Heat dissipation assembly and electronic equipment

Abstract

The utility model provides a heat dissipation assembly and electronic equipment. The heat dissipation assembly comprises a fan; the side wall is enclosed to form a containing space, the side wall is provided with an air outlet section, an air outlet is formed in the air outlet section, and the fan is located in the containing space; the stop structure comprises a stop part and a hollow part; the thermal inductance structure is connected with the stopping structure and can control the stopping structure to move in the extending direction of the air outlet section so as to adjust the relative position between the stopping structure and the air outlet section; wherein the size of the stopping part can at least completely cover the air outlet so as to prevent air of the fan from being blown out of the air outlet. According to the heat dissipation assembly and the electronic equipment, the air outlet can be opened and closed and the opening size of the air outlet can be adjusted under the requirements of different functions, the problem that the heat dissipation effect of a CPU is affected due to the fact that the air outlet can only continuously blow air is solved, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation devices, and particularly to a heat dissipation component and an electronic device. Background Art

[0002] Currently, most designs of heat dissipation devices use heat pipes or vacuum chamber heat pipes to connect heat dissipation fins to conduct heat to the heat dissipation fins, and use a fan to blow air to take away the heat. With the development of heat dissipation devices, the dual-outlet fan design is widely used. Its main air outlet is used to dissipate heat from the CPU, and the other air outlet, as the second air outlet, is used to divert a part of the air to blow onto the wafer or component, which can directly reduce the temperature of the wafer or component, increase the heat dissipation efficiency, and reduce the temperature of the chassis.

[0003] However, the existing fan structure designs on the market are all continuous blowing at the dual air outlets, and it is impossible to switch the second air outlet under different functional requirements. For example, for a solid state drive (SSD) or a dual-inline memory module (DIMM), active heat dissipation is only required under specific conditions. If continuous blowing for heat dissipation is carried out, it will affect the heat dissipation effect of the CPU and reduce the heat dissipation efficiency. Summary of the Utility Model

[0004] The present disclosure provides a heat dissipation component and an electronic device to at least solve the above technical problems existing in the prior art.

[0005] According to a first aspect of the present disclosure, a heat dissipation component is provided, including a fan, and further including:

[0006] A side wall that encloses to form an accommodation space. The side wall has an air outlet section, and an air outlet is provided on the air outlet section. The fan is located in the accommodation space;

[0007] A stop structure, including a stop portion and a hollow portion; and

[0008] A heat sensing structure, connected to the stop structure, capable of controlling the stop structure to move along the extending direction of the air outlet section to adjust the relative position between the stop structure and the air outlet section;

[0009] Wherein, the size of the stop portion is at least capable of completely covering the air outlet to block the air from the fan from blowing out through the air outlet.

[0010] In an implementable embodiment, the heat sensing structure has a cavity and a slideway communicated with the cavity. The stop structure further includes a connecting portion, and the connecting portion is embedded in the slideway and can slide along the slideway.

[0011] In an implementable embodiment, the connecting portion has a first position close to the cavity and a second position away from the cavity within the slideway. When the connecting portion is in the first position, the stopping portion coincides with the air outlet to cover the air outlet; when the connecting portion is in the second position, the hollow portion coincides with the air outlet to allow the air outlet to ventilate.

[0012] In an implementable embodiment, a receiving groove is formed in the air outlet section, and the receiving groove communicates with the end face of the air outlet section. The stopping structure is clamped in the receiving groove and can move within the receiving groove.

[0013] In an implementable embodiment, the heat sensing structure is connected to the end face of the air outlet section.

[0014] In an implementable embodiment, the heat sensing structure can sense a first temperature range, a second temperature range, and a third temperature range. When the heat sensing structure senses the first temperature range, the air outlet section is in a closed state, and the stopping portion coincides with the air outlet; when the heat sensing structure senses the second temperature range, the air outlet section is in a partially open state, and the stopping structure partially covers the air outlet; when the heat sensing structure senses the third temperature range, the air outlet section is in a fully open state, and the hollow portion coincides with the air outlet; wherein, the temperature of the first temperature range is less than the temperature of the second temperature range, and the temperature of the second temperature range is less than the temperature of the third temperature range.

[0015] In an implementable embodiment, the number of the air outlets is multiple, and the multiple air outlets are arranged at intervals.

[0016] In an implementable embodiment, the number of the stopping portions and the hollow portions is multiple. The number of the stopping portions is not less than the number of the air outlets, and the number of the hollow portions is not less than the number of the air outlets; wherein, the stopping portions and the hollow portions are arranged alternately.

[0017] In an implementable embodiment, the heat sensing structure is made of a heat-conducting material.

[0018] According to a second aspect of the present disclosure, an electronic device is provided, including a housing and electronic components disposed inside the housing. The housing is further provided with a heat dissipation component as described in any one of the above implementable embodiments, and the air outlet is disposed corresponding to the electronic components so that the air blown by the fan can pass through the air outlet and blow towards the electronic components.

[0019] In the present disclosure, since an air outlet is provided on the side wall of the heat dissipation component, the air from the fan in the accommodation space can be blown out from the air outlet to dissipate heat from the wafer or component; since the heat dissipation component further includes a stop structure and a heat sensing structure, the heat sensing structure is connected to the stop structure and can control the stop structure to move along the extending direction of the air outlet section, so that when the stop structure moves to make the stop part coincide with the air outlet, the stop part blocks the air outlet to prevent the air from the fan from blowing out; when the stop structure moves to make the hollow part coincide with or partially coincide with the air outlet, the hollow part communicates with the air outlet, and the air from the fan can be blown out from the air outlet. Thus, the heat dissipation component can open and close the air outlet and adjust the opening size of the air outlet according to different functional requirements, solves the problem that the air outlet can only blow continuously and affects the CPU heat dissipation effect, and improves the heat dissipation efficiency.

[0020] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it used to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] By referring to the accompanying drawings and reading the following detailed description, the above and other objects, features, and advantages of the exemplary embodiments of the present disclosure will become easily understood. In the drawings, several embodiments of the present disclosure are shown in an exemplary rather than restrictive manner, where:

[0022] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0023] Figure 1 Shows an overall structural schematic diagram of the heat dissipation component according to an exemplary embodiment of the present disclosure (the air outlet section is in a closed state);

[0024] Figure 2 Shows an overall structural schematic diagram of the heat dissipation component according to an exemplary embodiment of the present disclosure (the air outlet section is in a partially open state);

[0025] Figure 3 Shows an overall structural schematic diagram of the heat dissipation component according to an exemplary embodiment of the present disclosure (the air outlet section is in a fully open state);

[0026] Figure 4 Shows a partial cross-sectional view of the heat dissipation component according to an exemplary embodiment of the present disclosure (the air outlet section is in a closed state);

[0027] Figure 5 Shows a partial cross-sectional view of the heat dissipation component according to an exemplary embodiment of the present disclosure (the air outlet section is in a partially open state);

[0028] Figure 6 Shows a partial cross-sectional view of the heat dissipation component according to an exemplary embodiment of the present disclosure (the air outlet section is in a fully open state);

[0029] Figure 7 Shows a schematic structural diagram of the side wall of the heat dissipation component according to an exemplary embodiment of the present disclosure;

[0030] Figure 8 Shows a schematic structural diagram of the air outlet section of the heat dissipation component according to an exemplary embodiment of the present disclosure;

[0031] Figure 9 Shows a schematic structural diagram of the stop structure of the heat dissipation component according to an exemplary embodiment of the present disclosure;

[0032] Figure 10 Shows a cross-sectional view of the thermal sensing structure of the heat dissipation component according to an exemplary embodiment of the present disclosure;

[0033] Figure 11 Shows a schematic overall structure diagram of an electronic device according to an exemplary embodiment of the present disclosure;

[0034] Figure 12 Shows a schematic internal structure diagram of an electronic device according to an exemplary embodiment of the present disclosure;

[0035] Figure 13 Shows a partial view of an electronic device according to an exemplary embodiment of the present disclosure.

[0036] Description of reference numerals in the figure: 1. Fan; 2. Side wall; 3. Stop structure; 4. Thermal sensing structure; 5. D shell; 6. Electronic components; 21. Accommodating space; 22. Air outlet section; 31. Stop portion; 32. Hollow portion; 33. Connecting portion; 41. Cavity; 42. Slideway; 51. Heat dissipation holes; 220. Accommodating groove; 221. Air outlet. Detailed implementation manners

[0037] To make the objectives, features, and advantages of the present disclosure more obvious and understandable, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present disclosure.

[0038] The embodiments of the present disclosure will be described in detail below in conjunction with the drawings.

[0039] Refer to Figures 1 to 6As shown in the figure, a heat dissipation component according to an exemplary embodiment of the present disclosure includes a fan 1, a side wall 2, a stop structure 3, and a thermal sensing structure 4. The side wall 2 encloses to form an accommodation space 21. The side wall 2 has an air outlet section 22, and an air outlet 221 is provided on the air outlet section 22. The fan 1 is located in the accommodation space 21. The stop structure 3 includes a stop portion 31 and a hollow portion 32. The thermal sensing structure 4 is connected to the stop structure 3 and can control the stop structure 3 to move along the extending direction of the air outlet section 22 to adjust the relative position between the stop structure 3 and the air outlet section 22. Among them, the size of the stop portion 31 is at least capable of completely covering the air outlet 221 to block the air of the fan 1 from being blown out from the air outlet 221.

[0040] In this embodiment, the heat dissipation component is applied to various scenarios that require heat dissipation functions. For example, it can be applied to, including but not limited to, computers, game consoles, industrial equipment, or communication equipment, etc. The number of air outlets 221 on the side wall 2 is at least one. When the number of air outlets 221 is one, the air outlet 221 extends on the air outlet section 22. Correspondingly, the size of the stopping portion 31 of the stopping structure 3 is such that it can at least completely block the air outlet 221. When the stopping portion 31 and the air outlet 221 overlap, the air from the fan 1 is blocked inside the side wall 2. It can be understood that the size of the hollow portion 32 should also be designed based on the standard that the air outlet 221 can be completely ventilated when the hollow portion 32 and the air outlet 221 completely overlap. The air outlet 221 is usually arranged corresponding to the heat-generating components to blow air on the heat-generating components for heat dissipation. The stopping structure 3 is arranged beside the air outlet section 22. Specifically, beside the air outlet section 22 means the inner side close to the fan 1 or the outer side far from the fan 1; alternatively, the stopping structure 3 is clamped in the air outlet section 22 and can move relative to the air outlet section 22. The stopping structure 3 can be made of a thin plastic material, specifically a plastic sheet. The thermal sensing structure 4 can adjust the position of the stopping structure 3 through active user control or the thermal sensing structure 4 can automatically adjust the position of the stopping structure 3. When the thermal sensing structure 4 needs to adjust the position of the stopping structure 3 through active user control, the thermal sensing structure 4 is connected to a control module, and the control module can feedback the user's instruction to the heat pipe structure, so that the thermal sensing structure 4 drives the stopping structure 3 to move to different positions; when the thermal sensing structure 4 automatically adjusts the position of the stopping structure 3, the thermal sensing structure 4 is connected to the heat-generating components that need to be heat-dissipated, can sense the temperature change of the heat-generating components, and adjust the position of the stopping structure 3 according to the temperature change. The operating principle of the thermal sensing structure 4 when automatically adjusting the stopping structure 3 is as follows: when the thermal sensing structure 4 senses that the temperature of the heat-generating components is relatively low, the stopping structure 3 is in the position where the stopping portion 31 overlaps with the air outlet 221, and the air outlet 221 is closed. As the thermal sensing structure 4 senses that the temperature of the heat-generating components gradually rises, the thermal sensing structure 4 pushes the stopping structure 3 to gradually move in the direction away from the thermal sensing structure 4, so that the hollow portion 32 gradually overlaps with the air outlet 221 until the hollow portion 32 completely overlaps with the air outlet 221. During this process, the air volume blown out from the air outlet 221 gradually increases, blowing air on the heat-generating components to cool and dissipate heat; when the thermal sensing structure 4 senses that the temperature of the heat-generating components decreases, the thermal sensing structure 4 drives the stopping structure 3 to gradually move in the direction close to the thermal sensing structure 4, so that the stopping portion 31 gradually overlaps with the air outlet 221, and the air outlet 221 gradually closes until the stopping portion 31 completely overlaps with the air outlet 221, and the air outlet 221 is closed.

[0041] In this embodiment, since an air outlet 221 is provided on the side wall 2 of the heat dissipation component, the air from the fan 1 in the accommodation space 21 can be blown out from the air outlet 221 to dissipate heat from the wafer or components; since the heat dissipation component further includes a stop structure 3 and a heat sensing structure 4, the heat sensing structure 4 is connected to the stop structure 3 and can control the stop structure 3 to move along the extension direction of the air outlet section 22. When the stop structure 3 moves to a position where the stop portion 31 coincides with the air outlet 221, the stop portion 31 blocks the air outlet 221 to prevent the air from the fan 1 from being blown out from the air outlet 221; when the stop structure 3 moves to a position where the hollow portion 32 coincides with or partially coincides with the air outlet 221, the hollow portion 32 communicates with the air outlet 221, and the air from the fan 1 can be blown out from the air outlet 221. Thus, the heat dissipation component can open and close the air outlet 221 and adjust the opening size of the air outlet 221 according to different functional requirements, solving the problem that the air outlet 221 can only continuously blow air and affect the CPU heat dissipation effect, and improving the heat dissipation efficiency.

[0042] Specifically, in an implementable embodiment, the heat sensing structure 4 is made of a heat-conducting material.

[0043] In this embodiment, the heat sensing structure 4 can be made of metal heat-conducting materials such as copper, aluminum or steel, non-metal heat-conducting materials such as graphite or ceramics, or heat-conducting materials such as certain polymers and composite materials. Preferably, the heat sensing structure 4 is made of high heat-conducting materials with high heat conductivity such as diamond, graphene, carbon nanotubes, metal alloys (such as copper-nickel alloy, silver-copper alloy, etc.), and certain ceramics and composite materials. In addition, the heat sensing structure 4 can be connected to the heat-generating component through a connecting member made of a heat-conducting material or a high heat-conducting material.

[0044] Referring to Figure 9 and Figure 10 As shown, in an implementable embodiment, the heat sensing structure 4 has a cavity 41 and a slideway 42 communicating with the cavity 41. The stop structure 3 further includes a connecting portion 33. The connecting portion 33 is embedded in the slideway 42 and can slide along the slideway 42.

[0045] In this embodiment, the heat sensing structure 4 has an air cavity 41 for containing gas. When the heat sensing structure 4 senses that the temperature of the heat-generating component rises, the gas in the cavity 41 expands due to heat, and thus can push the connecting portion 33 to move along the slideway 42 in a direction away from the cavity 41. According to Charles-Gay-Lussac's law:

[0046] P t =P 0 (1 + βt),

[0047] where P t is the pressure of the gas at any temperature t, and P 0is the pressure at 0°C, t is the Celsius temperature, β is the coefficient of expansion of the gas. For an ideal gas, β = 1 / 273. Therefore, the expression can be simplified to:

[0048]

[0049] Also, because:

[0050]

[0051] where V is the volume of the gas, T is the absolute temperature of the gas, and k is a constant.

[0052] Therefore, it can be deduced that:

[0053]

[0054] where V t is the volume of the gas at temperature t, and V 0 is the volume at 0°C. Thus, it can be obtained that when the temperature rises, the volume of the gas expands by a certain amount, and the required expanded volume can be calculated, and the gas amount can be adjusted to control the temperature.

[0055] Furthermore, in an implementable manner, the connecting portion 33 has a first position close to and a second position away from the cavity 41 within the slideway 42. When the connecting portion 33 is at the first position, the stopping portion 31 coincides with the air outlet 221 to cover the air outlet 221; when the connecting portion 33 is at the second position, the hollow portion 32 coincides with the air outlet 221 to ventilate the air outlet 221.

[0056] Even further, in an implementable manner, the thermal sensing structure 4 can sense a first temperature range, a second temperature range, and a third temperature range. When the thermal sensing structure 4 senses the first temperature range, the air outlet section 22 is in a closed state, and the stopping portion 31 coincides with the air outlet 221; when the thermal sensing structure 4 senses the second temperature range, the air outlet section 22 is in a partially open state, and the stopping structure 3 partially covers the air outlet 221; when the thermal sensing structure 4 senses the third temperature range, the air outlet section 22 is in a fully open state, and the hollow portion 32 coincides with the air outlet 221. Among them, the temperature of the first temperature range is less than the temperature of the second temperature range, and the second temperature is less than the temperature of the third temperature range.

[0057] In this embodiment, the temperatures referred to in the first temperature section, the second temperature section, and the third temperature section are not limited to a specific temperature. The process from the first temperature section through the second temperature section to the third temperature section can be understood as a process of increasing temperature. The temperature in the first temperature section is the first temperature, the temperature in the second temperature section is the second temperature, and the temperature in the third temperature section is the third temperature. The first temperature can represent the initial temperature or the initial temperature section when the air outlet 221 is in the closed state. As the thermal sensing structure 4 senses the increase in the temperature of the heating component, the first temperature passes through the second temperature, and the air outlet 221 gradually changes to a partially open state, and the opening of the air outlet 221 becomes larger as the temperature rises. Finally, when the temperature rises to the third temperature, the air outlet 221 is fully opened to the fully open state. In the above process, as the temperature rises, the gas in the cavity 41 expands, and the gas pushes the connecting portion 33 to move from the first position to the final second position in the slideway 42. Correspondingly, the air outlet 221 also gradually changes from closed to open. It can be understood that as the thermal sensing structure 4 senses the decrease in the temperature of the heating component, the gas in the cavity 41 contracts, driving the connecting portion 33 to move from the second position to the initial first position in the slideway 42. Correspondingly, the air outlet 221 also gradually changes from open to closed, thereby realizing the automatic adjustment of the opening and size of the air outlet 221.

[0058] Referring Figure 7 and Figure 8 As shown, in an implementable embodiment, the air outlet section 22 is provided with a receiving groove 220, the receiving groove 220 communicates with the end face of the air outlet section 22, and the stop structure 3 is clamped in the receiving groove 220 and can move in the receiving groove 220.

[0059] Specifically, in an implementable embodiment, the thermal sensing structure 4 is connected to the end face of the air outlet section 22.

[0060] In this embodiment, by providing the receiving groove 220 in the air outlet section 22 and clamping the stop structure 3 in the receiving groove 220, space can be saved, the structure can be made more stable and compact, and air leakage can be better prevented when the air outlet section 22 is in the closed state, improving the heat dissipation efficiency of the CPU. The thermal sensing structure 4 is arranged at the end face of the air outlet section 22 and is fixedly connected or clamped to the end face of the air outlet section 22. The slideway 42 of the thermal sensing structure 4 communicates with the receiving groove 220 so that the stop structure 3 can slide smoothly in the receiving groove 220.

[0061] Referring Figure 7 As shown, in an implementable embodiment, the number of air outlets 221 is multiple, and the multiple air outlets 221 are arranged at intervals and are in a fence shape.

[0062] Correspondingly, in an implementable embodiment, the number of the stoppers 31 and the hollow portions 32 is multiple. The number of the stoppers 31 is not less than the number of the air outlets 221, and the number of the hollow portions 32 is not less than the number of the air outlets 221. Wherein, the stoppers 31 and the hollow portions 32 are arranged alternately.

[0063] In this embodiment, the number of the stoppers 31 and the hollow portions 32 are respectively not less than the number of the air outlets 221, so as to ensure that when the stopper 31 overlaps with the air outlet 221, each air outlet 221 can be blocked by the stopper 31 to prevent air flow, and when the hollow portion 32 overlaps with the air outlet 221, each air outlet 221 can ventilate. During the process of the air outlet 221 changing from the closed state to the fully open state, as the thermal sensing structure 4 pushes the stopper structure 3, the corresponding stopper 31 at each air outlet 221 simultaneously moves to a position between two adjacent air outlets 221, and the hollow portion 32 of the stopper structure 3 is gradually exposed at each air outlet 221.

[0064] Refer to Figures 11 to 13 As shown, the present disclosure further provides an electronic device, including a housing and electronic components 6 disposed inside the housing. A heat dissipation component as described in any one of the above implementable embodiments is further disposed inside the housing. The air outlet 221 is correspondingly disposed opposite to the electronic components 6, so that the air blown by the fan 1 can pass through the air outlet 221 and blow towards the electronic components 6.

[0065] In this embodiment, taking the electronic device as a laptop computer for example, the housing includes a C shell (referring to the housing around the keyboard and touchpad of the laptop computer) and a D shell 5 (referring to the lower housing in contact with the desktop at the bottom of the laptop computer). A heat dissipation hole 51 is formed in the D shell 5, and the heat dissipation component is disposed inside the housing and correspondingly disposed at the heat dissipation hole 51. The fan 1 discharges the hot air from the heat dissipation hole 51 to dissipate heat from the CPU. The electronic component 6 can be any component that generates heat. The air outlet 221 is arranged facing the electronic component 6 to dissipate heat from the electronic component 6. The heat sensing structure 4 is connected to the electronic component 6, and specifically can be connected to the heat generating component through a connecting member made of a heat conducting material or a high heat conducting material. Since the electronic device is provided with a heat dissipation component, an air outlet 221 is provided on the side wall 2 of the heat dissipation component, and the air from the fan 1 in the accommodation space 21 can be blown out from the air outlet 221 to dissipate heat from the chip or component. Also, since the heat dissipation component further includes a stop structure 3 and a heat sensing structure 4, the heat sensing structure 4 is connected to the stop structure 3 and can control the stop structure 3 to move along the extension direction of the air outlet section 22. Thus, when the stop portion 31 coincides with the air outlet 221, the stop portion 31 blocks the air outlet 221 to prevent the air from the fan 1 from blowing out from the air outlet 221; when the hollow portion 32 coincides with or partially coincides with the air outlet 221, the hollow portion 32 communicates with the air outlet 221, and the air from the fan 1 can be blown out from the air outlet 221. Therefore, the heat dissipation component can open and close the air outlet 221 and adjust the opening size of the air outlet 221 according to different functional requirements, solving the problem that the air outlet 221 can only continuously blow air and affect the heat dissipation effect of the CPU, and improving the heat dissipation efficiency of the electronic device.

[0066] In the description of the present disclosure, it should be understood that the orientation or positional relationship indicated by the orientation words is usually based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description. Without contrary description, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, so it cannot be understood as a limitation on the protection scope of the present disclosure; the orientation words "inside" and "outside" refer to the inside and outside relative to the contour of each component itself.

[0067] For ease of description, spatial relative terms such as "above", "over", "on the upper surface", "upper", etc. can be used here to describe the spatial positional relationship between one or more components or features shown in the figure and other components or features. It should be understood that spatial relative terms not only include the orientation of components described in the figure, but also different orientations during use or operation. For example, if the components in the attached drawings are inverted as a whole, the components "above other components or features" or "over other components or features" will include the situation where the components are "below other components or structures" or "under other components or structures". Thus, the exemplary term "above" can include both the orientation of "above" and "below". In addition, these components or features can also be positioned at other different angles (such as rotating 90 degrees or other angles), and this document intends to cover all such situations.

[0068] It should be noted that the terms used here are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present disclosure. As used here, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should also be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, components, assemblies, and / or combinations thereof.

[0069] It should be noted that the terms "first", "second", etc. in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects and do not necessarily describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of the present disclosure described here can be implemented in an order other than those illustrated or described here.

[0070] The present disclosure has been illustrated by the above embodiments, but it should be understood that the above embodiments are only for the purpose of example and illustration and are not intended to limit the present disclosure within the scope of the described embodiments. In addition, those skilled in the art can understand that the present disclosure is not limited to the above embodiments, and more variations and modifications can be made according to the teachings of the present disclosure, and these variations and modifications all fall within the scope claimed by the present disclosure. The protection scope of the present disclosure is defined by the appended claims and their equivalent scope.

Claims

1. A heat dissipation assembly, comprising a fan (1), characterized in that: Also includes: The side wall (2) is enclosed to form a containing space (21), the side wall (2) having an air outlet section (22), the air outlet section (22) being provided with an air outlet (221), and the fan (1) is located in the containing space (21); A stopper structure (3), comprising a stopper portion (31) and a hollow portion (32); as well as A thermal sensing structure (4) is connected to the stop structure (3) and is capable of controlling the stop structure (3) to move along the extension direction of the air outlet section (22) so as to adjust the relative position between the stop structure (3) and the air outlet section (22); The size of the stopper (31) is at least able to completely cover the air outlet (221), so as to prevent the wind of the fan (1) from being blown out from the air outlet (221).

2. The heat dissipation assembly according to claim 1, characterized in that: The thermal sensing structure (4) comprises a cavity (41) and a slideway (42) connected to the cavity (41); the stop structure (3) further comprises a connecting portion (33); the connecting portion (33) is embedded in the slideway (42) and is capable of sliding along the slideway (42).

3. The heat dissipation assembly according to claim 2, characterized in that: The connecting portion (33) has a first position close to the cavity (41) and a second position away from the cavity (41) in the slideway (42); when the connecting portion (33) is located at the first position, the stop portion (31) overlaps with the air outlet (221) to cover the air outlet (221); when the connecting portion (33) is located at the second position, the hollow portion (32) overlaps with the air outlet (221) to allow ventilation of the air outlet (221).

4. The heat dissipation assembly according to claim 1, characterized in that: The air outlet section (22) is provided with a receiving groove (220), the receiving groove (220) is communicated with the end surface of the air outlet section (22), and the stop structure (3) is clamped in the receiving groove (220) and is movable in the receiving groove (220).

5. The heat dissipation assembly according to claim 4, characterized in that: The thermal sensing structure (4) is connected to the end surface of the air outlet section (22).

6. The heat dissipation assembly according to claim 3, characterized in that: The thermal sensing structure (4) is capable of sensing a first temperature segment, a second temperature segment and a third temperature segment. When the thermal sensing structure (4) senses the first temperature segment, the air outlet segment (22) is in a closed state, and the stopper (31) overlaps with the air outlet (221); when the thermal sensing structure (4) senses the second temperature segment, the air outlet segment (22) is in a partially open state, and the stopper (31) partially covers the air outlet (221); when the thermal sensing structure (4) senses the third temperature segment, the air outlet segment (22) is in a fully open state, and the hollow portion (32) overlaps with the air outlet (221); wherein the temperature of the first temperature segment is lower than the temperature of the second temperature segment, and the temperature of the second temperature segment is lower than the temperature of the third temperature segment.

7. The heat dissipation assembly according to claim 1, characterized in that: The number of the air outlets (221) is multiple, and the multiple air outlets (221) are arranged at intervals.

8. The heat dissipation assembly according to claim 7, characterized in that: The number of the stop portions (31) and the hollow portions (32) is plural, the number of the stop portions (31) is not less than the number of the air outlets (221), and the number of the hollow portions (32) is not less than the number of the air outlets (221); wherein the stop portions (31) and the hollow portions (32) are arranged alternately.

9. The heat dissipation assembly according to claim 1, characterized in that: The thermal sensing structure (4) is made of heat-conducting material.

10. An electronic device, comprising a housing and an electronic component (6) arranged inside the housing, characterized in that: The shell is also provided with a heat dissipation assembly as claimed in any one of claims 1 to 9, and the air outlet (221) is arranged corresponding to the electronic component (6) so that the wind from the fan (1) can pass through the air outlet (221) and blow toward the electronic component (6).

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