Heat dissipation structure of solid state disk
By designing the cooling structure of the solid-state hard disk, using fan mounting holes and heat dissipation holes to achieve efficient heat dissipation, and improving space utilization through stacking design, the existing brackets lack heat dissipation structure and low space utilization are solved, and effective heat dissipation and space efficiency of the solid-state hard disk are improved.
Patent Information
- Application Number
- CN202421978907.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-15
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-08-15
AI Technical Summary
The existing solid-state drive bracket lacks a heat dissipation structure, which makes it difficult for the solid-state drive to dissipate heat during work. When multiple solid-state drives are placed in the chassis, the space occupancy of the bracket is not high, and more solid-state drives cannot be placed in a certain space.
A solid-state hard disk heat dissipation structure is designed, including an integrated body, a first side module and a second side module, which can achieve efficient heat dissipation through fan mounting holes and heat dissipation holes, and improve space utilization through stacking design.
It realizes effective heat dissipation of solid-state drives, ensures working temperature, improves space utilization, and facilitates the installation of multiple solid-state drives. It has the advantages of stable structure, good heat dissipation effect and practicality.
Smart Images
Figure CN222914435U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of solid state drive installation, and particularly relates to a heat dissipation structure for a solid state drive. Background Art
[0002] A solid state drive (SSD), also known as a solid state drive, is a hard disk made of a solid state electronic storage chip array. During the operation of the solid state drive, a bracket is often required to place it. Many existing brackets only simply place it without a heat dissipation structure, making it difficult for the solid state drive to dissipate heat during operation. Moreover, when multiple solid state drives need to be placed in a chassis, the bracket lacks a stacking function, resulting in a low space occupancy rate above the bracket and an inability to place more solid state drives in a certain space.
[0003] Therefore, in view of the above problems, further improvements are made. Summary of the Utility Model
[0004] The main purpose of the utility model is to provide a heat dissipation structure for a solid state drive, which is linked by a body, a first side module and a second side module, so as to install the solid state drive and dissipate heat efficiently through a fan mounting hole and a heat dissipation hole to ensure the working temperature. It also improves the space utilization rate through stacking, facilitating the installation of multiple solid state drives, and has the advantages of stable structure, good heat dissipation effect and high practicability.
[0005] To achieve the above object, the utility model provides a heat dissipation structure for a solid state drive, including a body, a first side module and a second side module which are integrally formed. The first side module and the second side module are respectively located on both sides of the body, wherein:
[0006] The body is provided with a first fan mounting hole, a second fan mounting hole, a third fan mounting hole, a first cushion block, a second cushion block and a plurality of solid state drive mounting holes. The first cushion block is located on the side close to the first side module and the second cushion block is located on the side close to the second side module. The first fan mounting hole, the second fan mounting hole, the third fan mounting hole and the solid state drive mounting holes are all located between the first cushion block and the second cushion block;
[0007] The first side module includes a first side main board and a first side sub-board. The first side sub-board is located on the side of the first side main board away from the first cushion block and above the first side main board. The top end of the first side main board is provided with a first placement block, and several first heat dissipation holes are provided on the side of the first side main board. A first solid-state drive placement groove is formed between the first cushion block and the first placement block; a second placement block is provided on the top of the first side sub-board, and a first stacking placement groove is formed between the second placement block and the first placement block;
[0008] The second side module includes a second side main board and a second side sub-board. The second side sub-board is located on the side of the second side main board away from the second cushion block and above the second side main board. The top end of the second side main board is provided with a third placement block, and several second heat dissipation holes are provided on the side of the second side main board. A second solid-state drive placement groove is formed between the second cushion block and the third placement block; a fourth placement block is provided on the top of the second side sub-board, and a second stacking placement groove is formed between the fourth placement block and the third placement block.
[0009] As a further preferred technical solution of the above technical solution, heat dissipation fans are installed in the first fan mounting hole, the second fan mounting hole, and the third fan mounting hole.
[0010] As a further preferred technical solution of the above technical solution, the solid-state drive is located between the first solid-state drive placement groove and the second solid-state drive placement groove.
[0011] As a further preferred technical solution of the above technical solution, the main body is further provided with a first limiting plate and a second limiting plate (for limiting the installation position of the solid-state drive).
[0012] As a further preferred technical solution of the above technical solution, a first stacking card slot is provided on the side of the first side main board away from the first cushion block, and a second stacking card slot is provided on the side of the second side main board away from the second cushion block; the second placement block is installed in the first stacking card slot of the adjacent stacked solid-state drive heat dissipation structure, and the fourth placement block is installed in the second stacking card slot of the adjacent stacked solid-state drive heat dissipation structure. Description of the Drawings
[0013] Figure 1 is a schematic structural diagram of a heat dissipation structure for a solid-state drive of the present utility model.
[0014] Figure 2 is a schematic structural diagram of a heat dissipation structure for a solid-state drive of the present utility model.
[0015] Figure 3 is a schematic structural diagram of a heat dissipation structure for a solid-state drive of the present utility model.
[0016] The reference numerals include: 100, the body; 110, the first fan mounting hole; 120, the second fan mounting hole; 130, the third fan mounting hole; 140, the first cushion block; 150, the second cushion block; 160, the solid-state drive mounting hole; 170, the first limiting plate; 180, the second limiting plate; 200, the first side module; 210, the first side main board; 211, the first placing block; 212, the first heat dissipation hole; 213, the first stacking card slot; 220, the first side sub-board; 221, the second placing block; 300, the second side module; 310, the second side main board; 311, the third placing block; 312, the second heat dissipation hole; 313, the second stacking card slot; 320, the second side sub-board; 321, the fourth placing block. Detailed implementation manners
[0017] The following description is used to disclose the present utility model so that those skilled in the art can implement the present utility model. The preferred embodiments in the following description are only examples, and those skilled in the art can think of other obvious variations. The basic principles defined in the following description of the present utility model can be applied to other implementation schemes, variant schemes, improvement schemes, equivalent schemes, and other technical schemes that do not depart from the spirit and scope of the present utility model.
[0018] The present utility model discloses a heat dissipation structure for a solid-state drive. The specific embodiments of the utility model will be further described below in conjunction with the preferred embodiments.
[0019] In the embodiments of the present utility model, those skilled in the art should note that the solid-state drive and the like involved in the present utility model can be regarded as the prior art.
[0020] Preferred embodiment.
[0021] As Figures 1-3 shown, the present utility model discloses a heat dissipation structure for a solid-state drive, including an integrally formed body 100, a first side module 200, and a second side module 300. The first side module 200 and the second side module 300 are respectively located on both sides of the body 100, wherein:
[0022] The body 100 is provided with a first fan mounting hole 110, a second fan mounting hole 120, a third fan mounting hole 130, a first cushion block 140, a second cushion block 150, and a plurality of solid-state drive mounting holes 160. The first cushion block 140 is located on the side close to the first side module 200, and the second cushion block 150 is located on the side close to the second side module 300. The first fan mounting hole 110, the second fan mounting hole 120, the third fan mounting hole 130, and the solid-state drive mounting hole 160 are all located between the first cushion block 140 and the second cushion block 150;
[0023] The first side module 200 includes a first side main board 210 and a first side sub-board 220. The first side sub-board 220 is located on the side of the first side main board 210 away from the first cushion block 140 and above the first side main board 210. A first placement block 211 is provided at the top end of the first side main board 210, and a number of first heat dissipation holes 212 are provided on the side of the first side main board 210. A first solid-state drive placement groove is formed between the first cushion block 140 and the first placement block 211; a second placement block 221 is provided at the top of the first side sub-board 220, and a first stacking placement groove is formed between the second placement block 221 and the first placement block 211;
[0024] The second side module 300 includes a second side main board 310 and a second side sub-board 320. The second side sub-board 320 is located on the side of the second side main board 310 away from the second cushion block 150 and above the second side main board 310. A third placement block 311 is provided at the top end of the second side main board 310, and a number of second heat dissipation holes 312 are provided on the side of the second side main board 320. A second solid-state drive placement groove is formed between the second cushion block 150 and the third placement block 311; a fourth placement block 321 is provided at the top of the second side sub-board 320, and a second stacking placement groove is formed between the fourth placement block 321 and the third placement block 311.
[0025] Specifically, heat dissipation fans (not shown) are installed in the first fan mounting hole 110, the second fan mounting hole 120, and the third fan mounting hole 130.
[0026] More specifically, the solid-state drive is located between the first solid-state drive placement groove and the second solid-state drive placement groove.
[0027] Furthermore, the body 110 is also provided with a first limiting plate 170 and a second limiting plate 180 (for limiting the installation position of the solid-state drive).
[0028] Even further, a first stacking card slot 213 is provided on the side of the first side main board 210 away from the first cushion block 140, and a second stacking card slot 313 is provided on the side of the second side main board 310 away from the second cushion block 150; the second placement block is installed in the first stacking card slot of the adjacent stacked solid-state drive heat dissipation structure, and the fourth placement block is installed in the second stacking card slot of the adjacent stacked solid-state drive heat dissipation structure.
[0029] Regarding the present utility model:
[0030] When the solid-state drive is working, on the one hand, effective heat dissipation is carried out through three cooling fans at the bottom, and on the other hand, heat can be dissipated through the first / second heat dissipation holes on both sides to ensure the working temperature. When stacking is required, place the body of another solid-state drive heat dissipation structure between the first / second stacking slots, and the bottom of the body of another solid-state drive heat dissipation structure is closely attached to the tops of the first placement block and the third placement block of the current solid-state drive heat dissipation structure. And to improve stability, insert the second placement block of the current solid-state drive heat dissipation structure into the first stacking card slot of the adjacent stacked solid-state drive heat dissipation structure, and insert the fourth placement block of the current solid-state drive heat dissipation structure into the second stacking card slot of the adjacent stacked solid-state drive heat dissipation structure.
[0031] It is worth mentioning that the technical features such as the solid-state drive involved in the patent application of the present utility model should be regarded as the prior art. The specific structures, working principles, and possible control methods and spatial arrangement methods of these technical features can be selected conventionally in the art, and should not be regarded as the inventive points of the patent of the present utility model. The patent of the present utility model will not be further specifically elaborated.
[0032] For those skilled in the art, it is still possible to modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.
Claims
1. A solid state hard disk heat dissipation structure, characterized in that: The device comprises an integrally formed body, a first side module and a second side module, wherein the first side module and the second side module are respectively located on two sides of the body, wherein: The body is provided with a first fan mounting hole, a second fan mounting hole, a third fan mounting hole, a first cushion block, a second cushion block and a plurality of solid state drive mounting holes, the first cushion block is located on a side close to the first side module and the second cushion block is located on a side close to the second side module, and the first fan mounting hole, the second fan mounting hole, the third fan mounting hole and the solid state drive mounting hole are all located between the first cushion block and the second cushion block; The first side module comprises a first side main board and a first side sub-board, the first side sub-board is located on a side of the first side main board away from the first cushion block and the first side sub-board is located above the first side main board, a first placement block is provided on the top of the first side main board and a plurality of first heat dissipation holes are provided on the side of the first side main board, a first solid state hard disk placement slot is formed between the first cushion block and the first placement block; a second placement block is provided on the top of the first side sub-board and a first stacking placement slot is formed between the second placement block and the first placement block; The second side module includes a second side main board and a second side sub-board, the second side sub-board is located on a side of the second side main board away from the second pad block and the second side sub-board is located above the second side main board, a third placement block is provided at the top of the second side main board and a plurality of second heat dissipation holes are provided on the side of the second side main board, a second solid-state hard disk placement slot is formed between the second pad block and the third placement block; a fourth placement block is provided on the top of the second side sub-board and a second stacking placement slot is formed between the fourth placement block and the third placement block.
2. A solid state hard disk heat dissipation structure according to claim 1, characterized in that: The first fan installation hole, the second fan installation hole and the third fan installation hole are all used to install a heat dissipation fan.
3. A solid state hard disk heat dissipation structure according to claim 2, characterized in that: The solid state hard disk is located between the first solid state hard disk placement slot and the second solid state hard disk placement slot.
4. A solid state hard disk heat dissipation structure according to claim 3, characterized in that: The main body is also provided with a first limiting plate and a second limiting plate.
5. A solid state hard disk heat dissipation structure according to claim 4, characterized in that: A first stacking slot is provided on a side of the first side mainboard away from the first pad block, and a second stacking slot is provided on a side of the second side mainboard away from the second pad block; the second placement block is installed in the first stacking slot of an adjacent stacked solid-state hard disk heat dissipation structure, and the fourth placement block is installed in the second stacking slot of an adjacent stacked solid-state hard disk heat dissipation structure.