Host case of automobile electronic test system

Abstract

The utility model discloses a host case of an automobile electronic test system, which comprises a case shell, a board card mounting assembly and a fan assembly, the board card mounting assembly is mounted above the fan assembly, the board card mounting assembly and the fan assembly are both mounted inside the case shell, the front surface of the case shell is a hollow part, and the fan assembly is mounted in the case shell. Through high-speed synchronous communication, a hot plug function and a state monitoring capability, a flexible and reliable solution is provided for test and control of a complex electronic system. Through the modular design, the expandability and flexibility of the system are realized, and the constantly changing test and control requirements are met. Meanwhile, through the design of the high-bandwidth backboard, flexible configuration of various functional board cards is supported, and powerful support is provided for various testing and control application scenes.

Description

Technical Field

[0001] The utility model relates to the technical field of test host computers, in particular to a host computer case of an automobile electronic test system. Background Art

[0002] With the rapid development of science and technology, various high-performance and high-complexity electronic devices and systems are constantly emerging, which puts forward higher requirements on test and control technology. In order to meet these requirements, the performance and function of the test host as the core component of the test and control system directly affect the test effect and control accuracy of the entire system. Therefore, it is particularly important to design a high-performance, flexible and reliable test host.

[0003] Traditional test hosts often use fixed architecture designs, with limited communication and data transmission rates and poor scalability, making it difficult to adapt to the ever-changing test and control requirements. In order to solve these problems, the new generation of test hosts began to adopt modular architecture designs, achieving high-speed, synchronous signal communication through synchronous trigger buses and Gigabit Ethernet networks. This design not only greatly improves the communication and data transmission rates, but also achieves high scalability of the system, allowing the test host to flexibly configure various test, control and other functional boards to meet the needs of different application scenarios.

[0004] In addition, the new generation of test hosts also has hot-swap function, which means that functional boards can be easily replaced or upgraded without affecting the normal operation of the system, thus further improving the maintainability and availability of the system. At the same time, the introduction of host status monitoring function enables users to understand the operating status of the test host in real time, discover and deal with potential problems in time, and ensure the stable operation of the system.

[0005] In terms of hardware design, the new generation of test hosts adopts a high-bandwidth, multi-slot backplane design, which provides strong support for the flexible configuration of various functional boards. Whether it is communication and control, high-speed data transmission or clock synchronization, it can be achieved by configuring the corresponding functional boards. This design not only improves the functional diversity of the test host, but also enables the test host to better adapt to various complex test and control application scenarios.

[0006] In order to solve the above problems, it is necessary to develop a new type of automotive electronic test system host chassis to improve heat dissipation, reduce noise, and facilitate installation and maintenance. The test host is designed based on a modular architecture, using a synchronous trigger bus and Gigabit Ethernet network to achieve high-speed, synchronous signal communication, supporting hot-swap functions, and has host status monitoring functions, providing a flexible, reliable, and high-performance test carrier. At the same time, the host is equipped with a high-bandwidth, multi-slot backplane, which can be flexibly configured with various test, control and other functional boards, and has functions such as communication and control, high-speed data transmission, and clock synchronization, providing flexible and high-performance solutions for test and control application scenarios. Utility Model Content

[0007] The purpose of the utility model is to solve the above technical problems and provide a host chassis of an automotive electronic test system, which provides a flexible and reliable solution for the test and control of complex electronic systems through high-speed synchronous communication, hot-swap function and status monitoring capability. Through modular design, the scalability and flexibility of the system are achieved to meet the ever-changing test and control needs. At the same time, through the high-bandwidth backplane design, it supports the flexible configuration of multiple functional boards and provides strong support for various test and control application scenarios.

[0008] The utility model adopts the following technical solution to solve the above technical problems: a host chassis of an automotive electronic test system, comprising a chassis shell, a board mounting assembly, a fan assembly and a control assembly, wherein the board mounting assembly is mounted above the fan assembly, and both the board mounting assembly and the fan assembly are mounted inside the chassis shell, the front side of the chassis shell is a hollow portion, and the control assembly is mounted inside the chassis shell.

[0009] Preferably, the board mounting assembly comprises an upper mounting member and a lower mounting member, both of which are mounted on the inner bottom of the chassis shell, and the fan assembly is mounted below the lower mounting member.

[0010] Preferably, the upper mounting member comprises an upper board mounting rail and an upper mounting bar, the upper board mounting rail is mounted in the chassis shell through the upper mounting bar, and two sides of the upper mounting bar are connected to the chassis shell;

[0011] The lower mounting member comprises a lower board mounting rail and a lower mounting bar. The lower board mounting rail is mounted in the chassis shell through the lower mounting bar. Both sides of the lower mounting bar are connected to the chassis shell.

[0012] Preferably, the upper mounting bar and the lower mounting bar both include a front beam and a back beam, which are respectively mounted on the front and rear sides of the upper board card mounting rail and the lower board card mounting rail, and insulating strips are provided on the front beam and the back beam.

[0013] Preferably, nut strips are installed on the front crossbeam and the backplane crossbeam, and the nut strips are used to fix the backplane PCB and the board assembly.

[0014] Preferably, the fan assembly comprises a fan bracket and a plurality of heat dissipation fans, the heat dissipation fans are fixed on the fan bracket, and two ends of the fan bracket are fixed on the inner side of the chassis shell.

[0015] Preferably, the chassis shell includes an upper cover plate, a lower cover plate, a left panel and a right panel, both ends of the upper cover plate and the lower cover plate are connected to the edges of the left panel and the right panel, and the inner side of the lower cover plate is provided with a padding strip to prevent the cooling fan from directly touching the lower cover plate.

[0016] Preferably, the lower cover plate is provided with a plurality of heat dissipation holes, and the heat dissipation holes are provided directly below the heat dissipation fan.

[0017] Preferably, filling sealing plates are provided at the front ends of the left side plate and the right side plate, and square handles are provided on the outer sides of the left side plate and the right side plate.

[0018] Preferably, the control component includes a board test component, a power management board and a board bus. The board bus is installed on the rear side of the chassis shell. The board test component and the power management board are both installed between the upper board mounting rail and the lower board mounting rail. The board test component and the power management board are both connected to the board bus.

[0019] The beneficial effects of the utility model are:

[0020] 1. The utility model adopts a modular structure design, equipped with a high-bandwidth, multi-slot backplane, selects a multi-slot combination according to the test scenario requirements, flexibly configures various test, control and other functional boards, has a status monitoring function, supports hot swapping of boards, and provides a reliable high-performance test carrier;

[0021] 2. The test host of this utility model adopts a modular architecture design, which makes the system highly scalable and flexible. This design allows users to flexibly configure and replace functional boards according to specific needs, so as to adapt to the ever-changing test and control scenarios. Through the synchronous trigger bus and Gigabit Ethernet network, the test host realizes high-speed and synchronous signal communication. This greatly improves the efficiency and accuracy of data transmission, and provides a strong guarantee for the precise testing and control of complex electronic systems;

[0022] 3. Based on synchronous trigger bus and Gigabit Ethernet network, this device realizes communication and control, high-speed data transmission, clock synchronization and other functions to meet the high-speed communication requirements of automotive electronic products. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0024] Figure 2 It is a schematic diagram of the assembly structure of the utility model;

[0025] Figure 3 It is a schematic diagram of the structure of the lower cover plate of the utility model;

[0026] Figure 4 It is a schematic diagram of the insulating strip structure of the utility model;

[0027] Figure 5 It is a schematic diagram of the control assembly installation structure of the utility model.

[0028] In the figure: 1. chassis shell, 11. hollow part, 12. upper cover, 13. lower cover, 131. padding bar, 132. heat dissipation hole, 14. left side plate, 15. right side plate, 16. filling cover plate, 17. square handle, 2. board mounting assembly, 21. upper mounting part, 211. upper board mounting rail, 212. upper mounting bar, 22. lower mounting part, 221. lower board mounting rail, 222. lower mounting bar, 23. front beam, 24. backplane beam, 25. insulation strip, 26. nut strip, 3. fan assembly, 31. fan bracket, 32. cooling fan, 4. control assembly, 41. board test assembly, 42. power management board, 43. board bus. DETAILED DESCRIPTION

[0029] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0030] like Figures 1-5 As shown, the utility model is a host chassis of an automotive electronic test system, including a chassis shell 1, a board mounting assembly 2, a fan assembly 3 and a control assembly 4, the board mounting assembly 2 is installed above the fan assembly 3, the board mounting assembly 2 and the fan assembly 3 are both installed inside the chassis shell 1, the front side of the chassis shell 1 is a hollow portion 11, and the control assembly 4 is installed inside the chassis shell 1.

[0031] By adopting the above technical solution, the fan assembly 3 directly dissipates the heat of the board mounting assembly 2, and can quickly take away the heat generated by the board mounting assembly 2, avoiding the problem of hardware overheating due to heat accumulation. Since the fan assembly 3 is installed inside the chassis shell 1, and the front of the chassis shell 1 is a hollow portion 11, such a design can reduce the direct contact between the fan and the outside world, thereby reducing noise. The board mounting assembly 2 and the fan assembly 3 are both installed inside the chassis shell 1. Such a design can protect the board mounting assembly 2 and the fan assembly 3 from the influence of the external environment, thereby improving the safety of the entire machine.

[0032] The board mounting assembly 2 includes an upper mounting member 21 and a lower mounting member 22 . Both the upper mounting member 21 and the lower mounting member 22 are mounted on the inner bottom of the chassis housing 1 , and the fan assembly 3 is mounted below the lower mounting member 22 .

[0033] By adopting the above-mentioned technical scheme, the layout design of the upper mounting member 21 and the lower mounting member 22 enables the fan assembly 3 to better utilize the space inside the chassis, form an effective heat dissipation airflow, and improve the heat dissipation efficiency. The board mounting assembly 2 is installed at the bottom inside the chassis, which can reduce the risk of board displacement or falling off due to vibration or other external factors, thereby improving the stability of the system.

[0034] The upper mounting member 21 includes an upper board mounting rail 211 and an upper mounting bar 212. The upper board mounting rail 211 is mounted in the chassis housing 1 through the upper mounting bar 212. Both sides of the upper mounting bar 212 are connected to the chassis housing 1.

[0035] The lower mounting member 22 includes a lower board mounting rail 221 and a lower mounting bar 222 . The lower board mounting rail 221 is mounted in the chassis shell 1 through the lower mounting bar 222 . Both sides of the lower mounting bar 222 are connected to the chassis shell 1 .

[0036] By adopting the above technical solution, the upper board card mounting rail 211 and the lower board card mounting rail 221 are installed in the chassis shell 1 through the upper mounting bar 212 and the lower mounting bar 222, making installation and maintenance more convenient. The user can quickly complete the installation and disassembly of the board card mounting assembly 2 through the upper mounting bar 212 and the lower mounting bar 222.

[0037] The upper mounting bar 212 and the lower mounting bar 222 both include a front crossbeam 23 and a backboard crossbeam 24, which are respectively mounted on the front and rear sides of the upper board card mounting rail 211 and the lower board card mounting rail 221, and insulating strips 25 are provided on the front crossbeam 23 and the backboard crossbeam 24.

[0038] By adopting the above technical solution, the provision of the insulating strip 25 can ensure electrical safety inside the chassis and prevent the risk of short circuit or electric shock caused by accidental contact. The design of the front beam 23 and the back beam 24 simplifies installation and maintenance.

[0039] Nut strips 26 are also installed on the front crossbeam 23 and the backplane crossbeam 24 , and the nut strips 26 are used to fix the backplane PCB and the board mounting assembly 2 .

[0040] The fan assembly 3 includes a fan bracket 31 and a plurality of heat dissipation fans 32 . The heat dissipation fans 32 are fixed on the fan bracket 31 . Both ends of the fan bracket 31 are fixed on the inner side of the chassis shell 1 .

[0041] By adopting the above technical solution, a temperature sensor is set inside the chassis to monitor the internal temperature of the chassis in real time, and the data is fed back to the cooling fan 32 to achieve more accurate heat dissipation control.

[0042] The chassis shell 1 includes an upper cover plate 12, a lower cover plate 13, a left side plate 14 and a right side plate 15. Both ends of the upper cover plate 12 and the lower cover plate 13 are connected to the edges of the left side plate 14 and the right side plate 15. The inner side of the lower cover plate 13 is provided with a padding strip 131 to prevent the cooling fan 32 from directly touching the lower cover plate 13.

[0043] By adopting the above technical solution, the upper cover 12, the lower cover 13, the left side plate 14 and the right side plate 15 together constitute a closed chassis shell. This design can effectively protect the internal board mounting assembly 2 and the fan assembly 3 to prevent them from being damaged by the external environment. The design of the pad 131 can prevent the cooling fan 32 from directly touching the lower cover 13, thereby avoiding the noise and wear caused by the friction between the fan rotation and the lower cover.

[0044] The lower cover plate 13 is provided with a plurality of heat dissipation holes 132 . The heat dissipation holes 132 are provided directly below the heat dissipation fan 32 .

[0045] By adopting the above technical solution and reasonably controlling the size and number of the heat dissipation holes 132, the noise generated by the flow of air can be effectively reduced and the comfort of use can be improved.

[0046] A filling sealing plate 16 is provided at the front end of the left side plate 14 and the right side plate 15 , and a square handle 17 is provided at the outer side of the left side plate 14 and the right side plate 15 .

[0047] By adopting the above technical solution, the filling sealing plate 16 can guide the airflow direction, optimize the airflow organization in the chassis, and improve the heat dissipation efficiency. By reasonably designing the openings or vents of the filling sealing plate 16, the heat dissipation wind direction and flow can be controlled to better meet the heat dissipation requirements and prevent the chassis from being damaged by external impact or vibration. The filling sealing plate 16 can be made of a material with an electromagnetic shielding effect to enhance the electromagnetic shielding performance of the chassis and reduce the impact of electromagnetic interference on internal electronic components. The design of the square handle 17 can make the chassis easier to carry and move, especially when the chassis needs to be moved to a different location or upgraded and maintained. The handle provides a stable and convenient grip point. Due to the shape and structure of the square handle 17, it can provide a more stable and safe grip to prevent users from being injured due to accidental slipping during transportation.

[0048] The control component 4 includes a board test component 41, a power management board 42 and a board bus 43. The board bus 43 is installed on the rear side of the chassis shell 1. The board test component 41 and the power management board 42 are both installed between the upper board mounting rail 211 and the lower board mounting rail 221. The board test component 41 and the power management board 42 are both connected to the board bus 43. The test board component 41 is divided into communication, signal simulation and other functions according to its functions.

[0049] By adopting the above technical solution, the card bus 43 can identify the card ID number, and the system can automatically identify and manage the connected cards without manual intervention. This automatic identification function greatly improves the flexibility and scalability of the system, making it simple and quick to add, replace or remove cards.

[0050] When the utility model is implemented, first, the user selects a suitable chassis shell 1 according to actual needs, including an upper cover plate 12, a lower cover plate 13, a left side plate 14 and a right side plate 15, and corresponding heat dissipation components, such as a heat dissipation fan 32 and a heat dissipation hole 132, and then, the lower cover plate 13 is placed in a suitable position to ensure that there is enough space between the lower cover plate 13 and the ground or other supports, and then the left side plate 14 and the right side plate 15 are respectively connected to the lower cover plate 13, and ensure that the connection is firm. Subsequently, the upper cover plate 12 is connected to the left side plate 14 and the right side plate 15 to form a complete chassis shell, and the board card installation component 2 is installed inside the chassis according to actual needs, and the stability and correctness of the board card installation component 2 are ensured, and the heat dissipation fan 32 is installed on the lower cover plate 13, and the heat dissipation fan 32 is aligned with the heat dissipation hole 132 so that the airflow can flow smoothly, and then the fan bracket 31 is connected to the heat dissipation fan 32, and the two ends of the fan bracket 31 are fixed to the inner side of the chassis shell 1, and the assembly work of the host chassis of the automotive electronic test system is completed.

[0051] During use, the control component 4 is installed in the chassis shell 1, and the board to be tested is inserted into the board installation component 2 as needed, and the power management board 42 is connected to start testing the board. The board installation component 2 is cooled by the fan component 3 to reduce its operating temperature. The cooling fan 32 is fixed to the inner side of the chassis shell 1 through the fan bracket 31, and directly cools the board installation component 2. At the same time, a number of ventilation and heat dissipation holes 132 are provided on the chassis shell 1. These ventilation and heat dissipation holes 132 can guide the airflow into the interior of the chassis and form a ventilation channel to further improve the heat dissipation efficiency. In addition, the filling sealing plate 16 set at the front end of the left side plate 14 and the right side plate 15 can enhance the structural stability, optimize the airflow organization, enhance the electromagnetic shielding, improve the aesthetics and facilitate installation and maintenance. The square handle 17 added to the outside of the left side plate 14 and the right side plate 15 provides a convenient way of carrying and moving, so that the user can move the chassis to the desired position more easily.

[0052] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0053] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A host chassis of an automotive electronic test system, characterized in that: The invention comprises a chassis shell (1), a board mounting assembly (2), a fan assembly (3) and a control assembly (4); the board mounting assembly (2) is mounted above the fan assembly (3); the board mounting assembly (2) and the fan assembly (3) are both mounted inside the chassis shell (1); the front side of the chassis shell (1) is a hollow portion (11); and the control assembly (4) is mounted inside the chassis shell (1).

2. The automotive electronic test system host chassis according to claim 1, characterized in that: The board mounting assembly (2) comprises an upper mounting member (21) and a lower mounting member (22); the upper mounting member (21) and the lower mounting member (22) are both mounted on the inner bottom of the chassis housing (1); and the fan assembly (3) is mounted below the lower mounting member (22).

3. The automotive electronic test system host chassis according to claim 2, characterized in that: The upper mounting member (21) comprises an upper board mounting rail (211) and an upper mounting bar (212); the upper board mounting rail (211) is mounted in the chassis housing (1) via the upper mounting bar (212); and two sides of the upper mounting bar (212) are connected to the chassis housing (1); The lower mounting member (22) comprises a lower board mounting rail (221) and a lower mounting bar (222); the lower board mounting rail (221) is mounted in the chassis shell (1) via the lower mounting bar (222); and two sides of the lower mounting bar (222) are connected to the chassis shell (1).

4. The automotive electronic test system host chassis according to claim 3, characterized in that: The upper mounting bar (212) and the lower mounting bar (222) both comprise a front crossbeam (23) and a back plate crossbeam (24); the front crossbeam (23) and the back plate crossbeam (24) are respectively mounted on the front and rear sides of the upper board card mounting guide rail (211) and the lower board card mounting guide rail (221); and insulating strips (25) are both provided on the front crossbeam (23) and the back plate crossbeam (24).

5. The automotive electronic test system host chassis according to claim 4, characterized in that: Nut strips (26) are also installed on the front crossbeam (23) and the backboard crossbeam (24), and the nut strips (26) are used to connect the upper board card installation guide rail (211) and the lower board card installation guide rail (221).

6. The automotive electronic test system host chassis according to claim 1, characterized in that: The fan assembly (3) comprises a fan bracket (31) and a plurality of heat dissipation fans (32). The heat dissipation fans (32) are fixed on the fan bracket (31), and both ends of the fan bracket (31) are fixed on the inner side of the chassis shell (1).

7. The automotive electronic test system host chassis according to claim 6, characterized in that: The chassis shell (1) comprises an upper cover plate (12), a lower cover plate (13), a left side plate (14) and a right side plate (15); both ends of the upper cover plate (12) and the lower cover plate (13) are connected to the edges of the left side plate (14) and the right side plate (15); and a padding strip (131) is provided on the inner side of the lower cover plate (13) to prevent the cooling fan (32) from directly contacting the lower cover plate (13).

8. The automotive electronic test system host chassis according to claim 7, characterized in that: The lower cover plate (13) is provided with a plurality of heat dissipation holes (132), and the heat dissipation holes (132) are arranged directly below the heat dissipation fan (32).

9. The automotive electronic test system host chassis according to claim 7, characterized in that: A filling sealing plate (16) is provided at the front end of the left side plate (14) and the right side plate (15), and a square handle (17) is provided on the outer side of the left side plate (14) and the right side plate (15).

10. The main chassis of the automotive electronic test system according to claim 3, characterized in that: The control component (4) comprises a board test component (41), a power management board (42) and a board bus (43); the board bus (43) is installed on the rear side of the chassis housing (1); the board test component (41) and the power management board (42) are both installed between an upper board mounting rail (211) and a lower board mounting rail (221); and the board test component (41) and the power management board (42) are both connected to the board bus (43).

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