Silicon wafer drying device and solar cell processing equipment

Abstract

The utility model relates to the technical field of silicon wafer drying, in particular to a silicon wafer drying device and solar cell processing equipment. The silicon wafer drying device comprises a drying groove body and a first heat preservation assembly. Wherein a plurality of channels for silicon wafers to circulate are arranged in the drying tank body, and the channels penetrate through two opposite surfaces of the drying tank body along the transmission direction of the silicon wafers and form an inlet and an outlet for transmitting the silicon wafers on the drying tank body. The first heat preservation assemblies are arranged at the inlet and the outlet and used for conducting heat preservation on the channel. And a first opening for conveying the silicon wafer is formed in the first heat preservation assembly and is opposite to the channel. The silicon wafer drying device can reduce the oxidation rate of the silicon wafer, improve the drying efficiency, save energy consumption and achieve the purpose of saving cost.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer drying, in particular to a silicon wafer drying device and a solar cell processing device. Background Art

[0002] With the continuous development of new energy technologies, solar cells, as one of the products of new energy technologies, have been increasingly favored by people. Silicon wafers, as the substrates (base materials) of solar cells, play a crucial role in them.

[0003] In the preparation process of solar cells, it is often necessary to perform wet process technologies such as texturing and etching on silicon wafers, and after each wet process technology, it is necessary to dry the silicon wafers to ensure that there is no residual liquid on the surface of the silicon wafers.

[0004] The drying effect of the silicon wafer drying devices in the prior art is not good. The drying tanks are all open-type, which will not only increase the oxidation rate of the silicon wafers, but also cause a large amount of heat loss, reduce the drying efficiency, and increase the energy consumption of the silicon wafer drying devices.

[0005] Therefore, it is urgent to design a silicon wafer drying device and a solar cell processing device to solve the above technical problems. Summary of the Utility Model

[0006] The first object of the utility model is to provide a silicon wafer drying device, which can reduce the oxidation rate of silicon wafers, improve the drying efficiency, save energy consumption and cost.

[0007] To achieve this purpose, the utility model adopts the following technical solutions:

[0008] The utility model provides a silicon wafer drying device, including:

[0009] A drying tank body, in which a plurality of channels for the silicon wafers to flow through are arranged, and along the transmission direction of the silicon wafers, the channels penetrate through the opposite two sides of the drying tank body and form an inlet and an outlet for the silicon wafers to be transmitted on the drying tank body;

[0010] A first heat preservation component, which is arranged at the inlet and the outlet, and is used for heat preservation of the channels; and a first opening for the silicon wafers to be transmitted is arranged on the first heat preservation component, and the first opening is arranged opposite to the channels.

[0011] As an optional technical solution of the silicon wafer drying device, the first heat preservation component includes a plurality of brushes, and adjacent two brushes form a brush unit, and the brush units are arranged at the inlet and the outlet; and a first opening for the silicon wafers to be transmitted is formed between adjacent two brushes;

[0012] Alternatively, the first heat preservation component includes a heat preservation film, the heat preservation film is arranged at the inlet and the outlet, and a plurality of the first openings are arranged on the heat preservation film, and the first openings are arranged in one-to-one correspondence with the channels.

[0013] As an alternative technical solution of a silicon wafer drying device, the silicon wafer drying device further includes a fixing member, and the brush is detachably connected to the drying tank body through the fixing member.

[0014] As an alternative technical solution of a silicon wafer drying device, the silicon wafer drying device further includes a second heat preservation component, and the second heat preservation component is arranged on the top of the channel and covers the channel.

[0015] As an alternative technical solution of a silicon wafer drying device, the second heat preservation component includes a heat preservation film, the heat preservation film is arranged on the top of the channel and partially closes the channel, and a plurality of the second openings are arranged on the heat preservation film, and the second openings are arranged in one-to-one correspondence with the channels.

[0016] As an alternative technical solution of a silicon wafer drying device, a support plate is arranged in the drying tank body, the support plate covers the top of the channel, a third opening is arranged on the support plate, the heat preservation film is arranged on the support plate, and the third opening is arranged opposite to the second opening.

[0017] As an alternative technical solution of a silicon wafer drying device, the silicon wafer drying device further includes:

[0018] A air supply component;

[0019] A heating component, one end of the heating component is communicated with the air supply component, and the other end is communicated with the channel, and the heating component is configured to heat the air generated by the air supply component to form hot air;

[0020] An air supply pipeline, one end of the air supply pipeline is communicated with the channel, and the other end is communicated with the air supply component, and the heating component is arranged on the air supply pipeline.

[0021] As an alternative technical solution of a silicon wafer drying device, the silicon wafer drying device further includes a return air pipeline and a hot air collecting cover, one end of the return air pipeline is communicated with the hot air collecting cover, and the other end is communicated with the air supply component, and the hot air collecting cover is erected on the top of the drying tank body.

[0022] As an alternative technical solution of a silicon wafer drying device, the silicon wafer drying device further includes a filter, and the filter is arranged upstream and / or downstream of the air supply component.

[0023] The second object of the present utility model is to provide a solar cell processing device, which can reduce heat loss, save energy consumption, improve drying efficiency, reduce the oxidation rate of silicon wafers, and achieve the purpose of cost saving.

[0024] To achieve this purpose, the present utility model adopts the following technical solutions:

[0025] The present utility model provides a solar cell processing device, including a fixture and the silicon wafer drying device described above. The fixture is used to hold the silicon wafer, and the fixture is slidably connected to the drying tank body so that the silicon wafer is transported in the channel.

[0026] The beneficial effects of the present utility model at least include:

[0027] The present utility model provides a silicon wafer drying device, which includes a drying tank body and a first heat preservation component. Among them, a plurality of channels for the silicon wafer to flow through are arranged in the drying tank body, and along the transmission direction of the silicon wafer, the channels penetrate through the opposite two sides of the drying tank body and form an inlet and an outlet for the silicon wafer to be transported on the drying tank body. The first heat preservation component is arranged at the inlet and the outlet, and the first heat preservation component is used to heat-preserve the channel; and a first opening for the silicon wafer to be transported is arranged on the first heat preservation component, and the first opening is arranged opposite to the channel.

[0028] In this way, the setting of the first heat preservation component can partially seal the inlet and the outlet of the channel. At the same time, a first opening is left on the first heat preservation component to facilitate the transportation of the silicon wafer. Through the setting of the first heat preservation component and the drying tank body, the channel can be partially sealed and heat-preserved, thereby reducing the heat loss of the hot air in the channel, saving energy consumption, saving costs, and improving the drying efficiency of the hot air on the silicon wafer. At the same time, it can also solve the problem that the residual liquid causes the oxidation of the silicon wafer on the silicon wafer, that is, reduce the oxidation rate of the silicon wafer and improve the product yield.

[0029] The present utility model also provides a solar cell processing device, which can reduce heat loss, save energy consumption, improve drying efficiency, reduce the oxidation rate of silicon wafers, and achieve the purpose of cost saving. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required to be used in the description of the embodiments of the present utility model. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the content of the embodiments of the present utility model and these drawings.

[0031] Figure 1 It is a schematic structural diagram of the silicon wafer drying device provided by the first embodiment of the present utility model;

[0032] Figure 2 It is a top view of the drying tank body and the first heat preservation component assembled in the first embodiment of the present utility model;

[0033] Figure 3 It is a top view of the drying tank body, the first heat preservation component and the second heat preservation component assembled in the first embodiment of the present utility model;

[0034] Figure 4 It is a schematic structural diagram of the connection between the drying tank body provided in the first embodiment of the present utility model and the air supply pipeline;

[0035] Figure 5 It is a schematic structural diagram of the silicon wafer drying device provided in the second embodiment of the present utility model.

[0036] Reference numerals

[0037] 100, drying tank body; 110, channel; 111, side wall; 120, support plate; 130, third opening;

[0038] 200, first heat preservation component; 210, first opening;

[0039] 300, second heat preservation component; 310, second opening;

[0040] 400, air supply component; 410, negative pressure fan;

[0041] 500, heating component;

[0042] 600, air supply pipeline; 610, confluence pipe; 620, first branch pipe; 630, second branch pipe;

[0043] 700, return air pipeline; 800, hot air collection hood; 900, filter. Detailed implementation manners

[0044] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Usually, the components of the embodiments of the present utility model described and illustrated herein can be arranged and designed in various different configurations.

[0045] Accordingly, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present invention without creative efforts fall within the scope of protection of the present invention.

[0046] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not require further definition and explanation in subsequent drawings.

[0047] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present invention is habitually placed during use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0048] In the description of the present invention, it should also be noted that unless otherwise clearly defined and limited, the terms "set" and "connect" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] In the present invention, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include the first and second features not being in direct contact but being in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0050] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation to the present utility model.

[0051] Embodiment 1

[0052] This embodiment provides a silicon wafer drying device, which can reduce the oxidation rate of silicon wafers, improve the drying efficiency, save energy consumption and cost.

[0053] As Figures 1 - 4 shown, the silicon wafer drying device mainly includes a drying tank body 100 and a first heat preservation component 200. Among them, a plurality of channels 110 for the silicon wafers to flow through are arranged in the drying tank body 100, and along the transmission direction of the silicon wafers, the channels 110 penetrate through the opposite two sides of the drying tank body 100 and form an inlet and an outlet for the silicon wafers to be transmitted on the drying tank body 100. The first heat preservation component 200 is arranged at the inlet and the outlet, and the first heat preservation component 200 is used to keep the channels 110 warm; and a first opening 210 for the silicon wafers to be transmitted is arranged on the first heat preservation component 200, and the first opening 210 is arranged opposite to the channels 110.

[0054] Based on the above design, in this embodiment, the setting of the first heat preservation component 200 can partially close the inlet and the outlet of the channels 110. At the same time, a first opening 210 is left on the first heat preservation component 200 to facilitate the transmission of the silicon wafers. Through the setting of the first heat preservation component 200 and the drying tank body 100, the channels 110 can be partially closed and insulated, thereby reducing the heat loss of the hot air in the channels 110, saving energy consumption and cost, and improving the drying efficiency of the hot air on the silicon wafers. At the same time, it can also solve the problem that the residual liquid causes the oxidation of the silicon wafers, that is, reduce the oxidation rate of the silicon wafers and improve the product yield.

[0055] Please refer to Figure 1 and Figure 3, in some alternative embodiments, the wafer drying device further includes a second heat preservation component 300, a air supply component 400, and a heating component 500. Among them, the second heat preservation component 300 is disposed on the top of the channel 110 and covers the channel 110. It should be noted that the second heat preservation component 300 can completely cover the channel 110, and in this case, a transmission chain is added in the channel 110 to drive and transmit the fixture; it can also partially cover the channel 110, that is to say, at this time, the second heat preservation component 300 is disposed on the top of the channel 110 and partially covers the channel 110. A second opening 310 for wafer transmission is provided on the second heat preservation component 300, and the second opening 310 is disposed opposite to the channel 110, so as to facilitate the fixture to pass through the second opening 310 to clamp the wafer. In the following, the case where the second heat preservation component 300 partially covers the channel 110 is taken as an example for description.

[0056] One end of the heating component 500 is communicated with the air supply component 400, and the other end is communicated with the channel 110. The heating component 500 is configured to heat the air generated by the air supply component 400 to form hot air.

[0057] The setting of the first heat preservation component 200 can partially close the inlet and outlet of the channel 110, and the setting of the second heat preservation component 300 can close the top of the channel 110. At the same time, a first opening 210 is left on the first heat preservation component 200, and a second opening 310 is left on the second heat preservation component 300 to facilitate the transmission of the wafer. Through the settings of the first heat preservation component 200 and the second heat preservation component 300, the channel 110 can be partially closed and heat-preserved, thereby reducing the heat loss of the hot air in the channel 110, saving energy consumption, saving costs, and improving the drying efficiency of the hot air on the wafer. At the same time, it can also solve the problem that the residual liquid causes oxidation of the wafer on the wafer, that is, reduce the oxidation rate of the wafer and improve the product yield.

[0058] Through the settings of the air supply component 400 and the heating component 500, hot air can be conveyed into the channel 110. The hot air blows directly on the liquid water droplets on the wafer in the channel 110 to drive away the water, and at the same time, in cooperation with the drying effect of the hot air on the liquid water droplets, the drying efficiency is improved.

[0059] It can be understood that the influence of the first opening 210 and the second opening 310 provided for wafer transmission on the heat preservation effect of the channel 110 can be ignored. The sizes of the first opening 210 and the second opening 310 can be flexibly set according to the thickness of the wafer, and will not be elaborated here one by one.

[0060] It should be noted that Figure 1 both the first heat preservation component 200 and the first opening 210 in are represented by dashed lines to clearly distinguish them from the solid line contour of the drying tank body 100, so as to clearly express the positions of the first heat preservation component 200 and the first opening 210.

[0061] It should be noted that the transmission direction of the silicon wafer is perpendicular to Figure 1 the plane where the X-axis and Y-axis are located in

[0062] Optionally, the air supply component 400 in this embodiment can be set as a positive pressure blower to blow the hot air generated by the heating component 500 into the channel 110.

[0063] Optionally, the heating component 500 can be set as a common air heater on the market.

[0064] Optionally, the first heat preservation component 200 in this embodiment includes a plurality of brushes. Two adjacent brushes form a brush unit, and the brush unit is arranged at the inlet and outlet; and a first opening 210 for the transmission of the silicon wafer is formed between two adjacent brushes. By arranging two brushes at both the inlet and outlet, it can ensure that the heat preservation effect on the channel 110 is improved as much as possible on the premise that the silicon wafer is transmitted through the first opening 210, thereby ensuring the drying efficiency. In addition, the setting of the brushes can clean foreign matters such as dirt on the silicon wafer, avoid affecting subsequent processes, and improve the product yield.

[0065] Optionally, the brushes in this embodiment can be set as soft hair brushes with high temperature resistance, which can extend the service life, avoid scratching the silicon wafer, and save costs.

[0066] Optionally, the silicon wafer drying device in this embodiment further includes a fixing member (not shown in the figure). The brush is detachably connected to the drying tank body 100 through the fixing member, which is beneficial to the replacement and maintenance of the brush, improves the operation convenience, and saves costs.

[0067] Optionally, the fixing member can be set as components such as bolts and screws.

[0068] Optionally, the first heat preservation component 200 in this embodiment includes a heat preservation film. The heat preservation film is arranged at the inlet and outlet, and a plurality of first openings 210 are arranged on the heat preservation film. The first openings 210 are arranged in one-to-one correspondence with the channel 110.

[0069] Optionally, in this embodiment, the second heat preservation component 300 includes a heat preservation film. The heat preservation film is arranged on the top of the channel 110 and partially closes the channel 110.

[0070] Furthermore, the above heat preservation film is preferably a Teflon material film, such as Teflon tape. Since the Teflon material film has good high temperature resistance, chemical corrosion resistance, low friction and insulation properties, therefore, by setting the second heat preservation component 300 as a Teflon material film, the heat preservation effect of the channel 110 can be improved, the drying efficiency can be improved, and the service life of the drying device can be extended.

[0071] Further, a plurality of second openings 310 are provided on the heat preservation film, and the second openings 310 are arranged in one-to-one correspondence with the channels 110, so that wafers can be transported in each channel 110, improving production efficiency.

[0072] Exemplarily, the number of the channels 110 and the second openings 310 in this embodiment can be set to five, eight, ten, etc.

[0073] Furthermore, a support plate 120 is provided in the drying tank body 100 in this embodiment. The support plate 120 covers the top of the channel 110. A third opening 130 is provided on the support plate 120. The heat preservation film is pasted on the support plate 120, and the third opening 130 is arranged opposite to the second opening 310. The setting of the support plate 120 can improve the reliability and convenience of pasting the heat preservation film. The operator only needs to ensure that the second opening 310 is opposite to the third opening 130, and then install the support plate 120 on the top of the channel 110 through bolts and other components to ensure that the third opening 130 is arranged opposite to the channel 110.

[0074] As Figure 1 shown, in this embodiment, the wafer drying device further includes an air supply pipeline 600. One end of the air supply pipeline 600 is communicated with the channel 110, and the other end is communicated with the air supply component 400. The heating component 500 is arranged on the air supply pipeline 600. The setting of the air supply pipeline 600 facilitates the connection between the heating component 500, the air supply component 400 and the channel 110, improving the connection reliability.

[0075] Further, the wafer drying device in this embodiment further includes a return air pipeline 700 and a hot air collecting hood 800. One end of the return air pipeline 700 is communicated with the hot air collecting hood 800, and the other end is communicated with the air supply component 400. The hot air collecting hood 800 is erected on the top of the drying tank body 100.

[0076] Through the settings of the air supply pipeline 600 and the return air pipeline 700, a hot air circulation loop can be formed. The heat generated in the upper part of the drying tank body 100 can be absorbed by the hot air collecting hood 800, then returned to the air supply component 400 again, and finally transported to the wafers in the channel 110 by the air supply component 400 for drying, thus avoiding waste of heat, saving energy consumption and cost.

[0077] Optionally, both the air supply pipeline 600 and the return air pipeline 700 in this embodiment are made of heat-resistant materials to extend the service life.

[0078] As Figure 1 and Figure 4As shown, in this embodiment, the silicon wafer drying device further includes a manifold 610, a first branch pipe 620, and a second branch pipe 630. Side walls 111 are formed on opposite sides of the channel 110. The manifold 610 is communicated with the air supply pipeline 600. One end of the first branch pipe 620 is communicated with the manifold 610, and the other end penetrates into the side wall 111. The second branch pipe 630 is arranged in the side wall 111, and one end of the second branch pipe 630 is communicated with the first branch pipe 620, and the other end of the second branch pipe 630 is communicated with the channel 110. In this way, hot air can be sequentially conveyed from the air supply pipeline 600 to the manifold 610, the first branch pipe 620, and the second branch pipe 630 and finally blown into the channel 110 to realize the drying effect on the silicon wafer.

[0079] Optionally, side walls 111 are provided on opposite sides of each channel 110 in this embodiment. One first branch pipe 620 is provided on each side wall 111, and a plurality of second branch pipes 630 are equidistantly arranged on each first branch pipe 620, so as to improve the uniformity of hot air drying the silicon wafer and ensure the drying effect.

[0080] Exemplarily, five, eight, or ten second branch pipes 630 of equal quantity can be equidistantly arranged on each first branch pipe 620 in this embodiment.

[0081] It can be understood that one end of the first branch pipe 620 is communicated with the manifold 610, the other end of the first branch pipe 620 is closed, and the second branch pipe 630 is arranged on the peripheral side of the first branch pipe 620.

[0082] Optionally, as Figure 1 shown, the silicon wafer drying device in this embodiment further includes a filter 900, and the filter 900 is arranged upstream and / or downstream of the air supply assembly 400. When the filter 900 is arranged upstream of the air supply assembly 400, the filter 900 filters the air, which can also be called the first filtration, to reduce impurities in the outside air from entering the inside of the air supply assembly 400; when the filter 900 is arranged downstream of the air supply assembly 400, the filter 900 filters the hot air in the air supply pipeline 600, which can also be called the second filtration, to prevent the hot air after the heat cycle from carrying foreign matters such as impurities from entering the channel 110 and improve the reliability and safety of drying the silicon wafer.

[0083] This embodiment also provides a solar cell processing device, which includes a fixture (not shown in the figure) and the above-mentioned silicon wafer drying device. The fixture is used to clamp the silicon wafer, and the fixture is slidably connected to the drying tank body 100 so that the silicon wafer is transported in the channel 110.

[0084] Since the solar cell processing equipment is equipped with the above-mentioned silicon wafer drying device, the solar cell processing equipment can reduce heat loss, save energy consumption, improve drying efficiency, reduce the oxidation rate of silicon wafers, and achieve the purpose of cost saving.

[0085] Embodiment 2

[0086] As Figure 5 shown, this embodiment provides a silicon wafer drying device, and the main difference from Embodiment 1 is that: the silicon wafer drying device in this embodiment further includes an air suction component, and the air suction component is arranged on the return air pipeline 700. Through the arrangement of the air suction component, the hot air above the drying tank body 100 can be sucked and this part of hot air can be conveyed to the air supply component 400, so as to re-dry the silicon wafers in the channel 110, realize the circulation function of the hot air, reduce the overflow of the hot air above the drying tank body 100 to the environment, save energy consumption, reduce heat loss, and achieve the purpose of cost saving.

[0087] Optionally, the air suction component in this embodiment can be set as a fan with a negative pressure function, that is, a negative pressure fan 410, to realize the function of sucking the hot air above the drying tank body 100.

[0088] The rest of the structure of the silicon wafer drying device in this embodiment is the same as that in Embodiment 1, and will not be described in detail here.

[0089] This embodiment also provides a solar cell processing equipment, which includes a fixture (not shown in the figure) and the above-mentioned silicon wafer drying device. The fixture is used to clamp the silicon wafers, and the fixture is slidably connected to the drying tank body 100 so that the silicon wafers can be transported in the channel 110.

[0090] Since the solar cell processing equipment is equipped with the above-mentioned silicon wafer drying device, the solar cell processing equipment can reduce heat loss, save energy consumption, improve drying efficiency, reduce the oxidation rate of silicon wafers, and achieve the purpose of cost saving.

[0091] Obviously, the above are only the preferred embodiments of the present invention and the technical principles applied. Those skilled in the art will understand that the present invention is not limited to the specific embodiments here, and various obvious changes, re-adjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the concept of the present invention, more other equivalent embodiments can be included, and the scope of the present invention is determined by the scope of the appended claims.

[0092] Note that in the description of this specification, the descriptions referring to the reference terms "some embodiments", "other embodiments", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

Claims

1. Silicon wafer drying device, characterized in that: include: A drying trough body (100), wherein a plurality of channels (110) for silicon wafers to flow are arranged in the drying trough body (100), and along the transmission direction of the silicon wafers, the channels (110) penetrate two opposite sides of the drying trough body (100) and form an inlet and an outlet on the drying trough body (100) for transmitting the silicon wafers; A first heat-insulating component (200), the first heat-insulating component (200) being arranged at the inlet and the outlet, the first heat-insulating component (200) being used to heat-insulate the channel (110); and a first opening (210) for transmitting the silicon wafer is arranged on the first heat-insulating component (200), the first opening (210) being arranged opposite to the channel (110).

2. The silicon wafer drying device according to claim 1, characterized in that: The first heat preservation component (200) comprises a plurality of brushes, two adjacent brushes forming a brush unit, the brush unit being arranged at the inlet and the outlet; and the first opening (210) for transmitting the silicon wafer is formed between two adjacent brushes; Alternatively, the first thermal insulation component (200) comprises a thermal insulation film, the thermal insulation film is arranged at the inlet and the outlet, a plurality of the first openings (210) are arranged on the thermal insulation film, and the first openings (210) are arranged in a one-to-one correspondence with the channels (110).

3. The silicon wafer drying device according to claim 2, characterized in that: The silicon wafer drying device also includes a fixing member, and the brush is detachably connected to the drying tank body (100) via the fixing member.

4. The silicon wafer drying device according to claim 1, characterized in that: The silicon wafer drying device further comprises a second heat preservation component (300), wherein the second heat preservation component (300) is arranged on the top of the channel (110) and covers the channel (110).

5. The silicon wafer drying device according to claim 4, characterized in that: The second thermal insulation component (300) comprises a thermal insulation film, which is arranged on the top of the channel (110) and partially closes the channel (110), and a plurality of second openings (310) are arranged on the thermal insulation film, and the second openings (310) are arranged in a one-to-one correspondence with the channels (110).

6. The silicon wafer drying device according to claim 5, characterized in that: A support plate (120) is arranged in the drying tank body (100), the support plate (120) is covered on the top of the channel (110), a third opening (130) is arranged on the support plate (120), the thermal insulation film is arranged on the support plate (120), and the third opening (130) is arranged opposite to the second opening (310).

7. The silicon wafer drying device according to claim 1, characterized in that: The silicon wafer drying device also includes: Air supply assembly (400); a heating component (500), one end of the heating component (500) being in communication with the air supply component (400), and the other end of the heating component (500) being in communication with the channel (110), and the heating component (500) being configured to heat the air generated by the air supply component (400) to form hot air; An air supply pipeline (600), one end of which is connected to the channel (110), and the other end of which is connected to the air supply component (400), and the heating component (500) is arranged on the air supply pipeline (600).

8. The silicon wafer drying device according to claim 7, characterized in that: The silicon wafer drying device also includes a return air duct (700) and a hot air collection hood (800), one end of the return air duct (700) is connected to the hot air collection hood (800), and the other end is connected to the air supply assembly (400), and the hot air collection hood (800) is mounted on the top of the drying tank body (100).

9. The silicon wafer drying device according to claim 7, characterized in that: The silicon wafer drying device further comprises a filter (900), and the filter (900) is arranged upstream and / or downstream of the air supply component (400).

10. A solar cell processing device, characterized in that: It comprises a clamp and a silicon wafer drying device as described in any one of claims 1 to 9, wherein the clamp is used to clamp the silicon wafer, and the clamp is slidably connected to the drying tank body (100) so that the silicon wafer can be transported in the channel (110).

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