Laser processing equipment

Abstract

The utility model relates to laser processing equipment which comprises a laser processing head and a machine frame, the laser processing head is detachably connected to the machine frame, and the machine frame is used for driving the laser processing head to move. The laser machining head comprises a laser emitter and a reflector set, and the reflector set and the laser emitter are correspondingly arranged so that laser beams emitted by the laser emitter can be reflected to the surface of a workpiece to be machined. When the laser processing head is used, laser beams emitted by the laser emitter can be vertically reflected to the surface of a workpiece through the reflecting mirror set according to needs, so that the vertical cutting function of the laser processing equipment is achieved, the oblique cutting phenomenon of a notch of the workpiece is avoided, and the attractiveness of the workpiece is improved. In addition, the laser processing head is detachably connected with the rack, so that the user can detach and carry the laser processing head according to actual needs, and the laser processing head is convenient for the user to use. And meanwhile, the laser processing head is detachable, so that the laser processing head can be adaptively connected to different racks, and the use requirements of users in different scenes are met.

Description

Technical Field

[0001] The utility model relates to the technical field of laser processing, and particularly relates to a laser processing device. Background Art

[0002] Laser processing is a technology that uses high-energy laser beams to perform cutting, welding, engraving, heat treatment, etc. on materials or the surfaces of materials. Compared with traditional mechanical processing, during laser processing, the processing head does not directly contact the workpiece, so it is not easy to damage the workpiece. At the same time, the laser has high energy and a small light spot, and the processing efficiency is high.

[0003] At present, there is a galvanometer engraving machine on the market that uses a laser beam for engraving. Its working principle is to make the laser beam incident on two galvanometers, and use a computer to control the reflection angles of each galvanometer, so that the laser beam is focused on the marking material and can move along the required path, thereby leaving a permanent mark on the material surface.

[0004] When the existing galvanometer engraving machine is processing, as long as the speed is set small enough and the power is large enough, the material can be cut through to achieve the cutting function. However, since the machine adjusts the galvanometer angle in real time to reflect the light, there will be a bevel cutting phenomenon during cutting, that is, the cut surface of the material is inclined and the cut is not beautiful. Summary of the Utility Model

[0005] An object of the utility model is to solve the deficiencies in the prior art, and to provide a laser processing device. To solve the above technical problems, the utility model adopts the following technical solutions:

[0006] A laser processing device includes a laser processing head and a frame. The laser processing head is detachably connected to the frame, and the frame is used to drive the laser processing head to move;

[0007] The laser processing head includes a laser emitter and a mirror group. The mirror group is arranged corresponding to the laser emitter to reflect the laser beam emitted by the laser emitter to the surface of the workpiece to be processed.

[0008] In one embodiment, the frame is a first mounting frame, and a first mounting portion is provided on the first mounting frame;

[0009] Or the frame is a second mounting frame, and a second mounting portion is provided on the second mounting frame;

[0010] The laser processing head is provided with a fixing portion for adaptively mounting with the first mounting portion or the second mounting portion;

[0011] The fixed part is provided with a trigger structure. When the laser processing head is installed on the first mounting rack through the fixed part, the trigger structure is in the first state; when the laser processing head is installed on the second mounting rack through the fixed part, the trigger structure is in the second state; the first state is different from the second state.

[0012] In one embodiment, when the laser processing head is installed on the first mounting rack, the mirror group vertically emits the laser beam emitted by the laser emitter onto the surface of the workpiece to be processed.

[0013] In one embodiment, the first mounting rack includes an X-axis track and a Y-axis track, and the X-axis track and the Y-axis track are perpendicular to each other;

[0014] The X-axis track is slidably connected to the Y-axis track, and the laser processing head is detachably and slidably arranged on the X-axis track.

[0015] In one embodiment, the first mounting rack further includes a Z-axis track, and the Z-axis track is perpendicular to the X-axis track and the Y-axis track;

[0016] The laser processing head is detachably and slidably arranged on the Z-axis track, and the Z-axis track is slidably arranged on the X-axis track.

[0017] In one embodiment, when the laser processing head is installed on the second mounting rack, the mirror group can reflect the laser beam emitted by the laser emitter to the surface of the workpiece to be processed at a predetermined angle.

[0018] In one embodiment, the second mounting rack includes a support frame and a workbench. One end of the support frame is connected to the workbench, and the laser processing head is detachably connected to the other end of the support frame. The laser processing head is disposed opposite to the workbench.

[0019] In one embodiment, the laser processing head is slidably arranged on the support frame so that the distance between the laser processing head and the workbench is adjustable.

[0020] In one embodiment, the mirror group includes a first mirror and a second mirror. The first mirror rotates about a first axis, and the second mirror rotates about a second axis. The first axis and the second axis are perpendicular to each other;

[0021] The first mirror is correspondingly arranged with the laser emitter and is used to reflect the laser beam emitted by the laser emitter to the second mirror at a predetermined angle. The second mirror is used to reflect the laser beam received from the first mirror to the workpiece at a predetermined angle.

[0022] In one embodiment, the mirror group further includes a first driving member and a second driving member. The first driving member is connected to the first mirror and is used to drive the first mirror to rotate about a first axis; the second driving member is connected to the second mirror and is used to drive the second mirror to rotate about a second axis.

[0023] From the above technical solutions, it can be seen that the present utility model has at least the following advantages and positive effects:

[0024] In the present utility model, the laser processing head includes a laser emitter and a mirror group. The mirror group can reflect the laser beam emitted by the laser emitter to the surface of the workpiece at a predetermined angle. In some scenarios, when cutting materials is required, the mirror group can be used to reflect the laser beam emitted by the laser emitter vertically to the surface of the workpiece, thereby realizing the vertical cutting function during the processing of the laser processing equipment, avoiding the phenomenon of oblique cutting of the incision on the workpiece, and improving the aesthetics of the workpiece.

[0025] In addition, by setting the laser processing head to be detachably connected to the frame, the user can detach and carry the laser processing head according to actual needs, which is convenient for the user to use. At the same time, the detachable laser processing head can also be adapted to be connected to different frames to meet the user's usage requirements in different scenarios. Description of the Drawings

[0026] Figure 1 is a schematic structural diagram of a laser processing equipment according to an embodiment of the present utility model.

[0027] Figure 2 is a schematic structural diagram of a laser processing equipment according to another embodiment of the present utility model.

[0028] Figure 3 is a schematic internal structure diagram of a laser processing head according to an embodiment of the present utility model.

[0029] Figure 4 is Figure 3 a schematic exploded view of the structure of the mirror group of the shown laser processing head.

[0030] Figure 5 is Figure 1 a schematic structural diagram of the connection between the shown laser processing head and the frame.

[0031] Figure 6 is Figure 2 a schematic structural diagram of the connection between the shown laser processing head and the frame.

[0032] The descriptions of the reference numerals are as follows:

[0033] 100 - Laser processing head;

[0034] 110 - Laser emitter; 120 - Mirror group;

[0035] 121 - First reflecting mirror; 122 - Second reflecting mirror; 123 - First driving member; 124 - Second driving member; 125 - Focusing lens; 126 - Dust cover; 127 - Light passing hole;

[0036] 130 - Fixed part; 140 - Screw;

[0037] 200 - Frame;

[0038] 210 - First mounting frame; 211 - X-axis track; 212 - Y-axis track; 213 - Z-axis track; 214 - First mounting portion;

[0039] 220 - Second mounting frame; 221 - Support frame; 222 - Workbench; 223 - Second mounting portion; 224 - Through slot. Detailed implementation manner

[0040] Typical implementation manners reflecting the features and advantages of the present utility model will be described in detail in the following description. It should be understood that the present utility model can have various changes in different implementation manners, all of which do not depart from the scope of the present utility model, and the descriptions and illustrations therein are essentially for illustrative purposes and not for limiting the present utility model.

[0041] In the description of the present application, it should be understood that in the embodiments shown in the drawings, the indication of the direction or position relationship (such as up, down, left, right, front and back, etc.) is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. When these elements are in the positions shown in the drawings, these descriptions are appropriate. If the description of the positions of these elements changes, then the indication of these directions also changes accordingly.

[0042] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, "a plurality" means two or more, unless otherwise specifically defined.

[0043] Please refer to Figures 1 to 4 As shown, the laser processing equipment of the embodiment of the present utility model includes a laser processing head 100 and a frame 200. The laser processing head 100 is detachably connected to the frame 200, and the frame 200 is used to drive the laser processing head 100 to move.

[0044] The laser processing head 100 includes a laser emitter 110 and a mirror group 120. The mirror group 120 is correspondingly arranged with the laser emitter 110 to emit the laser beam emitted by the laser emitter 110 onto the surface of the workpiece to be processed.

[0045] In this embodiment, the laser processing head 100 includes a laser emitter 110 and a mirror group 120. The mirror group 120 can reflect the laser beam emitted by the laser emitter 110 onto the surface of the workpiece at a predetermined angle. In some scenarios, when cutting materials is required, the mirror group 120 can be made to reflect the laser beam emitted by the laser emitter 110 vertically onto the surface of the workpiece, thereby realizing the vertical cutting function during the processing of the laser processing equipment, avoiding the bevel cutting phenomenon of the incision of the workpiece, and improving the aesthetics of the workpiece.

[0046] In addition, by setting the laser processing head 100 to be detachably connected to the frame 200, the user can detach and carry the laser processing head 100 according to actual needs, which is convenient for the user to use. At the same time, the detachable laser processing head 100 can also be adapted to be connected to different frames 200 to meet the user's usage requirements in different scenarios.

[0047] In the embodiment of the present application, the laser processing head 100 includes a laser emitter 110 and a mirror group 120. Among them, the laser emitter 110 can be a semiconductor laser. The semiconductor laser has the advantages of small volume and small occupied space, which is beneficial to the overall miniaturized design of the laser processing head 100.

[0048] See Figure 4 As shown, in an embodiment of the present application, the mirror group 120 includes a first mirror 121 and a second mirror 122. The first mirror 121 rotates around a first axis, and the second mirror 122 rotates around a second axis. The first axis and the second axis are perpendicular to each other.

[0049] The first mirror 121 is correspondingly arranged with the laser emitter 110 and is used to reflect the laser beam emitted by the laser emitter 110 onto the second mirror 122 at a predetermined angle. The second mirror 122 is used to reflect the laser beam received from the first mirror 121 onto the workpiece at a predetermined angle.

[0050] By designing the first reflector 121 and the second reflector 122 to have an adjustable angle structure, the laser beam can be reflected onto the workpiece surface at a predetermined angle as needed. Specifically, by adjusting the angles of the first reflector 121 and the second reflector 122, the direction of the laser beam can be adjusted in the vertical and horizontal directions, so that the laser beam acts on the workpiece surface at different angles. For example, the laser beam can be vertically emitted onto the surface of the workpiece to be processed to achieve the function of vertical cutting and avoid the phenomenon of bevel cutting at the incision. Another example is that the laser beam can be emitted onto the surface of the workpiece to be processed at a predetermined angle, so that the laser beam acts on different positions of the workpiece to achieve the engraving function of the device.

[0051] See Figure 4 , in one embodiment, in order to facilitate the adjustment of the angles of the first reflector 121 and the second reflector 122, the reflector group 120 further includes a first driving member 123 and a second driving member 124. The first driving member 123 is connected to the first reflector 121 and is used to drive the first reflector 121 to rotate about the first axis. Among them, the first driving member 123 can be a servo motor.

[0052] The second driving member 124 is connected to the second reflector 122 and is used to drive the second reflector 122 to rotate about the second axis. Among them, the second driving member 124 can be a servo motor.

[0053] In this embodiment, by driving the first reflector 121 and the second reflector 122 respectively by the first driving member 123 and the second driving member 124, it is convenient to adjust the angles of the first reflector 121 and the second reflector 122, so that the angle of the laser beam emitted onto the workpiece surface can be accurately adjusted, and the cutting or engraving function of the device can be realized.

[0054] As Figure 4 shown, in one embodiment, the laser processing head 100 further includes a focusing lens 125. The focusing lens 125 is correspondingly arranged with the second reflector 122. The focusing lens 125 is used to receive the laser beam reflected by the second reflector 122 and focus and emit it onto the workpiece. By providing the focusing lens 125, the laser beam can be focused, thereby improving the processing effect of the laser processing equipment.

[0055] To ensure the processing effect of the workpiece, it is necessary to ensure the intensity of the laser acting on the workpiece and prevent dust from covering the reflector group 120 during use. Therefore, the laser processing head 100 further includes a dust-proof cover 126. The focusing lens 125 is connected to the dust-proof cover 126 and encloses a dust-proof chamber, and the first reflector 121 and the second reflector 122 are arranged in the dust-proof chamber.

[0056] It can be understood that to ensure that the first driving member 123 and the second driving member 124 can smoothly drive the first reflecting mirror 121 and the second reflecting mirror 122, a first through hole and a second through hole are further provided on the dust cover 126. The first driving member 123 passes through the first through hole and is connected to the first reflecting mirror 121, and the second driving member 124 passes through the second through hole and is connected to the second reflecting mirror 122.

[0057] See Figure 3 , in one embodiment, a light passing hole 127 may be provided on the dust cover 126. The light passing hole 127 is arranged corresponding to the laser emitter 110. The light passing hole 127 is used for the laser emitter 110 to emit a laser beam to the first reflecting mirror 121. By providing the light passing hole 127 on the dust cover 126, it can be ensured that the laser beam emitted by the laser emitter 110 can smoothly exit onto the first reflecting mirror 121.

[0058] In an embodiment of the present application, the laser processing head 100 is detachably connected to the frame 200. As Figure 1 and Figure 5 shown, the frame 200 is a first mounting frame 210, and a first mounting portion 214 is provided on the first mounting frame 210.

[0059] Alternatively, as Figure 2 and Figure 6 shown, the frame 200 is a second mounting frame 220, and a second mounting portion 223 is provided on the second mounting frame 220.

[0060] A fixing portion 130 for adaptively mounting with the first mounting portion 214 or the second mounting portion 223 is provided on the laser processing head 100. Exemplarily, the fixing portion 130 may be a fixing plate provided on the housing of the laser processing head 100. Fixing through holes may be provided on the fixing plate.

[0061] As Figure 5 shown, the first mounting portion 214 may be a mounting plate provided on the first mounting frame 210. Mounting holes may be provided on the mounting plate corresponding to the fixing through holes. By using fasteners such as screws 140 to pass through the fixing through holes and tighten and fix them in the mounting holes, the laser processing head 100 can be detachably fixed to the first mounting frame 210.

[0062] As Figure 6 shown, the second mounting portion 223 may be a connecting plate provided on the second mounting frame 220. Connecting holes may be provided on the connecting plate corresponding to the fixing through holes. By using fasteners such as screws 140 to pass through the fixing through holes and tighten and fix them in the connecting holes, the laser processing head 100 can be detachably fixed to the second mounting frame 220.

[0063] In this embodiment, by providing a fixing part 130 on the laser processing head 100 and respectively providing a first mounting part 214 and a second mounting part 223 adapted to be fixedly mounted with the fixing part 130 on the first mounting frame 210 and the second mounting frame 220, the laser processing head 100 can be more conveniently mounted on the first mounting frame 210 or the second mounting frame 220. Thus, it is convenient to install and disassemble the laser processing head 100, enabling the laser processing head 100 to be used in combination with different frames 200.

[0064] It can be understood that the fixing part 130, the first mounting part 214, and the second mounting part 223 can also be other structures adapted for detachable connection. The detachable connection method between the fixing part 130 and the first mounting part 214 can also be snap connection, magnetic attraction connection, etc. The detachable connection method between the fixing part 130 and the second mounting part 223 can also be snap connection, magnetic attraction connection, etc.

[0065] In an embodiment of the present application, a trigger structure can be provided on the fixing part 130. When the laser processing head 100 is mounted on the first mounting frame 210 through the fixing part 130, the trigger structure is in the first state. When the laser processing head 100 is mounted on the second mounting frame 220 through the fixing part 130, the trigger structure is in the second state. Among them, the first state is different from the second state.

[0066] Specifically, the trigger structure can be a touch switch. When the laser processing head 100 is mounted on the first mounting frame 210 through the fixing part 130, the touch switch can be triggered. When the laser processing head 100 is mounted on the second mounting frame 220 through the fixing part 130, the touch switch is not triggered. Thus, it can be determined whether the laser processing head 100 is mounted on the first mounting frame 210 or the second mounting frame 220 by whether the touch switch is triggered.

[0067] See Figure 5 As shown, the touch switch can be fixed to the upper end of the fixing part 130. The mounting plate can be a relatively long plate. When the laser processing head 100 is mounted on the first mounting frame 210, the touch switch contacts the upper part of the mounting plate and is triggered. As Figure 6 shown, the fixing plate can be a relatively short plate. When the laser processing head 100 is mounted on the second mounting frame 220, the touch switch cannot contact the fixing plate, so the touch switch is not triggered.

[0068] Alternatively, the triggering structure can be a sensor, such as a pressure sensor, etc. When the laser processing head 100 is mounted to the first mounting frame 210 through the fixing portion 130, the sensor can output a first signal. When the laser processing head 100 is mounted to the second mounting frame 220 through the fixing portion 130, the sensor can output a second signal. The first signal is different from the second signal. Thus, it can be determined whether the laser processing head 100 is mounted on the first mounting frame 210 or the second mounting frame 220 based on the signal output by the sensor.

[0069] In this embodiment, by setting the triggering structure, the installation state of the laser processing head 100 can be accurately obtained, so that the action of the mirror group 120 inside it can be correspondingly controlled according to the different installation states of the laser processing head 100, enabling the laser beam to be vertically emitted or emitted at other preset angles. Therefore, when the laser processing head 100 is mounted on different frames, the laser processing equipment can automatically enter the cutting processing mode with vertical light emission or the engraving processing mode with light emission at a predetermined angle.

[0070] See Figure 1 As shown, in one embodiment, when the laser processing head 100 is mounted on the first mounting frame 210, the mirror group 120 vertically emits the laser beam emitted by the laser emitter 110 to the surface of the workpiece to be processed. At this time, the laser processing head 100 is suitable for vertical cutting processing of materials, avoiding the phenomenon of inclined cutting of the cross-section.

[0071] As Figure 1 As shown, the first mounting frame 210 can be a large-sized frame with a large volume. The first mounting frame 210 can move the laser processing head 100 along a predetermined track to achieve the functions of large-format marking and vertical cutting. Since the first mounting frame 210 can drive the laser processing head 100 to move along a predetermined track to process different positions of the workpiece. Therefore, when vertical cutting processing is required, the mirror group 120 in the laser processing head 100 can be kept in a position where the laser beam is vertically emitted to ensure that the laser processing head 100 always emits light vertically during the processing. Since it is not necessary to adjust the angles of the first mirror 121 and the second mirror 122 in real time during the processing, it can be ensured that the laser beam emitted by the laser processing head 100 acts vertically on the surface of the workpiece, effectively avoiding the inclined cutting phenomenon of the cutting surface of the workpiece.

[0072] See Figure 1 , in one embodiment, the first mounting frame 210 includes an X-axis track 211 and a Y-axis track 212, and the X-axis track 211 and the Y-axis track 212 are perpendicular to each other. The X-axis track 211 is slidably connected to the Y-axis track 212, and the laser processing head 100 is detachably and slidably arranged on the X-axis track 211. Among them, there can be two Y-axis tracks 212. Both ends of the X-axis track 211 are slidably arranged on the two Y-axis tracks 212.

[0073] In this embodiment, the laser processing head 100 is slidably mounted on the X-axis rail 211, and the X-axis rail 211 is slidably disposed on the Y-axis rail 212, so that the laser processing head 100 can reach each position within the processing range covered by the first mounting rack 210 in the X-axis direction and the Y-axis direction, realizing vertical cutting processing of different positions of the workpiece located within this processing range.

[0074] In the embodiment of the present application, the Y-axis rail 212 can adopt a linear displacement stage arranged along the Y-axis direction, and the end of the X-axis rail 211 is fixedly mounted on the slide table of this linear displacement stage.

[0075] The X-axis rail 211 can adopt a linear displacement stage arranged along the X-axis direction, and the first mounting portion 214 is fixedly mounted on the slide table of this linear displacement stage. As Figure 5 shown, when the laser processing head 100 is connected to the first mounting portion 214 through the fixing portion 130, the purpose of moving the laser processing head 100 in the X-axis direction and the Y-axis direction can be achieved.

[0076] Refer to Figure 5 , in one embodiment, the first mounting rack 210 further includes a Z-axis rail 213, and the Z-axis rail 213 is perpendicular to the X-axis rail 211 and the Y-axis rail 212. The laser processing head 100 is detachably and slidably disposed on the Z-axis rail 213, and the Z-axis rail 213 is slidably disposed on the X-axis rail 211.

[0077] In this embodiment, by providing the Z-axis rail 213, the laser processing head 100 can move up and down along the Z-axis direction, thereby facilitating the up and down movement of the laser processing head 100 according to actual needs to adapt to workpieces of different thicknesses to be processed for focusing.

[0078] In this embodiment, the Z-axis rail 213 can adopt a linear displacement stage arranged along the Z-axis direction, and the first mounting portion 214 is fixedly mounted on the slide table of this linear displacement stage. The Z-axis rail 213 is fixed to the slide table of the X-axis rail 211. When the laser processing head 100 is connected to the first mounting portion 214 through the fixing portion 130, the purpose of moving the laser processing head 100 in the Z-axis direction can be achieved.

[0079] Refer to Figure 2 , in one embodiment, when the laser processing head 100 is mounted on the second mounting rack 220, the mirror group 120 can reflect the laser beam emitted by the laser emitter 110 to the surface of the workpiece to be processed at a predetermined angle. Specifically, the second mounting rack 220 can be a portable frame with a small volume. The second mounting rack 220 can facilitate the portability and use of the laser processing head 100, making the laser processing head 100 suitable for laser processing and engraving in various outdoor scenarios.

[0080] See Figure 2 Figure 2 , in one embodiment, the second mounting frame 220 includes a support frame 221 and a workbench 222. One end of the support frame 221 is connected to the workbench 222, and the laser processing head 100 is detachably connected to the other end of the support frame 221. The laser processing head 100 is disposed opposite to the workbench 222.

[0081] In this embodiment, the workbench 222 is used to carry the workpiece to be processed. Wherein, the support frame 221 may be integrally formed with the workbench 222, or the support frame 221 may also be fixedly connected to the workbench 222 by screws.

[0082] The laser processing head 100 is detachably connected to the support frame 221, and the laser processing head 100 is disposed opposite to the workbench 222. Specifically, as Figure 6 shown, the second mounting portion 223 may be disposed at the end of the support frame 221 away from the workbench 222. The laser processing head 100 is detachably connected to the support frame 221 through the detachable connection between the fixing portion 130 and the second mounting portion 223.

[0083] See Figure 6 Figure 6 , in one embodiment, the laser processing head 100 is slidably disposed on the support frame 221 so that the distance between the laser processing head 100 and the workbench 222 is adjustable. In this embodiment, by setting the laser processing head 100 to be slidable relative to the support frame 221, it is convenient to move the laser processing head 100 up and down according to actual needs to adjust the focus for workpieces of different thicknesses to be processed.

[0084] Exemplarily, the second mounting portion 223 is slidably disposed on the support frame 221. When the fixing portion 130 is fixedly installed on the second mounting portion 223, the laser processing head 100 can move up and down relative to the support frame 221.

[0085] As Figure 6 shown, a long strip-shaped through groove 224 may be formed on the support frame 221. A slider slidably connected to the long strip-shaped through groove 224 may be provided on the second mounting portion 223. Further, a driving portion for driving the slider to slide may also be provided on the support frame 221. Wherein, the driving portion may be a linear electric cylinder, a cylinder or an electric telescopic rod, etc.

[0086] When the laser processing equipment according to the embodiment of the present utility model is in use, when the laser processing equipment recognizes that the laser processing head 100 is installed on the first installation rack 210 through the triggering structure, it can automatically enter the cutting processing mode. In the cutting processing mode, the reflecting mirror group 120 is always in the position where the laser beam is vertically emitted to the surface of the workpiece, and there is no need to additionally adjust the angles of each lens. And during the processing, the position of the laser processing head 100 can be adjusted through the X-axis track 211, the Y-axis track 212 and the Z-axis track 213 to realize the cutting processing of different positions of the workpiece.

[0087] When the laser processing equipment recognizes that the laser processing head 100 is installed on the second installation rack 220 through the triggering structure, it can automatically enter the engraving processing mode. In the engraving processing mode, the laser processing head 100 is relatively fixed to the support frame 221. At this time, the first driving member 123 and the second driving member 124 can be respectively used to drive the first reflecting mirror 121 and the second reflecting mirror 122 to move, so that the laser beam acts on the workpiece at a predetermined angle to realize the rapid engraving of the workpiece.

[0088] Of course, it can be understood that when the laser processing head 100 is installed on the first installation rack 210, it can also emit the laser beam at a predetermined angle to realize the engraving of the workpiece.

[0089] And when the laser processing head 100 is installed on the second installation rack 220, it can also emit the laser beam at a vertical angle to realize the cutting of the workpiece.

[0090] The above embodiments are only illustrative descriptions of the structures. The structures in each embodiment are not fixedly combined structures. Without structural conflicts, the structures in multiple embodiments can be arbitrarily combined and used.

[0091] Although the present utility model has been described with reference to several typical embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the present utility model can be specifically implemented in multiple forms without departing from the spirit or essence of the utility model, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be widely interpreted within the spirit and scope defined by the appended claims. Therefore, all changes and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A laser processing device, characterized in that: It comprises a laser processing head and a frame, wherein the laser processing head is detachably connected to the frame, and the frame is used to drive the laser processing head to move; The laser processing head comprises a laser emitter and a reflector group, wherein the reflector group is arranged corresponding to the laser emitter to reflect the laser beam emitted by the laser emitter to the surface of the workpiece to be processed.

2. The laser processing equipment according to claim 1, characterized in that: The rack is a first mounting rack, and a first mounting portion is provided on the first mounting rack; Or the rack is a second mounting rack, and the second mounting rack is provided with a second mounting portion; The laser processing head is provided with a fixing portion for fitting and mounting with the first mounting portion or the second mounting portion; A trigger structure is provided on the fixing portion. When the laser processing head is mounted on the first mounting frame through the fixing portion, the trigger structure is in a first state; when the laser processing head is mounted on the second mounting frame through the fixing portion, the trigger structure is in a second state; the first state is different from the second state.

3. The laser processing equipment according to claim 2, characterized in that: When the laser processing head is mounted on the first mounting frame, the reflector group emits the laser beam emitted by the laser transmitter vertically to the surface of the workpiece to be processed.

4. The laser processing equipment according to claim 2, characterized in that: The first mounting frame includes an X-axis track and a Y-axis track, and the X-axis track and the Y-axis track are perpendicular to each other; The X-axis track is slidably connected to the Y-axis track, and the laser processing head is detachably and slidably arranged on the X-axis track.

5. The laser processing equipment according to claim 4, characterized in that: The first mounting frame further comprises a Z-axis track, wherein the Z-axis track is perpendicular to the X-axis track and the Y-axis track; The laser processing head is detachably and slidably arranged on the Z-axis track, and the Z-axis track is slidably arranged on the X-axis track.

6. The laser processing equipment according to claim 2, characterized in that: When the laser processing head is mounted on the second mounting frame, the reflector group can reflect the laser beam emitted by the laser transmitter to the surface of the workpiece to be processed at a predetermined angle.

7. The laser processing equipment according to claim 2, characterized in that: The second mounting frame includes a supporting frame and a workbench, one end of the supporting frame is connected to the workbench, the laser processing head is detachably connected to the other end of the supporting frame, and the laser processing head is arranged opposite to the workbench.

8. The laser processing equipment according to claim 7, characterized in that: The laser processing head is slidably arranged on the support frame, so that the distance between the laser processing head and the workbench is adjustable.

9. The laser processing equipment according to claim 1, characterized in that: The reflector group comprises a first reflector and a second reflector, the first reflector rotates about a first axis, the second reflector rotates about a second axis, and the first axis and the second axis are perpendicular to each other; The first reflector is arranged corresponding to the laser emitter, and is used to reflect the laser beam emitted by the laser emitter to the second reflector at a predetermined angle, and the second reflector is used to reflect the laser beam received from the first reflector to the workpiece at a predetermined angle.

10. The laser processing equipment according to claim 9, characterized in that: The reflector group also includes a first driving member and a second driving member, the first driving member is connected to the first reflector and is used to drive the first reflector to rotate around the first axis; the second driving member is connected to the second reflector and is used to drive the second reflector to rotate around the second axis.

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