Fully-sealed soil moisture sensor

Abstract

The utility model discloses a fully-sealed soil moisture sensor, and belongs to the technical field of sensors. The first end of the shell is an open end; the PCB main board is arranged in the shell and is provided with a processor chip; the first PCB auxiliary board is arranged in the shell and is provided with an awakening component connected with the processor chip; the second PCB auxiliary board is arranged in the shell, and a soil moisture measuring circuit connected with the processor chip is arranged on the second PCB auxiliary board; at least two measuring probes and a power supply. According to the technical scheme, the sealing performance and durability of the soil moisture sensor can be improved.

Description

Technical Field

[0001] The present application belongs to the field of sensor technology, and in particular relates to a fully sealed soil moisture sensor. Background Art

[0002] Soil moisture measurement sensors play an indispensable role in the fields of agriculture, environmental ecology and meteorological research. Existing soil moisture sensors usually have a window cover on them to facilitate battery replacement or sensor configuration, so that batteries can be replaced or sensors can be configured at any time through the window cover. However, in some application scenarios of soil moisture sensors, the window cover makes it difficult to ensure sealing and safety, thus affecting the durability and reliability of soil moisture sensors. Utility Model Content

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a fully sealed soil moisture sensor that can better meet the needs of actual products for soil parameter measurement.

[0004] In a first aspect, the present application provides a fully sealed soil moisture sensor, comprising:

[0005] The housing has a first end which is an open end and is sealed by a sealant;

[0006] A PCB mainboard is arranged inside the housing and extends from the first end of the housing to the second end of the housing. A processor chip is arranged on the PCB mainboard, and the second end corresponds to the first end.

[0007] A first PCB sub-board is arranged inside the housing and close to the second end of the housing. The first PCB sub-board is arranged vertically with the PCB main board. A wake-up component is arranged on the first PCB sub-board. The wake-up component is electrically connected to the wake-up port of the processor chip.

[0008] A second PCB sub-board is arranged inside the housing and close to the first end of the housing. The second PCB sub-board is arranged vertically with the PCB main board. A soil moisture measurement circuit is arranged on the second PCB sub-board. The soil moisture measurement circuit is electrically connected to the first signal port of the processor chip.

[0009] At least two measuring probes are fixed in the sealant, the at least two measuring probes include a soil moisture measuring probe, a first end of the soil moisture measuring probe is electrically connected to the soil moisture measuring circuit, and a second end of the soil moisture measuring probe protrudes from the sealant;

[0010] The power supply is arranged inside the shell and is used to provide power to the processor chip, the wake-up component and the soil moisture measurement circuit.

[0011] In some embodiments, the sensor further comprises an end cover disposed at the first end, and the sealant is poured into a space formed by the second PCB sub-board and the end cover.

[0012] In some embodiments, the above-mentioned sensor further includes at least two support columns, and the support columns are arranged between the second PCB sub-board and the end cover.

[0013] In some embodiments, the housing of the sensor is a cylindrical tube with a spherical end, the second end of the housing is a spherical area, and the first PCB sub-board is located in the plane where the largest circular surface of the spherical area is located.

[0014] In some embodiments, the power supply of the sensor is a lithium battery, a battery holder is provided on the PCB mainboard, and the lithium battery is fixed on the battery holder.

[0015] In some embodiments, the above-mentioned sensor also includes a water accumulation measurement circuit and a water accumulation measurement electrode, the water accumulation measurement electrode is located inside the shell and connected to the water accumulation measurement circuit, the water accumulation measurement circuit is located on the second PCB sub-board, and the water accumulation measurement circuit is electrically connected to the second signal port of the processor chip.

[0016] In some embodiments, the at least two measuring probes of the sensor include a hollow probe, and the hollow probe has a built-in thermistor;

[0017] The sensor also includes:

[0018] A soil temperature measurement circuit is located on the second PCB sub-board, the soil temperature measurement circuit is electrically connected to the fourth signal port of the processor chip, the first end of the hollow probe is electrically connected to the soil temperature measurement circuit, and the second end of the hollow probe protrudes from the sealant.

[0019] In some embodiments, the at least two measuring probes of the sensor include soil conductivity measuring probes;

[0020] The sensor further comprises:

[0021] A soil conductivity measurement circuit is located on the second PCB sub-board, the soil conductivity measurement circuit is electrically connected to the third signal port of the processor chip, the first end of the soil conductivity measurement probe is electrically connected to the soil conductivity measurement circuit, and the second end of the soil conductivity measurement probe protrudes from the sealant.

[0022] In some embodiments, the sensor further comprises:

[0023] A configuration component is located on the first PCB sub-board, and the configuration component is electrically connected to the configuration port of the processor chip.

[0024] In some embodiments, the wake-up component of the sensor is one of an NFC component or a magnetic switch; and / or, the configuration component is one of an NFC component, WIFI and Bluetooth.

[0025] The soil moisture sensor provided in the embodiment of the present application utilizes a shell and a sealant to encapsulate a PCB main board, a first PCB sub-board, a second PCB sub-board, a processor chip, a wake-up component, a soil moisture measurement circuit, and a power supply into the shell, thereby forming an integrated fully sealed structure, so that it can be used in various environments; further, a wake-up component is used inside the soil moisture sensor, so that the soil moisture sensor can be in a sleep mode or a shutdown mode with extremely low power consumption for a long time when not in operation, and then the wake-up component is used to wake up when it needs to work, thereby saving power consumption, which can effectively solve the power consumption problem of the soil moisture sensor with a fully sealed structure, so that it can have a longer service life; finally, in the embodiment of the present application, the first PCB sub-board and the second PCB sub-board are both vertically fixed to the PCB main board, thereby forming a stable support structure, so that it can be compactly arranged inside the shell, and can also well protect the stability and safety of the components arranged on the PCB main board and the two sub-boards.

[0026] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0028] Figure 1 A schematic cross-sectional structure diagram of a fully sealed soil moisture sensor provided in an embodiment of the present application;

[0029] Figure 2 for Figure 1 A schematic cross-sectional view along the AA direction in the illustrated embodiment;

[0030] Figure 3 for Figure 1 A schematic cross-sectional view along the BB direction in the illustrated embodiment;

[0031] Figure 4 for Figure 1 A schematic cross-sectional view along the CC direction of the embodiment shown;

[0032] Figure 5 for Figure 1 A schematic cross-sectional view along the CC direction of the embodiment shown;

[0033] Figure 6 for Figure 1 A cross-sectional schematic diagram of a second PCB sub-board is shown;

[0034] Figure 7 for Figure 1 A cross-sectional schematic diagram of another second PCB sub-board is shown. DETAILED DESCRIPTION

[0035] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0036] Soil moisture sensors are widely used in fields such as agriculture, environmental ecology, and meteorological research. Existing soil moisture sensors usually do not seal the sensors in an integrated manner to facilitate battery replacement and configuration. However, in complex and diverse application scenarios, it is difficult to ensure the sealing and safety of unsealed soil moisture sensors. With the development of technology, it has been proposed to set up a fully sealed soil moisture sensor, but the fully sealed soil moisture sensor has a short service life due to the inability to replace and charge the battery.

[0037] In order to improve the adaptability of the soil moisture sensor to various environments and the durability during use, the present application provides a fully sealed soil moisture sensor.

[0038] The existing soil moisture sensor adopts a top opening design for easy battery replacement, which greatly reduces the sealing and safety of the sensor in the field. The present application fixes the PCB main board, the first PCB sub-board, the second PCB sub-board, the processor chip, the wake-up component, the soil moisture measurement circuit and the power supply inside the sensor housing according to a special structure and uses a sealant package to achieve a fully sealed setting of the soil moisture sensor, solving the above-mentioned sealing and safety problems. Among them, the above-mentioned special structure refers to the first PCB sub-board and the second PCB sub-board inside the housing are fixed vertically to the PCB main board to form a stable support structure, so that the internal structure of the sensor is not easily damaged during use, thereby improving the reliability of the fully sealed soil moisture sensor.

[0039] Furthermore, the present application sets a wake-up component in the internal chip of the sensor and connects it to the processor chip. When the soil moisture sensor is not in working time, the chips inside the sensor are set to sleep mode. When data needs to be collected, the sleep chip is awakened by the wake-up component, thereby greatly reducing the power consumption of the chip in the sleep mode. When the battery cannot be replaced, the actual use time of the battery is extended, thereby allowing the soil moisture sensor to have a longer service life.

[0040] The present application provides a fully sealed soil moisture sensor, which can be found in Figure 1 The fully sealed soil moisture sensor provided in the embodiment of the present application includes a housing 2, a PCB main board 1, a first PCB sub-board 3, a power supply 5, a second PCB sub-board 6 and at least two measuring probes 9.

[0041] Specifically, the shell 2 may be a semi-enclosed structure, with only the first end of the shell 2 being an open end, that is, there may be an opening at the first end of the shell 2 for installing other components of the soil moisture sensor, and after the installation of each component is completed, the opening may be sealed by a sealant so that the opening is also in a closed state; other components of the soil moisture sensor, such as the PCB main board 1, the first PCB sub-board 3, the second PCB sub-board 6, as well as the processor chip 10, the wake-up component, the soil moisture measurement circuit and the power supply 5, may be arranged inside the shell 2, thereby forming a fully sealed structure.

[0042] The PCB main board 1 is disposed inside the housing 2 and extends from the first end of the housing 2 to the second end of the housing 2. The position of the PCB main board 1 inside the housing 2 is shown in the figure. Figure 2 As shown, a processor chip 10 is arranged on the PCB mainboard 1, and the above-mentioned second end corresponds to the first end, which is equivalent to the two ends of the space formed by the PCB mainboard 1 against the inside of the shell 2; the processor chip 10 in the embodiment of the present application can be a chip with computing and communication capabilities, and its model is not limited in the embodiment of the present application.

[0043] For the first PCB sub-board 3, it is arranged inside the shell 2 and close to the second end of the shell 2. The first PCB sub-board 3 is arranged vertically with the PCB main board 1. A wake-up component is arranged on the first PCB sub-board 3, and the wake-up component is electrically connected to the wake-up port of the processor chip 10. In the non-working state, the above-mentioned processor chip 10 and the wake-up component are both in a dormant state. When data needs to be collected, the wake-up component can wake up the processor chip 10 at any time by a low-power wake-up method, and then the processor chip 10 starts to process data. Since the processor chip 10 in the dormant state consumes less power than the processor chip 10 in the working state, it can be seen that the use cycle of the soil moisture sensor can be extended by setting the wake-up component. For the second PCB sub-board 6, it is arranged inside the shell 2 and close to the first end of the shell 2. The second PCB sub-board 6 is arranged vertically with the PCB main board 1. A soil moisture measurement circuit is arranged on the second PCB sub-board 6, and the soil moisture measurement circuit is electrically connected to the first signal port of the processor chip 10.

[0044] At least two measuring probes 9 are fixed in the sealant. The at least two measuring probes 9 include a soil moisture measuring probe. The first end of the soil moisture measuring probe is electrically connected to the soil moisture measuring circuit, and the second end of the soil moisture measuring probe protrudes from the sealant. In the embodiment of the present application, soil moisture measurement can include multiple methods, such as measurement using time domain reflection technology. When the soil moisture sensor is working, the measuring probe can be inserted into the soil, and then a short pulse microwave signal is sent into the soil through the soil moisture measuring probe. When the pulse signal encounters a medium with a different dielectric constant, such as dry soil and wet soil, reflection occurs. The receiver in the soil moisture measuring probe is used to detect the reflected pulse signal, and then the total time from the pulse emission to the return is measured through the time domain reflection circuit in the soil moisture measurement circuit. The dielectric constant of the soil can be calculated through the total time of pulse propagation. The dielectric constant of the soil is proportional to the moisture content of the soil. The higher the soil moisture content, the greater the dielectric constant. Finally, the information measured by the soil moisture measurement circuit will be transmitted to the processor chip 10 through the first signal port, and then the processor chip 10 outputs the soil moisture content data. In the embodiment of the present application, a power supply 5 can also be provided, which is provided inside the housing 2, and is used to provide power to the above-mentioned processor chip 10, the wake-up component and the soil moisture measurement circuit. The power supply 5 in the embodiment of the present application can be independently provided in the housing 2, or it can be fixed on any of the above-mentioned PCB boards, so that all the components in the housing 2 are a fully fixed structure when installed, and when it is assembled into the housing 2, it can be after other components are assembled.

[0045] The fully sealed soil moisture sensor provided in the embodiment of the present application has a first PCB sub-board 3 whose position setting ensures that the PCB main board 1 is centered in the housing 2. The open end of the housing 2 is sealed and fixed with a sealant to the PCB main board 1, the first PCB sub-board 3, the second PCB sub-board 6, at least two measuring probes 9 and the power supply 5, so that the internal structure of the housing 2 remains stable, while ensuring the overall structural strength of the sensor and the rigidity of at least two measuring probes 9, thereby improving the sealing and safety of the fully sealed soil moisture sensor. Furthermore, since a wake-up component is set on the first PCB sub-board 3, the energy consumption of the chip inside the sensor during the dormant period is reduced to a certain extent, thereby extending the service life of the fully sealed soil moisture sensor.

[0046] The first PCB sub-board 3 is located at the spherical head of the housing 2, which is more conducive to transmitting information by sending electromagnetic signals. The second PCB sub-board 6 is located above the metal probe 9, closer to the soil, and is conducive to processing at least one of soil moisture, soil temperature and soil conductivity measurement data. The first PCB sub-board 3 can exchange positions with the second PCB sub-board 6.

[0047] In some embodiments, the sensor further comprises an end cover 8 disposed at the first end of the housing 2 , and the sealant is poured into the space formed by the second PCB sub-board 6 and the end cover 8 .

[0048] In some embodiments, the above-mentioned sensor further includes at least two support columns 7 , and the at least two support columns 7 are disposed between the second PCB sub-board 6 and the end cover 8 .

[0049] In some embodiments, after the PCB main board 1, the first PCB sub-board 3, the second PCB sub-board 6, the processor chip 10 and the power supply 5 are assembled as described above, the first ends of at least two measuring probes 9 are connected to the corresponding measuring circuits on the second PCB sub-board 6, and then the entire structure is placed inside the sensor housing 2, and then at least two supporting columns 7 are fixed to the second PCB sub-board 6. In some embodiments, the number of measuring probes 9 and supporting columns 7 can be set to 3. At this time, the connection positions of the measuring probes 9 and the supporting columns 7 with the second PCB sub-board 6 on the second PCB sub-board 6 can be shown as follows. Figure 3 The end cap 8 is provided with holes. The number of holes in the embodiment of the present application is the same as the number of the measuring probes 9 described above. The specific number is not limited. For example, the number of holes provided can be the same as the number of the measuring probes 9 described above. Figure 3 In the embodiment shown, the number of measuring probes 9 is the same, which is 3. At this time, the positions of the openings on the end cover 8 can be shown as follows: Figure 4 Then the measuring probe 9 is passed through the hole on the end cover 8, and the end cover 8 is installed on the second end of the sensor housing 2. At this time, the position of the measuring probe 9 of the sensor is as shown in FIG. Figure 5As shown, finally, sealant is poured between the end cover 8 and the second PCB sub-board 6 to complete the sealing of the sensor.

[0050] Among them, the end cover 8 can be provided to fix the at least two measuring probes 9, and by providing at least two supporting columns 7, the end cover 8 can be kept parallel to the second PCB sub-board 6, thereby improving the stability of the internal structure of the entire housing 2, which is conducive to the smooth progress of the subsequent sealant pouring. Finally, the sealant is poured between the end cover 8 and the second PCB sub-board 6. This pouring process uses the least amount of sealant to complete the full sealing of the sensor, and further fixes the measuring probe 9, the end cover 8 and the second PCB sub-board 6.

[0051] In some embodiments, the sensor housing 2 is a cylindrical tube with a spherical end, the second end of the housing 2 is a spherical area, and the first PCB sub-board 3 is located on the plane where the largest circular surface of the spherical area is located.

[0052] In some embodiments, the power supply 5 of the sensor is a lithium battery. A battery holder 4 is provided on the PCB main board 1 , and the lithium battery 5 is fixed on the battery holder 4 .

[0053] In some embodiments, the sensor further includes a water accumulation measurement circuit and a water accumulation measurement electrode. The water accumulation measurement electrode is located inside the housing 2 and connected to the water accumulation measurement circuit. Figure 6 for Figure 1 A cross-sectional schematic diagram of a second PCB sub-board 6 is shown, as shown in Figure 6 As shown, the water accumulation measurement circuit 62 and the soil moisture measurement circuit 61 are located on the second PCB sub-board 6, and the water accumulation measurement circuit 62 is electrically connected to the second signal port of the processor chip 10; when the sensor is working, the capacitance of the water accumulation measurement electrode can be charged by the water accumulation measurement circuit 62. In the case of no water accumulation and water accumulation, due to the different electrical conductivities of soil and water, the capacitance of the water accumulation detection electrode is also different. In the embodiment of the present application, the capacitance of the water accumulation detection electrode when water accumulates on the soil surface can be pre-set as a threshold capacitance. When the surface water accumulation measurement circuit 62 measures that the capacitance of the water accumulation measurement electrode changes and reaches the above-mentioned threshold capacitance, it can be determined that surface water accumulates, and finally the water accumulation measurement circuit 62 sends the above-mentioned measurement result to the processor chip 10.

[0054] In some embodiments, at least two measuring probes 9 of the sensor include a hollow probe, and the hollow probe has a built-in thermistor, wherein the thermistor may be one of a negative temperature coefficient resistor and a positive temperature coefficient resistor.

[0055] In some embodiments, the above-mentioned sensor may further include at least one of a soil temperature measurement circuit 63 and a soil conductivity measurement circuit 64. Figure 7 for Figure 1 Another cross-sectional schematic diagram of a second PCB sub-board 6 is shown in FIG. 1 , wherein the above two measuring circuits are both located on the second PCB sub-board. Figure 7 As shown, specifically:

[0056] The soil temperature measurement circuit 63 is electrically connected to the fourth signal port of the processor chip 10. The first end of the hollow probe is connected to the soil temperature measurement circuit 63, and the second end of the hollow probe protrudes from the sealant. When the sensor is working, the second ends of the at least two measuring probes 9 are fixedly inserted into the measured soil, and the resistance of the thermistor in the hollow probe changes accordingly with the temperature. Then, the soil temperature measurement circuit 63 measures the resistance of the thermistor, and finally transmits the measurement data to the processor chip 10 for processing.

[0057] In some embodiments, at least two measuring probes 9 of the above-mentioned sensor include soil conductivity measuring probes, wherein the soil conductivity measuring probes are one pair or more pairs. In some embodiments, the soil conductivity measuring probes and the soil moisture measuring probes are independent of each other to avoid mutual interference and make the measurement data more accurate.

[0058] The sensor in the above embodiment of the present application may further include:

[0059] The soil conductivity measurement circuit 64 is electrically connected to the third signal port of the processor chip 10. The first end of the soil conductivity measurement probe is connected to the soil conductivity measurement circuit 64, and the second end of the soil conductivity measurement probe protrudes from the sealant. When the sensor is working, the second ends of the at least two measurement probes 9 are fixedly inserted into the measured soil, and the soil conductivity measurement circuit applies current or voltage to one or more pairs of soil conductivity measurement probes to obtain the conductivity values ​​between the one or more pairs of soil conductivity measurement probes, and then transmits the measurement data to the processor chip 10 for processing through the soil conductivity measurement circuit 64.

[0060] In some embodiments, the sensor further comprises:

[0061] The configuration component is located on the first PCB sub-board 3 and is connected to the configuration port of the processor chip 10. The configuration component and the soil conductivity measurement circuit 64, soil temperature measurement circuit 63, water accumulation measurement circuit 62 and soil moisture measurement circuit 61 set on the second PCB sub-board 6 are connected to the corresponding pins of the processor chip 10 on the first PCB sub-board 3 to form a complete configuration circuit, ensuring that the soil moisture sensor can work as expected and meet specific application requirements. At the same time, through the cooperation of the configuration component and the wake-up component, the configuration process of the sensor can be realized by mobile phone or card reader operation, solving the configuration problems of traditional soil moisture sensors.

[0062] In some embodiments, the above-mentioned sensor wake-up component is one of an NFC component or a magnetic switch; and / or, the above-mentioned configuration component is one of an NFC component, a WIFI component and a Bluetooth component.

[0063] When the wake-up component is an NFC component, the NFC component mainly includes an NFC chip and an NFC coil. When the above sensor works, it mainly uses the principle of electromagnetic induction. When a mobile phone, a card reader or other device with NFC function is close to the above sensor, the two establish a wireless connection through electromagnetic coupling induction, thereby transmitting and interacting data; when the wake-up component is a magnetically controlled switch, the wake-up request issued by the processor chip 10 will cause the magnetic field around the chip to change. When the magnetically controlled switch detects the change in the magnetic field, it will trigger a wake-up signal to wake up the processor chip 10.

[0064] The power consumption of the NFC component or magnetic switch in the above process in both working and dormant states is only microamperes or nanoamperes. When the processor chip 10 is in dormant state, if there is no wake-up component, the dormant power consumption of the processor chip 10 to complete self-wake-up after dormancy is milliamperes. In this case, on the one hand, the processor chip 10 is only awakened when working; on the other hand, the power consumption of the NFC component and the magnetic switch is one to two orders of magnitude lower than that of the processor chip 10 itself, and a more energy-saving effect can be achieved from the above two aspects.

[0065] The technical solution provided by the embodiment of the present application is that the above-mentioned configuration component can receive a configuration signal, and then transmit the obtained configuration signal to the processor chip 10, so that the processor chip 10 controls the above-mentioned measurement circuit to perform measurement. The above-mentioned configuration signal can pass through the above-mentioned sensor housing 2. Through the above-mentioned configuration component, the wireless configuration of the above-mentioned fully sealed soil moisture sensor can be realized.

[0066] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0067] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0068] In the description of this application, "first feature" or "second feature" may include one or more of the features.

[0069] In the description of the present application, “plurality” means two or more.

[0070] In the description of the present application, a first feature being “on” or “under” a second feature may include that the first and second features are directly in contact with each other, or may include that the first and second features are not in direct contact with each other but are in contact with each other via another feature therebetween.

[0071] In the description of the present application, “above”, “over” and “above” a first feature to a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0072] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0073] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A fully sealed soil moisture sensor, characterized in that: include: A housing, wherein a first end of the housing is an open end, and the open end is sealed by a sealant; A PCB mainboard is arranged inside the housing and extends from the first end of the housing to the second end of the housing, a processor chip is arranged on the PCB mainboard, and the second end corresponds to the first end; A first PCB sub-board, the first PCB sub-board is arranged inside the housing and close to the second end of the housing, the first PCB sub-board is arranged vertically with the PCB main board, a wake-up component is arranged on the first PCB sub-board, and the wake-up component is electrically connected to the wake-up port of the processor chip; a second PCB sub-board, the second PCB sub-board being arranged inside the housing and close to the first end of the housing, the second PCB sub-board being arranged vertically with the PCB main board, the second PCB sub-board being provided with a soil moisture measurement circuit, and the soil moisture measurement circuit being electrically connected to the first signal port of the processor chip; at least two measuring probes fixed in the sealant, the at least two measuring probes comprising a soil moisture measuring probe, a first end of the soil moisture measuring probe being electrically connected to the soil moisture measuring circuit, and a second end of the soil moisture measuring probe protruding from the sealant; A power supply is arranged inside the housing and is used to provide power to the processor chip, the wake-up component and the soil moisture measurement circuit.

2. The sensor according to claim 1, characterized in that It also includes an end cover arranged at the first end, and the sealant is poured into the space formed by the second PCB sub-board and the end cover.

3. The sensor according to claim 2, characterized in that It also includes at least two support columns, which are arranged between the second PCB sub-board and the end cover.

4. The sensor according to claim 1, characterized in that The shell is a cylindrical tube with a spherical end, the second end of the shell is a spherical area, and the first PCB sub-board is located on the plane where the largest circular surface of the spherical area is located.

5. The sensor according to claim 1, characterized in that The power supply is a lithium battery. A battery fixing seat is provided on the PCB mainboard, and the lithium battery is fixed on the battery fixing seat.

6. The sensor according to claim 1, characterized in that It also includes a water accumulation measurement circuit and a water accumulation measurement electrode. The water accumulation measurement electrode is located inside the shell and connected to the water accumulation measurement circuit. The water accumulation measurement circuit is located on the second PCB sub-board and is electrically connected to the second signal port of the processor chip.

7. The sensor according to claim 1, characterized in that The at least two measuring probes include a hollow probe, and the hollow probe has a built-in thermistor; The sensor also includes: a soil temperature measurement circuit, located on the second PCB sub-board, the soil temperature measurement circuit is electrically connected to the fourth signal port of the processor chip, the first end of the hollow probe is electrically connected to the soil temperature measurement circuit, and the second end of the hollow probe protrudes from the sealant.

8. The sensor according to claim 1, characterized in that The at least two measurement probes include a soil conductivity measurement probe; The sensor further comprises: A soil conductivity measurement circuit is located on the second PCB sub-board, the soil conductivity measurement circuit is electrically connected to the third signal port of the processor chip, the first end of the soil conductivity measurement probe is electrically connected to the soil conductivity measurement circuit, and the second end of the soil conductivity measurement probe protrudes from the sealant.

9. The sensor according to claim 1, characterized in that Also includes: A configuration component is located on the first PCB sub-board, and the configuration component is electrically connected to the configuration port of the processor chip.

10. The sensor according to claim 9, characterized in that The wake-up component is one of an NFC component or a magnetic switch; and / or, the configuration component is one of an NFC component, a WIFI component and a Bluetooth component.

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