Pressure sensor and electronic device

Abstract

The utility model provides a pressure sensor and electronic equipment relates to sensor technical field, the pressure sensor includes flexible circuit board and shell, flexible circuit board includes connecting portion and output portion mutually connected, shell cover is provided in the connecting portion to form the accommodation cavity, the accommodation cavity is provided with MEMS chip and ASIC chip that signal connection, and the MEMS chip and ASIC chip are in signal connection. The side, away from the shell, of the connecting part is connected with a supporting piece. The output part extends out of the supporting piece and the containing cavity. The connecting part is matched with the shell to form a containing cavity, and the output part is in signal connection with an external structure. The output part can be bent or bent to extend to a position close to the external connection structure to realize signal connection with the external connection structure, and the size of the output part can be set according to the position of the external connection structure and the space structure in the electronic equipment, so that the installation flexibility is greatly improved, the installation difficulty is reduced, and meanwhile, lead connection is not needed, and the cost is reduced. The installation process is simplified, and the connection reliability is also improved.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors, in particular to a pressure sensor and electronic equipment. Background Art

[0002] Existing sensors use a printed circuit board as a substrate, and set pads on the printed circuit board to connect signals with external structures. For some external structures with harsh installation conditions or special structures, it is difficult to connect with the pads due to the limitation of installation space or installation position, resulting in installation difficulties.

[0003] In view of this, it is necessary to provide a new pressure sensor and electronic device to solve or at least alleviate the above technical defects. Utility Model Content

[0004] The main purpose of the utility model is to provide a pressure sensor and an electronic device, aiming to solve the technical problem of the difficulty in connecting and installing the sensor and the external structure in the prior art.

[0005] To achieve the above-mentioned purpose, according to one aspect of the utility model, the utility model provides a pressure sensor, including a flexible circuit board and a shell, the flexible circuit board including a connecting part and an output part connected to each other, the shell covering the connecting part to form a accommodating cavity, the accommodating cavity is provided with a signal-connected MEMS chip and an ASIC chip, the connecting part is connected to a support member on one side away from the shell, and the output part extends out of the support member and the accommodating cavity.

[0006] In some embodiments, the MEMS chip and the ASIC chip are stacked, the MEMS chip is bonded to the flexible circuit board, the ASIC chip is signal-connected to the flexible circuit board via a gold wire, and a sound hole is provided on the housing.

[0007] In some embodiments, a pad is disposed on the output portion.

[0008] In some embodiments, the support member is formed with a groove, the connecting portion is disposed in the groove, and the output portion extends out of the groove.

[0009] In some embodiments, the size of the output portion is smaller than that of the connecting portion, the groove includes a receiving sub-groove and a communicating sub-groove that are interconnected, the size of the communicating sub-groove is smaller than that of the receiving sub-groove, the connecting portion is arranged in the receiving sub-groove, the communicating sub-groove passes through the outer edge of the support member, and the output portion is partially arranged in the communicating sub-groove.

[0010] In some embodiments, the accommodating sub-groove is arranged in the middle position of the supporting member, the number of the communicating sub-grooves is multiple, and the multiple communicating sub-grooves are arranged at intervals along the outer circumference of the accommodating sub-groove, the number of the output parts is also multiple and equal to the number of the communicating sub-grooves, and the multiple communicating sub-grooves are arranged one-to-one with the multiple output parts.

[0011] In some embodiments, the support member is a support plate, and the support plate is attached to the flexible circuit board.

[0012] In some embodiments, the support member includes a support frame, a support block arranged in the support frame, and a plurality of connecting ribs connecting the support frame and the support block. The support block is arranged corresponding to the position of the MEMS chip, and the support frame is arranged corresponding to the outer edge of the shell.

[0013] In some embodiments, the support member and the flexible circuit board are pressed together into an integral piece.

[0014] In some embodiments, the support member is a metal member or a ceramic member.

[0015] According to another aspect of the present invention, the present invention further provides an electronic device, wherein the electronic device comprises the pressure sensor described above.

[0016] In the above scheme, the pressure sensor includes a flexible circuit board and a shell, the flexible circuit board includes a connecting part and an output part connected to each other, the shell is covered on the connecting part to form a receiving cavity, a signal-connected MEMS chip and an ASIC chip are arranged in the receiving cavity, the connecting part is connected to a support member on the side away from the shell, and the output part extends out of the support member and the receiving cavity. The flexible circuit board includes two parts, namely a connecting part and an output part, and the connecting part is used to cooperate with the shell to form a receiving cavity. Specifically, the shell can be bonded or soldered on the flexible circuit board by solder paste. In addition, the flexible circuit board also includes an output part, and the output part is used to connect the signal with the external structure. Since the flexible circuit board is flexible, the output part can be bent or curved, extended to a position close to the external structure, and realize the signal connection with the external structure, and the size of the output part can be set according to the position of the external structure and the spatial structure in the electronic device, which greatly improves the flexibility of installation and reduces the difficulty of installation. At the same time, there is no need to use wire connection, which simplifies the installation process and improves the reliability of the connection. In addition, since the flexible circuit board is flexible, in order to improve the rigidity of the pressure sensor, a support member is provided on the side of the connecting portion away from the housing. The support member is generally made of a harder material and is used to support the connecting portion to prevent the connecting portion from deforming or collapsing. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0018] Figure 1 This is a schematic cross-sectional structure diagram of a pressure sensor according to an embodiment of the utility model;

[0019] Figure 2 A schematic diagram of the structure of a support member of a pressure sensor according to an embodiment of the utility model;

[0020] Figure 3 Another structural schematic diagram of the support member of the pressure sensor according to the embodiment of the utility model;

[0021] Figure 4 For Figure 3 A schematic diagram of the structure of a flexible circuit board matching the supporting member;

[0022] Figure 5 This is another structural schematic diagram of the support member of the pressure sensor according to the embodiment of the utility model;

[0023] Figure 6 This is another structural schematic diagram of the support member of the pressure sensor according to the embodiment of the utility model.

[0024] Description of labels:

[0025] 100. Pressure sensor; 1. Housing; 2. Flexible circuit board; 21. Connecting part; 22. Output part; 3. Accommodating cavity; 4. MEMS chip; 5. ASIC chip; 6. Acoustic hole; 7. Support member; 70. Main body; 71. Groove; 711. Accommodating sub-groove; 712. Connecting sub-groove; 72. Support frame; 73. Support block; 74. Connecting rib; 8. Gold wire.

[0026] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with the implementation methods and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] It should be noted that all directional indications (such as up, down, etc.) in the implementation mode of the utility model are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0029] In addition, in the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0030] Furthermore, the technical solutions between the various implementation modes of the present invention may be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in the field. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0031] The pressure sensor includes a substrate and a shell covering the substrate. The substrate and the shell are surrounded by a receiving cavity. A MEMS chip and an ASIC chip are arranged in the receiving cavity. The MEMS chip and the ASIC chip are connected by signal. A sound hole connecting the outside world and the receiving cavity is opened on the substrate or the shell. The sound signal enters the MEMS chip of the pressure sensor through the sound hole and is received and converted into an electrical signal and transmitted to the ASIC chip to realize the pressure detection function.

[0032] Pressure sensors are generally used in electronic devices, such as smart wearable devices, such as mobile phones, headphones, bracelets, rings, computers, tablets or IPADs. According to feedback, when installing pressure sensors in electronic devices, installation difficulties often occur.

[0033] After careful research, the applicant found that when the pressure sensor is installed in an electronic device, due to the internal structure layout of the electronic device, the installation space left for the pressure sensor is limited, and there are clear constraints on the installation position of the pressure sensor. The substrate is generally made of a printed circuit board, and the installation environment of electronic devices of different types or models is also different. In the installation of the pressure sensor, a pad is provided on the substrate, and the pad on the substrate needs to be connected to the pad in the electronic device to achieve signal transmission. Therefore, the pad of the substrate needs to be set close to the pad in the electronic device. For situations where space is limited or the space installation position is far away from the pad of the electronic device, installation is very difficult.

[0034] The applicant considered connecting the pads of the substrate and the pads of the electronic device through wires to achieve signal connection. However, the use of wires increases the connection process and production costs. On the other hand, electronic devices often shake or collide during use, and loose wires and any pads will affect the normal use of the electronic device.

[0035] In addition, it should be noted that the subject matter of the present utility model is a pressure sensor, but is not limited to a pressure sensor, and may also be applicable to other types of sensors, such as an acoustic sensor, an optical sensor, a temperature sensor, a combination sensor, and the like.

[0036] To this end, the utility model provides a pressure sensor.

[0037] Reference Figure 1 According to one aspect of the utility model, the utility model provides a pressure sensor 100, including a flexible circuit board 2 and a shell 1, the flexible circuit board 2 includes a connecting portion 21 and an output portion 22 connected to each other, the shell 1 is covered on the connecting portion 21 to form a accommodating cavity 3, and a signal-connected MEMS chip 4 and an ASIC chip 5 are arranged in the accommodating cavity 3, the connecting portion 21 is connected to a support member 7 on the side away from the shell 1, and the output portion 22 extends out of the support member 7 and the accommodating cavity 3.

[0038] The flexible circuit board 2 is also called FPC (Full name in English: Flexible Printed Circuit). It is flexible in itself, and has a circuit inside and pads on the surface. It can electrically connect various electronic components and provide installation positions and signal transmission. Compared with traditional printed circuit boards, the flexible circuit board 2 can be folded and bent. In the above-mentioned embodiment of the utility model, the size of the flexible circuit board 2 is larger than that of a conventional printed circuit board. The conventional printed circuit board is generally set to a size slightly larger than the housing 1. In the embodiment of the utility model, the flexible circuit board 2 includes two parts, namely a connecting part 21 and an output part 22. The connecting part 21 is used to cooperate with the housing 1 to form a accommodating cavity 3. Specifically, the housing 1 can be bonded to the flexible circuit board 2 by bonding or soldering with solder paste. In addition, the flexible circuit board 2 also includes an output part 22, which is used to connect to an external structure signal. Since the flexible circuit board 2 is flexible, the output part 22 can be bent or curved to extend to a position close to the external structure to achieve signal connection with the external structure, and the size of the output part 22 can be set according to the position of the external structure and the spatial structure in the electronic device, which greatly improves the flexibility of installation and reduces the difficulty of installation. At the same time, there is no need to use wire connection, which simplifies the installation process and improves the reliability of the connection. In addition, since the flexible circuit board 2 is flexible, in order to improve the rigidity of the pressure sensor 100, a support member 7 is set on the side of the connecting part 21 away from the housing 1. The support member 7 is generally made of a harder material and is used to support the connecting part 21 to prevent the connecting part 21 from deforming or collapsing.

[0039] It should be noted that in the present application, the support member 7 only plays a supporting role, improves the strength of the flexible circuit board 2, and prevents the flexible circuit board 2 from deforming. There is no need to set up a circuit structure inside. The circuit structure is set in the flexible circuit board 2.

[0040] Reference Figure 1 In some embodiments, the MEMS chip 4 and the ASIC chip 5 are stacked, the MEMS chip 4 is bonded to the flexible circuit board 2, the ASIC chip 5 is connected to the flexible circuit board 2 by a gold wire 8, and a sound hole 6 is provided on the housing 1. The MEMS chip 4 is a pressure MEMS chip, and the ASIC chip 5 is a pressure ASIC chip. The MEMS chip 4 can be bonded to the flexible circuit board 2 by surface mounting technology, and is connected to the ASIC chip 5 by a gold wire 8. In this way, the pressure signal received by the MEMS chip 4 can be transmitted through the flexible circuit board 2 after being processed by the ASIC chip 5. The sound hole 6 is set in the housing 1, and it is convenient to open the hole, and there is no need to open holes on both the support member 7 and the flexible circuit board 2, which reduces the complexity of the process.

[0041] In some embodiments, a pad is provided on the output portion 22. The output portion 22 is signal-connected to the connection portion 21. The signal output by the ASIC chip 5 can be transmitted to the pad through the flexible circuit board 2. The pad here is used to realize signal connection with an external structure to transmit the signal detected by the pressure sensor 100 to the whole machine or the electronic device. The reliability of connection through the pad is higher. It should be noted that the connection portion 21 and the output portion 22 are described as two parts here, but in fact the two parts are integrally formed in forming the flexible circuit board 2. It is just because different positions can realize different functions, and it is convenient to describe them by dividing them into two parts.

[0042] Reference Figure 2 In some embodiments, the support member 7 is formed with a groove 71, the connection part 21 is arranged in the groove 71, and the output part 22 is arranged to extend out of the groove 71. The support member 7 includes a body 70 and a groove 71. In order to achieve the positioning and effective support of the connection part 21, a groove 71 that is recessed away from the connection part 21 can be provided on the support member 7. The connection part 21 is arranged in the groove 71, which can not only achieve effective positioning, but also the side wall and bottom wall of the groove can protect the connection part 21. The connection part 21 is not easily deformed by external pressure or collision, which can play a good protective role for the flexible circuit board 2. Since the output part 22 needs to extend out to connect with the external structure, it needs to extend out of the groove 71.

[0043] Reference Figure 3 and Figure 4 In some embodiments, the size of the output portion 22 is smaller than that of the connecting portion 21, the groove 71 includes a receiving sub-groove 711 and a communicating sub-groove 712 that are interconnected, the size of the communicating sub-groove 712 is smaller than that of the receiving sub-groove 711, the connecting portion 21 is disposed in the receiving sub-groove 711, the communicating sub-groove 712 runs through the outer edge of the supporting member 7, and a portion of the output portion 22 is disposed in the communicating sub-groove 712. The groove 71 here includes two parts, the receiving sub-groove 711 is used to accommodate the connecting portion 21, and the communicating sub-groove 712 runs through the outer edge of the supporting member 7 to connect the receiving sub-groove 711 with the outside. In this way, when the output portion 22 is placed in the receiving sub-groove 711, the connecting portion of the output portion 22 and the connecting portion 21 can be placed in the communicating sub-groove 712. Compared with the embodiment without the communicating sub-groove 712, this embodiment provides an avoidance position for the output portion, and is not easy to crush the flexible circuit board 2. Furthermore, the size of the output portion 22 is designed to be smaller than that of the connection portion 21 , which can be considered that the width of the output portion 22 is designed to be smaller, so that it can be easily moved through the narrow space of the electronic device and extend to the position where the pad needs to be soldered inside the electronic device.

[0044] Reference Figure 5In some embodiments, the receiving sub-groove 711 is disposed in the middle of the support member 7, the number of the communicating sub-grooves 712 is multiple, and the multiple communicating sub-grooves 712 are spaced apart along the periphery of the receiving sub-groove 711, the number of the output parts 22 is also multiple and equal to the number of the communicating sub-grooves 712, and the multiple communicating sub-grooves 712 are disposed one-to-one with the multiple output parts 22. In the application scenario where welding with pads at multiple different positions inside the electronic device is required, multiple output parts 22 can be disposed, and the multiple output parts 22 are all provided with pads, and corresponding communicating sub-grooves 712 are disposed corresponding to the positions of the output parts 22, so as to meet the actual scenario requirements of users requiring welding at multiple positions.

[0045] Regarding the specific structure of the support member 7, there are at least the following two specific implementations:

[0046] In the first embodiment, the support member 7 is a support plate, and the support plate is attached to the flexible circuit board 2. In this embodiment, the support member 7 is a whole support plate, and the shape and size of the support plate are substantially the same as the shape and size of the connecting portion 21, and the surface of the support plate is attached to the flexible circuit board 2, and can support the connecting portion 21 of the flexible circuit board 2 from various positions, specifically, support the connecting portion 21, and reduce the possibility of deformation of the connecting portion 21 of the flexible circuit board 2.

[0047] Reference Figure 6 In the second embodiment, the support member 7 includes a support frame 72, a support block 73 disposed in the support frame 72, and a plurality of connecting ribs 74 connecting the support frame 72 and the support block 73. The support block 73 is disposed corresponding to the position of the MEMS chip 4, and the support frame 72 is disposed corresponding to the outer edge of the housing 1. In this embodiment, the support member 7 is formed with some holes, and is not in the shape of a whole plate. However, the support block 73 is disposed at the installation position corresponding to the MEMS chip 4, and the support frame 72 is disposed at the connection position between the housing 1 and the flexible circuit board 2, that is, the outer edge position of the housing 1, that is, the position where the connecting portion 21 of the flexible circuit board 2 is connected to the electronic component is supported in a targeted manner, and the support blocks 73 and the support blocks 73 are connected by the connecting ribs 74 to improve the strength of the entire support member 7, which can save materials and reduce the possibility of bubbles generated during the bonding process of the support member 7 and the flexible circuit board 2.

[0048] Regarding the connection method between the support member 7 and the flexible circuit board 2, glue bonding can be used, which is more convenient and has a relatively low cost. In some embodiments, the support member 7 and the flexible circuit board 2 are pressed together as an integral part. By pressing together as an integral part, the flexible circuit board 2 can be supported more effectively, and the connection between the support member 7 and the flexible circuit board 2 is prefabricated, which can simplify the installation process of the pressure sensor 100.

[0049] In some embodiments, the support member 7 is a metal member or a ceramic member. In the embodiments of the present utility model, the support member 7 mainly serves to improve the strength and can be made of a material with relatively high hardness. The metal member can be copper or stainless steel sheet, and the ceramic member can be made of ordinary ceramic material.

[0050] According to another aspect of the present invention, the present invention further provides an electronic device, which includes the above-mentioned pressure sensor 100. The electronic device can be a smart wearable device, such as a mobile phone, earphones, bracelet, ring, or a computer or tablet or IPAD. Since the electronic device includes all technical solutions of all embodiments of the above-mentioned pressure sensor 100, it has at least all the beneficial effects brought by all the above-mentioned technical solutions, which will not be described one by one here.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and do not limit the patent scope of the present utility model; although the present application is described in detail with reference to the above embodiments, ordinary technicians in this field should understand that under the technical concept of the present utility model, it is still possible to modify the technical solutions recorded in the above embodiments, or to replace some or all of the technical features therein with equivalents; or directly / indirectly apply them to other related technical fields, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A pressure sensor, characterized in that: It includes a flexible circuit board and a shell, the flexible circuit board includes a connecting part and an output part connected to each other, the shell is covered on the connecting part to form a accommodating cavity, a MEMS chip and an ASIC chip for signal connection are arranged in the accommodating cavity, a support is connected to the side of the connecting part away from the shell, and the output part extends out of the support and the accommodating cavity.

2. The pressure sensor according to claim 1, characterized in that: The MEMS chip and the ASIC chip are stacked, the ASIC chip is bonded to the flexible circuit board, the ASIC chip is connected to the flexible circuit board signal through a gold wire, and a sound hole is arranged on the housing.

3. The pressure sensor according to claim 1, characterized in that: A welding pad is arranged on the output portion.

4. The pressure sensor according to any one of claims 1 to 3, characterized in that: The support member is formed with a groove, the connecting portion is arranged in the groove, and the output portion extends out of the groove.

5. The pressure sensor according to claim 4, characterized in that: The size of the output part is smaller than that of the connecting part, the groove includes a receiving sub-groove and a communicating sub-groove which are connected to each other, the size of the communicating sub-groove is smaller than that of the receiving sub-groove, the connecting part is arranged in the receiving sub-groove, the communicating sub-groove passes through the outer edge of the supporting member, and the output part is partially arranged in the communicating sub-groove.

6. The pressure sensor according to claim 5, characterized in that: The accommodating sub-groove is arranged in the middle position of the supporting member, the number of the communicating sub-grooves is multiple, and the multiple communicating sub-grooves are arranged at intervals along the outer circumference of the accommodating sub-groove, the number of the output parts is also multiple and equal to the number of the communicating sub-grooves, and the multiple communicating sub-grooves are arranged in a one-to-one correspondence with the multiple output parts.

7. The pressure sensor according to any one of claims 1 to 3, characterized in that: The support member is a support plate, and the support plate is attached to the flexible circuit board.

8. The pressure sensor according to any one of claims 1 to 3, characterized in that: The support member includes a support frame, a support block arranged in the support frame, and a plurality of connecting ribs connecting the support frame and the support block. The support block is arranged corresponding to the position of the MEMS chip, and the support frame is arranged corresponding to the outer edge of the shell.

9. The pressure sensor according to any one of claims 1 to 3, characterized in that: The support member and the flexible circuit board are pressed together into an integrated piece.

10. The pressure sensor according to any one of claims 1 to 3, characterized in that: The supporting member is a metal member or a ceramic member.

11. An electronic device, characterized in that: The electronic device comprises the pressure sensor according to any one of claims 1-10.

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