Electronic device packaging structure

Abstract

The utility model belongs to the field of electronic devices, and discloses an electronic device packaging structure which comprises a shell and a circuit board assembly in the shell, the circuit board assembly is provided with a contact pin located in the first end of the shell, the first end of the contact pin is arranged on the circuit board assembly, and the second end of the contact pin is arranged on one side of a circuit board. The circuit board assembly is further provided with an end cover located in the second end of the shell, the outer circumferential face of the end cover abuts against the inner circumferential face of the shell, the shell is provided with a glue inlet hole used for filling, the shell is further filled with a filling body, and the filling body is fixedly connected with the shell and the end cover and wraps the circuit board assembly and the first ends of the contact pins. The second end of the contact pin is arranged outside the filling body; according to the scheme, after the electronic device is subjected to glue pouring or injection molding, the circuit board in the electronic device can be fixed in the shell, one end of the shell is closed to enhance the sealing performance, the other opposite end of the shell can be prevented from being blocked, and the contact pins on the circuit board can be prevented from being completely wrapped, so that the contact pins on the circuit board can be conductively connected.

Description

Technical Field

[0001] The utility model relates to the field of electronic devices, in particular to an electronic device packaging structure. Background Art

[0002] An electronic device refers to an electronic component or assembly that undertakes specific functions in an electronic device. They form the basis of the electronic device. These devices can control the flow and conversion of electrons, thus supporting the realization of the functions of various circuits and systems.

[0003] An electronic device mainly consists of a housing, a circuit board, a packaging component, and a signal output component. The circuit board is arranged inside the housing. The packaging component enables the circuit board to be stably fixed inside the housing and at the same time seals the ports of the housing, allowing only the signal output component to pass through the housing. Among them, the signal output component can be either a wire or a pin. When a pin is selected, the electronic device is conductively connected to other electronic devices through the pin. Currently, most of the packaging components use filling bodies such as potting glue and hot melt glue. After the filling body is filled and cured inside the housing, it fixes all the components inside the housing and the housing to each other. During product processing, the molten filling body is injected into the housing from the port of the housing. The filling body fills the gaps everywhere inside the housing, not only fixing the circuit board inside the housing but also improving the sealing performance of the product. However, the pins for conductive connection with other electronic devices are also arranged at the port of the housing. When the filling body is injected into the interior of the housing from the port of the housing, it will come into contact with the pins, thus covering the pins and forming an insulating layer on the outer surface of the pins, hindering the pins from conducting electricity, resulting in product defects such as poor contact and a low production yield of the product. Summary of the Utility Model

[0004] The purpose of the utility model is to provide an electronic device packaging structure, which can, after potting or injection molding, not only fix the internal circuit board inside the housing and seal one end of the housing to enhance the sealing performance, but also avoid blocking the opposite end of the housing and prevent completely wrapping the pins on the circuit board at the same time, so that the pins on the circuit board can be inserted into other components for conductive connection.

[0005] The technical solution provided by the present utility model is: an electronic device packaging structure, including a tubular outer shell. A circuit board assembly is provided inside the outer shell. On the circuit board assembly, there are pins located inside the first end of the outer shell. The first end of the pin is arranged on the circuit board assembly, and the second end is arranged on one side of the circuit board assembly close to the port of the first end of the outer shell. On the circuit board assembly, there is also an end cap located inside the second end of the outer shell. The outer peripheral surface of the end cap abuts against the inner peripheral surface of the outer shell to seal the second end of the outer shell. The outer shell is provided with a glue inlet hole for filling, and the glue inlet hole is located between the second end of the pin and the end cap. A filling body is also filled inside the outer shell. The filling body is fixedly connected to the outer shell and the end cap respectively. The circuit board assembly and the first end of the pin are both fixedly connected inside the filling body, and the second end of the pin is arranged outside the filling body.

[0006] In the above-mentioned electronic device packaging structure, the filling body fills the glue inlet hole, and the filling body is a light guide block.

[0007] In the above-mentioned electronic device packaging structure, at least two glue inlet holes are provided, and adjacent two glue inlet holes are arranged at intervals along the circumferential direction of the outer shell.

[0008] In the above-mentioned electronic device packaging structure, an exhaust groove is provided on the outer peripheral surface of the end cap. One end of the exhaust groove opens towards the outside of the first end of the outer shell, and the opposite end opens towards the inside of the outer shell.

[0009] In the above-mentioned electronic device packaging structure, a support portion is provided on the filling body, and the support portion surrounds and is fixedly connected to the outer peripheral surface of the second end of the pin.

[0010] In the above-mentioned electronic device packaging structure, a clamping portion is provided on the pin between its first end and the second end. The diameter of the clamping portion is smaller than the diameters of the first end and the second end of the pin, and the clamping portion is arranged inside the filling body, and the filling body is fixedly connected to the clamping portion.

[0011] In the above-mentioned electronic device packaging structure, a coaxial sealing ring groove is provided on the outer peripheral surface of the filling body. The sealing ring groove is arranged at one end portion of the filling body close to the second end of the pin. A sealing ring is provided in the sealing ring groove, and the sealing ring is fixedly connected to the outer shell and the filling body respectively.

[0012] In the above-mentioned electronic device packaging structure, the circuit board assembly includes a circuit board and electronic components fixedly connected to the circuit board and electrically connected to the circuit board. The electronic components are sleeved inside the end cap and are fixedly connected to the filling body.

[0013] In the above-mentioned electronic device packaging structure, a convex edge is provided on the circuit board, and a mounting hole is formed in the electronic component, and the convex edge is clamped in the mounting hole.

[0014] In the above-mentioned electronic device packaging structure, a connecting wire is provided between the circuit board and the electronic component, the connecting wire is fixedly connected in the filling body, and the circuit board, the connecting wire and the electronic component are electrically connected in sequence.

[0015] After the present utility model adopts the above technical solution, the beneficial effects thereof are as follows:

[0016] In this technical solution, by connecting an end cover to the circuit board assembly, when the circuit board assembly is installed in the housing, the end cover is also installed in the second end of the housing. The outer peripheral surface of the end cover abuts against the inner peripheral surface of the housing. The end cover is in mutual fit with the housing, thereby closing the second end of the housing. When the filling body is in a molten state, it can flow by itself. The molten filling body enters the housing through the glue inlet hole. Since the glue inlet hole is between the end cover and the second end of the pin, when the filling body enters the housing, the filling body will not come into contact with the second end of the pin. During the continuous filling process of the filling body inside the housing, by using an auxiliary tool inside the first end of the housing, the auxiliary tool is between the second end of the pin and the filling body. The auxiliary tool blocks the filling body from contacting the second end of the pin, preventing the entire pin from being completely wrapped, so as to avoid forming an insulating layer on the surface of the pin. After the filling body cools and solidifies, the auxiliary tool is removed. The cooled and solidified filling body wraps the circuit board assembly and the first end of the pin, and also fills the inside of the end cover in a spreading manner, so that the housing, the end cover, the circuit board assembly and the pin are all fixedly connected to each other through the filling body. Finally, after the electronic device is potted or injection-molded, the circuit board inside it can be fixed in the housing, and one end of the housing can be closed to enhance the sealing performance. At the same time, it can also avoid blocking the opposite end of the housing and preventing the pins on the circuit board from being completely wrapped, so that the pins on the circuit board can be inserted into other components for electrical connection. Description of the Drawings

[0017] Figure 1 is the front view of the electronic device packaging structure of Embodiment 1 of the present utility model;

[0018] Figure 2 is the front cross-sectional view of the electronic device packaging structure of Embodiment 1 of the present utility model;

[0019] Figure 3 is the side cross-sectional view of the electronic device packaging structure of Embodiment 1 of the present utility model;

[0020] Figure 4 is the internal assembly schematic diagram of the electronic device packaging structure of Embodiment 1 of the present utility model;

[0021] Figure 5 Schematic three-dimensional assembly diagram of the circuit board assembly and the end cap in Embodiment 1 of the present utility model;

[0022] Figure 6 Schematic side cross-sectional assembly diagram of the circuit board assembly and the end cap in Embodiment 1 of the present utility model;

[0023] Figure 7 is of the present utility model Figure 6 Partial enlarged view of A;

[0024] Figure 8 Schematic diagram of the use of the connecting wire in Embodiment 1 of the present utility model;

[0025] Figure 9 Schematic three-dimensional assembly diagram of the circuit board assembly and the pin in Embodiment 1 of the present utility model.

[0026] Reference numerals: 1, outer shell; 2, end cap; 3, sealing ring; 4, pin; 5, filling body; 6, connecting seat; 7, circuit board assembly; 8, connecting wire;

[0027] 11, glue inlet hole; 21, exhaust groove; 41, clamping part; 51, supporting part; 71, circuit board; 711, convex edge; 72, electronic component; 721, mounting hole; 722, coil seat; 723, coil group. Detailed implementation manners

[0028] The following combines the specific implementation manners to further elaborate on the technical solutions of the present utility model in detail, but does not constitute any limitation to the present utility model.

[0029] Embodiment 1:

[0030] Combined with Figures 1-9 As shown, the present utility model provides an electronic device packaging structure, including a tubular outer shell 1. A circuit board assembly 7 is provided inside the outer shell 1. A pin 4 located inside the first end of the outer shell 1 is provided on the circuit board assembly 7. The first end of the pin 4 is provided on the circuit board assembly 7, and the second end is provided on one side of the circuit board assembly 7 adjacent to the port of the first end of the outer shell 1. An end cap 2 located inside the second end of the outer shell 1 is also provided on the circuit board assembly 7. The outer peripheral surface of the end cap 2 abuts against the inner peripheral surface of the outer shell 1 to close the second end of the outer shell 1. A glue inlet hole 11 for filling is provided on the outer shell 1. The glue inlet hole 11 is located between the second end of the pin 4 and the end cap 2. A filling body 5 is also filled inside the outer shell 1. The filling body 5 is fixedly connected to the outer shell 1 and the end cap 2 respectively. The circuit board assembly 7 and the first end of the pin 4 are both fixedly connected inside the filling body 5. The second end of the pin 4 is provided outside the filling body 5.

[0031] Its working principle is as follows: by connecting the end cap 2 to the circuit board assembly 7, when the circuit board assembly 7 is installed in the housing 1, together with installing the end cap 2 in the second end of the housing 1, the outer peripheral surface of the end cap 2 abuts against the inner peripheral surface of the housing 1. The end cap 2 is mutually fitted with the housing 1 to seal the second end of the housing 1. When the filling body 5 is in a molten state, it can flow by itself. The molten filling body 5 enters the housing 1 through the glue inlet hole 11. Since the glue inlet hole 11 is between the end cap 2 and the second end of the pin 4, at the moment when the filling body 5 enters the housing 1, the filling body 5 will not come into contact with the second end of the pin 4. During the continuous filling process of the filling body 5 inside the housing 1, by using a fixture inside the first end of the housing 1, the fixture is between the second end of the pin 4 and the filling body 5. The fixture blocks the filling body 5 from contacting the second end of the pin 4, preventing the entire pin 4 from being completely wrapped, so as to avoid forming an insulating layer on the surface of the pin 4. After the filling body 5 cools and solidifies, the fixture is removed. The cooled and solidified filling body 5 wraps the circuit board assembly 7 and the first end of the pin 4, and also fills the inside of the end cap 2 by means of spreading, so that the housing 1, the end cap 2, the circuit board assembly 7 and the pin 4 are all fixedly connected to each other through the filling body 5. Finally, after the electronic device is potted or injection-molded, it can not only fix the internal circuit board 71 in the housing 1 and seal one end of the housing 1 to enhance the sealing performance, but also avoid blocking the opposite end of the housing 1 and preventing the pin 4 on the circuit board 71 from being completely wrapped, so that the pin 4 on the circuit board 71 can be inserted into other components for conductive connection.

[0032] Combined with Figure 2 and Figure 3 As shown, for further improvement, the filling body 5 fills the glue inlet hole 11, and the filling body 5 is a light guide block.

[0033] In addition to jointly forming a clamping structure with the glue inlet hole 11 to enhance the connection strength between the filling body 5 and the housing 1, the filling body 5 also plays a role in guiding light, and can guide the light inside the housing 1 to emit at the glue inlet hole 11. The filling body 5 can be made of materials with light guiding characteristics such as PU potting glue and hot melt glue as the light guide block, and this embodiment does not limit this too much.

[0034] Combined with Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As shown, preferably, at least two glue inlet holes 11 are provided, and two adjacent glue inlet holes 11 are arranged at intervals along the circumferential direction of the housing 1.

[0035] In this embodiment, the number of the glue inlet holes 11 is increased, and the amount of the molten filling body 5 injected per unit time is increased. In addition, the glue inlet holes 11 serve as observation points for observing the light inside the housing 1 and are opened in different angular directions of the housing 1. Users can obtain the optical information of the operation of the electronic device from different azimuth angles through different glue inlet holes 11 respectively.

[0036] Combined with Figure 1 and Figure 5 As shown, in yet another improvement, an exhaust groove 21 is formed on the outer peripheral surface of the end cap 2. One end of the exhaust groove 21 opens towards the outside of the first end of the housing 1, and the opposite end opens towards the inside of the housing 1.

[0037] When the molten filling body 5 fills the inside of the housing 1, it will squeeze the air inside the housing 1. The arrangement of the exhaust groove 21 enables the squeezed air to be discharged to the outside of the housing 1 through the exhaust groove 21, preventing it from remaining inside the housing 1, so as to avoid the organizational structure defect of bubbles in the filling body 5 after molding due to the remaining air, improving the molding quality of the filling body 5, and thus enhancing the self-strength, connection strength and sealing performance of the filling body 5.

[0038] Combined with Figure 2 and Figure 3 As shown, in yet another preference, a support portion 51 is provided on the filling body 5. The support portion 51 surrounds and is fixedly connected to the outer peripheral surface of the second end of the pin 4.

[0039] In this embodiment, the support portion 51 is preferably in a frustum structure, and the specific structure of the support portion 51 is not overly limited in this embodiment.

[0040] Combined with Figures 2-6 and Figure 8 and Figure 9 As shown, in yet another improvement of this embodiment, a clamping portion 41 is provided on the pin 4 between its first end and the second end. The diameter of the clamping portion 41 is smaller than the diameters of the first end and the second end of the pin 4. The clamping portion 41 is arranged inside the filling body 5, and the filling body 5 is fixedly connected to the clamping portion 41.

[0041] The filling body 5 and the clamping portion 41 on the pin 4 together form a clamping structure, enhancing the connection strength between the filling body 5 and the pin 4.

[0042] As Figure 7 shown, in this embodiment, a sealing ring groove is formed on the outer peripheral surface of the filling body 5 and is arranged at one end of the filling body 5 adjacent to the second end of the pin 4. A sealing ring 3 is arranged in the sealing ring groove, and the sealing ring 3 is fixedly connected to the housing 1 and the filling body 5 respectively.

[0043] The sealing ring 3 can be bonded to the outer shell 1 and the filling body 5, or can be ultrasonically welded or connected by other methods. This embodiment does not impose too many restrictions on this.

[0044] Combined Figures 2-6 with Figure 8 and Figure 9 As shown, in actual assembly, a connecting seat 6 is provided between the pin 4 and the circuit board assembly 7. The connecting seat 6 is fixedly connected within the filling body 5, and the circuit board assembly 7, the connecting seat 6, and the first end of the pin 4 are electrically connected in sequence.

[0045] Combined Figure 2 , Figure 3 , Figure 4 , Figure 6 and Figure 7 As shown, the specific structure of the circuit board assembly 7 is that the circuit board assembly 7 includes a circuit board 71 and electronic components 72 fixedly connected to the circuit board 71 and electrically connected to the circuit board 71. The electronic components 72 are sleeved within the end cap 2 and are fixedly connected to the filling body 5.

[0046] In actual installation, a flange 711 is provided on the circuit board 71, and a mounting hole 721 is formed on the electronic component 72. The flange 711 is clamped within the mounting hole 721.

[0047] In this embodiment, a connecting wire 8 is provided between the circuit board 71 and the electronic component 72. The connecting wire 8 is fixedly connected within the filling body 5, and the circuit board 71, the connecting wire 8, and the electronic component 72 are electrically connected in sequence.

[0048] As Figure 7 shown, in a specific implementation, the electronic component 72 is an induction coil. The induction coil includes a coil seat 722 sleeved within the end cap 2 and a coil group 723 provided on the coil seat 722. An annular groove is formed on the end face of the coil seat 722 that abuts against the end cap 2, and the coil group 723 is fixedly connected within the annular groove.

[0049] The above embodiments are preferred embodiments of the present utility model, but the embodiments of the present utility model are not limited to the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications made without departing from the spirit and principle of the present utility model shall be equivalent replacement methods and are all included within the protection scope of the present utility model.

Claims

1. An electronic device packaging structure, comprising a tubular shell, a circuit board assembly is arranged in the shell, a pin is arranged on the circuit board assembly and is located in the first end of the shell, a first end of the pin is arranged on the circuit board assembly, and a second end of the pin is arranged on a side of the circuit board assembly adjacent to the first end port of the shell, characterized in that: The circuit board assembly is also provided with an end cover located inside the second end of the shell, and the outer circumferential surface of the end cover abuts against the inner circumferential surface of the shell to close the second end of the shell. The shell is provided with a glue inlet hole for filling, and the glue inlet hole is located between the second end of the pin and the end cover. The shell is also filled with a filling body, and the filling body is respectively fixedly connected to the shell and the end cover. The circuit board assembly and the first end of the pin are both fixedly connected to the filling body, and the second end of the pin is arranged outside the filling body.

2. The electronic device packaging structure according to claim 1, characterized in that: The filling body is filled in the glue inlet hole, and the filling body is a light guide block.

3. The electronic device packaging structure according to claim 1, characterized in that: At least two glue inlet holes are provided, and two adjacent glue inlet holes are spaced apart along the circumference of the shell.

4. The electronic device packaging structure according to claim 1, characterized in that: An exhaust groove is provided on the outer peripheral surface of the end cover, one end of the exhaust groove is open toward the outside of the first end of the shell, and the other end is open toward the inside of the shell.

5. The electronic device packaging structure according to claim 1, characterized in that: The filling body is provided with a supporting portion, which surrounds and is fixedly connected to the outer peripheral surface of the second end of the insertion pin.

6. The electronic device packaging structure according to claim 1, characterized in that: The insertion pin is provided with a retaining portion located between the first end and the second end thereof, the diameter of the retaining portion is smaller than the diameters of the first end and the second end of the insertion pin, the retaining portion is arranged in the filling body, and the filling body is fixedly connected to the retaining portion.

7. The electronic device packaging structure according to any one of claims 1 to 6, characterized in that: A coaxially arranged sealing ring groove is provided on the outer circumferential surface of the filling body, and the sealing ring groove is provided on an end portion of the filling body adjacent to the second end of the insertion pin. A sealing ring is provided in the sealing ring groove, and the sealing ring is fixedly connected to the outer shell and the filling body respectively.

8. The electronic device packaging structure according to any one of claims 1 to 6, characterized in that: The circuit board assembly comprises a circuit board and an electronic component fixedly connected to the circuit board and conductively connected to the circuit board. The electronic component is sleeved in the end cover and fixedly connected to the filling body.

9. The electronic device packaging structure according to claim 8, characterized in that: The circuit board is provided with a convex edge, the electronic component is provided with a mounting hole, and the convex edge is clamped in the mounting hole.

10. The electronic device packaging structure according to claim 8, characterized in that: A connecting wire is arranged between the circuit board and the electronic component. The connecting wire is fixedly connected to the filling body. The circuit board, the connecting wire and the electronic component are conductively connected in sequence.

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