Novel CCS integrated busbar

Abstract

The utility model discloses a novel CCS integrated busbar. The novel CCS integrated busbar comprises at least one FPC signal acquisition assembly, a plurality of aluminum bars, an upper insulating film and a lower insulating film. A base material of the FPC signal acquisition assembly is formed by gluing a middle adhesive layer on an insulating base film, and a circuit layer is a conductive circuit formed on the middle adhesive layer of the base material through aluminum foil etching or die cutting or a conductive circuit formed on the middle adhesive layer through silver paste in a printing mode. One end of each acquisition terminal is connected with each input end of a conductive circuit of the circuit layer, the connector is electrically connected with the output end of the conductive circuit of the circuit layer, the lower protective film is adhered to the lower part of the insulating base film, and the upper protective film is adhered to the upper part of the circuit layer; the aluminum bar is welded at the other end of the acquisition terminal; the upper insulating film is adhered to the upper protective film, and the lower insulating film is adhered to the lower protective film. The cable has the advantages of being good in conductive signal transmission performance, low in product cost and capable of meeting market requirements.

Description

Technical Field

[0001] The utility model relates to the field of information transmission of electronic products, and particularly to a novel CCS integrated busbar. Background Art

[0002] The CCS integrated busbar is often applied to new energy vehicles and energy storage battery modules to realize the series-parallel connection of battery cells, temperature and voltage sampling, and transmit information to the BMS system. Among them, the FPC signal acquisition component in the CCS integrated busbar is also called a flexible circuit board. At present, in the production of FPC, a base material rolled copper foil is used, which is formed by repeatedly rolling a high-precision copper strip using the principle of plastic processing. Its defects are as follows: First, with the substantial increase in the market price of copper, the competition in the new energy market is becoming increasingly fierce. Battery manufacturers are constantly demanding cost reduction. The cost of copper is expensive, and continuing to use copper foil cannot meet the market demand of battery manufacturers; Second,

[0003] For the FPC of copper foil, the circuit needs to be formed by etching. There are more than twenty etching manufacturing processes, involving equipment such as photolithography machines, etching machines, and hot presses. The high precision requirements of the equipment lead to a relatively high equipment investment price, high fixed investment, and many etching manufacturing processes, large process difficulty coefficient, long processing flow, and low processing efficiency; Third, the etching process will produce wastewater during production, causing environmental pollution. Summary of the Utility Model

[0004] In order to solve one or more of the above problems, the utility model provides a novel CCS integrated busbar.

[0005] According to one aspect of the utility model, the novel CCS integrated busbar includes: at least one FPC signal acquisition component, several aluminum bars, an upper insulating film, and a lower insulating film;

[0006] The FPC signal acquisition component includes a base material, a circuit layer, several acquisition terminals, and a connector. The base material is a covering film formed by gluing an intermediate adhesive layer on the upper surface of an insulating base film. The circuit layer is a conductive circuit formed by etching or die-cutting an aluminum foil on the intermediate adhesive layer of the base material. One end of each of the several acquisition terminals is respectively connected to each input end of the conductive circuit of the circuit layer, and the connector is electrically connected to the output end of the conductive circuit of the circuit layer. The lower surface of the insulating base film is adhesively connected to a lower protective film, and the upper surface of the circuit layer is adhesively connected to an upper protective film;

[0007] The other end of the aluminum bar is welded to the acquisition terminal;

[0008] The upper insulating film is adhesively connected to the upper protective film, and the lower insulating film is adhesively connected to the lower protective film. The upper insulating film and the lower insulating film surround the aluminum bar, and avoidance through holes are provided at the connection positions of the two and the aluminum bar.

[0009] The new CCS integrated busbar uses aluminum foil etching or die-cutting to form conductive circuits on a PI film, with a conductive structure adapted to the aluminum foil, and can well achieve the signal transmission function. Its beneficial effects are as follows: First, using aluminum foil as the raw material, the cost of aluminum foil is about one-fourth of that of copper foil, effectively reducing costs; Second, at the same time, the aluminum foil is lighter in weight, and the weight of the same volume of aluminum foil is about one-third of that of copper foil, reducing the weight of the equipment; Third, the aluminum foil can achieve better signal acquisition; Fourth, the aluminum foil has strong corrosion resistance and a longer service life.

[0010] In some embodiments, the collection terminal and the circuit layer are integrally formed, and the input end of the conductive circuit of the aluminum foil body extends outward to form a collection terminal made of aluminum sheet material.

[0011] The present invention also provides a new CCS integrated busbar, including: at least one FPC signal acquisition component, several aluminum bars, an upper insulating film, and a lower insulating film;

[0012] The FPC signal acquisition component includes a base material, a circuit layer, several collection terminals, and a connector. The base material is a cover film made by gluing an intermediate adhesive layer on the upper surface of an insulating base film. The circuit layer is several conductive circuits formed by printing silver paste on the intermediate adhesive layer of the base material. One end of each of the several collection terminals is respectively connected to each input end of the conductive circuit of the circuit layer, and the connector is electrically connected to the integrated output end of the conductive circuit of the circuit layer. The lower surface of the insulating base film is adhesively connected to a lower protective film, and the upper surface of the circuit layer is adhesively connected to an upper protective film;

[0013] The other end of the aluminum bar is welded to the collection terminal;

[0014] The upper insulating film is adhesively connected to the upper protective film;

[0015] The lower insulating film is adhesively connected under the lower protective film. The upper insulating film and the lower insulating film surround the aluminum bar, and avoidance through holes are provided at the connection positions between the two and the aluminum bar.

[0016] The new CCS integrated busbar uses a new FPC signal acquisition component to form various conductive circuits on the intermediate adhesive layer of the base material by printing silver paste to form the required circuit layer, and can well achieve the signal transmission function. Its beneficial effects are as follows: First, the cost of silver paste printing is cheaper than that of rolled copper foil, and the raw material cost is low, reducing the cost of CCS products; Second, the silver paste printing process is simple, with few processing procedures, a short process, a short processing cycle, and high printing efficiency, further reducing the cost of CCS products; Third, the equipment cost required for the printing method is low. Compared with the equipment such as lithography machines, etching machines, and hot presses required for etching, the fixed investment is greatly reduced, and at the same time, the cost of CCS production is reduced; Fourth, the printing process does not produce waste water, reducing the pollution to the environment.

[0017] In some embodiments, the acquisition terminal is a nickel sheet, and the nickel sheet is welded to the input end of the conductive circuit of the circuit layer.

[0018] In some embodiments, an NTC thermistor is further included, and the NTC thermistor is welded to the corresponding input end of the conductive circuit of the circuit layer.

[0019] In some embodiments, several input connection positions are provided on the front and rear sides of the upper surface of the base material, and one lateral end of the upper surface is the output connection position. The output ends of the conductive circuits of the circuit layer are horizontally and parallelly distributed at equal intervals at the output connection position, and the input ends of the conductive circuits of the circuit layer are longitudinally bent and enter each input connection position of the base material.

[0020] In some embodiments, at the output connection position and the input connection position, a reinforcing plate is provided on the lower surface of the insulating base film.

[0021] In some embodiments, the connector is exposed outside the upper insulating film and the lower insulating film;

[0022] The base material can be a sheet-like film cut from a rolled film at equal intervals.

[0023] In some embodiments, the lower surface of the insulating base film is adhesively connected to the lower protective film through a lower adhesive layer, and the upper surface of the circuit layer is adhesively connected to the upper protective film through an upper adhesive layer;

[0024] The insulating base film, the lower protective film, and the upper protective film are PI films composed of polyimide films, and the intermediate adhesive layer, the lower adhesive layer, and the upper adhesive layer are ADH hot melt adhesives;

[0025] The upper insulating film and the lower insulating film are PET films.

[0026] In some embodiments, the thickness of the insulating base film is 25um, or the thickness of the intermediate adhesive layer is 20um; or the thickness of the lower protective film is 12um, the thickness of the upper protective film is 25um, the thickness of the lower adhesive layer is 15um, and the thickness of the upper adhesive layer is 35um. Description of the Drawings

[0027] Figure 1 It is a three-dimensional schematic diagram of a novel CCS integrated busbar according to an embodiment of the present invention;

[0028] Figure 2 is Figure 1 a three-dimensional exploded schematic diagram of the novel CCS integrated busbar shown;

[0029] Figure 3 is Figure 1 a three-dimensional schematic diagram of the FPC signal acquisition component shown;

[0030] Figure 4 is Figure 3Cross-sectional schematic diagram of the FPC signal acquisition component shown;

[0031] Figure 5 is Figure 3 Top view schematic diagram of the substrate and the circuit layer shown;

[0032] Figure 6 is Figure 3 Top view schematic diagram of the insulating base film and the reinforcing plate shown;

[0033] FPC signal acquisition component 01, substrate 1, insulating base film 10, intermediate adhesive layer 11, reinforcing plate 12, circuit layer 2, acquisition terminals 3, connector 4, lower protective film 5, upper protective film 6, NTC thermistor 7, lower adhesive layer 8, upper adhesive layer 9;

[0034] Aluminum bar 02; upper insulating film 03; lower insulating film 04. Detailed implementation manners

[0035] The present utility model will be further described in detail below with reference to the accompanying drawings. It should be noted that the terms "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to the directions in the drawings, and the terms "inner" and "outer" refer to the directions towards or away from the geometric center of a specific component respectively.

[0036] Figures 1 to 6 Schematically shows a novel CCS integrated busbar according to an embodiment of the present utility model. As shown in the figure, a novel CCS integrated busbar of an embodiment includes: at least one FPC signal acquisition component 01, several aluminum bars 02, an upper insulating film 03 and a lower insulating film 04;

[0037] The FPC signal acquisition component 01 includes a substrate 1, a circuit layer 2, several acquisition terminals 3 and a connector 4. The substrate 1 is a covering film formed by adhesively bonding an intermediate adhesive layer 11 on the upper surface of an insulating base film 10. The circuit layer 2 is a conductive circuit formed by etching or die-cutting an aluminum foil on the intermediate adhesive layer 11 of the substrate 1. One ends of several acquisition terminals 3 are respectively connected to the respective input ends of the conductive circuit of the circuit layer 2, and the connector 4 is electrically connected to the output end of the conductive circuit of the circuit layer 2. The lower surface of the insulating base film 10 is adhesively connected to the lower protective film 5, and the upper surface of the circuit layer 2 is adhesively connected to the upper protective film 6;

[0038] The other ends of the aluminum bars 02 are welded to the acquisition terminals 3;

[0039] The upper insulating film 03 is adhesively connected to the upper protective film 6, and the lower insulating film 04 is adhesively connected to the lower protective film 5. The upper insulating film 03 and the lower insulating film 04 surround the aluminum bars 02, and avoidance through holes are provided at the connection positions between the two and the aluminum bars 02.

[0040] The new CCS integrated busbar forms a conductive circuit on a PI film by means of aluminum foil etching or die-cutting, and has a conductive structure adapted to the aluminum foil, which can well realize the signal transmission function. Its beneficial effects are as follows: First, using aluminum foil as the raw material, the cost of aluminum foil is about one-fourth of that of copper foil, effectively reducing costs; Second, at the same time, the aluminum foil is lighter in weight, and the weight of aluminum foil of the same volume is about one-third of that of copper foil, reducing the weight of the equipment; Third, the aluminum foil can achieve better signal acquisition; Fourth, the aluminum foil has strong corrosion resistance and a longer service life.

[0041] Preferably, the acquisition terminal 3 and the circuit layer 2 are integrally formed, and the input end of the conductive circuit of the aluminum foil body extends outward to form the acquisition terminal 3 made of aluminum sheet material. Its beneficial effects are as follows: The acquisition terminal 3 and the circuit layer 2 are made of the same material, so the acquisition terminal 3 and the circuit layer 2 can be integrally made without a welding structure, with higher conductivity, and a simple structure and lower production cost.

[0042] In another embodiment, the new CCS integrated busbar includes: at least one FPC signal acquisition component 01, several aluminum bars 02, an upper insulating film 03, and a lower insulating film 04;

[0043] The FPC signal acquisition component 01 includes a base material 1, a circuit layer 2, several acquisition terminals 3, and a connector 4. The base material 1 is a covering film made by gluing an intermediate adhesive layer 11 on the upper surface of an insulating base film 10. The circuit layer 2 is several conductive circuits formed by printing silver paste on the intermediate adhesive layer 11 of the base material 1. One end of each of the several acquisition terminals 3 is respectively connected to each input end of the conductive circuits of the circuit layer 2, and the connector 4 is electrically connected to the integrated output end of the conductive circuits of the circuit layer 2. The lower surface of the insulating base film 10 is adhesively connected to a lower protective film 5, and the upper surface of the circuit layer 2 is adhesively connected to an upper protective film 6;

[0044] The aluminum bar 02 is welded to the other end of the acquisition terminal 3;

[0045] The upper insulating film 03 is adhesively connected to the upper protective film 6;

[0046] The lower insulating film 04 is adhesively connected under the lower protective film 5. The upper insulating film 03 and the lower insulating film 04 surround the aluminum bar 02, and avoidance through holes are provided at the connection positions between the two and the aluminum bar 02.

[0047] Among them, the printing method preferably adopts a printing mold with circuit diagrams formed according to various requirements, and the silver paste is formed on the intermediate adhesive layer 11 of the base material 1 through the printing mold to form the circuit layer 2.

[0048] The new CCS integrated busbar adopts a new FPC signal acquisition component 01. The new FPC signal acquisition component 01 uses silver paste to form various conductive circuits on the middle adhesive layer 11 of the base material 1 through printing, forming the required circuit layer 2, which can well realize the signal transmission function. Its beneficial effects are as follows: First, the cost of silver paste printing is cheaper than that of rolled copper foil, and the raw material cost is low, reducing the cost of CCS products. Second, the silver paste printing process is simple, with fewer processing procedures, a short process flow, a short processing cycle, and high printing efficiency, further reducing the cost of CCS products. Third, the equipment cost required for the printing method is low. Compared with the equipment such as lithography machines, etching machines, and hot presses required for etching, the fixed investment is greatly reduced, and at the same time, the cost of CCS production is reduced. Fourth, the printing process does not produce waste water, reducing the pollution to the environment.

[0049] Furthermore, in the above two implementation manners, the acquisition terminal 3 is a nickel sheet, and the nickel sheet is welded to the input end of the conductive circuit of the circuit layer 2. Preferably, it further includes an NTC thermistor 7, and the NTC thermistor 7 is welded to the corresponding input end of the conductive circuit of the circuit layer 2. The collected corresponding signal is transmitted to the connector 4 through the NTC thermistor 7 and the conductive circuit of the circuit layer 2. Its beneficial effect is that this structure can achieve good signal acquisition and transmission performance.

[0050] Furthermore, in the above two implementation manners, several input connection positions are provided on the front and rear sides of the upper surface of the base material 1, and one lateral end of the upper surface is an output connection position. The output ends of the conductive circuits of the circuit layer 2 are horizontally arranged in parallel at equal intervals at the output connection position, and the input ends of the conductive circuits of the circuit layer 2 are longitudinally bent and enter each input connection position of the base material 1. Preferably, at the output connection position and the input connection position, a reinforcing plate 12 is provided on the lower surface of the insulating base film 10. Among them, several connection positions are provided on the front and rear sides of the base material 1 in the longitudinal direction, and the base material 11 is provided with process holes. Its beneficial effect is that this circuit layout is convenient for signal acquisition and transmission and can be effectively applied in various scenarios. At the same time, the setting of the reinforcing plate improves the structural strength of the device and facilitates the connection and setting of accessories.

[0051] Furthermore, in the above two implementation manners, the connector 4 is exposed outside the upper insulating film 03 and the lower insulating film 04;

[0052] The base material 1 can be a sheet-like film cut from a rolled film at equal intervals. Its beneficial effect is that this setting is convenient for rapid processing and has high production efficiency.

[0053] Furthermore, in the above two implementation manners, the lower surface of the insulating base film 10 is adhesively connected to the lower protective film 5 through the lower adhesive layer 8, and the upper surface of the circuit layer 2 is adhesively connected to the upper protective film 6 through the upper adhesive layer 9;

[0054] The insulating base film 10, the lower protective film 5, and the upper protective film 6 are PI films made of polyimide films, and the intermediate adhesive layer 11, the lower adhesive layer 8, and the upper adhesive layer 9 are ADH hot melt adhesives;

[0055] The upper insulating film 03 and the lower insulating film 04 are PET films. Its beneficial effects are: the PI film has good insulation performance, the PI cover film has good electrical properties, and the bonding strength is high, which is suitable for electrical insulation applications.

[0056] Preferably, the thickness of the insulating base film 10 is 25um, or the thickness of the intermediate adhesive layer 11 is 20um;

[0057] The thickness of the lower protective film 5 is 12um, the thickness of the upper protective film 6 is 25um, the thickness of the lower adhesive layer 8 is 15um, and the thickness of the upper adhesive layer 9 is 35um.

[0058] Preferably, the vertical legs of the connector 4 pass through the through holes at one end of the base material 1 and are connected to the reinforcing plate 12 below, and the mounting plate 12 here is provided with horizontal oval connecting holes.

[0059] A number of oval through holes are provided on the base material 1 at equal intervals in the horizontal direction.

[0060] The above are only some embodiments of the present invention. For those of ordinary skill in the art, without departing from the creative concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention.

Claims

1. The new CCS integrated busbar is characterized by: include: At least one FPC signal acquisition component (01), a plurality of aluminum bars (02), an upper insulating film (03) and a lower insulating film (04); The FPC signal acquisition component (01) comprises a substrate (1), a circuit layer (2), a plurality of acquisition terminals (3) and a connector (4); the substrate (1) is a covering film formed by gluing an intermediate adhesive layer (11) on the upper surface of an insulating base film (10); the circuit layer (2) is a conductive circuit formed by etching or die-cutting aluminum foil on the intermediate adhesive layer (11) of the substrate (1); one end of the plurality of acquisition terminals (3) is respectively connected to each input end of the conductive circuit of the circuit layer (2); the connector (4) is electrically connected to the output end of the conductive circuit of the circuit layer (2); the lower surface of the insulating base film (10) is glued to a lower protective film (5); and the upper surface of the circuit layer (2) is glued to an upper protective film (6); The aluminum bar (02) is welded to the other end of the collection terminal (3); The upper insulating film (03) is adhesively connected to the upper protective film (6), and the lower insulating film (04) is adhesively connected to the lower protective film (5). The upper insulating film (03) and the lower insulating film (04) surround the aluminum bar (02), and avoidance through holes are provided at the connection positions between the upper insulating film and the aluminum bar (02).

2. The new CCS integrated busbar according to claim 1 is characterized in that: The collection terminal (3) and the circuit layer (2) are integrally formed, and the input end of the conductive circuit of the aluminum foil body extends outward to form the collection terminal (3) made of aluminum sheet material.

3. The new CCS integrated busbar is characterized by: include: At least one FPC signal acquisition component (01), a plurality of aluminum bars (02), an upper insulating film (03) and a lower insulating film (04); The FPC signal acquisition component (01) comprises a substrate (1), a circuit layer (2), a plurality of acquisition terminals (3) and a connector (4), wherein the substrate (1) is a covering film formed by gluing an intermediate adhesive layer (11) on the upper surface of an insulating base film (10). The circuit layer (2) is a plurality of conductive circuits formed by printing silver paste on the intermediate adhesive layer (11) of the substrate (1). One end of a plurality of the collecting terminals (3) is respectively connected to each input end of the conductive circuit of the circuit layer (2); the connector (4) is electrically connected to the output end of the conductive circuit of the circuit layer (2); the lower surface of the insulating base film (10) is adhesively connected to the lower protective film (5); and the upper surface of the circuit layer (2) is adhesively connected to the upper protective film (6); The aluminum bar (02) is welded to the other end of the collection terminal (3); The upper insulating film (03) is adhesively connected to the upper protective film (6), and the lower insulating film (04) is adhesively connected to the lower protective film (5). The upper insulating film (03) and the lower insulating film (04) surround the aluminum bar (02), and avoidance through holes are provided at the connection positions between the upper insulating film and the aluminum bar (02).

4. The new CCS integrated busbar according to claim 1 or 3, characterized in that: The collection terminal (3) is a nickel sheet, which is welded to the conductive line input end of the line layer (2).

5. The new CCS integrated busbar according to claim 4 is characterized in that: It also includes an NTC thermistor (7), wherein the NTC thermistor (7) is welded to a corresponding conductive circuit input end of the circuit layer (2).

6. The new CCS integrated busbar according to claim 5 is characterized in that: The upper surface of the substrate (1) is provided with a plurality of input connection positions on both the front and rear sides, and one lateral end of the upper surface is an output connection position, the conductive circuit output ends of the circuit layer (2) are horizontally parallel and evenly spaced and distributed at the output connection positions, and the conductive circuit input ends of the circuit layer (2) are longitudinally bent and enter each input connection position of the substrate (1).

7. The new CCS integrated busbar according to claim 6 is characterized in that: The output connection position and the input connection position, and a reinforcing plate (12) are provided on the lower surface of the insulating base film (10).

8. The novel CCS integrated busbar according to claim 1 or 3, characterized in that: The connector (4) is exposed outside the upper insulating film (03) and the lower insulating film (04); The substrate (1) can be a sheet film cut from a roll film at equal intervals.

9. The novel CCS integrated busbar according to claim 1 or 3, characterized in that: The lower surface of the insulating base film (10) is adhesively connected to the lower protective film (5) via a lower adhesive layer (8), and the upper surface of the circuit layer (2) is adhesively connected to the upper protective film (6) via an upper adhesive layer (9); The insulating base film (10), the lower protective film (5) and the upper protective film (6) are PI films composed of polyimide films, and the middle adhesive layer (11), the lower adhesive layer (8) and the upper adhesive layer (9) are ADH hot melt adhesives; The upper insulating film (03) and the lower insulating film (04) are PET films.

10. The new CCS integrated busbar according to claim 9 is characterized in that: The thickness of the insulating base film (10) is 25 um, or the thickness of the intermediate glue layer (11) is 20 um; Or the thickness of the lower protective film (5) is 12 um, the thickness of the upper protective film (6) is 25 um, the thickness of the lower glue layer (8) is 15 um, and the thickness of the upper glue layer (9) is 35 um.

Images