Fixing device and semiconductor die bonder

Abstract

The utility model discloses a fixing device, and discloses a semiconductor die bonder with the fixing device, the fixing device comprises a pedestal, a heating disc, a fixing disc and a lifting block, the heating disc is installed on the pedestal; the fixing disc is detachably installed on the surface of the heating disc, a first air channel is arranged in the fixing disc, the two ends of the first air channel are a first air exhaust end and a first negative pressure end respectively, the first air exhaust end is arranged on the side wall of the fixing disc and connected with a negative pressure generator, and the first negative pressure end is arranged on the upper surface of the fixing disc in a penetrating mode. A plurality of concave positions are formed in the edge of the fixed disc; the lifting block can be embedded in the concave position in an up-down lifting mode. The semiconductor wafer placed on the fixing disc is fixed through the first air channel, position deviation of the semiconductor wafer in the follow-up machining process is avoided, and the machining precision is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor processing equipment, in particular to a fixing device and a semiconductor crystal bonding machine. Background Art

[0002] The advantages of gallium nitride semiconductor power devices are higher switching frequency, low internal resistance, less loss, and high power conversion rate. In the process of processing gallium nitride power devices, a solid crystal process is required. At present, there are semiconductor solid crystal machines for solid crystal on the market. For example, the utility model patent with application number CN202122999112.0 discloses a wafer fixing device and a solid crystal machine having the same. The wafer fixing device includes: a fixing table, a positioning hole is provided on the fixing table; a fixing component, the fixing component is placed in the positioning hole, the fixing component is provided with a mounting groove, the mounting groove is used to place the wafer ring, the fixing component includes a flange, and the flange is located outside the positioning hole; a limiter component, multiple limiters are arranged on the fixing table along the circumference of the positioning hole, and the limiter component includes an upper pulley abutting against the upper part of the flange and a lower pulley abutting against the lower part of the flange, and the flange can slide between the upper pulley and the lower pulley. The device is used for solid crystal assembly of the wafer, but the wafer or carrier position is easily offset during processing, which affects the actual processing accuracy. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a fixing device that can prevent the semiconductor wafer from positionally shifting during subsequent processing and improve processing accuracy.

[0004] The utility model also provides a semiconductor die bonding machine having the fixing device.

[0005] According to the first aspect of the present invention, the fixing device includes a base, a heating plate, a fixed plate and a lifting block, the heating plate is installed on the base; the fixed plate is detachably installed on the surface of the heating plate, the fixed plate has a first air duct built in, the two ends of the first air duct are respectively a first air suction end and a first negative pressure end, the first air suction end is arranged on the side wall of the fixed plate and is connected to a negative pressure generator, the first negative pressure end is arranged through the upper surface of the fixed plate, and a plurality of recesses are arranged on the edge of the fixed plate; the lifting block is embedded in the recess and can be raised and lowered.

[0006] The fixing device according to the embodiment of the utility model has at least the following beneficial effects: the semiconductor wafer placed on the fixing plate is fixed by using the first air duct to avoid positional displacement in subsequent processing and improve processing accuracy.

[0007] According to some embodiments of the utility model, the fixed plate has a built-in second air duct, the two ends of the second air duct are respectively a second air suction end and a second negative pressure end, the second air suction end is arranged on the side wall of the fixed plate and is connected to a negative pressure generator, and the second negative pressure end is arranged through the lower surface of the fixed plate.

[0008] According to some embodiments of the present invention, a heat insulation board for isolating heat is provided between the heating plate and the base.

[0009] According to some embodiments of the utility model, the base is provided with a built-in cooling water channel, and the cooling water channel has a water inlet joint and a water outlet joint, and the water inlet joint and the water outlet joint are arranged on the outer side of the base.

[0010] According to some embodiments of the present invention, the cooling water channel is arranged in a winding shape inside the base.

[0011] According to some embodiments of the utility model, a telescopic rod is fixedly connected to the lower end of the lifting block, and the telescopic rod is fixed on the base.

[0012] According to some embodiments of the present utility model, a plurality of first negative pressure ends are provided, and the plurality of first negative pressure ends are arranged around the center of the fixed disk at intervals.

[0013] A semiconductor die bonding machine according to an embodiment of the second aspect of the utility model comprises a workbench and the fixing device of the embodiment of the first aspect of the utility model, and the base is pivotally mounted above the workbench.

[0014] The semiconductor die bonder according to the embodiment of the utility model has at least the following beneficial effects: the semiconductor wafer placed on the fixed plate is fixed by the first air duct to avoid positional displacement in subsequent processing and to improve processing accuracy.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0017] Figure 1 A schematic diagram of a fixing device according to an embodiment of the utility model;

[0018] Figure 2 A schematic diagram of a fixing plate of a fixing device according to an embodiment of the utility model;

[0019] Figure 3 for Figure 2A magnified schematic diagram of part A;

[0020] Figure 4 for Figure 2 An enlarged schematic diagram of part B;

[0021] Figure 5 A schematic diagram of a fixing plate of a fixing device according to another embodiment of the utility model;

[0022] Figure 6 It is a cross-sectional schematic diagram of a base of a fixing device according to an embodiment of the utility model;

[0023] 100, base; 110, cooling water channel; 111, water inlet joint; 112, water outlet joint;

[0024] 200, heating plate;

[0025] 300, fixed plate; 310, first air duct; 311, first air extraction end; 312, first negative pressure end; 320, second air duct; 321, second air extraction end; 322, second negative pressure end; 330, concave position;

[0026] 400, lifting block; 410, telescopic rod;

[0027] 500, heat insulation board; DETAILED DESCRIPTION

[0028] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0029] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0030] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0031] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0032] The semiconductor die bonding machine of the present invention comprises a workbench (not shown) and a fixing device, wherein the base 100 is pivotally mounted above the workbench. The fixing device is used to place semiconductor wafers and wait for subsequent processing, wherein the semiconductor wafers are fixed to the workbench and the fixing device is mounted on the workbench. Figures 1 to 6 The fixing device includes a base 100, a heating plate 200, a fixed plate 300 and a lifting block 400. The heating plate 200 is installed on the base 100; the fixed plate 300 is detachably installed on the surface of the heating plate 200, and the fixed plate 300 is provided with a first air duct 310. The two ends of the first air duct 310 are respectively a first air extraction end 311 and a first negative pressure end 312. The first air extraction end 311 is arranged on the side wall of the fixed plate 300 and is connected to a negative pressure generator. The first negative pressure end 312 is arranged through the upper surface of the fixed plate 300, and a plurality of recesses 330 are arranged on the edge of the fixed plate 300; the lifting block 400 is embedded in the recess 330 and can be lifted up and down.

[0033] In actual use, refer to Figure 1 , the semiconductor wafer is placed on the fixed plate 300 under the clamping of a robot arm (not shown in the figure), and the negative pressure generator is started at the same time to form a negative pressure at the first negative pressure end 312, and adsorb the semiconductor wafer. After adsorption and fixation, it is subsequently processed by the processing structure. During the entire processing process, the semiconductor wafer placed on the fixed plate 300 is fixed by the first air duct 310 to avoid position displacement during subsequent processing and improve processing accuracy; in addition, the heating plate 200 can preheat the fixed plate 300, or continue to heat the fixed plate 300 during processing, so as to meet some specific process requirements; further, the multiple lifting blocks 400 located at the edge of the fixed plate 300 can be lifted by rising to lift the semiconductor wafer placed on the fixed plate 300, so as to facilitate the retrieval of the semiconductor wafer after processing.

[0034] It is worth mentioning that, refer to Figure 2 , Figure 3 and Figure 4In order to install the fixing plate and the heating plate 200 so that the heating plate 200 and the fixing plate 300 are fixed in relative position, the fixing plate 300 is built with a second air duct 320, and the two ends of the second air duct 320 are respectively a second air extraction end 321 and a second negative pressure end 322, the second air extraction end 321 is arranged on the side wall of the fixing plate 300, and is connected to a negative pressure generator, and the second negative pressure end 322 is arranged through the lower surface of the fixing plate 300. The negative pressure generator generates negative pressure at the second negative pressure end 322 to adsorb the fixing plate 300 on the heating plate 200.

[0035] Specifically, refer to Figure 5 A plurality of first negative pressure ends 312 are provided, and the plurality of first negative pressure ends 312 are arranged around the center of the fixing plate 300 at intervals, so as to better fix the position of the entire semiconductor wafer.

[0036] Preferably, refer to Figure 1 In order to prevent the heat generated by the heating plate 200 from affecting the base 100, a heat insulation plate 500 for isolating heat is provided between the heating plate 200 and the base 100. Furthermore, in order to improve the cooling effect of the base, refer to Figure 6 The base 100 has a built-in cooling water channel 110, and the cooling water channel 110 has an inlet joint 111 and an outlet joint 112. The inlet joint 111 and the outlet joint 112 are arranged on the outer side of the base 100. Specifically, in order to cool the entire base 100, the cooling water channel 110 is arranged in a winding shape inside the base 100.

[0037] In some embodiments, reference Figure 1 The lower end of the lifting block 400 is fixedly connected with a telescopic rod 410, and the telescopic rod 410 is fixed on the base 100. The telescopic rod 410 is used to raise the lifting block 400 or lower the lifting block 400.

[0038] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A fixing device, characterized in that: include: Base (100); A heating plate (200) is mounted on the base (100); A fixed plate (300) is detachably mounted on the surface of the heating plate (200); the fixed plate (300) is provided with a first air duct (310); two ends of the first air duct (310) are respectively a first air extraction end (311) and a first negative pressure end (312); the first air extraction end (311) is arranged on a side wall of the fixed plate (300) and is connected to a negative pressure generator; the first negative pressure end (312) is arranged through the upper surface of the fixed plate (300); and a plurality of recesses (330) are arranged on the edge of the fixed plate (300); The lifting block (400) is embedded in the recess (330) and can be lifted up and down.

2. The fixing device according to claim 1, characterized in that: The fixed plate (300) is provided with a second air duct (320) built therein, and the two ends of the second air duct (320) are respectively a second air suction end (321) and a second negative pressure end (322), the second air suction end (321) is arranged on the side wall of the fixed plate (300) and is connected to a negative pressure generator, and the second negative pressure end (322) is arranged through the lower surface of the fixed plate (300).

3. The fixing device according to claim 1 or 2, characterized in that: A heat insulation board (500) for isolating heat is provided between the heating plate (200) and the base (100).

4. The fixing device according to claim 3, characterized in that: The base (100) has a built-in cooling water channel (110), the cooling water channel (110) having a water inlet joint (111) and a water outlet joint (112), the water inlet joint (111) and the water outlet joint (112) being arranged on the outer side surface of the base (100).

5. The fixing device according to claim 4, characterized in that: The cooling water channel (110) is arranged in a meandering shape inside the base (100).

6. The fixing device according to claim 1, characterized in that: The lower end of the lifting block (400) is fixedly connected to a telescopic rod (410), and the telescopic rod (410) is fixed on the base (100).

7. The fixing device according to claim 1, characterized in that: A plurality of the first negative pressure ends (312) are provided, and the plurality of the first negative pressure ends (312) are arranged around the center of the fixed disk (300) at intervals.

8. A semiconductor die bonding machine, characterized in that: include: Workbench; In the fixing device according to any one of claims 1 to 7, the base (100) is pivotally mounted above the workbench.

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