Shielding structure, charging assembly and electronic equipment

Abstract

The embodiment of the utility model provides a shielding structure, a charging assembly and electronic equipment, relates to the technical field of charging equipment, and is used for reducing electromagnetic interference of the charging assembly and improving heat dissipation of the charging assembly. The shielding structure comprises a first insulating layer, a shielding layer with a plurality of pores and a second insulating layer which are stacked in sequence. According to the shielding structure provided by the embodiment of the invention, the shielding layer is arranged between the first insulating layer and the second insulating layer, and the shielding layer is provided with a plurality of pores. The multiple holes of the shielding layer can provide a high-frequency eddy current loop through the micro loop, a low-frequency eddy current loop is avoided, shielding of high-frequency radiation is achieved, and overflow of the high-frequency radiation is reduced. The first insulating layer and the second insulating layer are arranged on two opposite sides of the shielding layer and wrap the shielding layer, so that short circuit caused by contact between the shielding layer and other circuit structures can be avoided. The shielding layer can enhance the structural strength of the first insulating layer and the second insulating layer, and reduce the risk that the materials of the first insulating layer and the second insulating layer are fragile and easy to break.

Description

Technical Field

[0001] The present application relates to the technical field of charging equipment, and in particular to a shielding structure, a charging component and an electronic device. Background Art

[0002] With the development of wireless charging technology, various types of charging components or charging devices have emerged. As users' requirements for charging products become higher and higher, charging time is currently the key factor affecting user experience. In order to enable wireless charging to achieve fast charging, high-power charging is required.

[0003] However, as the charging power increases, wireless charging products will experience problems such as heating and electromagnetic interference, affecting the user experience. Utility Model Content

[0004] The embodiments of the present application provide a shielding structure, a charging component, and an electronic device for reducing electromagnetic interference of the charging component and improving heat dissipation of the charging component.

[0005] In order to achieve the above objectives, this application adopts the following technical solutions:

[0006] According to a first aspect of an embodiment of the present application, a shielding structure is provided, comprising a first insulating layer, a shielding layer having a plurality of pores, and a second insulating layer which are stacked in sequence.

[0007] In the shielding structure provided in the embodiment of the present application, the shielding layer is arranged between the first insulating layer and the second insulating layer, and the shielding layer has multiple pores. The multiple pores of the shielding layer can use micro-loops to provide high-frequency eddy current loops, avoid low-frequency eddy current loops, shield high-frequency radiation, and reduce high-frequency radiation overflow. The first insulating layer and the second insulating layer are arranged on opposite sides of the shielding layer, and the shielding layer is wrapped to avoid the shielding layer from contacting with other circuit structures to cause a short circuit. Therefore, the setting position of the shielding structure is not limited, and the applicability is strong. At the same time, the shielding layer can enhance the structural strength of the first insulating layer and the second insulating layer, and reduce the risk of the materials of the first insulating layer and the second insulating layer being brittle and easy to break. The solution provided in the embodiment of the present application is lighter than metal materials and does not affect the high-power charging efficiency.

[0008] In a possible implementation, at least one of the first insulating layer and the second insulating layer is made of a thermally conductive material. In this way, heat is dissipated through at least one of the first insulating layer or the second insulating layer, so that the shielding structure can dissipate heat for the charging coil.

[0009] In a possible implementation, at least one of the first insulating layer and the second insulating layer is made of thermoplastic material, so that the first insulating layer, the shielding layer and the second insulating layer can be fixedly connected by thermal pressing.

[0010] In a possible implementation, the material of the first insulating layer is the same as the material of the second insulating layer. In this way, the shielding structure is easy to prepare.

[0011] In a possible implementation, a plurality of pores are arranged into a mesh structure or a honeycomb structure, so as to absorb and shield high-frequency radiation and reduce high-frequency radiation overflow.

[0012] In a possible implementation, the material of the shielding layer includes fiber material. Thus, an implementation of a shielding structure is provided.

[0013] In a possible implementation, a plurality of apertures are arranged in a grid structure or a spiral structure, so as to absorb and shield high-frequency radiation and reduce high-frequency radiation overflow.

[0014] In a possible implementation, the material of the shielding layer includes a metal material. Thus, an implementation of a shielding structure is provided.

[0015] In a possible implementation, the first insulating layer or the second insulating layer further wraps around the side of the shielding layer, so as to prevent the material of the shielding layer from being exposed and causing a short circuit.

[0016] In a possible implementation, the edge of the shielding layer is retracted relative to the edges of the first insulating layer and the second insulating layer, so as to avoid the material of the shielding layer being exposed to cause a short circuit.

[0017] In a possible implementation, the first insulating layer, the shielding layer and the second insulating layer are fixedly connected by pressing, bonding or injection molding. In this way, multiple implementations are provided to form a shielding structure, which is simple to operate and easy to implement.

[0018] In a second aspect of an embodiment of the present application, a charging assembly is provided, comprising a charging coil and a shielding structure according to any one of the first aspects. The charging coil comprises a magnetic sheet and a coil portion attached to the magnetic sheet. The shielding structure is arranged on a side of the coil portion away from the magnetic sheet, and along the thickness direction of the charging coil, the projection of the shielding structure overlaps with the projection of the charging coil.

[0019] The shielding structure provided in the embodiment of the present application is arranged in the charging component, which can shield the high-frequency interference signal generated by the charging coil in the charging component, thereby reducing the electromagnetic interference generated by increasing the charging power.

[0020] In a possible implementation, the projection of the shielding structure covers the projection of the charging coil, so that the charging coil can be cooled.

[0021] In a possible implementation, the shielding structure also extends to the side of the magnetic sheet away from the coil portion to wrap the charging coil. In this way, the shielding structure can serve as the outer shell of the charging component to improve heat dissipation.

[0022] According to a third aspect of an embodiment of the present application, an electronic device is provided, comprising a charging component and a printed circuit board according to any one of the second aspects, wherein a shielding structure of the charging component is grounded through the printed circuit board.

[0023] The electronic device provided in the third aspect of the embodiment of the present application includes the charging component of any one of the second aspects, and its beneficial effects are the same as the beneficial effects of the charging component, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0025] Figure 2A A structural schematic diagram of a filtering technology illustrated in an embodiment of the present application;

[0026] Figure 2B A structural schematic diagram of a filtering structure illustrated in an embodiment of the present application;

[0027] Figure 2C A schematic diagram of another filtering structure according to an embodiment of the present application;

[0028] Figure 2D A schematic diagram of the structure of a heat sink according to an embodiment of the present application;

[0029] Figure 3A A schematic diagram of the structure of a charging assembly provided in an embodiment of the present application;

[0030] Figure 3B A schematic diagram of the structure of another charging assembly provided in an embodiment of the present application;

[0031] Figure 4 A schematic diagram of a shielding structure provided in an embodiment of the present application;

[0032] Figure 5 A schematic diagram of another shielding structure provided in an embodiment of the present application;

[0033] Figure 6 A schematic diagram of the structure of another shielding structure provided in an embodiment of the present application;

[0034] Fig. 7A A schematic diagram of the structure of another charging assembly provided in an embodiment of the present application;

[0035] Figure 7B A schematic diagram of the structure of another charging assembly provided in an embodiment of the present application;

[0036] Fig. 8A A schematic diagram of the structure of another charging assembly provided in an embodiment of the present application;

[0037] Figure 8B A schematic diagram of the structure of another charging assembly provided in an embodiment of the present application;

[0038] Figure 8C A schematic diagram of the structure of another charging assembly provided in an embodiment of the present application;

[0039] Fig.8D A schematic diagram of the structure of another charging assembly provided in an embodiment of the present application;

[0040] Fig. 9 A schematic diagram of the structure of another charging assembly provided in an embodiment of the present application;

[0041] Fig. 10A A schematic diagram of a structure in which a charging component provided in an embodiment of the present application is carried on a PCB;

[0042] Fig. 10B A schematic diagram of the structure of another charging component provided in an embodiment of the present application carried on a PCB;

[0043] Fig. 10C A schematic diagram of the structure of another charging component carried on a PCB provided in an embodiment of the present application.

[0044] Reference numerals

[0045] 1-electronic device; 2-display module; 3-middle frame; 4-housing; 5-cover plate; 11-printed circuit board; 10-charging component; 20-charging coil; 21-coil part; 22-magnetic sheet; 30-shielding structure; 110-first insulating layer; 120-second insulating layer; 210-shielding layer. DETAILED DESCRIPTION

[0046] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0047] In the following, the terms "second", "first", etc. are used only for convenience of description and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "second", "first", etc. may explicitly or implicitly include one or more of the feature. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0048] In addition, in the embodiments of the present application, directional terms such as "up", "down", "left" and "right" may be defined including but not limited to the orientation relative to the schematic placement of the components in the drawings. It should be understood that these directional terms may be relative concepts, which are used for relative description and clarification, and may change accordingly according to changes in the orientation of the components in the drawings.

[0049] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. In addition, the term "coupled" can be a direct electrical connection or an indirect electrical connection through an intermediate medium. The term "contact" can be a direct contact or an indirect contact through an intermediate medium.

[0050] In the embodiments of the present application, "and / or" describes the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B may represent: A exists alone, A and B exist at the same time, and B exists alone, where A and B may be singular or plural. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0051] The embodiment of the present application provides an electronic device. The electronic device may be, for example, a consumer electronic product, a home electronic product or a vehicle-mounted electronic product. Among them, consumer electronic products are such as mobile phones, tablet computers, laptop computers, e-readers, personal computers (PC), personal digital assistants (PDA), desktop displays, smart wearable products (e.g., smart watches, smart bracelets), virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, drones, etc. Home electronic products are such as smart door locks, remote controls, charging small household appliances (e.g., soybean milk machines, sweeping robots), etc. Vehicle-mounted electronic products are such as vehicle-mounted navigators, vehicle-mounted DVDs, etc. The above electronic devices may also be wireless chargers or electronic devices with wireless charging functions. The embodiment of the present application does not impose any special restrictions on the specific form of the above electronic devices. For the convenience of explanation, the following embodiments are all illustrated by taking the electronic device as a mobile phone as an example.

[0052] An example of an electronic device structure is shown in FIG. Figure 1 As shown, the electronic device 1 mainly includes a display module 2, a middle frame 3, a housing (or battery cover, rear housing) 4 and a cover plate 5.

[0053] The display module 2 has a light-emitting side from which a display image can be seen and a back side arranged opposite to the light-emitting side. The back side of the display module 2 is close to the middle frame 3 , and the cover plate 5 is arranged on the light-emitting side of the display module 2 .

[0054] The display module 2 includes a display panel (DP).

[0055] In a possible embodiment of the present application, the display module 2 is a liquid crystal display module. In this case, the display screen is a liquid crystal display (LCD). Based on this, the display module 2 also includes a backlight unit (BLU) located on the back of the liquid crystal display (away from the side of the LCD for displaying images).

[0056] The backlight module can provide light source to the liquid crystal display screen, so that each subpixel in the liquid crystal display screen can emit light to realize image display.

[0057] The backlight module can provide light (also called backlight) to the liquid crystal display screen, and each sub-pixel in the liquid crystal display screen can control the transmittance of light to realize image display.

[0058] Alternatively, in another possible embodiment of the present application, the display module 2 is an organic light emitting diode display module. In this case, the display screen is an organic light emitting diode (OLED) display screen. Since an electroluminescent layer is provided in each sub-pixel of the OLED display screen, the OLED display screen can be self-luminous after receiving the operating voltage. In this case, the display module 2 having the OLED display screen does not need to be provided with the backlight module.

[0059] The cover plate 5 is located at a side of the display module 2 away from the middle frame 3 . The cover plate 5 may be, for example, a cover glass (CG), and the cover glass may have a certain toughness.

[0060] The middle frame 3 is located between the display module 2 and the housing 4. The surface of the middle frame 3 away from the display module 2 is used to install internal components such as batteries, printed circuit boards (PCB), cameras, antennas, etc. After the housing 4 and the middle frame 3 are covered, the above internal components are located between the housing 4 and the middle frame 3.

[0061] The electronic device 1 also includes a charging component disposed on a printed circuit board. The printed circuit board is used to carry the charging component and is connected to the charging component so that the electronic device 1 can be wirelessly charged.

[0062] The charging component is used to realize the wireless charging function for the electronic device 1. Or the electronic device 1 can also be used as a charging device to wirelessly charge an electronic device having a charging component. This embodiment of the application does not limit this, and it can be reasonably set according to actual conditions.

[0063] Based on this, the embodiment of the present application further provides a charging component. The charging component can be used in the above-mentioned electronic device 1 to realize the wireless charging function for the electronic device 1. Alternatively, the charging component can also be used as a charging device to wirelessly charge the electronic device.

[0064] With the development of wireless charging technology, various types of charging components or charging devices have emerged. Among the various types of charging components, the charging time of the charging component is currently the key issue affecting the user experience. In order to achieve fast charging speed and short charging time, high power charging can be used. However, as the charging power of the charging component increases, the charging component will cause heat to rise. At the same time, the charging coil in the charging component will generate additional high-frequency signals on the basis of generating the working main frequency, causing electromagnetic interference (EMI) radiation, affecting the charging experience of the product.

[0065] Based on this, in order to reduce electromagnetic interference during charging, the present application embodiment illustrates a filtering technology. Figure 2A As shown, a filter circuit is provided at the input side of the charging assembly 10 to filter out high-frequency signals. Exemplarily, the filter circuit may include a common-mode inductor.

[0066] In the embodiment of the present application, a common-mode inductor is provided to filter out high-frequency signals. This technology is relatively mature, and the solution is simple and easy to operate. However, providing a common-mode inductor in the circuit will reduce the efficiency of the charging component 10, and the common-mode inductor is relatively large in size, which will occupy the internal space of the charging component 10, resulting in a larger size of the charging component 10.

[0067] Based on this, in order to reduce the size of the charging assembly 10, the embodiment of the present application also illustrates a filtering structure. For example, Figure 2B As shown, the material of the filter structure includes a fiber material, and the filter structure includes a plurality of fiber particles.

[0068] In the embodiment of the present application, the above-mentioned filtering structure is attached to the surface of the charging coil of the charging component 10, which can absorb the high-frequency signal generated by the charging coil.

[0069] The filtering structure provided in the embodiment of the present application has low cost and will not interfere with the working frequency band of the charging component 10, so that the working frequency band of the charging component 10 is lossless.

[0070] However, since the filter structure has the ability to conduct electricity and the filter structure made of fibers has low strength and is easily broken, its placement position is limited. In order to avoid short circuit, it cannot be placed near the printed circuit board 11.

[0071] For a high-power charging assembly 10, a cooling fan is also provided inside the charging assembly 10 for heat dissipation. When the charging assembly 10 is in operation, the cooling fan is turned on to dissipate heat for the charging coil. The filter structure will destroy its ability to absorb high-frequency signals due to the blowing of the cooling fan, and the fiber particles of the filter structure will be scattered inside the charging assembly 10 due to the blowing of the cooling fan, which may cause the charging assembly 10 to short-circuit. Therefore, the filter structure cannot be applied to a high-power charging assembly 10.

[0072] Based on this, in order to prevent the fiber particles of the filter structure from scattering and causing a short circuit in the charging assembly, the material of the filter structure may also include a metal material. Figure 2C As shown, the surface of the filter structure has a plurality of periodic structures, including any one or more of stripes, meshes, combs or grids.

[0073] In the embodiment of the present application, the above-mentioned filtering structure is arranged on the surface of the charging coil of the charging component 10, which can absorb the high-frequency signal generated by the charging coil.

[0074] The filter structure provided in the embodiment of the present application has a small thickness, and the absorption of signals in different frequency bands can be achieved by adjusting the size of the periodic structure (for example, the thickness and spacing of the stripes).

[0075] However, due to the high cost of the filter structure made of metal and the process limitations, the periodic structure of the filter structure cannot be made finer, resulting in partial overlap between the absorbed frequency band signal and the working frequency band signal of the charging coil, affecting the working efficiency of the charging coil.

[0076] In addition, since the thickness of the filter structure is relatively small, it affects the heat dissipation of the charging component.

[0077] Based on this, in order not to affect the heat dissipation of the charging components, such as Figure 2D As shown, the embodiment of the present application also illustrates a heat sink. The heat sink is arranged on the surface of a heating device (eg, a magnetic sheet) and can utilize the thermal conductivity of metal to dissipate heat for the charging coil.

[0078] The heat sink provided in the embodiment of the present application is easy to process, has good heat dissipation effect, and is simple to use.

[0079] However, the cost of the heat sink is relatively high, and metal conductivity can easily cause short circuits. In addition, placing the heat sink on the surface of the charging coil will cause self-heating due to the eddy current effect, affecting the heat dissipation effect.

[0080] Based on this, in order to reduce the electromagnetic interference of the charging component and improve the heat dissipation of the charging component, the embodiment of the present application also provides a charging component. Figure 3A As shown, the charging assembly 10 includes a charging coil 20 and a shielding structure 30 disposed on the charging coil 20. The charging coil 20 includes a coil portion 21 and a magnetic sheet 22. The coil portion 21 is attached to the magnetic sheet 22.

[0081] like Figure 3B As shown, the shielding structure 30 is disposed on a side of the coil portion 21 away from the magnetic sheet 22 .

[0082] Exemplarily, the edge of the magnetic sheet 22 exceeds the edge of the coil portion 21 .

[0083] like Figure 4 As shown, the shielding structure 30 includes a first insulating layer 110, a shielding layer 210 and a second insulating layer 120 which are stacked in sequence. The shielding layer 210 has a plurality of pores which can play a role of band-stop filtering for high-frequency signals.

[0084] That is, the first insulating layer 110 , the shielding layer 210 and the second insulating layer 120 are stacked in sequence along the thickness direction z.

[0085] What is explained here is that Figure 4 For the convenience of illustration, the thickness of the first insulating layer 110, the shielding layer 210 and the second insulating layer 120 are shown as relatively large, without specific limitation, and the actual thickness can be reasonably set according to the actual situation.

[0086] The shape of the shielding structure 30 is not limited in the embodiment of the present application. For example, the shielding structure 30 may include a regular shape such as a circle, a square or a polygon. Alternatively, for example, the shielding structure 30 may also include an irregular shape. The embodiment of the present application does not limit this, and it can be reasonably set according to the actual situation.

[0087] It is explained here that there is no limitation on the shapes and sizes of the first insulating layer 110, the shielding layer 210 and the second insulating layer 120. The shapes and sizes of the first insulating layer 110, the shielding layer 210 and the second insulating layer 120 can be the same or different.

[0088] The shielding layer 210 has a plurality of pores, and can provide a high-frequency eddy current loop by using a micro-loop, while avoiding a low-frequency eddy current loop. In this way, the shielding layer 210 can shield high-frequency radiation and reduce high-frequency radiation overflow without affecting the main working frequency.

[0089] In the embodiments of the present application, the shape of the pores is not limited and can be reasonably set according to actual conditions.

[0090] Exemplarily, the pores may include regular shapes such as circular, rectangular or polygonal. For example, a plurality of pores may be arranged in a mesh structure. Alternatively, a plurality of pores may also be arranged in a honeycomb structure.

[0091] Alternatively, illustratively, the pores may also include irregular shapes. The plurality of pores of the shielding layer 210 may be partially regular in shape and partially irregular in shape. Alternatively, all of them may be regular in shape. Alternatively, all of them may be irregular in shape. The present application embodiment does not limit this, and may be reasonably set according to actual conditions.

[0092] Among them, the pores may penetrate the shielding layer 210. Alternatively, they may not penetrate the shielding layer 210. That is, among the multiple pores, some may penetrate the shielding layer 210, and some may not penetrate the shielding layer 210. Alternatively, all may penetrate the shielding layer 210. Alternatively, all may not penetrate the shielding layer 210. The embodiment of the present application does not limit this, and it can be reasonably set according to the actual situation.

[0093] Regarding the material of the shielding layer 210 , the material of the shielding layer 210 includes a fiber material.

[0094] For example, the material of the shielding layer 210 may include fiber materials such as carbon fiber.

[0095] For example, the shielding layer 210 may include carbon fiber felt. In this way, the shielding layer 210 can enhance the structural strength of the first insulating layer 110 and the second insulating layer 120 and reduce the risk of the first insulating layer 110 and the second insulating layer 120 being brittle and easily broken.

[0096] Alternatively, illustratively, the material of the shielding layer 210 may include metal materials such as gold, silver, copper, iron, and aluminum.

[0097] For example, the shielding layer 210 may include a metal copper foil.

[0098] At this time, the plurality of pores of the shielding layer 210 may be arranged in a grid structure or a spiral structure. For example, the shielding layer 210 may be provided with pores in the shape of a spiral coil.

[0099] like Figure 4 As shown, the first insulating layer 110 and the second insulating layer 120 are respectively disposed on two opposite sides of the shielding layer 210 .

[0100] For example, Figure 5 As shown, the shielding layer 210 has a first surface a1 and a second surface a2 opposite to each other. The first insulating layer 110 is disposed on the first surface a1 of the shielding layer 210 , and the second insulating layer 120 is disposed on the second surface a2 of the shielding layer 210 .

[0101] The material of the first insulating layer 110 and the material of the second insulating layer 120 may be the same, or may be different, which is not limited in the present embodiment.

[0102] In some embodiments, a material of at least one of the first insulating layer 110 and the second insulating layer 120 includes an insulating material.

[0103] The insulating material may include polyethylene (PE) or polyvinyl chloride (PVC), for example.

[0104] Exemplarily, the material of the first insulating layer 110 includes insulating material.

[0105] Alternatively, illustratively, the material of the second insulating layer 120 includes insulating material.

[0106] Alternatively, illustratively, the material of the first insulating layer 110 and the material of the second insulating layer 120 both include insulating materials.

[0107] In this way, the phenomenon of self-heating of metal materials due to eddy current effect is avoided, and at the same time it can also play an insulating role.

[0108] In some embodiments, a material of at least one of the first insulating layer 110 and the second insulating layer 120 includes a thermally conductive material.

[0109] The thermal conductive material may include, for example, any one or more combinations of boron nitride, aluminum nitride and beryllium oxide.

[0110] Exemplarily, the material of the first insulating layer 110 includes a thermally conductive material.

[0111] Alternatively, illustratively, the material of the second insulating layer 120 includes a thermally conductive material.

[0112] Alternatively, illustratively, the material of the first insulating layer 110 and the material of the second insulating layer 120 both include thermally conductive materials.

[0113] In this way, heat can be dissipated through at least one of the first insulating layer 110 or the second insulating layer 120 , and heat dissipation of the charging coil 20 can be achieved through the shielding structure 30 .

[0114] In some embodiments, the first insulating layer 110 , the shielding layer 210 , and the second insulating layer 120 are fixedly connected by bonding.

[0115] Exemplarily, the first insulating layer 110 , the shielding layer 210 , and the second insulating layer 120 are bonded together using an adhesive to form the shielding structure 30 .

[0116] That is, an adhesive is applied between the first insulating layer 110 and the shielding layer 210 to achieve a fixed connection between the first insulating layer 110 and the shielding layer 210. An adhesive is applied between the shielding layer 210 and the second insulating layer 120 to achieve a fixed connection between the shielding layer 210 and the second insulating layer 120.

[0117] In some other embodiments, the first insulating layer 110 , the shielding layer 210 , and the second insulating layer 120 are fixedly connected by pressing.

[0118] Exemplarily, the first insulating layer 110, the shielding layer 210, and the second insulating layer 120 may be fixedly connected by thermal pressing. For example, the first insulating layer 110, the shielding layer 210, and the second insulating layer 120 may be fixedly connected by melting. The material of the first insulating layer 110 or the second insulating layer 120 may be filled in the pores of the shielding layer 210, which may improve the bonding degree and increase the structural strength of the shielding structure 30.

[0119] The material of at least one of the first insulating layer 110 and the second insulating layer 120 is thermoplastic. In other words, the material of at least one of the first insulating layer 110 and the second insulating layer 120 includes thermoplastic material.

[0120] The thermoplastic material may include, for example, at least one of polyethylene, polypropylene (PP), polystyrene (PS), polymethyl methacrylate (PMMA), polyvinyl chloride, nylon (PA), polycarbonate (PC), polyurethane (PU), polytetrafluoroethylene (PTFE) or polyethylene glycolterephthalate (PET).

[0121] It is explained here that the insulating material can also be doped with particles having high thermal conductivity to make the insulating material have thermal conductivity. Exemplarily, ceramic particles are doped into the thermoplastic material to achieve the thermal conductivity effect. For example, the material with high thermal conductivity can include oxides such as aluminum oxide and zirconium oxide, or nitrides, etc.

[0122] Exemplarily, the material of the first insulating layer 110 has thermoplasticity.

[0123] Alternatively, illustratively, the material of the second insulating layer 120 is thermoplastic.

[0124] Alternatively, illustratively, the material of the first insulating layer 110 and the material of the second insulating layer 120 are both thermoplastic.

[0125] For example, the material of the first insulating layer 110 and the material of the second insulating layer 120 are thermoplastic, and the first insulating layer 110 can be fixedly connected to the shielding layer 210 by thermal pressing, and the second insulating layer 120 can be fixedly connected to the shielding layer 210 at the same time.

[0126] In some other embodiments, the first insulating layer 110 , the shielding layer 210 , and the second insulating layer 120 are fixedly connected by injection molding.

[0127] Exemplarily, a mold is used to achieve injection molding between the first insulating layer 110 , the shielding layer 210 , and the second insulating layer 120 .

[0128] For example, the first insulating layer 110 is firstly formed by injection molding in a mold, and then the shielding layer 210 is placed on the first insulating layer 110 , and finally the second insulating layer 120 is formed by injection molding to form the shielding structure 30 .

[0129] In the embodiment of the present application, there is no limitation on the sizes of the first insulating layer 110 , the shielding layer 210 and the second insulating layer 120 . It is only necessary that the edge of the shielding layer 210 is retracted relative to the edges of the first insulating layer 110 and the second insulating layer 120 , that is, the edge of the shielding layer 210 does not exceed the edges of the first insulating layer 110 and the second insulating layer 120 .

[0130] In some embodiments, the material of the first insulating layer 110 includes an insulating thermally conductive material, and the material of the first insulating layer 110 has thermoplasticity. The material of the second insulating layer 120 includes an insulating thermally conductive material, and the material of the second insulating layer 120 has thermoplasticity. The material of the shielding layer 210 includes a fiber material.

[0131] For example, Figure 6 As shown, the first insulating layer 110 or the second insulating layer 120 further wraps around the side of the shielding layer 210 .

[0132] That is to say, the first insulating layer 110 and the second insulating layer 120 are also wrapped around the outer periphery of the shielding layer 210 , and the shielding layer 210 is surrounded by the first insulating layer 110 and the second insulating layer 120 .

[0133] In this way, the shielding layer 210 can be wrapped in the first insulating layer 110 and the second insulating layer 120 to prevent the material of the shielding layer 210 from being exposed and to prevent the shielding layer 210 from being broken and causing a short circuit in the charging coil 20 .

[0134] like Fig. 7AAs shown, for a charging component 10 that is not provided with a shielding structure 30, the charging component 10 is connected to a power source. During the charging process, the charging coil 20 generates a working main frequency A (low-frequency signal) and a high-frequency signal B (interference signal). The generated high-frequency signal will generate electromagnetic interference to the outside, affecting the charging performance.

[0135] like Figure 7B As shown, the shielding structure 30 is disposed on the charging coil 20 , and the shielding layer 210 in the shielding structure 30 can absorb the high-frequency interference magnetic field, control the high-frequency interference magnetic field within the shielding structure 30 , and prevent the high-frequency interference magnetic field from radiating and affecting the work.

[0136] In some embodiments, along the thickness direction z of the charging coil 20 , the projection of the shielding structure 30 overlaps with the projection of the charging coil 20 .

[0137] For example, Fig. 8A As shown, at least a portion of the edge of the shielding structure 30 extends beyond the edge of the charging coil 20 .

[0138] In the embodiment of the present application, the shapes of the shielding structure 30 and the charging coil 20 are not limited and can be reasonably set according to the actual situation. For the convenience of illustration, the shielding structure 30 and the charging coil 20 are illustrated as circles.

[0139] For example, Fig. 8A As shown, a portion of the shielding structure 30 exceeds the edge of the charging coil 20 , and another portion of the edge of the shielding structure 30 does not exceed the edge of the charging coil 20 .

[0140] That is, a portion of the edge of the shielding structure 30 is expanded compared to the edge of the charging coil 20 , and another portion of the edge of the shielding structure 30 is retracted compared to the edge of the shielding structure 30 .

[0141] In other words, a portion of the edge of the charging coil 20 is retracted compared to the edge of the shielding structure 30 , and another portion of the edge of the charging coil 20 is retracted compared to the edge of the shielding structure 30 .

[0142] For example, the shielding structure 30 and the charging coil 20 form a step shape.

[0143] Along the thickness direction z of the charging coil 20 , at least a portion of the projection of the shielding structure 30 overlaps with the projection of the charging coil 20 .

[0144] Or, for example, Figure 8B As shown, the edge of the shielding structure 30 extends beyond the edge of the charging coil 20 .

[0145] That is, the edge of the shielding structure 30 is expanded compared to the edge of the charging coil 20 , and the edge of the charging coil 20 is retracted compared to the edge of the shielding structure 30 .

[0146] Along the thickness direction z of the charging coil 20 , the projection of the charging coil 20 is located within the projection of the shielding structure 30 . The projection of the shielding structure 30 covers the projection of the charging coil 20 .

[0147] It is explained here that it is not limited to that the edges of each part of the shielding structure 30 are expanded compared to the edges of the charging coil 20. It is possible that part of the edges of the shielding structure 30 are expanded compared to the edges of the charging coil 20, and part of the edges of the shielding structure 30 are flush with the edges of the charging coil 20. In other words, part of the edges of the shielding structure 30 overlap with the edges of the charging coil 20. Alternatively, it is also possible that the edges of each part of the shielding structure 30 are expanded compared to the edges of the charging coil 20. The embodiment of the present application does not limit this, and it can be reasonably set according to the actual situation.

[0148] In this way, the charging coil 20 acts as a heat source, and the shielding structure 30 is disposed on the surface of the charging coil 20 , so that the heat can be transferred to the surroundings, thereby achieving heat dissipation for the charging coil 20 and cooling the charging coil 20 .

[0149] Or, for example, Figure 8C As shown, the edge of charging coil 20 extends beyond the edge of shielding structure 30 .

[0150] That is, the edge of the charging coil 20 is expanded compared to the edge of the shielding structure 30 , and the edge of the shielding structure 30 is contracted compared to the edge of the charging coil 20 .

[0151] Along the thickness direction z of the charging coil 20 , the projection of the shielding structure 30 is located within the projection of the charging coil 20 . The projection of the charging coil 20 covers the projection of the shielding structure 30 .

[0152] It is explained here that it is not limited to that the edge of each location of the charging coil 20 is expanded compared to the edge of the shielding structure 30. It is possible that part of the edge of the charging coil 20 is expanded compared to the edge of the shielding structure 30, and part of the edge of the charging coil 20 is flush with the edge of the shielding structure 30. In other words, part of the edge of the charging coil 20 coincides with the edge of the shielding structure 30. Alternatively, it is also possible that the edge of each location of the charging coil 20 is expanded compared to the edge of the shielding structure 30. The embodiment of the present application does not limit this, and it can be reasonably set according to actual conditions.

[0153] Or, for example, Fig.8D As shown, the edge of the shielding structure 30 is flush with the edge of the charging coil 20 .

[0154] That is, the shape of the shielding structure 30 is the same as that of the charging coil 20 . That is, the size of the shielding structure 30 is the same as that of the charging coil 20 .

[0155] Along the thickness direction z of the charging coil 20 , the projection of the shielding structure 30 coincides with the projection of the charging coil 20 .

[0156] In some embodiments, Fig.8D As shown, the shielding structure 30 may be disposed on the surface of the charging coil 20 .

[0157] That is, the shielding structure 30 is in direct contact with the charging coil 20 .

[0158] In other embodiments, Fig. 9 As shown, the shielding structure 30 may also be in indirect contact with the charging coil 20 .

[0159] That is, there is a gap between the shielding structure 30 and the charging coil 20 , and there is no direct contact between them.

[0160] At this time, the gap between the shielding structure 30 and the charging coil 20 can be filled with other dielectric materials. This embodiment of the present application does not limit this, and it can be reasonably set according to actual conditions.

[0161] In the embodiment of the present application, the relative position of the shielding structure 30 and the charging coil 20 is not limited. For example, the shielding structure 30 can be set on the coil portion 21 of the charging coil 20. Or, for example, the shielding structure 30 can be set on the magnetic sheet 22 of the charging coil 20. The embodiment of the present application does not limit this, and it can be reasonably set according to the actual situation. For example, the shielding structure 30 can be set in the area of ​​the charging coil 20 where the interference signal is emitted.

[0162] In some embodiments, the shielding structure 30 can also serve as a shell of the charging component 10 .

[0163] At this time, the shielding structure 30 wraps around the outer periphery of the charging coil 20 . The shielding structure 30 also extends to the side of the magnetic sheet 22 away from the coil portion 21 , wrapping the charging coil 20 .

[0164] Exemplarily, the first insulating layer 110 is disposed on a side close to the charging coil 20, and the second insulating layer 120 is disposed on a side of the first insulating layer 110 away from the charging coil 20. In this case, the second insulating layer 120 can be used as a shell to wrap around the outer periphery of the charging coil 20.

[0165] In this way, the first insulating layer 110 and the second insulating layer 120 are used for heat dissipation, and the shielding layer 210 is used for shielding high-frequency signals. In other words, the shielding structure 30 is used to achieve the overall shielding and heat dissipation of the charging assembly 10.

[0166] It is explained here that the shielding structure 30 provided in the embodiment of the present application is not limited to being disposed in the charging assembly 10. Exemplarily, the shielding structure 30 can also cover the surface of the interference source to absorb and shield the interference signal. For example, the material or structure of the shielding layer 210 in the shielding structure 30 can be changed so that the shielding structure 30 is used to shield the interference signal corresponding to the interference source.

[0167] In some embodiments, Fig. 10A As shown, the charging assembly 10 is carried on the printed circuit board 11. At this time, the charging assembly 10 and the printed circuit board 11 are electrically connected.

[0168] Exemplarily, the shielding structure 30 is disposed on a side of the charging coil 20 away from the printed circuit board 11 .

[0169] The shielding structure 30 is connected to the printed circuit board 11. For example, the shielding structure 30 is grounded through the printed circuit board 11. For example, the shielding layer 210 of the shielding structure 30 is grounded through the printed circuit board 11.

[0170] In the embodiment of the present application, there is no limitation on the number of charging coils 20 included in the charging assembly 10 .

[0171] For example, Fig. 10A As shown, the charging assembly 10 may include a charging coil 20 .

[0172] Alternatively, for example, the charging assembly 10 may include a plurality of charging coils 20. Fig. 10B As shown, the schematic charging assembly 10 includes two charging coils 20. Fig. 10B As shown, two charging coils 20 may be stacked on the printed circuit board 11. Alternatively, they may be spaced apart on the printed circuit board 11. The arrangement of the multiple charging coils 20 is not limited in the embodiment of the present application.

[0173] The embodiment of the present application does not limit the size of the printed circuit board 11. For example, Fig. 10A and Fig. 10B As shown, part of the edge of the printed circuit board 11 can be expanded relative to the edge of the charging component 10, and part of the edge can be retracted relative to the edge of the charging component 10. Alternatively, for example, Fig. 10C As shown, the shielding structure 30 of the charging assembly 10 can cover the surface of the printed circuit board 11. In other words, the edges of the shielding structure 30 are beyond the edges of the printed circuit board 11, that is, the projection of the shielding structure 30 covers the projection of the printed circuit board 11.

[0174] In this way, heat can be dissipated along the direction from the printed circuit board 11 to the shielding structure 30 , thereby improving the heat dissipation effect.

[0175] In the shielding structure 30 provided in the embodiment of the present application, the shielding layer 210 is arranged between the first insulating layer 110 and the second insulating layer 120, and the shielding layer 210 has multiple pores. The multiple pores of the shielding layer 210 can use micro-loops to provide high-frequency eddy current loops, avoid low-frequency eddy current loops, shield high-frequency radiation, and reduce high-frequency radiation overflow. The first insulating layer 110 and the second insulating layer 120 are arranged on opposite sides of the shielding layer 210, and the shielding layer 210 is wrapped to avoid the shielding layer 210 from contacting with other circuit structures to cause a short circuit. Therefore, the setting position of the shielding structure 30 is not limited, and the applicability is strong. At the same time, the shielding layer 210 can enhance the structural strength of the first insulating layer 110 and the second insulating layer 120, and reduce the risk of the materials of the first insulating layer 110 and the second insulating layer 120 being brittle and easy to break. The solution provided in the embodiment of the present application is lighter than metal materials and does not affect the high-power charging efficiency. The shielding structure 30 provided in the embodiment of the present application is disposed in the charging component 10, and can shield the high-frequency interference signal generated by the charging coil 20 in the charging component 10, thereby reducing the electromagnetic interference generated by increasing the charging power.

[0176] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A shielding structure, characterized in that: include: a first insulating layer; A shielding layer, disposed on the first insulating layer; The shielding layer has a plurality of pores; The plurality of pores constitute a microcircuit; The second insulating layer is arranged on a side of the shielding layer away from the first insulating layer.

2. The shielding structure according to claim 1, characterized in that: A material of at least one of the first insulating layer and the second insulating layer includes a thermally conductive material.

3. The shielding structure according to claim 1 or 2, characterized in that: A material of at least one of the first insulating layer and the second insulating layer has thermoplasticity.

4. The shielding structure according to any one of claims 1 to 3, characterized in that: The material of the first insulating layer is the same as that of the second insulating layer.

5. The shielding structure according to any one of claims 1 to 4, characterized in that: The plurality of pores are arranged in a network structure or a honeycomb structure.

6. The shielding structure according to any one of claims 1 to 5, characterized in that: The material of the shielding layer includes fiber material.

7. The shielding structure according to any one of claims 1 to 4, characterized in that: The plurality of pores are arranged in a grid structure or a spiral structure.

8. The shielding structure according to claim 7, characterized in that: The material of the shielding layer includes metal material.

9. The shielding structure according to any one of claims 1 to 8, characterized in that: The first insulating layer or the second insulating layer further wraps around a side edge of the shielding layer.

10. The shielding structure according to any one of claims 1 to 9, characterized in that: The edge of the shielding layer is retracted relative to the edges of the first insulating layer and the second insulating layer.

11. The shielding structure according to any one of claims 1 to 10, characterized in that: The first insulating layer, the shielding layer and the second insulating layer are fixedly connected by pressing, bonding or injection molding.

12. A charging assembly, characterized in that: include: The charging coil comprises a coil portion and a magnetic sheet; the coil portion is attached to the magnetic sheet; The shielding structure as described in any one of claims 1 to 11 is arranged on a side of the coil portion away from the magnetic sheet; along the thickness direction of the charging coil, the projection of the shielding structure overlaps with the projection of the charging coil.

13. The charging assembly according to claim 12, characterized in that: The projection of the shielding structure covers the projection of the charging coil.

14. The charging assembly according to claim 12, characterized in that: The shielding structure further extends to a side of the magnetic sheet away from the coil portion to wrap the charging coil.

15. An electronic device, characterized in that: It comprises the charging component and printed circuit board as described in any one of claims 12-14; the shielding structure of the charging component is grounded through the printed circuit board.

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