Heat dissipation type semiconductor packaging structure

Abstract

The utility model relates to the technical field of semiconductors, in particular to a heat dissipation type semiconductor packaging structure, which comprises a base, a chip, a silica gel pad, a heat dissipation plate and a water-cooling heat dissipation mechanism, and is characterized in that the water-cooling heat dissipation mechanism comprises an external water tank, an external water pump, an output pipe, a heat exchange coil pipe and a return pipe. An external water pump is started, the output pipe is matched with the first connecting pipe, and refrigerated water is conveyed into the heat exchange coil, so that cold water in the heat exchange coil exchanges heat with heat absorbed by the heat dissipation fins, the heat absorbed by the heat dissipation fins is taken away, heat dissipation of the chip is accelerated, and the service life of the chip is prolonged. And the water subjected to heat exchange is conveyed to the inside of the external water tank through the cooperation of the second connecting pipe and the return pipe, and is refrigerated through the semiconductor refrigeration sheet, so that circulating water-cooling heat dissipation is completed, and by adopting the structure, through the arrangement of the water-cooling heat dissipation mechanism, the heat dissipation effect on the chip is better.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a heat dissipation type semiconductor packaging structure. Background Art

[0002] When a highly integrated semiconductor chip operates, a large amount of heat will be generated. Moreover, the encapsulation colloid covering the semiconductor chip is formed by a poor heat transfer resin material with a thermal conductivity of only 0.8 w / m-k. Therefore, it is extremely easy to cause poor heat dissipation efficiency and endanger the performance and service life of the semiconductor chip.

[0003] To solve the above problems, the existing public patent (CN211828825U) discloses a heat dissipation packaged semiconductor, including a chip. Two pins are symmetrically arranged on the chip. The chip and the pins are externally wrapped with a packaging component. The packaging component includes a base. An installation groove for installing the chip is opened on the surface of the base. A plurality of heat conduction holes are evenly distributed on the surface of the installation groove. A heat conduction silica gel pad is added between the chip and the surface of the installation groove. A heat conduction groove communicated with the heat conduction holes is also opened at the bottom of the base. A heat dissipation plate is installed at the bottom of the heat conduction groove. A plurality of heat dissipation fins are evenly distributed on the surface of the heat dissipation plate, and a plurality of heat dissipation holes are evenly distributed on any one of the heat dissipation fins. A frame-shaped installation card slot is opened on the surface of the base along its circumferential direction. A frame-shaped heat conduction plate is clamped in the frame-shaped installation card slot. The chip is accommodated in the frame-shaped heat conduction plate. A plurality of heat conduction sheets are evenly installed between a group of symmetric side edges of the frame-shaped heat conduction plate, and an insulating encapsulation body is filled between the frame-shaped heat conduction plate and the chip. This technical solution improves the packaging structure of traditional semiconductors and improves their heat dissipation performance.

[0004] However, the heat dissipation structure in the existing heat dissipation packaged semiconductor is relatively simple, and the heat dissipation effect on the semiconductor chip is not ideal enough. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a heat dissipation type semiconductor packaging structure, aiming to solve the technical problem that the heat dissipation structure in the existing heat dissipation packaged semiconductor is relatively simple and the heat dissipation effect on the semiconductor chip is not ideal enough.

[0006] To achieve the above purpose, the utility model provides a heat dissipation type semiconductor packaging structure, including a base, a chip, a silica gel pad, a heat dissipation plate and a water-cooled heat dissipation mechanism. An installation groove is arranged on the upper surface of the base. A plurality of through holes are arranged at the inner bottom of the installation groove. A heat conduction column is arranged inside each through hole. The silica gel pad is arranged inside the installation groove. The chip is arranged on the upper surface of the silica gel pad. A heat dissipation groove is arranged at the bottom of the base. The heat dissipation plate is arranged inside the heat dissipation groove. One end of the heat conduction column far away from the silica gel pad is connected to the heat dissipation plate. A plurality of heat dissipation fins are arranged on the surface of the heat dissipation plate far away from the heat conduction column.

[0007] The water-cooling heat dissipation mechanism includes an external water tank, an external water pump, an output pipe, a heat exchange coil, and a return pipe. The heat exchange coil is embedded in the gaps between multiple heat dissipation fins. The two ends of the heat exchange coil are respectively provided with a first connecting pipe and a second connecting pipe. Both the first connecting pipe and the second connecting pipe penetrate through the side wall of the base. The input end of the external water pump is connected to the water outlet of the external water tank through a pipeline. The output end of the external water pump is provided with the output pipe. One end of the output pipe away from the external water pump is connected to the first connecting pipe. One end of the return pipe is connected to the second connecting pipe, and the other end of the return pipe is connected to the water return port of the external water tank. A semiconductor refrigeration sheet is arranged on the external water tank.

[0008] Wherein, support members are arranged on both sides of the heat exchange coil. One end of the support member is arranged outside the heat exchange coil, and the other end of the support member is connected to the inner side wall of the heat dissipation groove.

[0009] Wherein, each support member includes a fixed block, a support block, and a support ring. The support ring is arranged outside the heat exchange coil. One end of the support block is fixedly provided with the fixed block, and the other end of the support block is fixedly provided with the support ring. The support ring is arranged outside the heat exchange coil, and the fixed block is connected to the inner side wall of the heat dissipation groove.

[0010] Wherein, a dust-proof frame is arranged on the outer side wall of the external water tank, and the dust-proof frame is arranged outside the hot end of the semiconductor refrigeration sheet.

[0011] Wherein, the heat dissipation type semiconductor package structure further includes a bracket. The bracket is arranged inside one end of the dust-proof frame away from the external water tank. A drive motor is arranged on the bracket, and a heat dissipation blade is arranged at the output end of the drive motor.

[0012] Wherein, mounting blocks are arranged at each end corner of the bracket, and the outer side wall of the mounting block is connected to the inner side wall of the dust-proof frame.

[0013] For a heat dissipation type semiconductor package structure of the present utility model, the semiconductor refrigeration sheet is used to refrigerate the water in the external water tank. The external water pump is started, and through the cooperation of the output pipe and the first connecting pipe, the refrigerated water is conveyed into the heat exchange coil, so that the cold water in the heat exchange coil exchanges heat with the heat absorbed by the heat dissipation fins, thereby taking away the heat absorbed by the heat dissipation fins, and further accelerating the heat dissipation of the chip. And the water after heat exchange is conveyed into the interior of the external water tank through the cooperation of the second connecting pipe and the return pipe, and is refrigerated by the semiconductor refrigeration sheet, thus completing the circulating water-cooling heat dissipation. By adopting the above structure, through the setting of the water-cooling heat dissipation mechanism, the heat dissipation effect on the chip is better. Brief Description of the Drawings

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0015] Figure 1 It is a schematic structural diagram of a heat-dissipating semiconductor package structure according to the first embodiment of the present invention.

[0016] Figure 2 It is a partial exploded structural diagram of a heat-dissipating semiconductor package structure according to the first embodiment of the present invention.

[0017] Figure 3 It is a cross-sectional view of the internal structure of the base according to the first embodiment of the present invention.

[0018] Figure 4 It is a schematic external structure diagram of an external water tank according to the second embodiment of the present invention.

[0019] 101 - Base, 102 - Chip, 103 - Silicone pad, 104 - Heat sink, 105 - External water tank, 106 - External water pump, 107 - Output pipe, 108 - Heat exchange coil, 109 - Return pipe, 110 - Installation groove, 111 - Through hole, 112 - Heat conducting column, 113 - Heat dissipation groove, 114 - Heat dissipation fin, 115 - First connecting pipe, 116 - Second connecting pipe, 117 - Thermoelectric cooler, 118 - Fixed block, 119 - Support block, 120 - Support ring, 121 - Dust-proof frame, 201 - Bracket, 202 - Driving motor, 203 - Heat dissipation blade, 204 - Installation block. Detailed Description of the Embodiments

[0020] The following will describe in detail the embodiments of the present invention. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present invention, and should not be construed as a limitation of the present invention.

[0021] First Embodiment:

[0022] Please refer to Figures 1 to 3 , in which Figure 1 is a schematic structural diagram of a heat-dissipating semiconductor package structure according to the first embodiment, Figure 2 is a partial exploded structural diagram of a heat-dissipating semiconductor package structure according to the first embodiment,Figure 3 It is a cross-sectional view of the internal structure of the base in the first embodiment.

[0023] The utility model provides a heat dissipation type semiconductor packaging structure, which includes a base 101, a chip 102, a silica gel pad 103, a heat dissipation plate 104 and a water-cooled heat dissipation mechanism. The water-cooled heat dissipation mechanism includes an external water tank 105, an external water pump 106, an output pipe 107, a heat exchange coil 108 and a return pipe 109. Through the foregoing solution, the problem that the heat dissipation structure in the existing heat dissipation packaged semiconductor is relatively simple and the heat dissipation effect on the semiconductor chip 102 is not ideal is solved. It can be understood that the foregoing solution can be used in the packaging structure of the heat dissipation type semiconductor.

[0024] For this specific embodiment, an installation groove 110 is provided on the upper surface of the base 101. A plurality of through holes 111 are provided at the inner bottom of the installation groove 110. A heat conduction column 112 is provided inside each through hole 111. The silica gel pad 103 is provided inside the installation groove 110. The chip 102 is provided on the upper surface of the silica gel pad 103. A heat dissipation groove 113 is provided at the bottom of the base 101. The heat dissipation plate 104 is provided inside the heat dissipation groove 113. One end of the heat conduction column 112 away from the silica gel pad 103 is connected to the heat dissipation plate 104. A plurality of heat dissipation fins 114 are provided on one side of the heat dissipation plate 104 away from the heat conduction column 112. After the chip 102 is installed on the surface of the installation groove 110 through the silica gel pad 103, the heat generated by the chip 102 can be transferred from below to the silica gel pad 103, so that the heat is transferred to the heat dissipation plate 104 through the heat conduction column 112, and then the heat dissipation fins 114 uniformly arranged on the surface of the heat dissipation plate 104 perform heat exchange with the air to complete the dissipation of the heat.

[0025] Among them, the heat exchange coil 108 is embedded in the gaps between multiple heat dissipation fins 114. First connection pipes 115 and second connection pipes 116 are respectively arranged at both ends of the heat exchange coil 108. Both the first connection pipe 115 and the second connection pipe 116 penetrate through the side wall of the base 101. The input end of the external water pump 106 is connected to the water outlet of the external water tank 105 through a pipeline. An output pipe 107 is arranged at the output end of the external water pump 106. One end of the output pipe 107 far away from the external water pump 106 is connected to the first connection pipe 115. One end of the return pipe 109 is connected to the second connection pipe 116, and the other end of the return pipe 109 is connected to the water return port of the external water tank 105. A semiconductor refrigeration sheet 117 is arranged on the external water tank 105 to cool the water in the external water tank 105 by using the semiconductor refrigeration sheet 117. Start the external water pump 106. Through the cooperation of the output pipe 107 and the first connection pipe 115, the cooled water is conveyed into the heat exchange coil 108, so that the cold water in the heat exchange coil 108 exchanges heat with the heat absorbed by the heat dissipation fins, thereby taking away the heat absorbed by the heat dissipation fins 114, and further accelerating the heat dissipation of the chip 102. And the water after heat exchange is conveyed into the interior of the external water tank 105 through the cooperation of the second connection pipe 116 and the return pipe 109 and is cooled by the semiconductor refrigeration sheet 117, thus completing the cyclic water-cooled heat dissipation. With the above structure, through the setting of the water-cooled heat dissipation mechanism, the heat dissipation effect on the chip 102 is better.

[0026] Secondly, support members are arranged on both sides of the heat exchange coil 108. One end of the support member is arranged outside the heat exchange coil 108, and the other end of the support member is connected to the inner side wall of the heat dissipation groove 113. The heat exchange coil 108 is supported by the support member to prevent the heat exchange coil 108 from falling off from the gaps between multiple heat dissipation fins 114.

[0027] Meanwhile, each support member includes a fixed block 118, a support block 119 and a support ring 120. The support ring 120 is arranged outside the heat exchange coil 108. One end of the support block 119 is fixedly provided with the fixed block 118, and the other end of the support block 119 is fixedly provided with the support ring 120. After the support ring 120 is arranged outside the heat exchange coil 108, the fixed block 118 is fixed on the inner side wall of the heat dissipation groove 113, thus completing the installation of the support member.

[0028] In addition, a dust-proof frame 121 is provided on the outer side wall of the external water tank 105. The dust-proof frame 121 is arranged outside the hot end of the semiconductor refrigeration chip 117. Through the arrangement of the dust-proof frame 121, excessive dust is prevented from adhering to the hot end of the semiconductor refrigeration chip 117, which may cause the deterioration of the refrigeration effect of the semiconductor refrigeration chip 117.

[0029] When using a heat dissipation type semiconductor package structure of this embodiment, after the chip 102 is installed on the surface of the installation groove 110 through the silica gel pad 103, the heat generated by the chip 102 can be transferred downward to the silica gel pad 103, so that the heat is transferred to the heat dissipation plate 104 through the heat conduction column 112. Then, the heat dissipation fins 114 uniformly arranged on the surface of the heat dissipation plate 104 exchange heat with the air to complete the dissipation of heat. Moreover, the semiconductor refrigeration chip 117 is used to refrigerate the water in the external water tank 105. The external water pump 106 is started, and through the cooperation of the output pipe 107 and the first connecting pipe 115, the refrigerated water is transported into the heat exchange coil 108, so that the cold water in the heat exchange coil 108 exchanges heat with the heat absorbed by the heat dissipation fins, thereby taking away the heat absorbed by the heat dissipation fins 114, and further accelerating the heat dissipation of the chip 102. After heat exchange, the water is transported into the interior of the external water tank 105 through the cooperation of the second connecting pipe 116 and the return pipe 109 and is refrigerated by the semiconductor refrigeration chip 117, thus completing the circulating water-cooled heat dissipation. With the above structure, through the arrangement of the water-cooled heat dissipation mechanism, the heat dissipation effect on the chip 102 is better.

[0030] Second Embodiment:

[0031] On the basis of the first embodiment, please refer to Figure 4 , Figure 4 which is a schematic diagram of the external structure of the external water tank in the second embodiment.

[0032] The heat dissipation type semiconductor package structure provided by the present invention further includes a bracket 201.

[0033] For this specific embodiment, a bracket 201 is provided inside one end of the dust-proof frame 121 away from the external water tank 105. A driving motor 202 is arranged on the bracket 201, and a heat dissipation blade 203 is arranged at the output end of the driving motor 202. The driving motor 202 is installed on the bracket 201. When the driving motor 202 is started, the heat dissipation blade 203 is driven to rotate, thereby accelerating the air circulation speed between the hot end of the semiconductor refrigeration chip 117 and the outside air, and making the refrigeration effect of the cold end of the semiconductor refrigeration chip 117 better.

[0034] Wherein, mounting blocks 204 are provided at each end corner of the bracket 201, and the outer side wall of the mounting block 204 is connected to the inner side wall of the dust-proof frame 121. Through the arrangement of the mounting block 204, the installation of the bracket 201 is completed.

[0035] When using a heat dissipation type semiconductor packaging structure of this embodiment, through the arrangement of the mounting block 204, the installation of the bracket 201 is completed. The drive motor 202 is installed on the bracket 201, and the drive motor 202 is started to drive the heat dissipation blades 203 to rotate, thereby accelerating the air flow rate between the hot end of the semiconductor refrigeration sheet 117 and the outside air, and making the refrigeration effect of the cold end of the semiconductor refrigeration sheet 117 better.

[0036] The above-disclosed is only a preferred embodiment of the present invention, and of course, it cannot be used to limit the scope of the rights of the present invention. Those of ordinary skill in the art can understand all or part of the processes of implementing the above embodiments, and the equivalent changes made according to the claims of the present invention still fall within the scope covered by the present invention.

Claims

1. A heat dissipation type semiconductor packaging structure, comprising a base, a chip, a silicone pad and a heat dissipation plate, wherein the upper surface of the base is provided with a mounting groove, the inner bottom of the mounting groove is provided with a plurality of through holes, each of the through holes is provided with a heat conducting column, the silicone pad is provided inside the mounting groove, the chip is provided on the upper surface of the silicone pad, a heat dissipation groove is provided at the bottom of the base, the heat dissipation plate is provided inside the heat dissipation groove, one end of the heat conducting column away from the silicone pad is connected to the heat dissipation plate, and a side of the heat dissipation plate away from the heat conducting column is provided with a plurality of heat dissipation fins, characterized in that: Also includes a water cooling heat dissipation mechanism; The water-cooled heat dissipation mechanism includes an external water tank, an external water pump, an output pipe, a heat exchange coil and a return pipe. The heat exchange coil is embedded in the gaps between the plurality of heat dissipation fins. The two ends of the heat exchange coil are respectively provided with a first connecting pipe and a second connecting pipe. The first connecting pipe and the second connecting pipe both penetrate the side wall of the base. The input end of the external water pump is connected to the water outlet of the external water tank through a pipeline. The output end of the external water pump is provided with the output pipe. The end of the output pipe away from the external water pump is connected to the first connecting pipe, one end of the return pipe is connected to the second connecting pipe, and the other end of the return pipe is connected to the return water port of the external water tank. A semiconductor refrigeration plate is provided on the external water tank.

2. The heat dissipation type semiconductor package structure according to claim 1, characterized in that: Support members are arranged on both sides of the heat exchange coil, one end of the support member is arranged outside the heat exchange coil, and the other end of the support member is connected to the inner wall of the heat dissipation groove.

3. The heat dissipation type semiconductor package structure according to claim 2, characterized in that: Each of the support members includes a fixed block, a support block and a support ring, wherein the support ring is arranged on the outside of the heat exchange coil, the fixed block is fixedly arranged on one end of the support block, the support ring is fixedly arranged on the other end of the support block, the support ring is arranged on the outside of the heat exchange coil, and the fixed block is connected to the inner wall of the heat dissipation groove.

4. The heat dissipation type semiconductor package structure according to claim 3, characterized in that: A dustproof frame is arranged on the outer side wall of the external water tank, and the dustproof frame is arranged outside the hot end of the semiconductor refrigeration plate.

5. The heat dissipation type semiconductor package structure as claimed in claim 4, characterized in that: The heat dissipation type semiconductor packaging structure further comprises a bracket, the bracket is arranged inside the end of the dustproof frame away from the external water tank, a driving motor is arranged on the bracket, and a heat dissipation blade is arranged at the output end of the driving motor.

6. The heat dissipation type semiconductor package structure according to claim 5, characterized in that: A mounting block is arranged at each end corner of the bracket, and an outer side wall of the mounting block is connected to an inner side wall of the dustproof frame.

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