Solder paste dispensing valve

Abstract

The utility model belongs to the technical field of dispensing, and discloses a solder paste dispensing valve which comprises a first mounting seat, a fixed seat, a movable seat, a driving module and a nozzle, a first channel is arranged in the first mounting seat and communicated with a liquid source, the fixed seat and the movable seat are respectively provided with a second channel and a third channel, and the second channel is communicated with the driving module. The second channel is communicated with the first channel, a corrugated pipe is connected between the fixed seat and the movable seat, the end, away from the first channel, of the second channel is communicated with the third channel through the corrugated pipe, and the end, away from the second channel, of the third channel has a blocked first working state and a second working state communicated with the outside. The driving module can push the movable base to move towards the fixed base in the axial direction of the corrugated pipe, and a spraying opening of the nozzle communicates with the first channel. According to the solder paste dispensing valve, solder paste is sprayed out of the nozzle through deformation of the corrugated pipe, a moving part used for extruding the solder paste does not need to be arranged, and therefore loss is reduced, and the service life of the solder paste dispensing valve is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of dispensing, in particular to a solder paste dispensing valve. Background Art

[0002] In the prior art, a solder paste dispensing valve generally realizes high-speed dispensing through a unique ejector. Specifically, the solder paste dispensing valve generally uses moving parts such as a piston or a plunger to extrude the solder paste, so that the solder paste is ejected from a fine nozzle.

[0003] During the working process, the moving parts will rub against the solder paste. Moreover, due to the high-speed movement of the moving parts, the reliability of the moving parts will rapidly decrease due to wear, resulting in a short service life of the solder paste dispensing valve.

[0004] Therefore, the above problems need to be solved urgently. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a solder paste dispensing valve to solve the problem of the short service life of the solder paste dispensing valve.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] A solder paste dispensing valve, comprising:

[0008] A first mounting seat, internally provided with a first channel, and the first channel is communicated with a liquid source;

[0009] A fixed seat and a moving seat, which are respectively provided with a second channel and a third channel. The second channel is communicated with the first channel. A bellows is connected between the fixed seat and the moving seat. One end of the second channel far from the first channel is communicated with the third channel through the bellows. One end of the third channel far from the second channel has a first working state of being blocked and a second working state of being communicated with the outside;

[0010] A driving module, capable of pushing the moving seat to move along the axial direction of the bellows towards the fixed seat; and

[0011] A nozzle, installed on the first mounting seat, and the nozzle orifice is communicated with the first channel.

[0012] Preferably, the driving module is a piezoelectric stack.

[0013] Preferably, the solder paste dispensing valve further includes a second mounting base provided with a cavity on which a first through hole is formed in the cavity wall. The piezoelectric stack is installed in the cavity, and the head of the piezoelectric stack passes through the first through hole and can push against the moving seat. The solder paste dispensing valve further includes a first air nozzle and a second air nozzle, both of which communicate with the cavity. The first air nozzle is configured to supply air to the cavity, and the second air nozzle is configured to discharge the gas in the cavity.

[0014] Preferably, a first accommodation groove is formed in the second mounting base. The first through hole communicates the first accommodation groove and the cavity. One end of the moving seat away from the fixed seat is located in the first accommodation groove. The head of the piezoelectric stack passes through the first through hole and extends into the first accommodation groove. The solder paste dispensing valve further includes a sealing ring sleeved on the outer periphery of the piezoelectric stack and pressed and defined between the bottom of the first accommodation groove and the moving seat and between the side wall of the first accommodation groove and the piezoelectric stack.

[0015] Preferably, a second accommodation groove is formed in the first mounting base, and a second through hole is formed in the bottom of the second accommodation groove. The fixed seat is placed in the second accommodation groove and placed on the bottom of the second accommodation groove. The second through hole communicates the second channel and the first channel.

[0016] Preferably, a first plug is detachably installed at one end of the third channel away from the second channel.

[0017] Preferably, one end of the first channel away from the liquid source has a third working state in which it is blocked and a fourth working state in which it communicates with the outside.

[0018] Preferably, a second plug is detachably installed at one end of the first channel away from the liquid source.

[0019] Preferably, the nozzle, the second channel, the corrugated pipe and the third channel are coaxially arranged.

[0020] Preferably, a joint is installed on the first mounting base, and the first channel communicates with the liquid source through the joint.

[0021] Advantages of the present invention:

[0022] In the present invention, the solder paste is ejected from the nozzle by the deformation of the corrugated pipe, that is, the present invention realizes dispensing through a deformable fluid chamber without setting a moving part for extruding the solder paste, thereby reducing losses and improving the service life of the solder paste dispensing valve. Description of the drawings

[0023] Figure 1 It is a schematic structural diagram of the solder paste dispensing valve in the embodiment of the present utility model;

[0024] Figure 2 It is a top view of the solder paste dispensing valve in the embodiment of the present utility model;

[0025] Figure 3 It is a Figure 2 cross-sectional view along the A-A line in

[0026] Figure 4 It is Figure 3 a partial enlarged view at B in

[0027] In the figure:

[0028] 1. First mounting seat; 11. First channel; 12. Second accommodation groove; 121. Second through hole; 13. Second plug; 14. Connector; 2. Fixed seat; 21. Second channel; 3. Moving seat; 31. Third channel; 32. First plug; 4. Bellows; 5. Driving module; 6. Nozzle; 61. Spray port; 7. Second mounting seat; 71. Cavity; 72. First through hole; 73. First air nozzle; 74. Second air nozzle; 75. First accommodation groove; 76. Observation hole; 77. Control board; 8. Sealing ring. Specific embodiments

[0029] The following further describes the present utility model in detail with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. Additionally, it should be noted that for the convenience of description, only the parts related to the present utility model rather than all the structures are shown in the drawings.

[0030] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0031] In the present utility model, unless otherwise clearly specified and defined, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "beneath" and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0032] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "right" and "left" are based on the orientation or positional relationships shown in the drawings. They are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0033] Please refer to Figures 1 to 4 , this embodiment provides a solder paste dispensing valve, which includes a first mounting seat 1, a fixed seat 2, a moving seat 3, a driving module 5 and a nozzle 6. Among them, a first channel 11 is provided inside the first mounting seat 1, and the first channel 11 is communicated with a liquid source (not shown in the figure). Specifically, a connector 14 is installed on the first mounting seat 1, and the first channel 11 is communicated with the liquid source through the connector 14.

[0034] The fixed seat 2 and the moving seat 3 are respectively provided with a second channel 21 and a third channel 31. Among them, the second channel 21 is communicated with the first channel 11. A bellows 4 is connected between the fixed seat 2 and the moving seat 3. One end of the second channel 21 far from the first channel 11 is communicated with the third channel 31 through the bellows 4. The first channel 11, the second channel 21, the inner cavity of the bellows 4 and the third channel 31 together form a fluid chamber. The driving module 5 can push the moving seat 3 to move along the axial direction of the bellows 4 towards the fixed seat 2. The nozzle 6 is installed on the first mounting seat 1, and the nozzle orifice 61 of the nozzle 6 is communicated with the first channel 11.

[0035] In addition, one end of the third channel 31 away from the second channel 21 has a first working state in which it is blocked and a second working state in which it communicates with the outside. When solder paste is first injected into the first channel 11, one end of the third channel 31 away from the second channel 21 is first in the second working state, so as to ensure that the solder paste can be smoothly injected into the first channel 11. Moreover, during the injection of the solder paste, the gas in the fluid chamber can be exhausted, that is, the fluid chamber can be filled with solder paste. After the fluid chamber is filled with solder paste, one end of the third channel 31 away from the second channel 21 returns to and remains in the first working state.

[0036] Exemplarily, in this embodiment, a first plug 32 is detachably installed at one end of the third channel 31 away from the second channel 21, and the staff can disassemble and assemble the first plug 32 to switch the end of the third channel 31 away from the second channel 21 between the first working state and the second working state.

[0037] Of course, in other alternative embodiments, one end of the third channel 31 away from the second channel 21 can also be switched between the first working state and the second working state by other means such as setting a valve, and this embodiment does not make specific limitations on this.

[0038] In addition, it is worth noting that the first plug 32 can be installed at one end of the third channel 31 away from the second channel 21 by a detachable means such as bolt connection, and this embodiment does not make specific limitations on this either.

[0039] When the driving module 5 pushes against the moving seat 3 to move along the axial direction of the corrugated pipe 4 towards the fixed seat 2, the corrugated pipe 4 deforms, so as to extrude the solder paste in the fluid chamber from the nozzle 6. When the driving module 5 releases the push on the moving seat 3, the corrugated pipe 4 can recover its deformation. It can be understood that after the driving module 5 releases the push on the moving seat 3 each time, the liquid source injects solder paste into the first channel 11 once, so as to ensure that the corrugated pipe 4 can recover its deformation each time. Moreover, since the gas in the fluid chamber has been exhausted, therefore, this embodiment can eliminate the problem of unstable solder paste spraying caused by the compressibility of the gas, so as to ensure that a fixed amount of solder paste is extruded from the nozzle 6 each time subsequently.

[0040] In addition, it is worth noting that the corrugated pipe 4 is a metal part, so as to stably support the moving seat 3. Moreover, in this embodiment, the nozzle orifice 61 of the nozzle 6, the second channel 21, the corrugated pipe 4 and the third channel 31 are coaxially arranged, so as to ensure that the solder paste in the fluid chamber can be ejected more smoothly from the nozzle orifice 61 of the nozzle 6.

[0041] Based on the above, in this embodiment, the solder paste is ejected from the nozzle 6 through the deformation of the corrugated pipe 4, that is, in this embodiment, dispensing is realized through a deformable fluid chamber, and there is no need to set moving parts for extruding the solder paste, so as to reduce losses and further improve the service life of the solder paste dispensing valve.

[0042] It should be noted that the nozzle 6 can be selected as a flat nozzle 6 or a pointed nozzle 6 to meet the requirements of non-contact and contact dispensing.

[0043] It should also be noted that in this embodiment, the driving module 5 is a piezoelectric stack. In this embodiment, by controlling the piezoelectric stack, the piezoelectric stack can push the moving seat 3 towards the fixed seat 2 through the head, thereby realizing the compression deformation of the bellows 4 to reduce the fluid chamber, so that the solder paste can be ejected from the nozzle 6. Based on the above, in this embodiment, by controlling the piezoelectric stack, continuous dispensing of the solder paste valve can be achieved.

[0044] Moreover, in this embodiment, the speed of the solder paste ejected from the nozzle 6 can also be controlled by controlling the voltage change speed of the piezoelectric stack, further meeting the requirements of non-contact and contact dispensing.

[0045] It can be understood that the specific structure and working principle of the piezoelectric stack are both prior arts, so they will not be elaborated in this embodiment.

[0046] Furthermore, the solder paste valve further includes a second mounting seat 7. A cavity 71 is provided on the second mounting seat 7. A first through hole 72 is provided on the cavity wall of the cavity 71. The piezoelectric stack is installed in the cavity 71, and the head of the piezoelectric stack passes through the first through hole 72 and can push against the moving seat 3. The solder paste valve further includes a first air nozzle 73 and a second air nozzle 74. Both the first air nozzle 73 and the second air nozzle 74 are communicated with the cavity 71. The first air nozzle 73 is configured to supply air to the cavity 71, and the second air nozzle 74 is configured to discharge the gas in the cavity 71 to realize the circulation of the gas in the cavity 71, thereby cooling the piezoelectric stack, preventing the piezoelectric stack from malfunctioning due to long-term operation, and further improving the service life of the solder paste valve.

[0047] Further, a first receiving groove 75 is provided on the second mounting seat 7. The first through hole 72 communicates the first receiving groove 75 and the cavity 71. One end of the moving seat 3 away from the fixed seat 2 is located in the first receiving groove 75. The head of the piezoelectric stack passes through the first through hole 72 and extends into the first receiving groove 75. The solder paste dispensing valve further includes a sealing ring 8. The sealing ring 8 is sleeved on the outer periphery of the piezoelectric stack and is pressed and limited between the bottom of the first receiving groove 75 and the moving seat 3 and between the side wall of the first receiving groove 75 and the piezoelectric stack. That is, the sealing ring 8 is located on the side of the first through hole 72 away from the cavity 71 and surrounds the outer periphery of the first through hole 72. The sealing ring 8 plays a sealing role, thus avoiding the leakage of gas in the cavity 71. In addition, the sealing ring 8 can prevent the high-pressure gas delivered into the cavity 71 by the first air nozzle 73 from entering between the head of the piezoelectric stack and the moving seat 3, so as to ensure that the moving seat 3 moves toward the fixed seat 2 only under the action of the piezoelectric stack and is not affected by other factors, and further ensure that the solder paste can be stably ejected from the nozzle orifice 61 of the nozzle 6.

[0048] And a second receiving groove 12 is provided on the first mounting seat 1. A second through hole 121 is provided at the bottom of the second receiving groove 12. The fixed seat 2 is placed in the second receiving groove 12 and is placed on the bottom of the second receiving groove 12, so as to ensure that the fixed seat 2 remains stationary when the bellows 4 deforms. The second through hole 121 communicates the second channel 21 and the first channel 11.

[0049] It should be noted that the second mounting seat 7 and the first mounting seat 1 are detachably connected together, which is convenient for assembling and subsequent maintenance of the solder paste dispensing valve.

[0050] Moreover, an observation hole 76 is also provided on the second mounting seat 7, which is convenient for the staff to observe whether the positions of structures such as the moving seat 3 and the bellows 4 are correct after completing the assembly operation of the solder paste dispensing valve. In addition, the staff can also observe the position of the first plug 32 through the observation hole 76 during the working process of the solder paste dispensing valve, so as to ensure that after the gas in the fluid chamber is exhausted, the first plug 32 can be accurately installed at one end of the third channel 31 away from the second channel 21.

[0051] In addition, it is also worth noting that the end of the first channel 11 far from the liquid source has a blocked third working state and a fourth working state communicating with the outside. When the solder paste is first injected into the first channel 11, the end of the first channel 11 far from the liquid source is first in the fourth working state, so as to further ensure that the solder paste can be smoothly injected into the first channel 11, and further ensure that the gas in the fluid chamber can be exhausted during the injection of the solder paste. After the fluid chamber is filled with the solder paste, the end of the first channel 11 far from the liquid source returns to and maintains the third working state. That is, this embodiment can further eliminate the problem of unstable solder paste spraying caused by the compressibility of the gas, so as to further ensure that a fixed amount of solder paste is extruded from the nozzle 6 each time subsequently.

[0052] Exemplarily, a second plug 13 is detachably installed at the end of the first channel 11 far from the liquid source, and the staff can disassemble and assemble the second plug 13 to switch the end of the first channel 11 far from the liquid source between the third working state and the fourth working state.

[0053] Of course, in other alternative embodiments, the end of the first channel 11 far from the liquid source can also be switched between the third working state and the fourth working state by other means such as setting a valve, and this embodiment does not make specific restrictions on this.

[0054] In addition, it is worth noting that the second plug 13 can be installed at the end of the first channel 11 far from the liquid source by a detachable means such as bolt connection, and this embodiment also does not make specific restrictions on this.

[0055] It is also worth noting that a control board 77 is installed on the second mounting seat 7, and the control board 77 is electrically connected to the piezoelectric stack to control the voltage change speed of the piezoelectric stack.

[0056] Obviously, the above embodiments of the present invention are only examples for clearly explaining the present invention, and are not limitations on the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. Solder paste dispensing valve, characterized in that: include: A first mounting seat (1) is provided with a first channel (11) inside, wherein the first channel (11) is connected to a liquid source; The fixed seat (2) and the movable seat (3) are respectively provided with a second channel (21) and a third channel (31); the second channel (21) is communicated with the first channel (11); a bellows (4) is connected between the fixed seat (2) and the movable seat (3); an end of the second channel (21) away from the first channel (11) is communicated with the third channel (31) through the bellows (4); an end of the third channel (31) away from the second channel (21) has a first working state of being blocked, and a second working state of being communicated with the outside; a driving module (5) capable of pushing the movable seat (3) to move along the axial direction of the bellows (4) toward the fixed seat (2); and A nozzle (6) is mounted on the first mounting seat (1), and a nozzle (61) of the nozzle (6) is in communication with the first channel (11).

2. The solder paste dispensing valve according to claim 1, characterized in that: The driving module (5) is a piezoelectric stack.

3. The solder paste dispensing valve according to claim 2, characterized in that: The solder paste dispensing valve further comprises a second mounting seat (7), a cavity (71) is arranged on the second mounting seat (7), a first through hole (72) is arranged on the cavity wall of the cavity (71), the piezoelectric stack is mounted in the cavity (71), and the head of the piezoelectric stack passes through the first through hole (72) and can push against the movable seat (3), the solder paste dispensing valve further comprises a first air nozzle (73) and a second air nozzle (74), the first air nozzle (73) and the second air nozzle (74) are both connected to the cavity (71), the first air nozzle (73) is configured to supply air to the cavity (71), and the second air nozzle (74) is configured to exhaust the gas in the cavity (71).

4. The solder paste dispensing valve according to claim 3, characterized in that: The second mounting seat (7) is provided with a first accommodating groove (75), the first through hole (72) connects the first accommodating groove (75) and the cavity (71), the end of the movable seat (3) away from the fixed seat (2) is located in the first accommodating groove (75), the head of the piezoelectric stack passes through the first through hole (72) and extends into the first accommodating groove (75), and the solder paste dispensing valve also includes a sealing ring (8), the sealing ring (8) is sleeved on the outer periphery of the piezoelectric stack, and is pressed and limited between the bottom of the first accommodating groove (75) and the movable seat (3) and between the side wall of the first accommodating groove (75) and the piezoelectric stack.

5. The solder paste dispensing valve according to claim 1, characterized in that: The first mounting seat (1) is provided with a second accommodating groove (12), the bottom of the second accommodating groove (12) is provided with a second through hole (121), the fixing seat (2) is placed in the second accommodating groove (12) and is placed on the bottom of the second accommodating groove (12), and the second through hole (121) is connected with the second channel (21) and the first channel (11).

6. The solder paste dispensing valve according to claim 1, characterized in that: A first plug (32) is detachably mounted on one end of the third channel (31) away from the second channel (21).

7. The solder paste dispensing valve according to claim 1, characterized in that: The end of the first channel (11) away from the liquid source has a third working state in which it is blocked, and a fourth working state in which it is connected to the outside.

8. The solder paste dispensing valve according to claim 7, characterized in that: A second plug (13) is detachably mounted on one end of the first channel (11) away from the liquid source.

9. The solder paste dispensing valve according to claim 1, characterized in that: The nozzle (61), the second channel (21), the bellows (4) and the third channel (31) are coaxially arranged.

10. The solder paste dispensing valve according to claim 1, characterized in that: A joint (14) is mounted on the first mounting seat (1), and the first channel (11) is connected to the liquid source via the joint (14).

Images