Memory with automatic heat dissipation function

Abstract

The utility model discloses a memory with an automatic heat dissipation function. The memory comprises a shell, a mainboard, a storage element and a cooling fan, a containing cavity is defined by the shell, an air inlet hole and an air outlet hole are formed in the left side and the right side of the shell respectively, and the air inlet hole and the air outlet hole are both communicated with the containing cavity; the main board is mounted in the accommodating cavity; the storage element is arranged in the accommodating cavity and is electrically connected with the mainboard; the cooling fan is installed in the containing cavity and electrically connected with the mainboard. The cooling fan is used for sucking air outside the shell through the air inlet hole and enabling the air to flow out through the air outlet hole so as to take away heat in the containing cavity. Therefore, the memory can take away heat generated when the mainboard and the storage element in the containing cavity work through the cooling fan, the temperature in the containing cavity is effectively reduced, the situation that the mainboard and the storage element are too high in temperature and affect efficiency and even are damaged is avoided, and the high speed and the safety of data storage are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment, in particular to a memory with automatic heat dissipation function. BACKGROUND

[0002] The rapid development of electronic technology makes the function of electronic equipment more and more rich, which leads to more and more data stored in the electronic equipment. In order to reduce the influence of too much data on the processing speed of the electronic equipment, part of the data can be stored in the portable memory for storage, which not only reduces the influence of too much data stored in the electronic equipment on the processing speed, but also is more convenient to carry and use. Therefore, the portable memory is more and more favored by people.

[0003] In the prior art, in order to reduce the size, the portable memory is generally only provided with an outer shell outside the memory. When the memory exchanges data for a long time, a large amount of heat may be generated, which may affect the speed of data exchange, and even may burn the memory, resulting in data loss and affecting the use of users. CONTENT OF THE INVENTION

[0004] The embodiment of the present application provides a memory with automatic heat dissipation function, which can reduce the influence of poor heat dissipation of the portable memory during long time use.

[0005] The memory with automatic heat dissipation function provided by the embodiment of the present application comprises a shell, a mainboard, a storage element and a heat dissipation fan, the shell is enclosed to form a containing cavity, the left side of the shell and the right side of the shell are respectively provided with an air inlet hole and an air outlet hole, the air inlet hole and the air outlet hole are both in communication with the containing cavity; the mainboard is installed in the containing cavity; the storage element is installed in the containing cavity and is electrically connected with the mainboard; the heat dissipation fan is installed in the containing cavity and is electrically connected with the mainboard, and the heat dissipation fan is used for sucking the air outside the shell into the air inlet hole and flowing out of the air outlet hole to take away the heat in the containing cavity.

[0006] In the memory with automatic heat dissipation function provided by the embodiment of the present application, the memory can suck the air outside the shell into the air inlet hole and flow out of the air outlet hole through the heat dissipation fan to take away the heat generated by the mainboard and the storage element during work, effectively reduce the temperature inside the containing cavity, avoid the case that the temperature of the mainboard and the storage element is too high to affect the efficiency or even damage, and improve the high speed and safety of data storage.

[0007] In some embodiments, the left side of the shell is provided with an air inlet plug, the air inlet hole is arranged on the air inlet plug, the right side of the shell is provided with an air outlet plug, and the air outlet hole is arranged on the air outlet plug.

[0008] In some embodiments, the air inlet head is formed with a channel structure facing the accommodating cavity, the heat dissipation fan is provided with an air inlet opening, the channel structure is in communication with the air inlet opening to form an air inlet channel, and the heat dissipation fan is provided with an air outlet opening in communication with the accommodating cavity.

[0009] In some embodiments, the air outlet head is formed with a limiting protrusion facing one side of the accommodating cavity, and the limiting protrusion is used for limiting the mainboard.

[0010] In some embodiments, the memory further comprises a magnetic attraction element attached to the bottom of the shell and used for attracting external equipment.

[0011] In some embodiments, the memory further comprises at least one data interface male head and one data interface female head, and the data interface male head and the data interface female head are electrically connected to the mainboard.

[0012] In some embodiments, the memory further comprises a data line, one end of the data line is electrically connected to the data interface male head, and the other end is used for connecting to external equipment when the external equipment is attracted by the magnetic attraction element on the bottom of the shell.

[0013] In some embodiments, the shell comprises a main body and a bottom cover detachably connected to the main body, the bottom cover is provided with a mounting position, and the magnetic attraction element is mounted on the mounting position.

[0014] In some embodiments, the memory further comprises a display screen, the shell is internally provided with a support frame, the display screen is fixed on the support frame and electrically connected to the mainboard, and the top of the shell is at least partially transparent.

[0015] In some embodiments, the shell comprises a main body and a top cover detachably connected to the main body, and the top cover is at least partially transparent.

[0016] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0017] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description, including the appended drawings.

[0018] Figure 1 is a perspective view of the memory in the embodiment of the present application;

[0019] Figure 2 is a sectional view of the memory in the embodiment of the present application along the direction of A-A; Figure 1 ​

[0020] Figure 3 is a schematic diagram of a disassembled structure of the memory in the embodiment of the present application;

[0021] Figure 4 is a schematic diagram of a three-dimensional structure of the heat dissipation fan in the embodiment of the present application;

[0022] Figure 5 is a schematic diagram of a three-dimensional structure of the memory in the embodiment of the present application from another angle;

[0023] Figure 6 is a schematic diagram of a connection between the memory and the data line in the embodiment of the present application.

[0024] Main component symbol explanation:

[0025] The memory 100;

[0026] The shell 10, the accommodating cavity 11, the air inlet plug 12, the air inlet hole 121, the channel structure 122, the air outlet plug 13, the air outlet hole 131, the limiting protrusion 132, the supporting protrusion 133, the bottom cover 14, the mounting position 141, the main body 15, the top cover 16, the supporting frame 17;

[0027] The mainboard 20;

[0028] The storage element 30;

[0029] The heat dissipation fan 40, the air inlet opening 41, and the air outlet opening 42;

[0030] The magnetic attraction member 50, the display screen 60, the data interface male head 61, the data interface female head 62, the data line 70, the first end 71, the wire body 72, the connecting arm 73, and the second end 74. DETAILED DESCRIPTION

[0031] The embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0032] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0033] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0034] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] The following disclosure provides many different embodiments, or examples, for implementing different structures of the present application. For the purpose of simplifying the present application, the components and arrangements of specific examples are described in the following. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to numbers and / or letters in different examples, and such repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art can realize the application of other processes and / or the use of other materials.

[0036] Please refer to Figures 1-3 The memory 100 with automatic heat dissipation function of the embodiment of the present application comprises a shell 10, a mainboard 20, a storage element 30 and a heat dissipation fan 40, the shell 10 is enclosed to form a containing cavity 11, the left side of the shell 10 and the right side of the shell 10 are respectively provided with an air inlet hole 121 and an air outlet hole 131, the air inlet hole 121 and the air outlet hole 131 are both communicated with the containing cavity 11; the mainboard 20 is installed in the containing cavity 11; the storage element 30 is installed in the containing cavity 11 and is electrically connected with the mainboard 20; the heat dissipation fan 40 is installed in the containing cavity 11 and is electrically connected with the mainboard 20, and the heat dissipation fan 40 is used for sucking the air outside the shell 10 into the air inlet hole 121 and flowing out of the air outlet hole 131 to take away the heat in the containing cavity 11.

[0037] In the memory 100 with automatic heat dissipation function of the embodiment of the present application, the memory 100 can suck the air outside the shell 10 into the air inlet hole 121 and flow out of the air outlet hole 131 by the heat dissipation fan 40 to take away the heat generated by the mainboard 20 and the storage element 30 when working, effectively reduce the temperature inside the containing cavity 11, avoid the case that the temperature of the mainboard 20 and the storage element 30 is too high to affect the efficiency or even damage, and improve the speed and safety of data storage.

[0038] Specifically, the shell 10 can generally have a rectangular structure, and the containing cavity 11 is formed in the hollow inside to accommodate the installation of the mainboard 20, the storage element 30, the heat dissipation fan 40 and the like. The shell 10 is mainly used for protecting the internal elements, and thus the shell 10 can generally be made of metal material, having good pressure resistance and heat dissipation, such as aluminum alloy material. Of course, the shape and material of the shell 10 are not limited in the present application.

[0039] The mainboard 20 can generally be a printed circuit board, mainly used for realizing the electrical connection between various elements in the circuit of the memory 100, so that the whole circuit can normally operate. The mainboard 20 is fixedly installed in the containing cavity 11, and can be fixed by screws, clamps and the like, and the fixing mode of the mainboard 20 in the containing cavity 11 is not limited in the present application.

[0040] The storage element 30 can be a chip for storage. The storage element 30 is also fixedly installed in the accommodating cavity 11 and electrically connected with the mainboard 20, so that data can be input or output to the storage element 30 through the mainboard 20. Further, the storage element 30 can be electrically connected with the mainboard 20 by welding or the like, which is not limited in the present application.

[0041] Based on Figure 1 The left side and the right side of the shell 10 are respectively formed with an air inlet hole 121 and an air outlet hole 131, and a plurality of air inlet holes 121 and air outlet holes 131 can be provided, which is not limited in the present application. The heat dissipation fan 40 is fixedly installed in the accommodating cavity 11. Preferably, the heat dissipation fan 40 can be arranged on one side of the accommodating cavity 11 close to the air inlet hole 121, so that the heat dissipation fan 40 can better suck air from the air inlet hole 121 and accelerate the air circulation in the accommodating cavity 11.

[0042] When the memory 100 starts to run, the heat dissipation fan 40 also starts to run, which can suck external air from the air inlet hole 121 and discharge internal hot air from the air outlet hole 131 to realize the gas exchange between the accommodating cavity 11 and the outside of the shell 10, take out the heat generated by the elements such as the mainboard 20 in the accommodating cavity 11, so as to achieve the effect of effectively dissipating heat of the elements in the accommodating cavity 11 and avoid the situation of overheating of the elements.

[0043] Please refer to Figure 2 and Figure 3 In some embodiments, the left side of the shell 10 is provided with an air inlet plug 12, and the air inlet hole 121 is arranged on the air inlet plug 12. The right side of the shell 10 is provided with an air outlet plug 13, and the air outlet hole 131 is arranged on the air outlet plug 13.

[0044] In this way, the user can replace different air inlet plugs 12 or air outlet plugs 13 according to different use scenarios to adjust the air volume or air inlet angle, etc. At the same time, corresponding structures can be arranged on the plugs on both sides to cooperate with the installation and fixation of the elements in the accommodating cavity 11 and the operation.

[0045] Specifically, the left side of the shell 10 can be provided with a mounting hole position matched with the shape of the air inlet plug 12, the air inlet plug 12 is detachably arranged on the left side of the shell 10, and the air inlet hole 121 is formed on the air inlet plug 12. The right side of the shell 10 can be provided with a mounting hole position matched with the shape of the air outlet plug 13, the air outlet plug 13 is detachably arranged on the right side of the shell 10, and the air outlet hole 131 is formed on the air outlet plug 13. The air inlet plug 12 and the air outlet plug 13 can be provided in square, circular and other shapes, which are not limited in the application. Further, the air inlet plug 12 and the air outlet plug 13 are provided in a split structure with the shell 10, which can also facilitate the mold opening manufacturing of the shell 10, avoiding the increase of manufacturing cost due to the complexity of the overall structure.

[0046] Please refer to Figures 2-4 In some embodiments, the air inlet plug 12 is formed with a channel structure 122 towards the accommodating cavity 11, the heat dissipation fan 40 is provided with an air inlet opening 41, the channel structure 122 and the air inlet opening 41 are in communication to form an air inlet channel, and the heat dissipation fan 40 is provided with an air outlet opening 42, which is in communication with the accommodating cavity 11.

[0047] In this way, the heat dissipation fan 40 can increase the air inlet amount through cooperation with the channel structure 122, so that the inhaled air can better flow into the accommodating cavity 11 from the air outlet opening 42 of the heat dissipation fan 40, and the heat dissipation effect of the heat dissipation fan 40 is improved.

[0048] Specifically, the heat dissipation fan 40 is provided with an air inlet opening 41 towards the side of the air inlet hole 121, the air inlet plug 12 is provided with a channel structure 122 towards the inside of the accommodating cavity 11, the channel structure 122 extends inwardly corresponding to the air inlet opening 41, and an air inlet channel is formed, which can play a role in airflow guiding, so that the air inlet amount of the heat dissipation fan 40 is sufficient when it operates, and the heat dissipation effect of the heat dissipation fan 40 is improved.

[0049] Preferably, the air inlet hole 121 can be provided on the air inlet plug 12 corresponding to the channel structure 122, so that the airflow formed by the heat dissipation fan 40 can only be inhaled through the air inlet channel and then discharged through the air outlet hole 131, and will not be discharged from the side of the air inlet plug 12. The inhaled air enters from the left side of the accommodating cavity 11 and is discharged from the right side of the accommodating cavity 11, which can better dissipate heat for the internal components, avoid inhaling from the left side and discharging from the left side, and weaken the heat dissipation effect.

[0050] Of course, in some other embodiments, the channel structure 122 can also be provided to extend from the air outlet opening 42 of the heat dissipation fan 40 towards the air inlet plug 12, and form an air inlet channel corresponding to the air inlet hole 121 on the air inlet plug 12, which is not limited in the application.

[0051] Please refer to Figure 2In some embodiments, the air outlet plug 13 is provided with a limiting protrusion 132 on the side facing the accommodating cavity 11, which is used to limit the main board 20.

[0052] In this way, the main board 20 installed in the accommodating cavity 11 is fixed more firmly, avoiding the internal main board 20 from shaking due to the accidental falling of the memory 100, and improving the stability of the overall structure of the memory 100.

[0053] Specifically, the limiting protrusion 132 can extend from the inner wall of the air outlet plug 13 to the inside of the accommodating cavity 11. When the air outlet plug 13 is installed in place, the limiting protrusion 132 can be clamped on the upper side of the main board 20 to limit the main board 20 to a certain extent, avoiding the main board 20 from shaking up and down in the accommodating cavity 11, and improving the stability of the internal elements of the accommodating cavity 11.

[0054] Please refer to Figure 2 and Figure 3 In some embodiments, the memory 100 further comprises a magnetic member 50 attached to the bottom of the shell 10, which is used to attract external devices.

[0055] In this way, when the user uses the memory 100, the memory 100 can be attracted to the external device through the magnetic member 50 at the bottom, avoiding shaking due to the movement of the external device, causing unstable connection or even falling off, affecting the user's use.

[0056] Specifically, the magnetic member 50 can include a magnet or other magnetic member, and the magnetic member 50 can be fixedly installed on the bottom of the shell 10. When the memory 100 is connected and used with a mobile external device such as a mobile phone, tablet or notebook computer, it is inevitable to use in a moving state. When moving, the memory 100 will shake with the movement of the external device, which may cause the data line 70 to separate from the external device or the memory 100 to separate from the data line 70, affecting the user's data transmission. Therefore, the memory 100 can be attracted to the external device through the magnetic member 50 to avoid the above situation, improve the data security of the memory 100 when moving, and also avoid damage caused by the falling of the memory 100.

[0057] Please refer to Figure 3 and Figure 5 In some embodiments, the memory 100 further comprises at least one data interface male head 61 and one data interface female head 62, which are electrically connected with the main board 20.

[0058] In this way, the memory 100 can be connected to an external device through the data interface male head 61 or the data interface female head 62, and the two interfaces are arranged to enable the memory 100 to be adapted to different external devices, thereby improving the adaptability of the memory 100.

[0059] Specifically, the shell 10 can be provided with openings corresponding to the data interface male head 61 and the data interface female head 62. One end of the data interface male head 61 is electrically connected to the main board 20, and the other end extends out of the shell 10 through the opening to facilitate connection with an external device. In some embodiments, the memory 100 further comprises a wire head support fixed to the opening for supporting the data interface male head 61, thereby improving the stability of the data interface male head 61. One end of the data interface female head 62 is electrically connected to the main board 20, and the other end faces the corresponding opening. The male head on the external data line 70 can be connected to the data interface female head 62 to achieve connection with an external device.

[0060] Of course, the memory 100 can be provided with only the data interface male head 61, only the data interface female head 62, or both the data interface male head 61 and the data interface female head 62, and the present application does not make specific limitations in this regard.

[0061] Please refer to Figure 3 and Figure 6 In some embodiments, the memory 100 further comprises a data line 70. When an external device is attracted by the magnetic member 50 at the bottom of the shell 10, one end of the data line 70 is electrically connected to the data interface male head 61, and the other end is used to connect with the external device.

[0062] Specifically, the data line 70 can comprise a first end 71, a wire body 72, a connecting arm 73, and a second end 74 connected in sequence. The first end 71 is used to connect with the data interface male head 61 or the data interface female head 62, the second end 74 is used to connect with the external device, one end of the connecting arm 73 is connected to the second end 74, and the other end is connected to the wire body 72, so that the first end 71 and the second end 74 are in the same direction. Furthermore, when the memory 100 is connected to an external device through the data line 70 and the memory 100 is attracted to the external device, the data line 70 can be more closely located at the back of the electronic device, avoiding the connection end of the data line 70 extending out to affect the use effect.

[0063] Please refer to Figure 2 and Figure 3 In some embodiments, the shell 10 comprises a main body 15 and a bottom cover 14 detachably connected to the main body 15. The bottom cover 14 is provided with a mounting position 141, and the magnetic member 50 is mounted on the mounting position 141.

[0064] In this way, the detachable arrangement of the bottom cover 14 and the main body 15 enables the accommodation cavity 11 to be open to the outside, facilitating the installation or replacement of the magnetic member 50, and the mounting position 141 on the bottom cover 14 can limit the position of the magnetic member 50, improving the stability of the magnetic member 50.

[0065] Specifically, the bottom cover 14 can include the bottom of the entire shell 10, and the bottom cover 14 and the main body 15 jointly enclose the accommodation cavity 11. Of course, the bottom cover 14 can also only include part of the bottom of the shell 10, and can be detached with respect to the main body 15 to facilitate the installation or replacement of the magnetic member 50.

[0066] The bottom cover 14 can be formed with a mounting position 141 matched with the shape of the magnetic member 50, and the magnetic member 50 can be fixed at the mounting position 141 by adhesion, embedding or other means to limit the position of the magnetic member 50, so that the magnetic member 50 can be fixed on the bottom cover 14. The mounting position 141 can be arranged on the inner side of the bottom cover 14 or on the outer side of the bottom cover 14, or the mounting position 141 is in the form of a hole, and the magnetic member 50 is embedded in the hole. The application does not make specific limitations in this regard.

[0067] Please refer to Figure 2 and Figure 3 In some embodiments, the memory 100 further includes a display screen 60, and the shell 10 is internally provided with a support frame 17, the display screen 60 is fixed on the support frame 17 and electrically connected with the main board 20, and the top of the shell 10 is at least partially transparent.

[0068] In this way, the memory 100 can display the current storage space and other information through the display screen 60, and the user can more intuitively understand the current state of the memory 100.

[0069] Specifically, the display screen 60 can include a small LED screen. The support frame 17 can be in the form of a plate structure installed in the accommodation cavity 11, and the display screen 60 can be fixed on the top of the support frame 17. The support frame 17 can be provided with a through hole for the passage of the wire, and the wire of the display screen 60 can pass through the through hole to achieve electrical connection with the main board 20. The top of the shell 10 can be transparent in the region corresponding to the display screen 60, so that the display content on the display screen 60 can be seen from the outside.

[0070] Further, the two sides of the support frame 17 can be respectively placed on the left and right air inlet plugs 12 and air outlet plugs 13, and the inner sides of the air inlet plugs 12 and the air outlet plugs 13 can be provided with support protrusions 133 for supporting and fixing the support frame 17. Of course, since the inner side of the air inlet plug 12 is formed with a channel structure 122, the support frame 17 can be fixed on the channel structure 122. The application does not limit the fixing mode of the support frame 17 in the accommodation cavity 11.

[0071] Please refer to Figure 2 andFigure 3 In some embodiments, the shell 10 comprises a main body 15 and a top cover 16 detachably connected with the main body 15, and the top cover 16 is at least partially light-transmissive.

[0072] Specifically, the top cover 16 can be entirely made of a material with light-transmissivity such as glass or plastic, or can be partially made of a material with light-transmissivity, so as to not only have certain rigidity, but also enable the content on the display screen 60 to be displayed externally. The material of the top cover 16 is not limited in the present application.

[0073] Further, the detachable arrangement of the top cover 16 and the main body 15 enables the accommodating cavity 11 to be open to the outside, so as to facilitate the installation of various elements inside the accommodating cavity 11. After the top cover 16 is opened, the elements can be installed inside the accommodating cavity 11 through the upper portion of the main body 15, and the elements can also be replaced when damaged later.

[0074] In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0075] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A memory with automatic heat dissipation function, characterized in that, include: The housing encloses a receiving cavity, and an air inlet and an air outlet are respectively provided on the left and right sides of the housing, and both the air inlet and the air outlet communicate with the receiving cavity; Motherboard, the motherboard being installed within the accommodating cavity; Storage element, the storage element being mounted within the accommodating cavity and electrically connected to the motherboard; and A cooling fan is installed inside the accommodating cavity and electrically connected to the motherboard. The cooling fan is used to draw in air from outside the housing through the air inlet and let it flow out through the air outlet to remove heat from the accommodating cavity. An air inlet plug is provided on the left side of the housing, and an air inlet hole is provided on the air inlet plug. An air outlet plug is provided on the right side of the housing, and an air outlet hole is provided on the air outlet plug.

2. The memory with automatic heat dissipation function according to claim 1, characterized in that, The air inlet plug has a channel structure facing the accommodating cavity, the cooling fan has an air inlet opening, the channel structure is connected to the air inlet opening to form an air inlet channel, and the cooling fan has an air outlet opening that is connected to the accommodating cavity.

3. The memory with automatic heat dissipation function according to claim 1, characterized in that, The air outlet plug has a limiting protrusion on the side facing the accommodating cavity, and the limiting protrusion is used to limit the motherboard.

4. The memory with automatic heat dissipation function according to claim 1, characterized in that, The memory also includes a magnetic clasp that fits against the bottom of the housing for attaching external devices.

5. The memory with automatic heat dissipation function according to claim 4, characterized in that, The memory also includes at least one male data interface connector and one female data interface connector, which are electrically connected to the motherboard.

6. The memory with automatic heat dissipation function according to claim 5, characterized in that, The memory also includes a data cable. When an external device is attracted to the magnetic connector at the bottom of the housing, one end of the data cable is electrically connected to the male connector of the data interface, and the other end is used to connect to the external device.

7. The memory with automatic heat dissipation function according to claim 4, characterized in that, The housing includes a main body and a bottom cover detachably connected to the main body. The bottom cover has a mounting position, and the magnetic component is mounted on the mounting position.

8. The memory with automatic heat dissipation function according to claim 1, characterized in that, The memory also includes a display screen. A support frame is provided inside the housing. The display screen is fixed on the support frame and electrically connected to the motherboard. At least part of the top of the housing is translucent.

9. The memory with automatic heat dissipation function according to claim 8, characterized in that, The housing includes a main body and a top cover detachably connected to the main body, the top cover being at least partially translucent.

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