Desktop computer mainboard and desktop computer

Abstract

The utility model relates to a desktop computer mainboard and a desktop computer, the desktop computer mainboard comprises a circuit board, a memory bare chip and a heat dissipation piece, the memory bare chip is welded to the circuit board, the heat dissipation piece comprises a heat transfer plate and a plurality of heat dissipation fins, and the heat transfer plate is attached to the surface, deviating from the circuit board, in the memory bare chip; the cooling fins are arranged on the surface, away from the memory bare chip, of the heat transfer plate at intervals. The heat transfer plate in the heat dissipation piece is attached to the surface, away from the circuit board, of the memory bare chip, so that heat generated by the memory bare chip during operation can be transferred to the heat dissipation piece through the heat transfer plate, and the heat dissipation piece can quickly dissipate the heat generated by the memory bare chip to the outside in a mode of increasing the heat dissipation area. Therefore, the desktop computer mainboard can effectively dissipate heat of the memory bare chip in high-load operation, so that the temperature of the memory bare chip in operation is effectively reduced, and stable performance of the memory bare chip in continuous operation is ensured.

Description

Technical Field

[0001] The present application relates to the technical field of desktop computers, and in particular to a desktop motherboard and a desktop computer. Background Art

[0002] Desktop computers are widely used because of their easy maintenance, easy upgrade, high scalability and strong stability. Desktop computers include desktop motherboards and memory chips on the desktop motherboard. Generally, the overall performance of desktop computers is affected by the memory performance. For example, memory chips with high bandwidth, low latency and low power consumption are conducive to improving the overall performance of desktop computers.

[0003] However, when a desktop computer is running, the memory die will generate a large amount of heat due to high-load operation. Therefore, how to effectively dissipate the heat of the memory die running at high load becomes an urgent problem to be solved. Summary of the invention

[0004] Based on this, it is necessary to provide a desktop motherboard and a desktop computer that can effectively dissipate heat for memory chips running under high load in order to solve the above problems.

[0005] The technical solution is as follows:

[0006] In a first aspect, the present application provides a desktop motherboard, comprising:

[0007] Circuit boards;

[0008] A memory die, wherein the memory die is soldered to the circuit board;

[0009] The heat sink comprises a heat transfer plate and a plurality of heat sinks. The heat transfer plate is arranged in contact with the surface of the memory die away from the circuit board. The plurality of heat sinks are arranged in an interval manner on the surface of the heat transfer plate away from the memory die.

[0010] In the above-mentioned desktop motherboard, the memory die is connected to the circuit board by welding, which allows the memory die to be directly integrated on the circuit board without a memory slot, thereby achieving a high degree of integration of the motherboard. This compact design helps to reduce the space occupied by the desktop motherboard and reduce the chassis volume of the desktop computer, thereby providing hardware support for the thinness and portability of the desktop computer. Since the heat transfer plate in the heat sink is fitted on the surface of the memory die away from the circuit board, when the memory die generates heat due to high-load operation, the memory die can transfer the heat to the heat sink provided on the heat transfer plate through the heat transfer plate by heat transfer, so as to effectively disperse the heat generated by the memory die and export it to the chassis where the desktop motherboard is installed by increasing the heat dissipation area. Therefore, the desktop motherboard can effectively dissipate the heat of the memory die running under high load, thereby effectively reducing the temperature of the memory die during operation, and ensuring that the memory die can maintain stable performance when it continues to work.

[0011] The technical solution is further described below:

[0012] In one embodiment, the desktop mainboard includes a first fixing member and a second fixing member, wherein the first fixing member and the second fixing member are respectively disposed on opposite sides of the heat transfer plate and are both fixedly connected to the circuit board and the heat transfer plate.

[0013] In one embodiment, the memory die includes LPDDR.

[0014] In one embodiment, the memory die is LPDDR5 memory or LPDDR5X memory.

[0015] In one embodiment, the desktop motherboard includes a power management module, the power management module is provided with a voltage conversion circuit, and the voltage conversion circuit is connected to the memory die.

[0016] In one embodiment, there are multiple memory dies, which are soldered to the circuit board in an interval arrangement along the extension direction of the heat transfer plate, and the surface of each memory die facing away from the circuit board is attached to the heat transfer plate.

[0017] In one embodiment, the number of the memory dies is two or four.

[0018] In one embodiment, the desktop motherboard includes a central processing unit, the central processing unit is disposed on the circuit board, and the central processing unit is electrically connected to the memory die.

[0019] In one embodiment, the desktop motherboard includes a configuration module, the configuration module is disposed on the circuit board, and the configuration module is connected to the memory die.

[0020] In a second aspect, the present application provides a desktop computer, comprising a chassis and any one of the above-mentioned desktop motherboards, wherein the chassis forms a chassis cavity, and the desktop motherboard is disposed in the chassis cavity.

[0021] In the above-mentioned desktop computer, the memory die is connected to the circuit board by welding, which enables the memory die to be directly integrated on the circuit board without a memory slot, thereby realizing the high integration of the desktop motherboard. This compact design helps to reduce the space occupied by the desktop motherboard and reduce the chassis volume of the desktop computer, thereby providing hardware support for the thinness and portability of the desktop computer. Since the heat transfer plate in the heat sink is fitted on the surface of the memory die away from the circuit board, when the memory die generates heat due to high-load operation, the memory die can transfer the heat to the heat sink arranged on the heat transfer plate through the heat transfer plate by heat transfer, so as to effectively disperse and export the heat generated by the memory die into the chassis cavity by increasing the heat dissipation area, so as to be dissipated from the chassis cavity to the outside. Therefore, the desktop computer can effectively dissipate the heat of the memory die running under high load, thereby effectively reducing the temperature of the memory die during operation, ensuring that the memory die can maintain stable performance when working continuously, and ensuring the reliability of the overall performance of the desktop computer during operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 The figure is a schematic diagram of the structure of the connection between the circuit board, the memory die and the heat sink in one embodiment.

[0023] Figure 2 Schematic diagram of the structure of a desktop motherboard in one embodiment.

[0024] Figure 3 FIG. 4 is a schematic diagram of the structure of a desktop motherboard in another embodiment.

[0025] Description of reference numerals:

[0026] 100. Desktop motherboard; 1. Circuit board; 2. Power management module; 3. Central processing unit; 4. Heat sink; 41. Heat transfer plate; 42. Heat sink; 5. Memory die; 6. First fixing member; 7. Second fixing member. DETAILED DESCRIPTION

[0027] To make the above objects, features, and advantages of the present application more apparent and understandable, the following provides a detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings. Many specific details are set forth in the following description to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0028] In the description of the present application, it should be understood that if terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the accompanying drawings. These are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the present application.

[0029] In addition, if terms such as "first" and "second" appear, these terms are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0030] In the present application, unless otherwise clearly specified and limited, if terms such as "install", "connect", "couple", "fix", etc. appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0031] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0032] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0033] See also Figures 1 to 3 A desktop motherboard 100 provided in one embodiment of the present application includes a circuit board 1, a memory die 5 and a heat sink 4. The memory die 5 is soldered to the circuit board 1, and the heat sink 4 includes a heat transfer plate 41 and a plurality of heat sinks 42. The heat transfer plate 41 is arranged in contact with the surface of the memory die 5 away from the circuit board 1. The plurality of heat sinks 42 are arranged at intervals on the surface of the heat transfer plate 41 away from the memory die 5.

[0034] In the above-mentioned desktop motherboard 100, the memory die 5 is connected to the circuit board 1 by welding, so that the memory die 5 can be directly integrated on the circuit board 1 without a memory slot, thereby realizing a high degree of integration of the motherboard. This compact design helps to reduce the space occupied by the desktop motherboard 100 and reduce the chassis volume of the desktop computer, thereby providing hardware support for the thinness and portability of the desktop computer. Since the heat transfer plate 41 in the heat sink 4 is arranged on the surface of the memory die 5 away from the circuit board 1, when the memory die 5 generates heat due to high-load operation, the memory die 5 can transfer the heat to the heat sink 42 arranged on the heat transfer plate 41 through the heat transfer method, so as to effectively disperse and export the heat generated by the memory die 5 to the chassis where the desktop motherboard 100 is installed by increasing the heat dissipation area. Therefore, the desktop motherboard 100 can effectively dissipate the heat of the memory die 5 running under high load, thereby effectively reducing the temperature of the memory die 5 during operation, and ensuring that the memory die 5 can maintain stable performance when it continues to work.

[0035] Furthermore, compared with the traditional design in which the memory die 5 is inserted into the memory slot, the memory die 5 is soldered to the circuit board 1, which can not only optimize the wiring of the circuit board 1, reduce the loss and interference of signal transmission on the desktop motherboard 100, and ensure the integrity of the signal, but also reduce the thermal resistance and heat source of the desktop motherboard 100, thereby ensuring the heat dissipation effect of the desktop motherboard 100 and improving the stability and reliability of the desktop motherboard 100 during operation. In addition, this design can also avoid the problem of incompatibility or inconvenience in plugging and unplugging between the memory die 5 and the memory slot, greatly simplifying the user's maintenance and upgrade process, and improving the user experience.

[0036] In another embodiment, the desktop motherboard 100 includes a first fixing member 6 and a second fixing member 7, which are respectively disposed on opposite sides of the heat transfer plate 41 and are both fixedly connected to the circuit board 1 and the heat transfer plate 41. In this way, since the first fixing member 6 and the second fixing member 7 are respectively disposed on opposite sides of the heat transfer plate 41 and are both fixedly connected to the heat transfer plate 41 and the circuit board 1, and the heat transfer plate 41 and the memory die 5 are arranged in close contact, the memory die 5 can be stably disposed between the circuit board 1 and the heat sink 4, so that the heat sink 4 can ensure that the memory die 5 will not fall off due to vibration or impact, and ensure that the memory die 5 will not bend or deform due to external force, which advantageously improves the stability of the memory die 5.

[0037] Optionally, the first fixing member 6 and the second fixing member 7 may be disposed at two diagonal positions of the heat transfer plate 41, so that the first fixing member 6 and the second fixing member 7 can reliably fix the heat sink 4 to the circuit board 1. Specifically, the first fixing member 6 and the second fixing member 7 may be screws.

[0038] In one embodiment, the memory die 5 includes LPDDR (Low Power Double Data Rate SDRAM). Among them, LPDDR has the characteristics of small size and low power consumption, which is not only conducive to realizing the high integration of the desktop motherboard 100 and reducing the occupied space of the desktop motherboard 100, but also can effectively improve the overall performance of the desktop computer. The LPDDR product series includes LPDDR1 memory, LPDDR2 memory, LPDDR3 memory, LPDDR4 memory, LPDDR5 memory and LPDDR5X memory, etc. Each upgrade iteration of LPDDR can further reduce its power consumption.

[0039] Optionally, the memory die 5 is LPDDR5 memory or LPDDR5X memory. Both LPDDR5 memory and LPDDR5X memory have the characteristics of high bandwidth, low latency and low power consumption. Directly welding and integrating LPDDR5 memory or LPDDR5X memory into the circuit board 1 can not only improve the overall performance of the desktop motherboard 100, ensure the stability and efficiency of data transmission, and improve the signal quality of the desktop motherboard 100. It can also provide stable and efficient memory support for desktop computers. Therefore, setting LPDDR5 memory or LPDDR5X memory in the desktop motherboard 100 can achieve beneficial effects such as high integration, optimized wiring, simplified maintenance, enhanced heat dissipation and improved performance, which brings significant improvements and advantages to modern computer hardware design.

[0040] Schematically, the memory die 5 can be a LPDDR5 memory with 315 ball positions or 496 ball positions; or it can be a LPDDR5X memory with 315 ball positions or 496 ball positions. Among them, 315 ball positions and 496 ball positions refer to the package type of the memory die 5, and "ball positions" refer to the number of solder balls at the bottom of the package of the memory die 5. These solder balls are used to connect with the corresponding pads on the circuit board 1 to achieve connection.

[0041] In other embodiments, the memory die 5 may also be DDR (Double Data Rate SDRAM, double data rate synchronous dynamic random access memory), for example, it may be DDR1 memory, DDR2 memory, DDR3 memory, DDR4 memory or DDR5 memory.

[0042] Furthermore, if Figure 2 and Figure 3 As shown, the desktop motherboard 100 includes a power management module 2, and the power management module 2 is provided with a voltage conversion circuit, and the voltage conversion circuit is connected to the memory die 5. In this way, the power management module 2 can connect external power to the desktop motherboard 100 to provide power to various power-consuming components on the desktop motherboard 100. Among them, the power management module 2 can provide a stable and specification-compliant voltage to the memory die 5 through the voltage conversion circuit to ensure that the memory die 5 can obtain appropriate voltage and current during operation. Specifically, the voltage value of the LPDDR5 memory or LPDDR5X memory during operation is lower than the voltage value output by the power management module 2, so in order to enable the memory die 5 to obtain the required power, a voltage conversion circuit needs to be set between the power management module 2 and the memory die 5, so that the voltage output by the power management module 2 is converted into a voltage compatible with the memory die 5.

[0043] Further, in one embodiment, if Figure 2 and Figure 3As shown, there are multiple memory chips 5, and multiple memory chips 5 are welded to the circuit board 1 in an interval arrangement along the extension direction of the heat transfer plate 41, and the surface of each memory chip 5 facing away from the circuit board 1 is arranged in contact with the heat transfer plate 41. In this way, not only can the memory capacity of the desktop motherboard 100 be effectively improved, but also the heat dissipation of each memory chip 5 during operation can be effectively guaranteed. Among them, using the same heat sink 4 to dissipate heat for multiple memory chips 5 can not only speed up the heat dissipation speed of each memory chip 5, but also reduce the space occupied by the fixed heat sink 4, which is conducive to the miniaturization of the desktop motherboard 100. In addition, multiple memory chips 5 are arranged along the extension direction of the heat transfer plate 41, which can ensure the stability and efficiency of signal transmission between the memory chips 5.

[0044] Optionally, the number of memory dies 5 can be set as needed, such as one, two, three or more. Schematically, the number of memory dies 5 is four. Figure 2 Alternatively, the number of memory dies 5 may be two, such as Figure 3 shown.

[0045] Further, in one embodiment, if Figure 2 and Figure 3 As shown, the desktop motherboard 100 includes a central processing unit 3, which is disposed on a circuit board 1 and is electrically connected to a memory die 5. In this way, the central processing unit 3 can write data to or read data from the memory die 5, thereby ensuring the overall performance of the desktop motherboard 100. Specifically, when there are multiple memory die 5, the multiple memory die 5 are all disposed on one side of the central processing unit 3, and each memory die 5 is electrically connected to the central processing unit 3.

[0046] Specifically, in view of the high bandwidth and low latency characteristics of LPDDR5 memory and LPDDR5X memory, a dedicated signal transmission and processing circuit can be designed in the desktop motherboard 100 to ensure the high efficiency and stability of data exchange between the memory die 5 and the central processor 3, and reduce the loss and interference in the signal transmission process. The dedicated signal transmission and processing circuit may include a clock circuit, a driver circuit, a receiver circuit, a terminal matching circuit, etc.

[0047] In addition, the power management module 2 is electrically connected to the central processing unit 3 so that the power management module 2 can provide electrical energy to the central processing unit 3 .

[0048] Furthermore, the desktop motherboard 100 includes a configuration module, which is disposed on the circuit board 1 and connected to the memory die 5. In this way, during the system startup process, the configuration module can not only initialize and configure the memory die 5 to which it is connected, but also call the data information stored in the memory die 5 to initialize and configure the external device. Therefore, the setting of the configuration module can ensure the overall performance of the desktop motherboard 100. Among them, the configuration module can include a Basic Input Output System (BIOS) module or a Unified Extensible Firmware Interface (UEFI) module.

[0049] Specifically, the configuration module is electrically connected to the power management module 2, so that the power management module 2 can provide a circuit to the configuration module, so that the configuration module can drive the memory die 5 and the external device to initialize and configure. When there are multiple memory die 5, each memory die 5 is electrically connected to the configuration module.

[0050] Combination Figures 1 to 3 As shown, an embodiment of the present application further provides a desktop computer, which includes a chassis and a desktop motherboard 100 in any of the above embodiments, wherein the chassis forms a chassis cavity, and the desktop motherboard 100 is disposed in the chassis cavity.

[0051] In the above desktop computer, the memory die 5 is connected to the circuit board 1 by welding, so that the memory die 5 can be directly integrated on the circuit board 1 without a memory slot, thereby realizing the high integration of the desktop motherboard 100. This compact design helps to reduce the space occupied by the desktop motherboard 100 and reduce the chassis volume of the desktop computer, thereby providing hardware support for the thinness and portability of the desktop computer. Since the heat transfer plate 41 in the heat sink 4 is fitted on the surface of the memory die 5 away from the circuit board 1, when the memory die 5 generates heat due to high load operation, the memory die 5 can transfer the heat to the heat sink 42 provided on the heat transfer plate 41 through the heat transfer method, so as to effectively disperse and guide the heat generated by the memory die 5 into the chassis cavity by increasing the heat dissipation area, and then dissipate it from the chassis cavity to the outside. Therefore, the desktop computer can effectively dissipate heat for the memory die 5 running at high load, thereby effectively reducing the temperature of the memory die 5 during operation, ensuring that the memory die 5 can maintain stable performance during continuous operation, and ensuring the reliability of the overall performance of the desktop computer during operation.

[0052] The technical features of the above embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0053] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed. However, it should not be construed as a limitation to the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A desktop motherboard, characterized in that: include: Circuit boards; A memory die, wherein the memory die is soldered to the circuit board; The heat sink comprises a heat transfer plate and a plurality of heat sinks. The heat transfer plate is arranged in contact with the surface of the memory die away from the circuit board. The plurality of heat sinks are arranged in an interval manner on the surface of the heat transfer plate away from the memory die.

2. The desktop motherboard according to claim 1, characterized in that: The desktop mainboard includes a first fixing member and a second fixing member. The first fixing member and the second fixing member are respectively arranged on opposite sides of the heat transfer plate and are both fixedly connected to the circuit board and the heat transfer plate.

3. The desktop motherboard according to claim 2, characterized in that: The memory die includes LPDDR.

4. The desktop motherboard according to claim 3, characterized in that: The memory die is LPDDR5 memory or LPDDR5X memory.

5. The desktop motherboard according to claim 4, characterized in that: The desktop mainboard comprises a power management module, the power management module is provided with a voltage conversion circuit, and the voltage conversion circuit is connected to the memory bare chip.

6. The desktop motherboard according to any one of claims 1 to 5, characterized in that: There are multiple memory dies, which are welded to the circuit board in an interval arrangement along the extension direction of the heat transfer plate, and the surface of each memory die facing away from the circuit board is attached to the heat transfer plate.

7. The desktop motherboard according to claim 6, characterized in that: The number of the memory dies is two or four.

8. The desktop motherboard according to claim 1, characterized in that: The desktop mainboard includes a central processing unit, which is arranged on the circuit board and is electrically connected to the memory die.

9. The desktop motherboard according to claim 8, characterized in that: The desktop mainboard comprises a configuration module, which is arranged on the circuit board and connected to the memory die.

10. A desktop computer, characterized in that: It comprises a chassis and a desktop mainboard according to any one of claims 1 to 9, wherein the chassis forms a chassis cavity, and the desktop mainboard is arranged in the chassis cavity.

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