Electronic device

Abstract

The utility model discloses electronic equipment, and the electronic equipment comprises a first circuit board which is provided with a first through hole; the second circuit board is stacked on the first circuit board; the mainboard support is provided with a boss, and the mainboard support, the first circuit board and the second circuit board are arranged in a stacked mode; an elastic sheet; wherein the boss is arranged on the first circuit board in a penetrating mode through the first through hole, and the second circuit board is electrically connected with the boss through the elastic piece.

Description

Technical Field

[0001] The present application belongs to the field of electronic technology, and specifically relates to an electronic device. Background Art

[0002] In the related art, the devices on the frame board in electronic devices such as mobile phones are far away from the antenna of the mainboard bracket. Therefore, in order to achieve connectivity between the devices on the frame board in the mobile phone and the antenna of the mainboard bracket, it is necessary to connect the signal line to the pad between the frame board and the mainboard, and then connect the signal line to the spring clip on the mainboard bracket. However, this will cause the antenna path to become longer and reduce the antenna performance. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide an electronic device that can solve the problem in the prior art that the antenna path is long and the antenna performance is reduced when the antenna is connected from the middle frame board to the mainboard bracket.

[0004] In a first aspect, an embodiment of the present application provides an electronic device, including:

[0005] A first circuit board, wherein a first through hole is formed in the first circuit board;

[0006] a second circuit board, the second circuit board being stacked on the first circuit board;

[0007] A mainboard bracket, wherein the mainboard bracket is provided with a boss, and the mainboard bracket, the first circuit board and the second circuit board are stacked;

[0008] shrapnel;

[0009] The boss is penetrated through the first through hole in the first circuit board, and the second circuit board is electrically connected to the boss through the spring.

[0010] In an embodiment of the present application, the electronic device includes: a first circuit board, a first through hole is provided on the first circuit board; a second circuit board, the second circuit board is stacked on the first circuit board; a mainboard bracket, the mainboard bracket is provided with a boss, the mainboard bracket, the first circuit board and the second circuit board are stacked; a spring; wherein the boss is passed through the first through hole on the first circuit board, and the second circuit board is electrically connected to the boss through the spring. In this way, by providing a boss structure on the mainboard bracket and making it pass through the through hole of the first circuit board, the distance between the mainboard bracket and the second circuit board is shortened, so that the antenna of the second circuit board and the mainboard bracket can be directly connected through the spring without pulling the signal line, thereby achieving the purpose of shortening the antenna path and improving the antenna performance.

[0011] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0013] Figure 1 is a schematic cross-sectional structural diagram of an electronic device according to an embodiment of the present application;

[0014] Figure 2 is a schematic diagram of an antenna path of an electronic device according to an embodiment of the present application;

[0015] Figure 3 is a schematic structural diagram of a widened pad design of a shelf according to an embodiment of the present application;

[0016] Figure 4 is a cross-sectional schematic diagram of a through hole design on a shelf according to an embodiment of the present application;

[0017] Figure 5 It is a structural schematic diagram of a mainboard according to an embodiment of the present application, in which a cutout design is made below the through hole of the frame plate to avoid air. DETAILED DESCRIPTION

[0018] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0019] In the description of this application, unless otherwise specified, "plurality" means two or more than two. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the related objects are in an "or" relationship.

[0020] In the description of the present application, it should be understood that the terms "upper", "lower", "vertical", "horizontal", "top", "bottom", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0021] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0022] In order to make the embodiments of the present application clearer, the relevant technical knowledge involved in the present application is first introduced as follows:

[0023] In order to increase the area of ​​components on the motherboard, the industry currently often uses CAVITY frame design to improve the utilization rate of motherboard components. On motherboards with CAVITY frame design, components and welding shrapnel can be placed on both the TOP and BOT surfaces of the motherboard, and CAVITY frame can only place components and welding shrapnel on the BOT surface. CAVITY refers to a local recessed structure. The TOP surface of the motherboard usually refers to the front of the motherboard, that is, the upper surface of the plug-in components. The BOT surface is the bottom surface of the motherboard, which is the back relative to the TOP surface of the motherboard. Shrapnel is often used on mobile phone motherboards to connect with the motherboard bracket or the antenna on the motherboard bracket. Positive pressure shrapnel that does not break the board, board-breaking shrapnel, and reverse pressure shrapnel are often used on the TOP / BOT surface of the motherboard and the BOT surface of the CAVITY frame. Currently, they are only used on the BOT surface of the motherboard in the industry.

[0024] Currently, only non-breaking positive pressure springs are used on CAVITY racks in the industry, which can only connect the CAVITY rack with the antenna on the mainboard bracket. If you want to connect the CAVITY rack device with the antenna on the mainboard bracket, you need to connect the signal line through the pad between the CAVITY rack and the mainboard, and then connect the signal line to the positive pressure spring or the breaking spring on the mainboard to connect with the mainboard bracket antenna. Because the signal line needs to be connected between the CAVITY rack and the mainboard, this will cause the antenna path to become longer and the antenna performance to deteriorate, thus affecting the user experience.

[0025] The embodiment of the present application designs a boss structure for the mainboard bracket and passes through the hollowed-out area in the middle of the mainboard, thereby directly welding a counter-pressure spring sheet on the bracket. The spring sheet on the bracket can be directly connected to the metal antenna of the mainboard bracket, thereby shortening the antenna path and improving the antenna performance.

[0026] The structure of the electronic device provided by the embodiment of the present application is described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0027] See also Figure 1 , Figure 1This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 1 As shown, the electronic device includes:

[0028] A first circuit board 11, wherein a first through hole 111 is formed on the first circuit board 11;

[0029] A second circuit board 12, 1 The second circuit board 12 is stacked on the first circuit board 11;

[0030] A mainboard bracket 13, wherein the mainboard bracket 13 is provided with a boss 131, and the mainboard bracket 13, the first circuit board 11 and the second circuit board 12 are stacked;

[0031] Shrapnel 14;

[0032] The boss 131 is disposed on the first circuit board 11 through the first through hole 111 , and the second circuit board 12 is electrically connected to the boss 131 through the spring 14 .

[0033] In the embodiment of the present application, the first circuit board 11 may be a mainboard 11, the second circuit board 12 may be a frame board 12, and the mainboard support 13 may also be called a mainboard cover. Usually, the middle frame structure of the electronic device is designed as follows: the frame board 12 is stacked on the mainboard 11, and the stacked structure of the mainboard 11 and the frame board 12 is stacked on the mainboard support 13. For ease of understanding, the embodiment of the present application is mainly described by taking the stacked design structure of the mainboard and the frame board as an example.

[0034] In order to shorten the antenna path from the frame to the antenna on the mainboard bracket, the mainboard bracket structure of the electronic device is improved. In the traditional mobile phone frame, it is necessary to connect the signal line from the components on the TOP surface of the frame, pass through the frame and the mainboard, and then detour a certain distance to connect with the spring clip on the mainboard bracket to achieve the connection between the frame and the antenna on the mainboard bracket. There is a problem that the antenna path is too long, resulting in a decrease in antenna performance. After the improved design, the embodiment of the present application proposes a mainboard bracket with a boss structure, so that its boss part passes through the hollowed-out area in the middle of the mainboard and reaches the side of the frame, as shown in the following figure. Figure 2 As shown in FIG. 1 , the improved design shortens the distance between the frame and the antenna on the mainboard bracket, so that the TOP surface device of the frame can be directly connected to the antenna on the mainboard bracket through the spring clip, greatly shortening the antenna path (such as Figure 2 This avoids the degradation of antenna performance caused by the lengthening of the antenna path.

[0035] like Figure 1 and Figure 2As shown, the frame 12 is welded and fixed on the main board 11, and the side of the frame 12 facing away from the main board 11, such as the BOT side, is equipped with a device 121, wherein the frame 12 can be a local recessed (CAVITY) frame commonly used on the main board in the industry, and the main board 11 and the frame 12 equipped with the device are welded and fixed to form a stacked PCB structure. The main board 11 can be a frame structure with a hollowed-out middle portion, such as the main board 11 is provided with a through hole, i.e., the first through hole 111, and the frame 12 can also be a frame structure with a hollowed-out middle portion, i.e., the frame 12 can also be provided with a through hole, and the frame 12 can also be stacked on one side of the main board 11 without punching holes.

[0036] In some embodiments, a second through hole is provided on the second circuit board 12, and the boss 131 is provided on the first circuit board 11 and the second circuit board 12 through the first through hole 111 and the second through hole. That is, the main board 11 and the frame board 12 are both hollowed out in the middle and stacked on each other, and the sizes of the through holes provided in the hollowed-out area in the middle, that is, on the board, can be substantially the same and opposite to each other, so that the boss 131 can pass through it, and is located beside the frame board 12 and at a relatively consistent height with the frame board 12.

[0037] Since the spring piece 14 is usually designed to be welded on the frame plate, the Z-direction height (vertical height, i.e. Figure 1 The height from top to bottom in the middle is relatively high, so the mainboard bracket 13 can be designed as a boss, and the boss 131 passes through the through holes of the mainboard 11 and the frame plate 12 and contacts the spring piece 14 on the frame plate 12.

[0038] On the basis of the above improved structure, the frame 12 and the boss 131 can be directly connected through a spring 14, specifically, one end of the spring 14 is fixedly connected to the pad on the frame 12, and the other end is fixedly connected to the upper surface of the boss 131, which can be an electrical connection method such as welding; wherein the mainboard bracket 13 is usually made of metal and is designed to be used as a middle frame antenna. In this way, the device on the frame 12 and the antenna of the mainboard bracket 13 directly establish a conductive circuit through a spring 14, such as Figure 2 As shown, the mainboard bracket 13 antenna path (such as Figure 2 The length of the antenna (as indicated by the dashed arrow) is greatly shortened, thereby improving the antenna performance.

[0039] Optionally, the boss 131 includes a base 1311 and a protrusion 1312, the protrusion 1312 is located on the base 1311, the base 1311 is located on the side of the first circuit board 11 facing away from the second circuit board 12, and the protrusion 1312 is penetrated through the first through hole 111 and disposed on the first circuit board 11. Specifically, Figure 1 and Figure 2As shown, the boss 131 is a convex structure, the bottom is a base 1311, located below the main board 11, the upper part is a protrusion 1312, located above the main board 11, and the protrusion 1312 passes through the through holes of the main board 11 and the frame board 12 to reach the side of the frame board 12. The boss structure design has the advantages of being simple and easy to implement.

[0040] Optionally, the boss 131 is flush with the surface of the second circuit board 12 .

[0041] like Figure 1 and Figure 2 As shown, in some embodiments, the boss 131 may be designed to be flush with the surface height of the frame plate 12 , which is more conducive to the fixed connection between the boss 131 and the spring plate 14 on the frame plate 12 .

[0042] Optionally, a side area of ​​the second circuit board 12 connected to the elastic sheet 14 has an extension portion 122 extending toward the location of the elastic sheet 14 .

[0043] like Figure 1 and Figure 3 As shown, in some embodiments, the side of the frame plate 12 (including the welding pad on the frame plate) corresponding to the position of the spring sheet 14 can be widened to accommodate the welding position such as the welding hole required for welding the spring sheet 14.

[0044] like Figure 3 As shown, the side area where the frame plate 12 and its welding pad are connected to the spring sheet 14 is widened and has an extension portion 122 extending toward the location of the spring sheet 14 .

[0045] In this way, by widening the pad area of ​​the frame plate 12 , it is more convenient to directly connect the frame plate 12 to one end of the spring 14 without using a signal line.

[0046] Optionally, an opening 1221 is provided on the surface of the extension portion 122 , and one end of the spring 14 connected to the second circuit board 12 has a pin, and the pin is inserted into the opening 1221 and fixed to the second circuit board 12 by welding.

[0047] like Figure 3 and Figure 4 As shown, in some embodiments, the spring clip 14 is welded and fixed to the frame plate 12 through its pins. To cooperate with the pin connection structure of the spring clip 14, an opening 1221 can be opened on the surface of the extension portion 122 of the frame plate 12 to insert the pin of the spring clip 14 into the opening 1221 for welding and fixing. Usually, there are two pins of the spring clip 14, and correspondingly, two matching openings 1221 are also opened on the surface of the extension portion 122 of the frame plate 12.

[0048] The opening 1221 may be designed as a through hole or a blind hole, that is, the opening does not penetrate the entire frame plate.

[0049] Optionally, the spring piece 14 is a reverse pressure spring piece, a positive pressure spring piece or a side pressure spring piece.

[0050] In some embodiments, the spring clip 14 welded on the frame plate 12 can be not only a reverse pressure spring clip, but also other types of spring clips such as a positive pressure spring clip and a side pressure spring clip. Such spring clips can be inserted into the opening 1221 on the frame plate 12 by means of pins and welded and fixed.

[0051] Alternatively, if Figure 4 As shown, the opening 1221 is a through hole design structure, such as Figure 5 As shown, an avoidance groove is provided at the position of the main board 11 corresponding to the opening 1221 .

[0052] In some embodiments, in order to simplify the manufacturing process, the opening 1221 (also called welding hole) on the frame plate 12 can be designed as a through hole punched from top to bottom. The specific design of the welding hole is as follows: Figure 4 As shown. And because the welding hole is designed as a through hole, when welding the spring piece 14 through this welding hole, it is necessary to fill the welding hole with solder paste. The solder paste is fluid when passing through the high-temperature furnace, and it is easy to overflow from the bottom of the through hole, forming a solder residue higher than the bottom surface of the frame plate 12 at the bottom edge of the through hole. Since this solder residue is higher than the bottom surface of the frame plate 12, when the frame plate 12 is welded to the main board 11 again, the solder residue at the bottom of the frame plate 12 will interfere with the main board 11, resulting in the inability to effectively weld the frame plate 12 and the main board 11, resulting in problems such as cold soldering and false soldering. In order to avoid this problem, it is proposed in this embodiment to make a cut-out avoidance design at the position of the main board 11 corresponding to the extension portion 122 of the frame plate 12, that is, corresponding to the welding hole, that is, to set an avoidance groove, which can be specifically shown as follows Figure 5 As shown in the dotted line frame area, the bottom of the frame plate 12 corresponding to the welding hole is designed to avoid air and is not blocked by the main board structure.

[0053] The welding hole through-hole and the air avoidance design below the welding hole in this embodiment are not only more convenient for processing, but also can effectively prevent the solder residue at the bottom of the frame plate 12 from interfering with the main board 11 and affecting the welding and fixing of the entire frame plate 12 and the entire main board 11.

[0054] It should be noted that the air avoidance design adopted in this embodiment can also facilitate directly supporting the welding fixture on the bottom of the frame plate 12 when welding the spring piece 14, thereby avoiding deformation of the frame plate cantilever structure when welding the spring piece 14.

[0055] Alternatively, if Figure 1 and Figure 2 As shown, a metal connector 15 is disposed on the surface of the boss 131 , and the boss 131 is connected to one end of the spring 14 via the metal connector 15 .

[0056] In one embodiment, the boss 131 can be connected to one end of the spring 14 through a metal connector 15 disposed on the surface, which can not only ensure that the antenna of the mainboard bracket 13 and the spring 14 are effectively fixedly connected, but also ensure good conductivity.

[0057] Optionally, the metal connector 15 is a gold-plated rivet or a gold-plated sheet.

[0058] In some embodiments, in order to optimize the contact reliability between the spring clip 14 and the boss 131 on the mainboard bracket 13, gold-plated rivets can be designed on the surface of the boss 131, or gold-plated sheets can be welded to effectively reduce the contact resistance between the spring clip 14 and the boss 131, that is, reduce the resistance generated by the contact between the spring clip 14 and the boss 131 to obtain better conductivity.

[0059] Optionally, the surface of the boss 131 is a metal surface, and the metal surface is formed by laser engraving or high-gloss processing.

[0060] In some embodiments, the metal surface of the boss 131 can also be laser engraved, highlighted, or processed to remove the anode layer covering the surface of the boss 131 as much as possible to expose the metal inside, thereby improving the conductivity between the boss 131 and the spring 14. That is, this solution can also achieve the effect of reducing the contact resistance between the spring 14 and the boss 131.

[0061] To summarize the above implementation methods, the embodiments of the present application use a certain structural design to allow the spring clips to be directly welded to the frame plate, thereby enabling the spring clips on the frame plate to be directly connected to the metal antenna of the mainboard bracket, shortening the antenna connection path and improving the antenna performance.

[0062] In one embodiment of the present application, two through holes are designed at the pad position of the frame plate to penetrate the entire pad in the Z direction from top to bottom, which is not only more convenient for processing, but also allows the solder legs of the spring clip to extend into the through holes, and the through holes are filled with solder paste to solder the spring clips. In order to prevent the solder paste from overflowing from the other side of the through holes and affecting the welding of the frame plate and the main board, a through hole avoidance area is designed on the main board structure to avoid false welding and cold welding problems between the frame plate and the main board, and the jig can directly support the frame plate, which is beneficial to ensure the flatness of the frame plate after the spring clips are welded.

[0063] The utility model can be applied not only to mobile phones, but also to other electronic products.

[0064] According to an embodiment of the present application, the electronic device includes: a first circuit board, a first through hole is provided on the first circuit board; a second circuit board, the second circuit board is stacked on the first circuit board; a mainboard bracket, the mainboard bracket is provided with a boss, the mainboard bracket, the first circuit board and the second circuit board are stacked; a spring; wherein the boss is passed through the first through hole on the first circuit board, and the second circuit board is electrically connected to the boss through the spring. In this way, by providing a boss structure on the mainboard bracket and making it pass through the through hole of the first circuit board, the distance between the mainboard bracket and the second circuit board is shortened, so that the antenna of the second circuit board and the mainboard bracket can be directly connected through the spring without pulling the signal line, thereby achieving the purpose of shortening the antenna path and improving the antenna performance.

[0065] Other structures of the electronic device according to the embodiment of the present application, such as a housing and an antenna, and operations are known to those skilled in the art and will not be described in detail here.

[0066] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0067] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: A first circuit board (11), wherein a first through hole (111) is formed on the first circuit board; A second circuit board (12), the second circuit board being stacked on the first circuit board; A mainboard bracket (13), wherein the mainboard bracket is provided with a boss (131), and the mainboard bracket (13), the first circuit board (11) and the second circuit board (12) are stacked; Shrapnel (14); The boss is penetrated through the first through hole in the first circuit board (11), and the second circuit board is electrically connected to the boss through the spring sheet (14).

2. The electronic device according to claim 1, characterized in that: The second circuit board (12) is provided with a second through hole, and the boss is penetrated through the first through hole and the second through hole and is arranged on the first circuit board (11) and the second circuit board (12).

3. The electronic device according to claim 1, characterized in that: The boss (131) comprises a base (1311) and a protrusion (1312), wherein the protrusion is located on the base, the base is located on a side of the first circuit board (11) facing away from the second circuit board (12), and the protrusion is penetrated through the first through hole in the first circuit board (11).

4. The electronic device according to claim 1, characterized in that: The boss (131) is flush with the surface of the second circuit board (12).

5. The electronic device according to claim 1, characterized in that: A side area of ​​the second circuit board (12) connected to the spring sheet (14) comprises an extension portion (122) extending towards the location of the spring sheet (14).

6. The electronic device according to claim 5, characterized in that: An opening (1221) is provided on the surface of the extension portion (122); one end of the spring sheet (14) connected to the second circuit board (12) has a plug pin, and the plug pin is inserted into the opening (1221) and fixed to the second circuit board (12) by welding.

7. The electronic device according to claim 6, characterized in that: The opening (1221) is a through hole, and the first circuit board (11) is provided with an avoidance groove at a position corresponding to the opening.

8. The electronic device according to claim 1, characterized in that: A metal connecting piece (15) is provided on the surface of the boss (131), and the boss (131) is connected to one end of the spring sheet (14) via the metal connecting piece (15).

9. The electronic device according to claim 8, characterized in that: The metal connecting piece (15) is a gold-plated rivet or a gold-plated sheet.

10. The electronic device according to claim 1, characterized in that: The surface of the boss (131) is a metal surface, and the metal surface is formed by laser engraving or high-gloss processing.

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