Electrode removing device and probe structure thereof

Abstract

The utility model provides an electrode removing device and a probe structure thereof, and the probe structure comprises an installation seat; the first end of the probe rod is connected with the mounting seat, and the second end of the probe rod is an electrode contact end; the suction and removal part comprises a suction and removal pipe, the first end of the suction and removal pipe is arranged on the mounting seat or the probe rod and is in insulation fit with the mounting seat or the probe rod, and the second end of the suction and removal pipe is higher than or flush with the second end of the probe rod; wherein a connector used for being connected with a negative pressure suction and removal structure is arranged on the suction and removal pipe, so that liquid located at the second end of the suction and removal pipe flows into the suction and removal pipe. According to the technical scheme, the problem that the electrolyte may remain on the semiconductor device when the electrode is removed in the prior art is effectively solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor device electrode removal, in particular to an electrode removal device and a probe structure thereof. Background Art

[0002] Power semiconductor devices play an indispensable role in power transmission equipment. The design of power semiconductor devices is related to the overall efficiency, stability and safety of the power system. There are many types of power semiconductor devices, one of which is the gate-commutated thyristor. When processing gate-commutated thyristor chips, due to the large chip area, local uniformity anomalies are inevitable during doping, photolithography and other processes. Local contamination is inevitable during the chip processing process, resulting in short circuits in the cathode of some cell gates of the chip, thereby causing the entire chip to fail. Removing the electrode metal of the short-circuited cell can make the problem cell fail, thereby achieving the purpose of repairing the electrode.

[0003] In the prior art, when removing the problematic cell metal electrode, an electrolyte can be dripped at the problematic cell metal electrode and powered on to remove the problematic cell metal electrode. However, after the problematic cell metal electrode is removed, the electrolyte may not be completely used, that is, some of the electrolyte may remain on the semiconductor device. Utility Model Content

[0004] The main purpose of the utility model is to provide an electrode removal device and a probe structure thereof, so as to solve the problem in the related art that when removing the electrode, the electrolyte may remain on the semiconductor device.

[0005] In order to achieve the above-mentioned purpose, according to one aspect of the utility model, a probe structure of an electrode removal device is provided, including: a mounting seat; a probe rod, the first end of the probe rod is connected to the mounting seat, and the second end of the probe rod is the electrode contact end; a suction piece, the suction piece includes a suction tube, the first end of the suction tube is arranged on the mounting seat or the probe rod and is insulated from the mounting seat or the probe rod, and the second end of the suction tube is higher than or flush with the second end of the probe rod; wherein the suction tube is provided with an interface for connecting to a negative pressure suction structure, so that the liquid located at the second end of the suction tube flows into the suction tube.

[0006] Furthermore, the suction tube and the probe rod are nested; wherein the probe rod is inserted into the suction tube, or a avoidance hole extending along the axial direction of the probe rod is provided on the probe rod, and the suction tube is inserted into the avoidance hole.

[0007] Furthermore, the first end of the suction tube is arranged on the mounting seat and is insulated from the mounting seat. When the probe rod is inserted into the suction tube, the interface is arranged on the side wall of the suction tube, and the negative pressure suction structure is connected to the interface.

[0008] Furthermore, the first end of the suction tube is movably arranged on the mounting seat along the axial direction of the probe rod, and the suction member has a suction position and an avoidance position. When the suction member is in the suction position, there is a first distance between the second end of the suction tube and the second end of the probe rod. When the suction member is in the avoidance position, there is a second distance between the second end of the suction tube and the second end of the probe rod, wherein the first distance is smaller than the second distance.

[0009] Furthermore, the probe structure of the electrode removal device also includes a driving member arranged on the mounting seat, and the driving member cooperates with the suction tube to drive the suction tube to move.

[0010] Furthermore, the probe structure of the electrode removal device also includes a flow guide, which is wrapped around the outer circumference of the probe rod.

[0011] Furthermore, the first end of the flow guide is connected to the mounting seat, and the second end of the flow guide is arranged adjacent to the second end of the probe rod.

[0012] Furthermore, in a direction from the second end of the flow guide member to the first end of the flow guide member, an outer diameter of the second end of the flow guide member gradually increases.

[0013] According to another aspect of the present invention, an electrode removal device is provided. The electrode removal device includes a substrate and a probe structure of the electrode removal device disposed on the substrate. The probe structure of the electrode removal device is the probe structure of the electrode removal device described above.

[0014] Furthermore, the electrode removal device also includes a wafer stage, which includes a wafer stage body and a support platform. The wafer stage is adjustably disposed on the base, and the support platform is rotatably disposed on the wafer stage body. The semiconductor device is placed on the support platform, and the second end of the probe rod of the probe structure of the electrode removal device is located above the semiconductor device.

[0015] Furthermore, the electrode removal device also includes a flexible conductive member arranged on the wafer stage body, and the flexible conductive member is in contact with the gate electrode of the semiconductor device.

[0016] By applying the technical solution of the utility model, the probe structure of the electrode removal device includes a mounting seat, a probe rod and a suction piece. The first end of the probe rod is connected to the mounting seat, and the second end of the probe rod is an electrode contact end. The suction piece includes a straw, and the first end of the straw is arranged on the mounting seat and insulated with the mounting seat. The second end of the straw is higher than or flush with the second end of the probe rod. An interface is provided on the suction tube, and the interface is used to connect with the negative pressure suction structure so that the liquid at the second end of the suction tube flows into the suction tube. Through the above arrangement, the mounting seat can support the probe rod. The second end of the probe rod can contact the electrode to facilitate the flow of current. The first end of the suction tube is insulated with the mounting seat to ensure that the current flows only through the probe rod. The negative pressure suction structure can be connected to the interface, so that a negative pressure environment is generated in the suction tube, generating suction, and then the liquid can flow into the suction tube via the second end of the suction tube, realizing the suction of the liquid and avoiding liquid residue. Therefore, the technical solution of the present application effectively solves the problem that the electrolyte may remain on the semiconductor device when removing the electrode in the related art. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0018] Figure 1 A three-dimensional structural schematic diagram of an embodiment of a probe structure of an electrode removal device according to the utility model is shown;

[0019] Figure 2 Shows Figure 1 A cross-sectional schematic diagram of a probe structure;

[0020] Figure 3 Shows Figure 2 A local enlarged schematic diagram of the probe structure at A;

[0021] Figure 4 Shows Figure 1 A schematic diagram of a three-dimensional structure in which a suction member of a probe structure is in a suction position;

[0022] Figure 5 Shows Figure 4 A cross-sectional schematic diagram of a probe structure;

[0023] Figure 6 Shows Figure 5 A local enlarged schematic diagram of the probe structure at B;

[0024] Figure 7 Shows Figure 1 A partial cross-sectional schematic diagram of a probe rod and a suction member of another embodiment of a probe structure;

[0025] Figure 8 A three-dimensional structural schematic diagram of an embodiment of an electrode removal device according to the utility model is shown.

[0026] The above drawings include the following reference numerals:

[0027] 10. Mounting seat; 20. Probe rod; 21. Avoidance hole; 30. Suction member; 31. Suction tube; 311. Interface; 40. Guide member; 100. Base body; 110. Wafer table; 111. Wafer table body; 112. Support table; 120. Flexible conductive member. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means a limitation on the utility model and its application or use. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0029] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0030] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the utility model. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0031] like Figure 1As shown, the probe structure of the electrode removal device of this embodiment includes: a mounting seat 10, a probe rod 20 and a suction piece 30. The first end of the probe rod 20 is connected to the mounting seat 10, and the second end of the probe rod 20 is the electrode contact end. The suction piece 30 includes a suction tube 31, the first end of the suction tube 31 is arranged on the mounting seat 10 and is insulated from the mounting seat 10, and the second end of the suction tube 31 is higher than or flush with the second end of the probe rod 20. Among them, the suction tube 31 is provided with an interface 311 for connecting with a negative pressure suction structure, so that the liquid at the second end of the suction tube 31 flows into the suction tube 31.

[0032] Applying the technical solution of this embodiment, the probe structure of the electrode removal device includes a mounting seat 10, a probe rod 20 and a suction piece 30. The first end of the probe rod 20 is connected to the mounting seat 10, and the second end of the probe rod 20 is an electrode contact end. The suction piece 30 includes a suction tube 31, and the first end of the suction tube 31 is arranged on the mounting seat 10 and is insulated from the mounting seat 10. The second end of the suction tube 31 is higher than or flush with the second end of the probe rod 20. An interface 311 is provided on the suction tube 31, and the interface 311 is used to connect with the negative pressure suction structure so that the liquid at the second end of the suction tube 31 flows into the suction tube 31. Through the above-mentioned arrangement, the mounting seat 10 can support the probe rod 20. The second end of the probe rod 20 can contact the electrode to facilitate the flow of current. The first end of the suction tube 31 is insulated from the mounting seat 10, which can ensure that the current only flows through the probe rod 20. The negative pressure suction structure can be connected to the interface 311, so that a negative pressure environment is generated in the suction tube 31, generating suction, and then the liquid can flow into the suction tube 31 through the second end of the suction tube 31, thereby achieving the suction of the liquid and avoiding liquid residue. Therefore, the technical solution of this embodiment effectively solves the problem in the related art that when removing the electrode, the electrolyte may remain on the semiconductor device.

[0033] It should be noted that the liquid refers to an electrolyte.

[0034] The mounting base 10 is provided with a mounting through hole for accommodating the probe rod 20. The mounting base 10 is also provided with a first mounting hole for accommodating the first end of the suction tube 31.

[0035] In other embodiments, the first end of the suction tube 31 is connected to the probe rod 20 and is insulated from the probe rod 20. The suction tube 31 can be tied to the probe rod 20 by a plurality of cable ties.

[0036] like Figure 2As shown, in the present embodiment, the suction tube 31 is nested with the probe rod 20. The probe rod 20 is inserted into the suction tube 31. Such an arrangement allows the suction tube 31 and the probe rod 20 to occupy less space, thereby preventing the probe rod 20 from interfering with other structures of the electrode removal device or with the semiconductor device when moving. The suction tube 31 will not interfere with the probe rod 20, and can also ensure that the suction tube is accurately aligned with the area where the electrolyte needs to be removed, thereby improving the efficiency and accuracy of removing the electrolyte.

[0037] like Figure 7 As shown, in another embodiment, the probe rod 20 is provided with an avoidance hole 21 extending along the axial direction of the probe rod 20 , and the suction tube 31 is passed through the avoidance hole 21 .

[0038] like Figures 2 to 5 As shown, in this embodiment, when the probe rod 20 is inserted into the suction tube 31, the interface 311 is arranged on the side wall of the suction tube 31, and the negative pressure suction structure is connected with the interface 311. The above arrangement can ensure the normal flow of the liquid, and can also prevent the liquid from remaining at the junction of the suction tube 31 and the mounting seat 10, and can also prevent the liquid from remaining at the junction of the probe rod 20 and the mounting seat 10, that is, it prevents the liquid from remaining on the probe structure.

[0039] The suction member 30 further includes an arc-shaped connecting pipe, which is connected to the suction pipe 31 and communicates with the interface. The arc-shaped connecting pipe is connected to the negative pressure suction structure.

[0040] The interfaces 311 include a plurality of arc-shaped connecting pipes, and the plurality of arc-shaped connecting pipes are arranged one by one corresponding to the plurality of interfaces 311. The plurality of arc-shaped connecting pipes are arranged at equal intervals along the axial direction of the suction pipe 31.

[0041] In the axial direction of the probe rod 20 , the distance between the arc-shaped connecting tube and the second end of the probe rod 20 increases first and then decreases, so as to prevent the liquid from flowing back into the suction tube 31 through the arc-shaped connecting tube.

[0042] like Figures 2 to 6As shown, in the present embodiment, the first end of the suction tube 31 is movably disposed on the mounting seat 10 along the axial direction of the probe rod 20, and the suction member 30 has a suction position and an avoidance position. When the suction member 30 is in the suction position, the second end of the suction tube 31 is at a first distance from the second end of the probe rod 20, and when the suction member 30 is in the avoidance position, the second end of the suction tube 31 is at a second distance from the second end of the probe rod 20, wherein the first distance is smaller than the second distance. The suction tube 31 is movably disposed, so that the second end of the suction tube 31 can be moved toward or away from the second end of the probe rod 20, and then when liquid needs to be sucked, the suction tube 31 is switched from the avoidance position to the suction position, and the second end of the suction tube 31 moves toward the second end of the probe rod 20, so as to facilitate the suction of liquid. When there is no need to absorb the liquid, that is, when the probe rod 20 moves, or when the probe rod 20 contacts the electrode, the second end of the suction tube 31 moves in a direction away from the second end of the probe rod 20, so that the suction tube 31 does not interfere with the probe rod 20, thereby facilitating the movement of the probe rod 20. At this time, the suction tube 31 switches from the suction position to the avoidance position.

[0043] like Figure 6 As shown, in this embodiment, the probe structure of the electrode removal device further includes a driving member disposed on the mounting seat 10, and the driving member cooperates with the suction tube 31 to move the suction tube 31. The driving member can drive the suction tube 31 to move, so that the suction tube 31 can move between the avoidance position and the suction position.

[0044] It should be noted that the driving member may be a driving motor. The driving member may also be a threaded knob and a nut, the nut is arranged on the suction tube 31, and the threaded knob is turned to drive the suction tube 31 to move. The driving member may also be a gear and a rack, and the suction tube 31 is driven to move by the gear and the rack. The driving member may also be a cylinder.

[0045] like Figure 2 and Figure 3 As shown, in this embodiment, the probe structure of the electrode removal device also includes a guide member 40, which is wrapped around the periphery of the probe rod 20. The guide member 40 can guide the flow of the liquid to facilitate the liquid to flow to the interface 311. The guide member 40 is wrapped around the periphery of the probe rod 20, which can prevent liquid from remaining on the probe rod 20 and ensure the cleanliness of the electrode surface.

[0046] The guide member 40 includes a heat shrink tube. In other embodiments, the guide member 40 may also include a rubber skin, which is wrapped around the outer circumference of the probe rod, and the seams on both sides of the rubber skin extend along the axial direction of the probe rod 20.

[0047] like Figure 2 and Figure 3As shown, in this embodiment, the first end of the guide member 40 is connected to the mounting seat 10, and the second end of the guide member 40 is arranged adjacent to the second end of the probe rod 20. The first end of the guide member 40 is connected to the mounting seat 10, so that the liquid will not remain at the junction of the probe rod 20 and the mounting seat 10, that is, the liquid residue is avoided. The second end of the guide member 40 is arranged adjacent to the second end of the probe rod 20, which can reduce the contact area between the probe rod 20 and the external environment, thereby reducing the probability of liquid remaining on the probe rod 20.

[0048] The mounting seat 10 is also provided with a second mounting hole communicated with the mounting through hole for receiving the first end of the flow guide member 40 .

[0049] The second end of the guide member 40 is disposed adjacent to the second end of the probe rod 20 , which means that in the axial direction of the probe rod 20 , the distance between the second end of the guide member 40 and the second end of the probe rod 20 is greater than 0 and less than or equal to 3 mm.

[0050] like Figure 2 and Figure 3 As shown, in this embodiment, the outer diameter of the second end of the flow guide 40 gradually increases in the direction from the second end of the flow guide 40 to the first end of the flow guide 40. Through the above arrangement, the second end of the flow guide 40 can play a role in guiding the liquid, so that the liquid can flow into the suction tube 31 more easily. It also makes the diameter of the second end of the flow guide 40 adjacent to the second end of the probe rod 20 smaller, reducing the probability of liquid remaining between the second end of the flow guide 40 and the junction of the probe rod 20.

[0051] It should be noted that the diameter of the second end of the guide member 40 at the smallest diameter is almost the same as the diameter of the probe rod, that is, the difference between the smallest diameter of the second end of the guide member 40 and the diameter of the probe rod is close to zero.

[0052] In other embodiments, a liquid injection port is further provided on the side wall of the suction tube 31, and liquid can flow into the suction tube through the liquid injection port, and then the liquid flows to the semiconductor device through the suction tube 31. When the electrolyte is injected, the second end of the suction tube 31 moves in a direction away from the mounting seat until the second end of the probe rod 20 is located in the suction tube 31, so that the second end of the suction tube 31 is closer to the semiconductor device, which is convenient for dripping the liquid. After the electrolyte injection is completed, the second end of the suction tube 31 moves in a direction close to the mounting seat 10 until the second end of the probe rod 20 protrudes from the suction tube 31.

[0053] like Figure 8As shown, the electrode removal device of this embodiment includes a substrate 100 and a probe structure of the electrode removal device disposed on the substrate 100, and the probe structure of the electrode removal device is the probe structure of the above-mentioned electrode removal device. The above-mentioned probe structure has a suction member 30, and the interface 311 of the suction member 30 is connected to the negative pressure suction structure, so that the suction tube 31 can suck the liquid, thereby preventing the liquid from remaining on the semiconductor device. The electrode removal device having the above-mentioned probe structure also has the above-mentioned advantages.

[0054] It should be noted that the probe rod 20 of the probe structure is in contact with the cathode electrode of the semiconductor device.

[0055] like Figure 8 As shown, in this embodiment, the electrode removal device further includes a wafer stage 110, which includes a wafer stage body 111 and a support platform 112. The wafer stage 110 is adjustable on the substrate 100, and the support platform 112 is rotatably disposed on the wafer stage body 111. The semiconductor device is placed on the support platform 112, and the second end of the probe rod 20 of the probe structure of the electrode removal device is located above the semiconductor device. The support platform 112 can drive the semiconductor device to rotate, and the movement of the wafer stage body 111 can drive the support platform 112 to move, so that the wafer stage 110 can drive the semiconductor device to move to various positions, so that the semiconductor device can contact the probe structure.

[0056] like Figure 8 As shown, in this embodiment, the electrode removal device further includes a flexible conductive member 120 disposed on the wafer stage body 111, and the flexible conductive member 120 contacts the gate electrode of the semiconductor device. The flexible conductive member 120 can realize the flow of current. And the flexible conductive member 120 can avoid damage to the motor on the semiconductor device.

[0057] The flexible conductive member 120 is a flexible conductive column, the material of the flexible conductive column is rubber or rubber, and there is conductive metal inside the flexible conductive column to achieve conductivity.

[0058] It should be noted that the structure of the electrode removal device in this embodiment is the same as that of the Chinese invention patent with application number 202310762808.2 except for the probe structure and the flexible conductive member. The first probe in the Chinese invention patent with application number 202310762808.2 is replaced by the probe structure in this embodiment, the probe rod 20 of the probe structure realizes the corresponding function of the first probe, and the conductive brush is replaced by the flexible conductive member 120 in this embodiment.

[0059] When a liquid injection port is also provided on the side wall of the suction tube 31, the syringe in the Chinese invention patent with application number 202310762808.2 is connected to the liquid injection port through a connecting pipe. A switch valve is provided on the connecting pipe. When the electrolyte is dripped, the switch valve is opened, and when the electrolyte is dripped, the switch valve is closed, so that when the suction tube 31 is in the suction position, the electrolyte in the syringe is not sucked into the suction tube 31 under the action of negative pressure suction.

[0060] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present utility model; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0061] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used herein are interpreted accordingly.

[0062] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0063] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A probe structure of an electrode removal device, characterized in that: include: Mounting seat (10); A probe rod (20), wherein a first end of the probe rod (20) is connected to the mounting seat (10), and a second end of the probe rod (20) is an electrode contact end; A suction member (30), the suction member (30) comprising a suction tube (31), a first end of the suction tube (31) being arranged on the mounting seat (10) or the probe rod (20) and insulated from the mounting seat (10) or the probe rod (20), and a second end of the suction tube (31) being higher than or flush with the second end of the probe rod (20); The suction pipe (31) is provided with an interface (311) for connecting to a negative pressure suction structure, so that the liquid at the second end of the suction pipe (31) flows into the suction pipe (31).

2. The probe structure of the electrode removal device according to claim 1, characterized in that: The suction tube (31) is nested with the probe rod (20); wherein the probe rod (20) is inserted into the suction tube (31), or a avoidance hole (21) extending along the axial direction of the probe rod (20) is provided on the probe rod (20), and the suction tube (31) is inserted into the avoidance hole (21).

3. The probe structure of the electrode removal device according to claim 2, characterized in that: The first end of the suction tube (31) is arranged on the mounting seat (10) and is insulated from the mounting seat (10). When the probe rod (20) is inserted into the suction tube (31), the interface (311) is arranged on the side wall of the suction tube (31), and the negative pressure suction structure is connected to the interface (311).

4. The probe structure of the electrode removal device according to claim 3, characterized in that: The first end of the suction tube (31) is movably arranged on the mounting seat (10) along the axial direction of the probe rod (20), and the suction member (30) has a suction position and an avoidance position. When the suction member (30) is in the suction position, a first distance exists between the second end of the suction tube (31) and the second end of the probe rod (20), and when the suction member (30) is in the avoidance position, a second distance exists between the second end of the suction tube (31) and the second end of the probe rod (20), wherein the first distance is smaller than the second distance.

5. The probe structure of the electrode removal device according to claim 4, characterized in that: The probe structure of the electrode removal device further comprises a driving member arranged on the mounting seat (10), wherein the driving member cooperates with the suction tube (31) to move the suction tube (31).

6. The probe structure of the electrode removal device according to any one of claims 3 to 5, characterized in that: The probe structure of the electrode removal device further comprises a flow guide (40), wherein the flow guide (40) is wrapped around the outer circumference of the probe rod (20).

7. The probe structure of the electrode removal device according to claim 6, characterized in that: The first end of the flow guide (40) is connected to the mounting seat (10), and the second end of the flow guide (40) is arranged adjacent to the second end of the probe rod (20).

8. The probe structure of the electrode removal device according to claim 7, characterized in that: In a direction from the second end of the flow guide member (40) to the first end of the flow guide member (40), the outer diameter of the second end of the flow guide member (40) gradually increases.

9. An electrode removal device, comprising a substrate (100) and a probe structure of the electrode removal device arranged on the substrate (100), characterized in that: The probe structure of the electrode removal device is the probe structure of the electrode removal device according to any one of claims 1 to 8.

10. The electrode removal device according to claim 9, characterized in that: The electrode removal device further comprises a wafer stage (110), wherein the wafer stage (110) comprises a wafer stage body (111) and a support platform (112), wherein the wafer stage (110) is adjustably disposed on the substrate (100), and the support platform (112) is rotatably disposed on the wafer stage body (111), and a semiconductor device is placed on the support platform (112), and a second end of a probe rod (20) of a probe structure of the electrode removal device is located above the semiconductor device.

11. The electrode removal device according to claim 10, characterized in that: The electrode removal device further comprises a flexible conductive member (120) arranged on the wafer stage body (111), wherein the flexible conductive member (120) is in contact with the gate electrode of the semiconductor device.

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