Chip processing gluing equipment

Abstract

The utility model discloses chip processing gluing equipment, and particularly relates to the technical field of gluing, the chip processing gluing equipment comprises a base, one side of the upper end face of the base is connected with an L-shaped supporting plate, the upper end of the L-shaped supporting plate is provided with a connecting seat, and the lower end face of the connecting seat is connected with a first electric telescopic rod; a brushing assembly is arranged at the lower end of the first electric telescopic rod, an adjustable placing structure is arranged at the position, located on one side of the L-shaped supporting plate, of the upper end of the base, and a controller is installed on the front surface wall of the base. The adjustable placing structure comprises a placing seat, a hollow vertical plate, a bearing plate, a first connecting plate, a second connecting plate, a first plate groove, a second plate groove, a threaded rod, a threaded block and a handle. By arranging the adjustable placing structure, the chip can be quickly taken out after gluing, the problem that the taking-out difficulty coefficient is large when the chip is manually buckled and taken due to the limited space of the placing cavity is avoided, and the defect that the gluing efficiency is influenced due to long taking-out time caused by difficult taking-out is overcome.

Description

Technical Field

[0001] The utility model relates to the technical field of glue coating, in particular to a chip processing glue coating device. Background Art

[0002] In the semiconductor industry, after a chip is manufactured, it is necessary to etch the chip at the mesa position. After the voltage after etching reaches the requirement, a glue coating device is used to coat the mesa position with glue to protect the mesa. A glue coating device refers to a device that can evenly coat a glue slurry such as a solvent glue slurry, a latex, and a water glue slurry on the surface of an article, and can also be widely used in fields such as toy manufacturing, packaging, paper product bonding and fixing.

[0003] Currently, most glue coating devices use a placement seat to place the chip to be coated. Since the chip is relatively thin, when removing the coated chip, it is necessary to manually pick up the chip. However, the space in the placement cavity is limited, making it difficult to remove the chip, and if removed carelessly, it is easy to damage the chip, making the chip removal inconvenient. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a chip processing glue coating device to solve the above deficiencies in the technology.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A chip processing glue coating device, comprising:

[0006] A base, one side of the upper end surface of the base is connected with an L-shaped support plate, a connecting seat is arranged at the upper end of the L-shaped support plate, a first electric telescopic rod is connected to the lower end surface of the connecting seat, a brushing component is arranged at the lower end of the first electric telescopic rod, an adjustable placement structure is arranged on the upper end of the base and on one side of the L-shaped support plate, and a controller is installed on the front surface of the base;

[0007] The adjustable placement structure includes a placement seat, a hollow vertical plate, a receiving plate, a first connecting plate, a second connecting plate, a first plate groove, a second plate groove, a threaded rod, a threaded block, and a handle. The placement seat is installed on the upper end surface of the base through a block, the hollow vertical plate is installed on the upper end surface of the base and on one side of the placement seat, the receiving plate is arranged inside the placement seat, and the first connecting plate and the second connecting plate are arranged outside the receiving plate.

[0008] Preferably, the first plate groove is opened on one side of the inner wall of the placement seat, and the first plate groove is arranged outside the first connecting plate, and the second plate groove is opened on the other side of the inner wall of the placement seat.

[0009] Preferably, the threaded rod is threadedly connected to the inside of the hollow vertical plate, the threaded block is threadedly connected to the outside of the threaded rod, the handle is arranged on the upper end surface of the hollow vertical plate, and the threaded rod passes through the hollow vertical plate and is connected to the handle.

[0010] Preferably, a disassembly and assembly structure is provided at the connection between the receiving plate and the first connecting plate and the second connecting plate. The disassembly and assembly structure includes an empty slot, a spring, a clamping block, a clamping groove, a pulling block and a movable slot. The empty slot is opened on the inner walls of the first connecting plate and the second connecting plate. The spring is connected inside the empty slot. The clamping block is connected to the free end of the spring. The clamping groove is opened on the inner wall of the receiving plate. The clamping block is inserted into the clamping groove.

[0011] Preferably, the pulling block is connected to the upper end surface of the clamping block. The movable slot is opened on the upper end surfaces of the first connecting plate and the second connecting plate.

[0012] Preferably, a moving slot is opened on the upper end surface of the L-shaped support plate. The moving slot is arranged outside the first electric telescopic rod. A sleeve is installed on the upper end surface of the L-shaped support plate. A second electric telescopic rod is connected inside the sleeve. The free end of the second electric telescopic rod is connected to the connecting seat.

[0013] Preferably, the coating assembly includes a glue box, a connecting frame, a rolling brush and a glue pipe. The glue box is connected to the lower end surface of the first electric telescopic rod. The connecting frame is connected to the lower end surface of the glue box. The rolling brush is movably connected inside the connecting frame. The glue pipe is arranged inside the connecting frame, and the inlet end of the glue pipe is connected to the glue box.

[0014] In the above technical solution, the technical effects and advantages provided by the present utility model are as follows:

[0015] 1. By setting the adjustable placement structure, the glue application device has an adjustable placement function. After glue application, the chip can be quickly taken out, avoiding the problem that the difficulty coefficient of taking out the chip is large due to the limited space of the placement cavity when manually pulling the chip out, and preventing the disadvantage that the taking-out time is increased due to the difficult taking-out, which affects the glue application efficiency, and enhancing the convenience of taking out the chip;

[0016] 2. By setting the disassembly and assembly structure, the adjustable placement structure has the disassembly and assembly function of the receiving plate, can realize the disassembly and assembly of the connecting plate and the receiving plate, can replace the corresponding matching receiving plate according to the size of the chip to be glued actually required, enhancing the applicable range of the adjustable placement structure without limitation. In addition, the worn receiving plate can also be replaced to avoid damage to the chip caused by the worn receiving plate and reduce the number of damaged chips during the glue application operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0018] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0019] Figure 2 It is a sectional view of the present utility model;

[0020] Figure 3 It is a schematic diagram of the adjustable placement structure of the present utility model;

[0021] Figure 4 It is a sectional view of the first connecting plate of the present utility model;

[0022] Figure 5 It is a schematic diagram of the disassembly and assembly structure of the present utility model.

[0023] Explanation of reference numerals:

[0024] 1, base; 2, L-shaped support plate; 3, connecting seat; 4, first electric telescopic rod; 5, glue box; 6, connecting frame; 7, roller brush; 8, adjustable placement structure; 81, placement seat; 82, hollow vertical plate; 83, receiving plate; 84, first connecting plate; 85, second connecting plate; 86, first plate groove; 87, second plate groove; 811, threaded rod; 812, threaded block; 813, handle; 9, rubber tube; 10, disassembly and assembly structure; 101, empty groove; 102, spring; 103, block; 104, card slot; 105, pull block; 106, moving groove; 11, moving groove; 12, sleeve; 13, second electric telescopic rod; 14, controller. Detailed implementation manners

[0025] In order to enable those skilled in the art to better understand the technical solutions of the present utility model, the following will further introduce the present utility model in detail in conjunction with the drawings.

[0026] The present utility model provides a chip processing glue coating device as shown in Figure 1 and Figure 2 including:

[0027] Base 1, one side of the upper end surface of base 1 is connected with an L-shaped support plate 2, a connecting seat 3 is arranged at the upper end of the L-shaped support plate 2, a first electric telescopic rod 4 is connected to the lower end surface of the connecting seat 3, and a coating assembly is arranged at the lower end of the first electric telescopic rod 4. The coating assembly includes a glue box 5, a connecting frame 6, a rolling brush 7 and a glue pipe 9. The glue box 5 is connected to the lower end surface of the first electric telescopic rod 4, the connecting frame 6 is connected to the lower end surface of the glue box 5, the rolling brush 7 is movably connected inside the connecting frame 6, the glue pipe 9 is arranged inside the connecting frame 6, and the inlet end of the glue pipe 9 is connected to the glue box 5. A controller 14 is installed on the front surface wall of the base 1.

[0028] Further, referring to Figure 2 As shown, a moving groove 11 is formed on the upper end surface of the L-shaped support plate 2. The moving groove 11 is arranged outside the first electric telescopic rod 4. A sleeve 12 is installed on the upper end surface of the L-shaped support plate 2, and a second electric telescopic rod 13 is connected inside the sleeve 12. The free end of the second electric telescopic rod 13 is connected to the connecting seat 3.

[0029] Specifically, when applying glue, first place the chip to be glued at the corresponding placement position, then operate the controller 14 to turn on the first electric telescopic rod 4 and the second electric telescopic rod 13 in sequence. The first electric telescopic rod 4 drives the glue box 5 to descend, so that the rolling brush 7 descends to contact the surface of the chip, and the glue slurry in the glue box 5 drips onto the rolling brush 7 through the glue pipe 9. Then the second electric telescopic rod 13 drives the connecting seat 3, so that the first electric telescopic rod 4 moves in the moving groove 11, which can drive the rolling brush 7 to move horizontally, and can perform glue application operations on a number of chips arranged side by side and at equal distances.

[0030] The present utility model provides a chip processing glue application device as shown in Figure 2 and Figure 3 As shown, an adjustable placement structure 8 is arranged on the upper end of the base 1 and on one side of the L-shaped support plate 2. The adjustable placement structure 8 includes a placement seat 81, a hollow vertical plate 82, a receiving plate 83, a first connecting plate 84, a second connecting plate 85, a first plate groove 86, a second plate groove 87, a threaded rod 811, a threaded block 812 and a handle 813. The placement seat 81 is installed on the upper end surface of the base 1 through a block. The hollow vertical plate 82 is installed on the upper end surface of the base 1 and on one side of the placement seat 81. The receiving plate 83 is arranged inside the placement seat 81, and the first connecting plate 84 and the second connecting plate 85 are arranged outside the receiving plate 83.

[0031] The first plate groove 86 is formed on one side of the inner surface wall of the placement seat 81, and the first plate groove 86 is arranged outside the first connecting plate 84. The second plate groove 87 is formed on the other side of the inner surface wall of the placement seat 81.

[0032] The threaded rod 811 is threadedly connected to the inside of the hollow vertical plate 82, the threaded block 812 is threadedly connected to the outside of the threaded rod 811, the handle 813 is provided on the upper end surface of the hollow vertical plate 82, and the threaded rod 811 passes through the hollow vertical plate 82 and is connected to the handle 813.

[0033] Through the above technical solution:

[0034] After the chip is coated with glue, first hold the handle 813 by hand and rotate it counterclockwise. At this time, the threaded block 812 moves upward, driving the second connecting plate 85 to move upward, and the receiving plate 83 moves upward along with the second connecting plate 85. At the same time, the first connecting plate 84 moves within the first plate groove 86, so that it moves the receiving plate 83 upward to the upper port of the placement seat 81, increasing the space for taking out the chip, enabling the chip to be taken out quickly, avoiding the problem of difficult extraction coefficient when manually triggering to take out the chip due to the limited space of the placement cavity, preventing the disadvantage of affecting the coating efficiency due to the difficult extraction resulting in an increased extraction time, enhancing the convenience of chip extraction. In addition, the height of the placement groove of the receiving plate 83 is lower than the thickness of the chip, preventing the situation that the chip is easily damaged due to the thin chip when taking out carelessly, improving the use effect of the coating equipment. In addition, after taking out, rotate the handle 813 counterclockwise, and the connecting plate descends, restoring the receiving plate 83 with the uncoated chip to its original position.

[0035] The present utility model provides a Figure 4 and Figure 5 A chip processing and coating device as shown. A disassembly and assembly structure 10 is provided at the connection between the receiving plate 83 and the first connecting plate 84 and the second connecting plate 85. The disassembly and assembly structure 10 includes an empty slot 101, a spring 102, a clamping block 103, a clamping groove 104, a pulling block 105, and a moving slot 106. The empty slot 101 is opened on the inner walls of the first connecting plate 84 and the second connecting plate 85. The spring 102 is connected to the inside of the empty slot 101. The clamping block 103 is connected to the free end of the spring 102. The clamping groove 104 is opened on the inner wall of the receiving plate 83. The clamping block 103 is inserted into the clamping groove 104.

[0036] The pulling block 105 is connected to the upper end surface of the clamping block 103. The moving slot 106 is opened on the upper end surfaces of the first connecting plate 84 and the second connecting plate 85.

[0037] Through the above technical solution:

[0038] First, hold the pull block 105 by hand and pull it outward. The pull block 105 moves within the movable slot 106. At this time, the spring 102 in the empty slot 101 is stressed and contracts, driving the clamping block 103 to move out of the clamping slot 104 and retract into the empty slot 101. This operation can release the connection between the connecting plate and the receiving plate 83. The corresponding and matching receiving plate 83 can be replaced according to the size of the glue-coated chip actually required, which enhances the applicable range of the adjustable placement structure 8 without limitation. In addition, the worn receiving plate 83 can also be replaced to avoid damage to the chip caused by the worn receiving plate 83 and reduce the number of damaged chips during the glue-coating operation.

[0039] Only some exemplary embodiments of the present invention have been described by way of illustration above. Without doubt, for those of ordinary skill in the art, the described embodiments can be modified in various different ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and description are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A chip processing glue coating equipment, characterized in that: include: A base (1), wherein one side of the upper end surface of the base (1) is connected to an L-shaped support plate (2), the upper end of the L-shaped support plate (2) is provided with a connecting seat (3), the lower end surface of the connecting seat (3) is connected to a first electric telescopic rod (4), the lower end of the first electric telescopic rod (4) is provided with a painting brush assembly, an adjustable placement structure (8) is provided at the upper end of the base (1) and located on one side of the L-shaped support plate (2), and a controller (14) is installed on the front surface wall of the base (1); The adjustable placement structure (8) comprises a placement seat (81), a hollow vertical plate (82), a receiving plate (83), a first connecting plate (84), a second connecting plate (85), a first plate groove (86), a second plate groove (87), a threaded rod (811), a threaded block (812) and a handle (813); the placement seat (81) is mounted on the upper end surface of the base (1) through a block; the hollow vertical plate (82) is mounted on the upper end surface of the base (1) and is located on one side of the placement seat (81); the receiving plate (83) is arranged inside the placement seat (81); and the first connecting plate (84) and the second connecting plate (85) are arranged on the outside of the receiving plate (83).

2. The chip processing glue coating equipment according to claim 1, characterized in that: The first plate groove (86) is opened on one side of the inner surface wall of the placement seat (81), and the first plate groove (86) is arranged outside the first connecting plate (84), and the second plate groove (87) is opened on the other side of the inner surface wall of the placement seat (81).

3. The chip processing glue coating equipment according to claim 1, characterized in that: The threaded rod (811) is threadedly connected to the inside of the hollow vertical plate (82), the threaded block (812) is threadedly connected to the outside of the threaded rod (811), the handle (813) is arranged on the upper end surface of the hollow vertical plate (82), and the threaded rod (811) passes through the hollow vertical plate (82) and is connected to the handle (813).

4. The chip processing glue coating equipment according to claim 1, characterized in that: A disassembly structure (10) is provided at the connection between the receiving plate (83) and the first connecting plate (84) and the second connecting plate (85), and the disassembly structure (10) comprises an empty slot (101), a spring (102), a clamping block (103), a clamping slot (104), a pulling block (105) and a movable slot (106); the empty slot (101) is provided on the inner wall of the first connecting plate (84) and the second connecting plate (85); the spring (102) is connected to the inside of the empty slot (101); the clamping block (103) is connected to the free end of the spring (102); the clamping slot (104) is provided on the inner wall of the receiving plate (83); and the clamping block (103) is inserted into the inside of the clamping slot (104).

5. The chip processing glue coating equipment according to claim 4, characterized in that: The pulling block (105) is connected to the upper end surface of the clamping block (103), and the movable groove (106) is opened on the upper end surfaces of the first connecting plate (84) and the second connecting plate (85).

6. The chip processing glue coating equipment according to claim 1, characterized in that: The upper end surface of the L-shaped support plate (2) is provided with a movable groove (11), and the movable groove (11) is arranged outside the first electric telescopic rod (4). The upper end surface of the L-shaped support plate (2) is installed with a sleeve (12), and the interior of the sleeve (12) is connected to the second electric telescopic rod (13), and the free end of the second electric telescopic rod (13) is connected to the connecting seat (3).

7. The chip processing glue coating equipment according to claim 1, characterized in that: The brushing assembly comprises a rubber box (5), a connecting frame (6), a roller brush (7) and a rubber hose (9); the rubber box (5) is connected to the lower end surface of the first electric telescopic rod (4); the connecting frame (6) is connected to the lower end surface of the rubber box (5); the roller brush (7) is movably connected to the inside of the connecting frame (6); the rubber hose (9) is arranged inside the connecting frame (6), and the inlet end of the rubber hose (9) is connected to the rubber box (5).

Images