Slit die head
By designing that the slit width of the slit die head gradually increases from the first end to the second end, the problem of uneven coating of the existing die head when applying a circular or annular substrate is solved, and a more uniform coating effect is achieved.
Patent Information
- Application Number
- CN202421783094.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-26
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-07-26
AI Technical Summary
When coating the substrate, the existing slit die heads cannot adapt to the circular or annular substrate due to the uniform width of the slits, resulting in uneven coating.
A slit die head is designed with the first end width of the slit less than the second end width and a gradient slit shape is formed through an adjustable gasket and chute structure to accommodate substrates of different shapes.
By adjusting the width of the slit, the outflow amount of the coating liquid at the first end of the slit is reduced, and the outflow amount at the second end is increased, ensuring that the coating liquid is distributed evenly on the surface of the substrate and improving the coating quality.
Smart Images
Figure CN222901589U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of die heads, in particular to a slit die head. Background Art
[0002] Coating is a common process used to apply a coating liquid on the surface of a substrate. The main purpose of coating includes protecting the substrate, beautifying the surface, improving surface properties or achieving specific functions. Common coating methods include spin coating, slit coating, roller coating, blade coating, spray coating, dip coating, etc. Among them, slit coating has the advantages of good coating uniformity, precise control, paint saving, wide applicability and efficient production. It is suitable for various coating application scenarios and is widely used in industrial production.
[0003] In the prior art, since the width of the slit of the slit die is uniform, slit coating can only be performed along a straight line. When the substrate is circular or annular, the die and the substrate need to rotate relative to each other in the circumferential direction, which will cause the thickness of the coating liquid at the center of the substrate to be greater than the thickness of the coating liquid at the edge of the substrate, resulting in uneven coating on the substrate surface.
[0004] Therefore, the existing slot die is in urgent need of improvement. Summary of the invention
[0005] The utility model aims to provide a slit die head, which can improve the uniformity of coating of the die head on the surface of a wafer, thereby improving the quality of the wafer.
[0006] The purpose of the utility model is achieved by the following technical solutions:
[0007] A slot die comprises: a die body, a cavity for containing a coating liquid is arranged in the die body, a slot communicating with the cavity is arranged on the discharge side of the die body, and the slot has a first end and a second end opposite to each other along the length direction of the die body;
[0008] Wherein, the width of the first end of the slit is smaller than the width of the second end of the slit.
[0009] Preferably, the die body comprises a first body and a second body, and the first body and the second body are connected by a fixing member;
[0010] The first body is provided with a first cavity, and / or the second body is provided with a second cavity.
[0011] Preferably, the first body is provided with a first oblique groove communicating with the cavity, and the second body is provided with a second oblique groove communicating with the cavity, and when the first body and the second body are connected, the first oblique groove and the second oblique groove form the slit.
[0012] Preferably, a gasket is further included, and the gasket is arranged between the first body and the second body, so that the slit is formed when the first body and the second body are connected.
[0013] Preferably, the gasket comprises a first arm and a second arm, the first arm being close to a first end of the slit, and the second arm being close to a second end of the slit;
[0014] The thickness of the first arm is smaller than the thickness of the second arm, so that the width of the first end of the slit is smaller than the width of the second end of the slit.
[0015] Preferably, in the length direction of the die body, the thickness of the first arm close to the slit is greater than the thickness of the first arm away from the slit, and the thickness of the second arm away from the slit is greater than the thickness of the second arm close to the slit.
[0016] Preferably, the gasket is U-shaped, and comprises a connecting arm, the first support arm and the second support arm are respectively arranged at two ends of the connecting arm, and the connecting arm is arranged on a side of the die body away from the slit.
[0017] Preferably, the width of the slit gradually increases from the first end of the slit to the second end of the slit.
[0018] Preferably, the cross-sectional shape of the slit along the direction perpendicular to the height of the die head is a fan-shaped structure, a fan-ring structure, a triangular structure or a trapezoidal structure, wherein the central angle of the fan-shaped structure or the fan-ring structure is 0-10°;
[0019] The center of the fan-shaped structure is close to the first end of the slit, and the arc of the fan-shaped structure is close to the second end of the slit;
[0020] The inner arc of the fan ring structure is close to the first end of the slit, and the outer arc of the fan ring structure is close to the second end of the slit.
[0021] Preferably, the ratio of the inner arc diameter of the fan ring structure to the outer arc diameter of the fan ring structure is 1:(1.02-1.3).
[0022] Compared with the prior art, the beneficial effects of the present invention include at least:
[0023] The slit die of the utility model has a first end with a smaller width than a second end with a smaller width, so that the outflow of the coating liquid from the first end with a smaller amount, and the outflow of the coating liquid from the second end with a smaller amount. When the slit die is applied to rotary coating, since the area covered by the first end with a smaller area than the area covered by the second end with a smaller amount when the slit die is working, the thickness of the coating liquid in the area covered by the first end with a smaller amount is equal to the thickness of the coating liquid in the area covered by the second end with a smaller amount, thereby improving the uniformity of the coating of the die on the surface of the wafer, and further improving the quality of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 It is a schematic structural diagram of a coating device according to an embodiment of the utility model.
[0025] Figure 2 It is a structural schematic diagram of the carrying platform in the embodiment of the utility model.
[0026] Figure 3 yes Figure 2 A local enlarged schematic diagram of point A in the middle.
[0027] Figure 4 It is a structural schematic diagram of a slit die head according to an embodiment of the utility model.
[0028] Figure 5 yes Figure 4 A local enlarged schematic diagram of point B in the middle.
[0029] Figure 6 yes Figure 4 A partial enlarged schematic diagram of point C in the middle.
[0030] Figure 7 It is a structural schematic diagram of another slit die head according to an embodiment of the utility model.
[0031] Figure 8 yes Figure 7 A partial enlarged schematic diagram of point D in the middle.
[0032] Fig. 9 yes Figure 7 A partial enlarged schematic diagram of point E in the middle.
[0033] Fig.10 It is a schematic diagram of an exploded view of a slit die head of an embodiment of the utility model from one perspective.
[0034] Fig.11 It is a schematic diagram of an exploded view of the slit die of an embodiment of the utility model from another perspective.
[0035] Fig.12 It is a structural schematic diagram of a slit of a slit die head in an embodiment of the utility model.
[0036] Fig.13It is a schematic structural diagram of another slit of the slit die in the embodiment of the utility model.
[0037] In the figure: 100, coating device; 1, slit die; 11, die body; 111, first body; 1111, first fixing hole; 1112, first inclined groove; 112, second body; 1121, second fixing hole; 1122, second inclined groove; 12, cavity; 121, first cavity; 122, second cavity; 13, slit; 131, first end; 132, second end; 133, fan-shaped structure; 134, fan ring structure; 1341, inner arc; 1342, outer arc; 14, fixing member; 15, gasket; 151, through hole; 152, first arm; 1521, third end; 1522, fourth end; 153, second arm; 1531, fifth end; 1532, sixth end; 154, connecting arm; 2, supporting platform; 21, vent hole; 22, groove; 200, wafer. DETAILED DESCRIPTION
[0038] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete and to fully convey the concepts of example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted.
[0039] The words expressing positions and directions described in the present utility model are all explained by taking the drawings as examples, but they can be changed as needed, and all the changes are included in the protection scope of the present utility model.
[0040] refer to Figures 1 to 13 The utility model provides a coating device 100, comprising: a slit die 1 and a carrier platform 2, wherein the slit die 1 is arranged above the carrier platform 2, and the slit die 1 is used to coat a wafer 200 placed on the carrier platform 2, that is, to coat a coating liquid on the surface of the wafer 200, and the coating liquid is, for example, a perovskite solution.
[0041] Specifically, refer to Figure 1 The carrier 2 is used to carry the wafer 200. The carrier 2 may be in a circular, square or other shape. As a preferred embodiment, the carrier 2 is in a circular shape, and the wafer 200 is preferably in a circular or ring shape. The present invention is described by taking the wafer 200 as an example, and the wafer 200 may also be replaced by other types of thin sheet substrates.
[0042] As a preferred method, refer to Figure 2 , Figure 3, a vent hole 21 is provided on the side of the carrier 2 facing the wafer 200, and the number of the vent holes 21 is preferably multiple. A joint (not shown) connected to the vent hole 21 is provided on the side of the carrier 2 facing away from the wafer 200, and the vent hole 21 is connected to a vacuum pump (not shown) through the joint, so that the wafer 200 is adsorbed on the carrier 2. When the vacuum pump is working, a vacuum is formed in the vent hole 21, and the wafer 200 is adsorbed on the carrier 2, which prevents the position of the wafer 200 from shifting, ensures that the slit die 1 accurately coats the coating liquid on the wafer 200, and prevents the wafer 200 from vibrating or shaking, which causes uneven distribution of the coating liquid. On the other hand, it can also prevent the wafer 200 from warping, making the surface of the wafer 200 smoother, thereby improving the uniformity of the coating liquid coated on the wafer 200 by the slit die 1.
[0043] refer to Figure 2 , Figure 3 , multiple vent holes 21 can be arranged in a circular shape, that is, multiple vent holes 21 are distributed in a circular shape around the center of the carrier 2, and the vent holes 21 distributed in a circular shape have multiple layers of intervals, so that the wafer 200 can be subjected to uniform suction, ensuring that the wafer 200 is adsorbed on the carrier 2. A groove 22 is also provided on the side of the carrier 2 facing the wafer 200. The shape of the groove 22 corresponds to the distribution of the vent holes 21. The groove 22 can connect the multiple vent holes 21, further allowing the wafer 200 to be subjected to a more uniform suction. In this embodiment, the groove 22 can be circular as a whole.
[0044] refer to Figure 1 , Fig.10 , Fig.11 The slit die 1 may include a die body 11, which is arranged above the supporting platform 2. A cavity 12 for accommodating the coating liquid is arranged in the die body 11, and a slit 13 connected to the cavity 12 is arranged on the discharge side of the die body 11, that is, the slit 13 is arranged on the side of the die body 11 facing the wafer 200, and the coating liquid in the cavity 12 flows out through the slit 13, and the slit 13 extends along the length direction of the die body 11, and the slit 13 has a first end 131 and a second end 132 opposite to each other along the length direction of the die body 11.
[0045] refer to Figure 1, the carrier 2 and the slot die 1 can rotate relative to each other in the circumferential direction, that is, the carrier 2 and the die body 11 can rotate relative to each other in the circumferential direction, so that the coating liquid in the cavity 12 is coated on the wafer 200 through the slit 13, and the first end 131 of the slit 13 of the slot die 1 is arranged close to the center of the wafer 200, and the second end 132 of the slit 13 is arranged close to the edge of the wafer 200, that is, the first end 131 of the slit 13 of the die body 11 is arranged close to the center of the wafer 200, and the second end 132 of the slit 13 is arranged close to the edge of the wafer 200. In other words, when the carrier 2 is stationary, the slot die 1 can rotate relative to the carrier 2, so that the slot die 1 can coat the wafer 200. When the slot die 1 is stationary, the carrier 2 can rotate relative to the slot die 1, so that the slot die 1 can coat the wafer 200. Of course, the support platform 2 and the slit die 1 can rotate circumferentially at the same time, for example, the support platform 2 rotates counterclockwise and the slit die 1 rotates clockwise, or the support platform 2 rotates clockwise and the slit die 1 rotates counterclockwise, or the support platform 2 and the slit die 1 rotate in the same direction but with a speed difference, thereby enabling the slit die 1 to coat the chip 200.
[0046] Among them, the width of the first end 131 of the slit 13 is smaller than the width of the second end 132 of the slit 13, so that the outflow of the coating liquid from the first end 131 of the slit 13 can be reduced, and the outflow of the coating liquid from the second end 132 of the slit 13 can be increased, that is, from the first end 131 of the slit 13 to the second end 132 of the slit 13, the outflow of the coating liquid tends to increase. Because when the slit die 1 is working, the area covered by the first end 131 of the slit 13 is smaller than the area covered by the second end 132 of the slit 13, that is, from the first end 131 of the slit 13 to the second end 132 of the slit 13, the area covered by the slit 13 also tends to increase, so that the thickness of the coating liquid in the area covered by the first end 131 of the slit 13 is equal to or approximately equal to the thickness of the coating liquid in the area covered by the second end 132 of the slit 13, thereby improving the uniformity of the die coating on the surface of the wafer 200, thereby improving the quality of the wafer 200.
[0047] Since the coating is applied from the center of the chip 200 to the edge of the chip 200, the area of the chip 200 that needs to be coated gradually increases, and the width of the slit 13 gradually increases from the first end 131 of the slit 13 to the second end 132 of the slit 13, that is, the coating liquid flowing out of the slit 13 gradually increases from the first end 131 of the slit 13 to the second end 132 of the slit 13. When the outflow amount of the coating liquid has an increasing trend that is the same or approximately the same as the increasing trend of the area covered by the slit 13, the uniformity of the thickness of the coating liquid on the chip 200 can be further improved.
[0048] In one embodiment, reference Figures 4 to 11The die body 11 may include a first body 111 and a second body 112. The first body 111 is provided with one or more first fixing holes 1111, and the second body 112 is provided with one or more second fixing holes 1121. The first body 111 and the second body 112 are connected by a fixing member 14. The fixing member 14 is, for example, a bolt, and the bolt fixes the first body 111 and the second body 112 through the first fixing hole 1111 and the second fixing hole 1121. The number of the first fixing holes 1111 and the number of the second fixing holes 1121 are preferably the same.
[0049] refer to Fig.10 , Fig.11 , the first body 111 may also be provided with a first cavity 121. When the first body 111 and the second body 112 are fixedly connected, the first cavity 121 forms a sealed cavity 12. The first cavity 121 is used to contain the coating liquid. The second body 112 may also be provided with a second cavity 122. When the first body 111 and the second body 112 are fixedly connected, the second cavity 122 forms a sealed cavity 12. The second cavity 122 is used to contain the coating liquid. Of course, while the first body 111 is provided with the first cavity 121, the second body 112 is provided with the second cavity 122. When the first body 111 and the second body 112 are fixedly connected, the first cavity 121 and the second cavity 122 are combined to form a sealed cavity 12. The cavity 12 is used to contain the coating liquid.
[0050] refer to Figure 5 , Figure 6 , the first body 111 may be provided with a first slanted groove 1112 communicating with the cavity 12, and the first slanted groove 1112 may be formed by grinding, cutting, etc. When the first body 111 and the second body 112 are fixedly connected, a slit 13 is formed between the first slanted groove 1112 and the second body 112. The second body 112 may be provided with a second slanted groove 1122 communicating with the cavity 12, and the second slanted groove 1122 may be formed by grinding, cutting, etc. When the first body 111 and the second body 112 are fixedly connected, a slit 13 is formed between the second slanted groove 1122 and the first body 111. Of course, while the first body 111 is provided with the first slanted groove 1112, the second body 112 is provided with the second slanted groove 1122, and when the first body 111 and the second body 112 are fixedly connected, the first slanted groove 1112 and the second slanted groove 1122 form a slit 13.
[0051] In another embodiment, reference Fig.10 , Fig.11The slit die 1 may also include a gasket 15, which is disposed between the first body 111 and the second body 112 so that a slit 13 is formed when the first body 111 and the second body 112 are connected. The thickness of the gasket 15 is equal to or approximately equal to the width of the slit 13, and the material of the gasket 15 is an incompressible solid material. The material of the gasket 15 may be hard plastic, stainless steel, etc., that is, in the thickness direction of the gasket 15, when the gasket 15 is squeezed, the thickness of the gasket 15 will basically not change, and the material of the gasket 15 is, for example, stainless steel. When the first body 111 and the second body 112 are fixedly connected, the gasket 15 creates a gap between the first body 111 and the second body 112, and the cavity 12 is connected to the outside through the gap, that is, the coating liquid in the cavity 12 flows out through the gap, and the gap is the slit 13 in this application. One or more through holes 151 are provided on the gasket 15 , and the fixing member 14 can pass through the through holes 151 . The number of the through holes 151 is preferably the same as the number of the first fixing holes 1111 and the number of the second fixing holes 1121 .
[0052] Specifically, the number of the gaskets 15 can be one or more. When the number of the gaskets 15 is more than one, the number of the gaskets 15 is at least two, and the two gaskets 15 are respectively arranged on both sides of the slit 13 in the length direction of the die body 11 .
[0053] refer to Fig.10 , Fig.11 When the number of the gasket 15 is one, the gasket 15 may include a first arm 152 and a second arm 153, wherein the first arm 152 is close to the first end 131 of the slit 13, and the second arm 153 is close to the second end 132 of the slit 13, that is, in the length direction of the die body 11, the first arm 152 and the second arm 153 are respectively arranged on both sides of the slit 13. The thickness of the first arm 152 is smaller than the thickness of the second arm 153, so that the width of the first end 131 of the slit 13 is smaller than the width of the second end 132 of the slit 13.
[0054] In the length direction of the die body 11, the thickness of the first arm 152 close to the slit 13 is greater than the thickness of the first arm 152 away from the slit 13, and the thickness of the second arm 153 away from the slit 13 is greater than the thickness of the second arm 153 close to the slit 13. Specifically, in the length direction of the die body 11, the first arm 152 has a third end 1521 and a fourth end 1522 opposite to each other, the third end 1521 of the first arm 152 is away from the first end 131 of the slit 13, and the fourth end 1522 of the first arm 152 is close to the first end 131 of the slit 13, that is, the thickness of the fourth end 1522 of the first arm 152 is greater than the thickness of the third end 1521 of the first arm 152. In the length direction of the die body 11, the second arm 153 has a fifth end 1531 and a sixth end 1532 opposite to each other, the fifth end 1531 of the second arm 153 is close to the second end 132 of the slit 13, and the sixth end 1532 of the second arm 153 is far away from the second end 132 of the slit 13, that is, the thickness of the sixth end 1532 of the second arm 153 is greater than the thickness of the fifth end 1531 of the second arm 153. The thickness variation trend of the first arm 152 and the second arm 153 is preferably the same or substantially the same as the width variation trend of the slit 13, that is, in the length direction of the die body 11, the thickness of the first arm 152 gradually increases from the third end 1521 of the first arm 152 to the fourth end 1522 of the first arm 152, and the thickness of the second arm 153 gradually increases from the fifth end 1531 of the second arm 153 to the sixth end 1532 of the second arm 153. In this way, the connection between the first body 111 and the second body 112 and the gasket 15 can be made tighter, and at the same time, it can prevent the first body 111 and the second body 112 from being subjected to uneven force when being fastened by the fastener due to the different thickness of the gasket 15, thereby causing the first body 111 and the second body 112 to warp, deform, and other problems, resulting in the width of the slit 13 being affected, thereby ensuring that the width of the slit 13 reaches a preset value.
[0055] refer to Fig.10 , Fig.11The gasket 15 is preferably in a U-shape as a whole. The gasket 15 may include a connecting arm 154. The first arm 152 and the second arm 153 are respectively arranged at both ends of the connecting arm 154. The connecting arm 154 is arranged on the side of the die body 11 away from the slit 13. In this embodiment, the connecting arm 154 is arranged above the cavity 12, that is, the connecting arm 154 is arranged on the side of the cavity 12 away from the slit 13. In the length direction of the die body 11, the thickness of the connecting arm 154 close to the second arm 153 is greater than the thickness of the connecting arm 154 close to the first arm 152. The thickness variation trend of the connecting arm 154 is preferably the same or substantially the same as the width variation trend of the slit 13, that is, in the length direction of the die body 11, the thickness of the connecting arm 154 gradually increases from one end close to the first arm 152 to one end close to the second arm 153. This can further make the connection between the first body 111 and the second body 112 and the gasket 15 tighter, and at the same time prevent the first body 111 and the second body 112 from being subjected to uneven force when being fastened by the fastener due to the different thickness of the gasket 15, thereby causing the first body 111 and the second body 112 to warp, deform, and other problems, resulting in the width of the slit 13 being affected, thereby ensuring that the width of the slit 13 reaches a preset value.
[0056] In a specific embodiment, the cross-sectional shape of the slit 13 along the direction perpendicular to the height of the die body 11 may be a fan-shaped structure 133, a fan-ring structure 134, a triangular structure or a trapezoidal structure, etc., that is, the cross-sectional shape of the slit 13 along the direction perpendicular to the height of the slit die 1 may be a fan-shaped structure 133, a fan-ring structure 134, a triangular structure or a trapezoidal structure, etc. When the cross-sectional shape of the slit 13 along the direction perpendicular to the height of the die body 11 is a fan-shaped structure 133 or a fan-ring structure 134, the central angle of the fan-shaped structure 133 or the fan-ring structure 134 is 0-10°. When the cross-sectional shape of the slit 13 along the direction perpendicular to the height of the die body 11 is a triangular structure or a trapezoidal structure, the extension lines of the long sides of the two sides of the slit 13 in the length direction of the die body 11 intersect and form an angle, and the range of the angle is 0-10°.
[0057] refer to Fig.12, when the coating liquid can realize laminar flow in the slit 13, that is, the velocity distribution of the coating liquid in the slit 13 is uniform, the boundary of the slit 13, that is, the influence of the roughness of the inner wall surface of the slit 13 is ignored, at this time, the inner wall of the slit 13 is smooth, and the flow rate at different positions is basically the same. The thickness of the coating liquid on the wafer 200 is related to the speed of the coating liquid flowing out of the slit 13, the width of the slit 13, that is, the center angle of the slit 13, and the angular velocity of the circumferential relative rotation between the carrier 2 and the slit die 1. It is only necessary to keep the speed of the coating liquid flowing out of the slit 13, the width of the slit 13, that is, the center angle of the slit 13, and the angular velocity of the circumferential relative rotation between the carrier 1 and the slit die 1 unchanged to ensure the uniformity of the thickness of the coating liquid on the wafer 200. In other words, the coating liquid flowing out of the slit 13 increases uniformly from the first end 131 of the slit 13 to the second end 132 of the slit 13. At this time, the cross-sectional shape of the slit 13 along the direction perpendicular to the height of the slit die 1 is preferably a fan-shaped structure 133. When the cross-sectional shape of the slit 13 along the direction perpendicular to the height of the slit die 1 is a fan-shaped structure 133, the center of the fan-shaped structure 133 is close to the first end 131 of the slit 13, and the arc of the fan-shaped structure 133 is close to the second end 132 of the slit 13.
[0058] refer to Fig.13 Even when the coating liquid can achieve laminar flow in the slit 13, that is, the velocity distribution of the coating liquid in the slit 13 is uniform, due to the influence of the inner wall surface roughness of the slit 13, the inner wall surface roughness of the slit 13 produces resistance to the flow of the coating liquid, resulting in a decrease in the flow rate of the coating liquid near the inner wall surface of the slit 13, thereby making the flow rate of the slit 13 near the center of the chip 200 smaller, and the flow rate away from the center of the chip 200 larger, resulting in a smaller coating liquid thickness near the center of the chip 200, that is, the inner wall surface roughness of the slit 13 has a greater influence on the flow rate of the slit 13 near the center of the chip 200. At this time, the cross-sectional shape of the slit 13 along the direction perpendicular to the height of the slit die 1 is preferably a fan-ring structure 134. When the cross-sectional shape of the slit 13 along the direction perpendicular to the height of the slit die 1 is a fan-ring structure 134, the inner arc 1341 of the fan-ring structure 134 is close to the first end 131 of the slit 13, and the outer arc 1342 of the fan-ring structure 134 is close to the second end 132 of the slit 13. As a result, the flow velocity near the center of the wafer 200 increases more, while the flow velocity away from the center of the wafer 200 increases less, thereby reducing the influence of the wall resistance of the slit 13. When the flow velocity near the center of the wafer 200 increases to the point where the influence of the wall resistance of the slit 13 can be completely eliminated, the uniformity of the thickness of the coating liquid on the wafer 200 can be ensured.
[0059] The ratio of the diameter of the inner arc 1341 of the fan ring structure 134 to the diameter of the outer arc 1342 of the fan ring structure 134 is 1:(1.02-1.3). By controlling the ratio of the diameter of the inner arc 1341 of the fan ring structure 134 to the diameter of the outer arc 1342 of the fan ring structure 134, the flow velocity near the center of the wafer 200 can be increased more, while the flow velocity far from the center of the wafer 200 can be increased less, thereby reducing the influence of the wall resistance of the slit 13 and improving the uniformity of the thickness of the coating liquid on the wafer 200.
[0060] Although the embodiments of the utility model have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the utility model. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the utility model without departing from the principles and purpose of the utility model. All of these changes should fall within the scope of protection of the claims of the utility model.
Claims
1. A slot die head, characterized in that: include: A die body, wherein a cavity for containing a coating liquid is disposed in the die body, a slit communicating with the cavity is disposed on a discharge side of the die body, and the slit has a first end and a second end opposite to each other along a length direction of the die body; Wherein, the width of the first end of the slit is smaller than the width of the second end of the slit.
2. The slot die according to claim 1, characterized in that: The die body comprises a first body and a second body, wherein the first body and the second body are connected by a fixing member; The first body is provided with a first cavity, and / or the second body is provided with a second cavity.
3. The slot die according to claim 2, characterized in that: The first body is provided with a first oblique groove communicating with the cavity, and the second body is provided with a second oblique groove communicating with the cavity. When the first body and the second body are connected, the first oblique groove and the second oblique groove form the slit.
4. The slot die according to claim 2, characterized in that: A gasket is also included, and the gasket is arranged between the first body and the second body, so that the slit is formed when the first body and the second body are connected.
5. The slot die according to claim 4, characterized in that: The gasket includes a first arm and a second arm, the first arm is close to the first end of the slit, and the second arm is close to the second end of the slit; The thickness of the first arm is smaller than the thickness of the second arm, so that the width of the first end of the slit is smaller than the width of the second end of the slit.
6. The slot die according to claim 5, characterized in that: In the length direction of the die body, the thickness of the first arm close to the slit is greater than the thickness of the first arm away from the slit, and the thickness of the second arm away from the slit is greater than the thickness of the second arm close to the slit.
7. The slot die according to claim 5, characterized in that: The gasket is U-shaped and comprises a connecting arm. The first support arm and the second support arm are respectively arranged at two ends of the connecting arm. The connecting arm is arranged on a side of the die body away from the slit.
8. The slot die according to claim 1, characterized in that: The width of the slit gradually increases from the first end of the slit to the second end of the slit.
9. The slot die according to claim 1, characterized in that: The cross-sectional shape of the slit along the direction perpendicular to the height of the die head is a fan-shaped structure, a fan-ring structure, a triangular structure or a trapezoidal structure, wherein the central angle of the fan-shaped structure or the fan-ring structure is 0-10°; The center of the fan-shaped structure is close to the first end of the slit, and the arc of the fan-shaped structure is close to the second end of the slit; The inner arc of the fan ring structure is close to the first end of the slit, and the outer arc of the fan ring structure is close to the second end of the slit.
10. The slot die according to claim 9, characterized in that: The ratio of the inner arc diameter of the fan ring structure to the outer arc diameter of the fan ring structure is 1:(1.02-1.3).