which comprises a tray, a plurality of first holes and a plurality of second holes are arranged on the tray in an array manner, and the first holes are positioned on one side of the second holes; the plurality of PIN blocks are arranged in the first holes and are used for supporting a peak plate piece; a plurality of first holes are formed in the tray, a plurality of second holes are formed in the tray, a plurality of PIN blocks are arranged in the first holes, the filler strip is flatly laid on the tray and shields part of the first holes in the plurality of first holes and part of the second holes in the plurality of second holes, the PIN blocks are not arranged in the first holes shielded by the filler strip, and the height difference between the filler strip and the upper surface of a peak plate supported by the PIN block on one side is 45 mm. It is ensured that the peak plate 1 is properly supported and is not subjected to excessive pressure in the plastic uptake process, full wrapping of the peak plate is ensured, and meanwhile material damage caused by too large pressure is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of peak plate thermoforming machines, and particularly relates to a tray processing mechanism of a peak plate thermoforming machine. Background Art

[0002] During the thermoforming process of peak series plates, especially when using a Wenkangna three-station thermoforming machine, the industry faces a series of technical challenges and problems, which directly affect the processing efficiency, product quality and production cost. The following is an overview of the specific technical drawbacks and problems:

[0003] Corner wrinkling and gluing problems: When thermoforming in the silicone plate mode, since the thermoforming stroke of the machine is only 15 mm, the thermoforming stroke is achieved by switching the vertical and horizontal states of the PIN block. The PIN block in the vertical state is 15 mm higher than the PIN block in the horizontal state. To ensure that the material can be closely attached and avoid gluing, it is usually necessary to increase the positive and negative pressure parameters. However, this will increase the pressure on the silicone plate at the peak, resulting in the material being easily punctured, affecting the quality and strength of the finished product.

[0004] Incomplete wrapping and corner gluing: The limitation of the thermoforming stroke also causes the silicone plate to be unable to completely wrap the peak series plates, especially at the four corners of the plates, which will cause gluing problems and affect the appearance and structural integrity of the product.

[0005] Equipment loss and cost problems: Due to the short thermoforming stroke, in order to achieve the ideal processing effect, it is necessary to use relatively high negative pressure parameters. This not only exacerbates the loss of the silicone plate, increases the cost of replacement and maintenance, but also the frequent equipment repair and material replacement bring a certain financial burden to the enterprise. Content of the Utility Model

[0006] Therefore, it is necessary to provide a tray processing mechanism of a peak plate thermoforming machine to solve the problems raised in the background art.

[0007] To achieve the above object, the utility model provides a tray processing mechanism of a peak plate thermoforming machine, including:

[0008] A tray, which is arranged in an array with a plurality of first holes and a plurality of second holes, and the first holes are located on one side of the second holes;

[0009] A plurality of PIN blocks, which are arranged in the first holes and are used to support the peak plates; and

[0010] The spacer bar is laid flat on the tray, covering some of the first holes among the multiple first holes and some of the second holes among the multiple second holes. The PIN blocks are not provided in the first holes covered by the spacer bar. The height difference between the spacer bar and the upper surface of the spike plate supported by the PIN blocks on one side is 45 mm.

[0011] Furthermore, both the first holes and the second holes are 4884 in number, and are arranged in an array of 44 columns * 111 rows.

[0012] Furthermore, the first holes are square and the second holes are circular.

[0013] Furthermore, the spacer bar is a stainless-steel spacer bar.

[0014] The above technical solution has the following beneficial effects:

[0015] During the operation, first, a specific number of PIN blocks are removed, and then the spacer bar is placed on the tray to cover the predetermined first holes and second holes. When the tray passes through the scanning area with the spike plate, the photoelectric switch detects the PIN blocks not blocked by the spacer bar, and these PIN blocks remain in the vertical state to support the spike plate. Since there are no PIN blocks at the position of the spacer bar, when the film skin covers the upper surface of the spike plate, it will also cover the spacer bar. The upper surface of the PIN block is above the upper surface of the spacer bar. The height difference between the spacer bar and the upper surface of the spike plate supported by the PIN blocks on one side is controlled to be 45 mm to ensure that the spike plate is properly supported during the thermoforming process without being under excessive pressure. Subsequently, the spike plate enters the press, the silicone plate is softened through heat conduction, and a lower negative pressure parameter is used for drawing to ensure full wrapping of the spike plate while avoiding material damage caused by excessive pressure. Description of the Drawings

[0016] Figure 1 It is a top view of the tray processing mechanism in this embodiment;

[0017] Figure 2 It is a schematic structural diagram of the first holes and the second holes in this embodiment;

[0018] Figure 3 It is a side view of the tray processing mechanism in this embodiment;

[0019] Figure 4 It is a vertical state diagram of the PIN block in this embodiment;

[0020] Figure 5 It is a horizontal state diagram of the PIN block in this embodiment.

[0021] Description of the Reference Numerals:

[0022] 1. Spike plate;

[0023] 2. Pad strip;

[0024] 3. PIN block;

[0025] 4. Tray;

[0026] 5. First hole;

[0027] 6. Second hole;

[0028] 7. Membrane skin. Specific implementation manner

[0029] To describe in detail the technical content, structural features, achieved purposes and effects of the technical solution, the following is a detailed description in conjunction with specific embodiments and with reference to the accompanying drawings.

[0030] Please refer to Figures 1 to 5 , this embodiment provides a processing mechanism for the tray 4 of a spike plate thermoforming machine, including:

[0031] Tray 4, a plurality of first holes 5 and a plurality of second holes 6 are arranged in an array on the tray 4, and the first holes 5 are located on one side of the second holes 6;

[0032] A plurality of PIN blocks 3, including an upper part and a lower part that can be articulated, the lower part contacts the bottom of the first hole 5, and one of the first holes 5 accommodates one of the PIN blocks 3. The upper part is used to support the spike plate 1. The lower part can be bent relative to the upper part to form an L-shaped structure so that the PIN block 3 is in a horizontal state, and the lower part and the upper part are in the same vertical direction so that the PIN block 3 is in a vertical state; and

[0033] Pad strip 2, the pad strip 2 is laid flat on the tray 4, covering some of the first holes 5 among the plurality of first holes 5 and some of the second holes 6 among the plurality of second holes 6. The PIN block 3 is not provided in the first holes 5 covered by the pad strip 2. The height difference between the pad strip 2 and the upper surface of the spike plate 1 supported by one side of the PIN block is 45 mm, and the structure is as Figure 3 shown.

[0034] During the operation, first, a specific number of PIN blocks 3 are removed, and then the spacer bar 2 is placed on the tray 4, covering the predetermined first hole 5 and second hole 6. When the tray 4 passes through the scanning area with the spike plate 1, the photoelectric switch detects the PIN blocks 3 that are not blocked by the spacer bar 2, and these PIN blocks 3 remain in a vertical state for supporting the spike plate 1. Since there are no PIN blocks 3 at the position of the spacer bar 2, when the film skin 7 covers the upper surface of the spike plate 2, it also covers the spacer bar 2. The upper surface of the PIN block 3 is above the upper surface of the spacer bar 2. The height difference between the spacer bar 2 and the upper surface of the spike plate 1 supported by the PIN block 3 on one side is controlled to be 45 mm to ensure that the spike plate 1 is properly supported during the thermoforming process without excessive pressure. Subsequently, the spike plate 1 enters the press, the silicone plate is softened by high-temperature conduction, and a lower negative pressure parameter is used for drawing to ensure full wrapping of the spike plate 1 while avoiding material damage caused by excessive pressure.

[0035] Please refer to Figure 4 and Figure 5 , in this embodiment, the upper part can be in a T-shaped structure.

[0036] Please refer to Figure 1 and Figure 2 , in this embodiment, both the first hole 5 and the second hole 6 have 4,884, and they are both arranged in an array of 44 columns * 111 rows. The size of the tray 4 and the layout of the holes are carefully designed to meet the requirements of large-scale production. The position and size of each hole are carefully designed to ensure that the PIN block 3 and the spacer bar 2 can be accurately installed and operated, while ensuring the normal operation of the photoelectric switch and the adsorption device located below.

[0037] Please refer to Figure 1 and Figure 2 , in this embodiment, the first hole 5 is square, and the second hole 6 is circular. For example, the square first hole 5 is used to place the PIN block 3, and its square design can provide a larger contact area. Especially when the PIN block 3 also has a square cross-section, it exactly fits the square first hole 5.

[0038] Please refer to Figure 1 , in this embodiment, the spacer bar 2 is made of stainless steel, which is known for its high strength, corrosion resistance, and good thermal stability, and is suitable for long-term use in the high-temperature and high-pressure environment of the thermoforming machine.

[0039] In this embodiment, the peak plate blister machine is a prior art, such as the existing Wenconna three-station blister machine. The general operation process is: pallet placement - scanning - film laying display - pressing - turning over the plate - pallet reset. Negative pressure: The method of using a vacuum pump + negative pressure tank is adopted, which is used in the pressing mechanism and evacuates the vacuum from the lower part through the holes in the pallet, so that the silicone plate (about 2 mm thick) drives the film skin 7 to fit on the peak plate. The photoelectric switch can be located below the pallet 4 and is used to detect the position of the peak plate 1, and can be detected by infrared opposed light. The conversion between the vertical state and the horizontal state of the PIN block 3 is controlled by a lever. The lever makes the PIN block outside the coverage of the upper plate of the pallet lie down through the telescopic action of a micro cylinder. The peak plate blister machine is also equipped with a proximity switch to detect whether the PIN plate is in place during reset.

[0040] Before improvement, the film skin 7 was wrapped around the plate 5 surface by a negative pressure silicone plate. Due to the 15 mm height difference between the vertical and horizontal PIN blocks, the wrapping effect of the silicone plate was limited. Therefore, the method of adding a cushion plate between the PIN block and the peak plate was adopted. However, the cushion plate needed to be placed multiple times, which affected the production efficiency. So finally, the solution of this application was adopted, directly removing the adapted PIN block 3, placing a stainless steel strip to cover the square hole, and forming a 45 mm height difference.

[0041] This application has the following beneficial effects:

[0042] 1. The design of a 45 mm height difference ensures the full wrapping of the peak plate.

[0043] 2. The small negative pressure processing combination parameters save the pressing time and power energy efficiency.

[0044] 3. Canceling the cushion strip mode improves the work efficiency and per capita output value.

[0045] 4. Extending the service life of the press silicone plate and saving costs.

[0046] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or terminal device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or terminal device. Without further limitation, elements defined by the statement "comprising..." or "including..." do not exclude the presence of additional elements in the process, method, article or terminal device comprising the said elements. In addition, in this text, "greater than", "less than", "more than" etc. are understood not to include the present number; "above", "below", "within" etc. are understood to include the present number.

[0047] Although the above-described embodiments have been described, those skilled in the art can make additional changes and modifications once they learn the basic creative concept. Therefore, the above description is only the embodiments of the present invention, and does not limit the patent protection scope of the present invention. Any equivalent structure or equivalent process transformation made by using the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. A tray processing mechanism for a peak panel blister machine, characterized in that: include: A tray, wherein the tray array is arranged with a plurality of first holes and a plurality of second holes, wherein the first holes are located on one side of the second holes; a plurality of PIN blocks, the PIN blocks being disposed in the first holes and used for supporting the peak plate; as well as A pad strip is laid flat on the pallet to cover part of the first holes among the plurality of first holes and part of the second holes among the plurality of second holes, the PIN block is not set in the first hole covered by the pad strip, wherein the height difference between the pad strip and the upper surface of the peak plate supported by the PIN block on one side is 45 mm.

2. The pallet processing mechanism according to claim 1, characterized in that: There are 4884 first holes and 4884 second holes, which are arranged in an array of 44 columns and 111 rows.

3. The pallet processing mechanism according to claim 1 or 2, characterized in that: The first hole is square, and the second hole is circular.

4. The pallet processing mechanism according to claim 1, characterized in that: The pad is a stainless steel pad.

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