Chip support device

Abstract

The chip support device comprises a bowl support, an insulating block, a bonding pad assembly, a chip and an adhesive layer assembly, the bowl support is provided with a containing groove penetrating through the bowl support, an opening in the top of the containing groove is larger than an opening in the bottom of the containing groove, the insulating block is arranged below the containing groove, the bonding pad assembly comprises a positive bonding pad and a negative bonding pad, and the adhesive layer assembly is arranged in the containing groove. One end of the chip is electrically connected with the positive electrode pad, the other end of the chip is electrically connected with the negative electrode pad, the positive electrode pad comprises a positive electrode pad body and a first convex part arranged on the positive electrode pad body, the negative electrode pad comprises a negative electrode pad body and a second convex part arranged on the negative electrode pad body, and the containing groove is filled with an adhesive layer assembly. The bonding pad assembly and the chip are covered with the adhesive layer assembly, the top of the insulating block is flush with the top of the first protruding part and the top of the second protruding part, so that the effect of no tin mixing is achieved, meanwhile, solder paste does not flow back or little flow back, welding of the chip and the bonding pad assembly is firmer, and pseudo soldering is effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of LED product packaging, in particular to a chip bracket device. Background Art

[0002] With the widespread application of LEDs, the low-end market of regular-mount products has reached saturation, and flip-chip high-efficiency products are quietly impacting the mid-to-high-end lighting market, with increasingly higher requirements. Customers have requirements not only for product parameters, but also for product performance, which is becoming increasingly critical.

[0003] Existing flip-chip products are produced by combining a flip-chip bracket with a flip-chip, following the process of die bonding → reflow soldering → glue dispensing → blanking → optical splitting → taping and shipment. However, in the existing process, the flip-chip mainly relies on the positive and negative solder balls at the bottom, which are melted together through solder paste welding. However, the two electrodes are on the same horizontal line, and the bottom of the bracket is flat, which can easily lead to tin cross-linking and cause a short circuit. In addition, because there are various decomposition substances in the solder paste, they will continue to evaporate during the reflow soldering process. If the void rate of the chip's electrode and the bottom is too large, it is easy to have a cold solder joint, which will cause excessive current and burn out the lamp beads. Utility Model Content

[0004] In view of the above situation, it is necessary to provide a chip bracket device to solve the problems of tinning and cold soldering at the bottom of the bracket in the prior art.

[0005] A chip support device comprises a cup support, an insulating block, a pad assembly, a chip and a glue layer assembly;

[0006] The bowl and cup holder is provided with a receiving groove which passes through the bowl and cup holder, the opening at the top of the receiving groove is larger than the opening at the bottom of the receiving groove, the insulating block is arranged below the receiving groove, the pad assembly comprises a positive pad and a negative pad, the positive pad and the negative pad are respectively located on both sides of the insulating block, one end of the chip is electrically connected to the positive pad, the other end of the chip is electrically connected to the negative pad, the chip is partially located in the receiving groove, the positive pad comprises a positive pad body and a first protrusion arranged on the positive pad body, the negative pad comprises a negative pad body and a first protrusion arranged on the negative pad body A second protrusion, the first protrusion and the second protrusion are partially located in the accommodating groove, the spacing between the first protrusion and the second protrusion is smaller than the pin spacing of the chip, the top of the insulating block is flush with the top of the first protrusion and the top of the second protrusion, a Zener tube is also provided on the positive electrode pad body, the Zener tube and the first protrusion are respectively located at the two ends of the positive electrode pad body, the chip is electrically connected to the Zener tube, a third protrusion is provided on the inner side wall of the accommodating groove, the adhesive layer assembly is filled in the accommodating groove, the adhesive layer assembly covers the pad assembly and the chip, and the adhesive layer assembly is used to excite the light of the chip to form white light.

[0007] The utility model arranges the positive electrode pad and the negative electrode pad on both sides of the insulating block, and the positive and negative pins of the chip are respectively arranged on the side adjacent to the first protrusion and the second protrusion and away from the insulating block, and the top of the insulating block is flush with the top of the first protrusion and the top of the second protrusion. The insulating block effectively prevents the solder paste from easily crossing the insulating block after the solder paste is melted, and the solder paste reflows and short-circuits the positive electrode pad and the negative electrode pad, thereby achieving the effect of no tin cross-linking. At the same time, under the premise that the solder paste does not reflow or reflows less, the welding of the chip and the pad assembly is more firm, and the occurrence of cold solder joints is effectively reduced; and the third protrusion arranged on the inner side of the bowl and cup bracket, relative to the original smooth surface, the contact between the third protrusion and the adhesive layer assembly increases the contact area, improves the bonding strength, reduces the risk of debonding, improves the air tightness of the LED lamp beads, increases long-term stability, extends the service life, reduces the requirements for the process to a certain extent, and improves the production efficiency; the adhesive layer assembly effectively excites the light of the chip, improves the photoelectric performance of the LED lamp beads, and further realizes the overall performance improvement of the LED lamp beads.

[0008] Further, the adhesive layer assembly includes a first adhesive layer, a second adhesive layer, a third adhesive layer and a fourth adhesive layer. The first adhesive layer is arranged around the inner wall of the accommodating groove, the first adhesive layer covers the third convex portion, and the width of the bottom of the first adhesive layer is greater than the width of the top of the first adhesive layer, the top of the first adhesive layer is lower than the top of the bowl and cup holder, the bottom of the first adhesive layer covers the Zener tube and the pad assembly, the pad assembly and the chip are provided with a second adhesive layer, the circumference of the second adhesive layer is connected to the first adhesive layer, the top of the second adhesive layer is higher than the top of the chip, the second adhesive layer is used to diverge the light of the chip, the third adhesive layer is provided on the second adhesive layer, the third adhesive layer is used to expand the divergence range of the light of the chip, the fourth adhesive layer is provided on the third adhesive layer, the top of the fourth adhesive layer is not higher than the top of the bowl and cup holder, and the fourth adhesive layer is used to excite the light of the chip to form white light.

[0009] The utility model arranges a glue layer assembly in the cup holder, firstly covers the Zener tube and the pad assembly with a first glue layer, effectively reducing the absorption of light emitted by the chip by the Zener tube and the pad assembly, and then forms a second glue layer above the pad assembly and the chip, which can effectively stimulate the efficiency of the chip to emit blue light, and then forms a third glue layer on the second glue layer to play a role of mirror reflection, and finally forms a fourth glue layer on the third glue layer to stimulate the chip to emit blue light to form white light, thereby effectively improving the photoelectric performance of the LED lamp beads.

[0010] Furthermore, the first adhesive layer, the second adhesive layer, the third adhesive layer and the fourth adhesive layer are all silicone layers, the first adhesive layer is white, the second adhesive layer is red, the third adhesive layer is transparent, and the fourth adhesive layer is green.

[0011] Furthermore, an insulating base is provided below the bowl and cup support, and the insulating base is arranged around the bowl and cup support to enclose a receiving cavity, and the pad assembly and the insulating block are both located in the receiving cavity.

[0012] Furthermore, the positive electrode pad also includes a fourth protrusion, which is arranged between the Zener tube and the first protrusion, and the apex of the fourth protrusion is higher than the apex of the insulating base. The negative electrode pad also includes a fifth protrusion, which is back to the second protrusion and adjacent to the insulating base, and the apex of the fifth protrusion is higher than the apex of the insulating base.

[0013] Furthermore, the first adhesive layer covers the top of the fourth convex portion and the top of the fifth convex portion.

[0014] In the utility model, the first adhesive layer covers the top of the fourth convex portion and the top of the fifth convex portion, so as to form a reflection layer for the light excited by the chip.

[0015] Furthermore, the second adhesive layer and the third adhesive layer are arc-shaped.

[0016] Furthermore, the third protrusion is sawtooth-shaped. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of the first embodiment of the utility model;

[0018] Figure 2 It is a structural schematic diagram of the bowl and cup support and the insulating base of the first embodiment of the utility model.

[0019] Figure numerals: 1. bowl and cup holder; 11. receiving groove; 12. third protrusion; 2. insulating block; 3. pad assembly; 31. positive pad; 311. positive pad body; 312. first protrusion; 313. fourth protrusion; 32. negative pad; 321. negative pad body; 322. second protrusion; 323. fifth protrusion; 4. chip; 5. adhesive layer assembly; 51. first adhesive layer; 52. second adhesive layer; 53. third adhesive layer; 54. fourth adhesive layer; 6. Zener tube; 7. insulating base; 71. receiving cavity. DETAILED DESCRIPTION

[0020] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The drawings provide embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing this embodiment is to make the disclosure of the present invention more thorough and comprehensive.

[0021] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by technicians in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items. In addition, the various embodiments of the present invention, the features in the embodiments, and the features of the embodiments can be freely combined without obvious conflicts or contradictions.

[0023] A chip support device, such as Figure 1 and Figure 2 As shown, it includes a bowl and cup support 1, an insulating block 2, a pad assembly 3, a chip 4, a glue layer assembly 5, a Zener tube 6 and an insulating base 7.

[0024] Specifically, the bowl and cup holder 1 is provided with a receiving groove 11 which passes through the bowl and cup holder 1, the opening at the top of the receiving groove 11 is larger than the opening at the bottom of the receiving groove 11, the insulating block 2 is arranged below the receiving groove 11, the pad assembly 3 includes a positive pad 31 and a negative pad 32, the positive pad 31 and the negative pad 32 are respectively located on both sides of the insulating block 2, one end of the chip 4 is electrically connected to the positive pad 31, and the other end of the chip 4 is electrically connected to the negative pad 32, the chip 4 is partially located in the receiving groove 11, the positive pad 31 includes a positive pad body 311 and a first protrusion 312, the negative pad 32 includes a negative pad body 321 and a second protrusion 322, the first protrusion 312 and the second protrusion 322 are both partially located in the receiving groove 11, the first protrusion 31 2 and the second convex portion 322 are smaller than the pin spacing of the chip 4, the top of the insulating block 2 is flush with the top of the first convex portion 312 and the top of the second convex portion 322, a Zener tube 6 is provided on the side of the positive electrode pad body facing away from the first convex portion 312, the Zener tube 6 and the first convex portion 312 are respectively located at the two ends of the positive electrode pad body 31, the chip 4 is electrically connected to the Zener tube 6, the positive electrode pad 31 also includes a fourth convex portion 313, the fourth convex portion 313 is provided between the Zener tube 6 and the first convex portion 312, the apex of the fourth convex portion 313 is higher than the apex of the insulating base 7, the negative electrode pad 32 also includes a fifth convex portion 323, the fifth convex portion 323 is facing away from the second convex portion 322 and is adjacent to the insulating base 7, the apex of the fifth convex portion 323 is higher than the apex of the insulating base 7.

[0025] Specifically, the inner wall of the accommodating groove 11 is provided with a third protrusion 12, and the third protrusion 12 is serrated. The third protrusion 12 extends from the top of the bowl and cup holder 1 to the bottom of the bowl and cup holder 1. The accommodating groove 11 is provided with a glue layer component 5, and the glue layer component 5 covers the insulating block 2, the pad component 3 and the chip 4. The glue layer component 5 is used to excite the light of the chip 4 to form white light.

[0026] Specifically, the adhesive layer assembly 5 includes a first adhesive layer 51, a second adhesive layer 52, a third adhesive layer 53 and a fourth adhesive layer 54. The first adhesive layer 51 is arranged around the inner side wall of the receiving groove 11, and the first adhesive layer 51 covers the third convex portion 12. The width of the bottom of the first adhesive layer 51 is greater than the width of the top of the first adhesive layer 51. The top of the first adhesive layer 51 is lower than the top of the bowl and cup support 1. The bottom of the first adhesive layer 51 covers the Zener tube 6, the top of the fourth convex portion 313 and the top of the fifth convex portion 323. The second adhesive layer 52 is arranged on the pad assembly 3 and the chip 4. 52, the second adhesive layer 52 is connected to the first adhesive layer 51 in the circumferential direction, the top of the second adhesive layer 52 is higher than the top of the chip 4, the second adhesive layer 52 is used to stimulate the light efficiency of the chip 4, the second adhesive layer 52 is provided with a third adhesive layer 53, the third adhesive layer 53 is used for the light of the chip 4 to form a mirror reflection effect, the second adhesive layer 52 and the third adhesive layer 53 are arc-shaped, the third adhesive layer 53 is provided with a fourth adhesive layer 54, the top of the fourth adhesive layer 54 is not higher than the top of the bowl and cup bracket 1, and the fourth adhesive layer 54 is used to stimulate the light of the chip 4 to finally form white light.

[0027] Specifically, the first adhesive layer 51 , the second adhesive layer 52 , the third adhesive layer 53 and the fourth adhesive layer 54 are all silicone layers. The first adhesive layer 51 is white, the second adhesive layer 52 is red, the third adhesive layer 53 is transparent, and the fourth adhesive layer 54 is green.

[0028] Specifically, an insulating base 7 is provided under the bowl and cup support 1. The insulating base 7 is arranged around the bowl and cup support 1 and encloses a receiving cavity 71. The pad assembly 3 is located in the receiving cavity 71. The insulating base 7 is made of silicone.

[0029] In the present invention, the positive electrode pad 31 and the negative electrode pad 32 are arranged on both sides of the insulating block 2, and the positive and negative pins of the chip 4 are respectively arranged on the side close to the first protrusion 312 and the second protrusion 322 and away from the insulating block 2. The top of the insulating block 2 is flush with the top of the first protrusion 312 and the top of the second protrusion 322. The insulating block 2 effectively prevents the solder paste from easily crossing the insulating block after the solder paste is melted, resulting in a short circuit of the solder paste reflow of the positive electrode pad 31 and the negative electrode pad 32, thereby achieving the effect of no tin cross-linking. At the same time, under the premise that the solder paste does not reflow or reflows less, the welding of the chip 2 and the pad assembly 3 is more firm, which effectively reduces the occurrence of cold soldering. The third protrusion 12 arranged on the inner side of the bowl and cup bracket 1 has a contact with the adhesive layer assembly 5 relative to the original smooth surface, which increases the contact area and improves the bonding strength. , reducing the risk of debonding, improving the air tightness of LED lamp beads, increasing long-term stability, extending service life, reducing the requirements for process to a certain extent, and improving production efficiency; by arranging a glue layer assembly in the bowl cup bracket, firstly, the first glue layer is used to cover the Zener tube 6, the top of the fourth protrusion 313 and the top of the fifth protrusion 323, so as to effectively reduce the absorption of the light emitted by the chip 4 by the Zener tube 6 and the pad assembly 3, and then a second glue layer 52 is formed above the pad assembly 3 and the chip 4, which can effectively stimulate the efficiency of the chip 4 to emit blue light, and then a third glue layer 53 is formed on the second glue layer 52 to play a role of mirror reflection, and finally a fourth glue layer 54 is formed on the third glue layer 53 to stimulate the chip 4 to emit blue light to form white light, thereby improving the photoelectric performance of the LED lamp beads and further realizing the overall performance improvement of the LED lamp beads.

[0030] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0031] The above-mentioned embodiments only express the implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A chip support device, characterized in that: Including a bowl and cup bracket, an insulating block, a pad assembly, a chip and a glue layer assembly; The bowl and cup holder is provided with a receiving groove which passes through the bowl and cup holder, the opening at the top of the receiving groove is larger than the opening at the bottom of the receiving groove, the insulating block is arranged below the receiving groove, the pad assembly comprises a positive pad and a negative pad, the positive pad and the negative pad are respectively located on both sides of the insulating block, one end of the chip is electrically connected to the positive pad, the other end of the chip is electrically connected to the negative pad, the chip is partially located in the receiving groove, the positive pad comprises a positive pad body and a first protrusion arranged on the positive pad body, the negative pad comprises a negative pad body and a first protrusion arranged on the negative pad body A second protrusion, the first protrusion and the second protrusion are partially located in the accommodating groove, the spacing between the first protrusion and the second protrusion is smaller than the pin spacing of the chip, the top of the insulating block is flush with the top of the first protrusion and the top of the second protrusion, a Zener tube is also provided on the positive electrode pad body, the Zener tube and the first protrusion are respectively located at the two ends of the positive electrode pad body, the chip is electrically connected to the Zener tube, a third protrusion is provided on the inner side wall of the accommodating groove, the adhesive layer assembly is filled in the accommodating groove, the adhesive layer assembly covers the pad assembly and the chip, and the adhesive layer assembly is used to excite the light of the chip to form white light.

2. The chip holder device according to claim 1, characterized in that: The adhesive layer assembly includes a first adhesive layer, a second adhesive layer, a third adhesive layer and a fourth adhesive layer. The first adhesive layer is arranged around the inner side wall of the accommodating groove, the first adhesive layer covers the third convex portion, and the width of the bottom of the first adhesive layer is greater than the width of the top of the first adhesive layer, the top of the first adhesive layer is lower than the top of the bowl and cup holder, the bottom of the first adhesive layer covers the Zener tube and the pad assembly, the pad assembly and the chip are provided with a second adhesive layer, the circumference of the second adhesive layer is connected to the first adhesive layer, the top of the second adhesive layer is higher than the top of the chip, the second adhesive layer is used to diverge the light of the chip, the third adhesive layer is provided on the second adhesive layer, the third adhesive layer is used to expand the divergence range of the light of the chip, the fourth adhesive layer is provided on the third adhesive layer, the top of the fourth adhesive layer is not higher than the top of the bowl and cup holder, and the fourth adhesive layer is used to excite the light of the chip to form white light.

3. The chip holder device according to claim 2, characterized in that: The first adhesive layer, the second adhesive layer, the third adhesive layer and the fourth adhesive layer are all silicone layers.

4. The chip holder device according to claim 3, characterized in that: An insulating base is provided below the bowl and cup support. The insulating base is arranged around the bowl and cup support to enclose a receiving cavity. The pad assembly and the insulating block are both located in the receiving cavity.

5. The chip holder device according to claim 4, characterized in that: The positive electrode pad also includes a fourth protrusion, which is arranged between the Zener tube and the first protrusion, and the apex of the fourth protrusion is higher than the apex of the insulating base. The negative electrode pad also includes a fifth protrusion, which faces away from the second protrusion and is adjacent to the insulating base, and the apex of the fifth protrusion is higher than the apex of the insulating base.

6. The chip holder device according to claim 5, characterized in that: The first adhesive layer covers the top of the fourth convex portion and the top of the fifth convex portion.

7. The chip holder device according to claim 3, characterized in that: The second adhesive layer and the third adhesive layer are arc-shaped.

8. The chip holder device according to claim 1, characterized in that: The third protrusion is sawtooth-shaped.

Images