Anti-interference integrated circuit board

By setting filter capacitors and common mode inductors at the power input end of the integrated circuit board, and adding heat dissipation holes and heat sinks on the circuit board, combined with the magnetically isolated anti-interference cover design, the problems of low heat dissipation efficiency and signal interference in the traditional integrated circuit board are solved, and the working efficiency and anti-interference are improved.

CN222916266UActive Publication Date: 2025-05-27DONGGUAN KUDE INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202421707923.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-18
Publication Date
2025-05-27
Estimated Expiration
2034-07-18

AI Technical Summary

Technical Problem

The traditional integrated circuit board has simple structure and low heat dissipation efficiency, which leads to signal interference during use of the chip, affecting the anti-interference ability and electrical stability of the integrated circuit.

Method used

An anti-interference integrated circuit board is designed. By setting filter capacitors and common mode inductors at the power input end of the circuit board, the power signal interference is eliminated, and multiple sets of heat dissipation holes and heat sinks are set on the circuit support cavity seat to improve heat dissipation efficiency. At the same time, a magnetically isolated anti-interference cover is designed to shield signal interference.

Benefits of technology

It improves the working efficiency and anti-interference of the integrated circuit, enhances the heat dissipation efficiency of the circuit board, reduces signal interference, and extends the service life of the circuit board.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an anti-interference integrated circuit board, which relates to the technical field of circuit boards and comprises a circuit board assembly and an anti-interference assembly arranged at the upper end of the circuit board assembly, the circuit board assembly comprises a circuit supporting cavity seat, a lead frame is arranged on the top surface of the circuit supporting cavity seat, and a chip carrier is arranged at the upper end of the lead frame. A main chip is arranged on the top face of the chip carrier, a power input end is arranged on one side of the circuit supporting cavity base, a lead is arranged on one side of the main chip, one end of the lead penetrates through the circuit supporting cavity base and extends to one side of the power input end, the power input end is electrically connected with the main chip through the lead, and a heat dissipation hole cavity is formed in one side of the circuit supporting cavity base. According to the integrated circuit board, the circuit board assembly and the anti-interference assembly are arranged in a matched mode, the multiple sets of heat dissipation hole cavities penetrate through the upper side and the lower side of the circuit supporting cavity base, the integrated circuit board has the anti-interference signal effect through joint cooperation of the circuit board assembly and the anti-interference assembly, the service life of the circuit board is prolonged, and the working efficiency of the circuit board is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to an anti-interference integrated circuit board. Background Art

[0002] A circuit board, also known as a printed circuit board (PCB), aluminum substrate, high-frequency board, ultra-thin circuit board, ultra-thin printed circuit board, etc. Common board layer structures include single-layer boards, double-layer boards, and multi-layer boards. Signal interference will occur between adjacent circuit boards. With the continuous improvement of the performance of electronic devices, the functions are becoming more and more complex, and the functions of chips are also increasing. However, the heat dissipation problem of chips hinders the further application of this packaging structure. The current packaging structure has poor heat dissipation effect. Therefore, signal interference will be formed during the use of the chip. At this time, the chip cannot be used, resulting in poor anti-interference ability of the integrated circuit, thus affecting the electrical stability of the integrated circuit.

[0003] On this basis, after retrieval, the Chinese patent authorization announcement number CN109874225B discloses an integrated circuit board;

[0004] However, there are deficiencies in this patent application: the structure and function of the traditional integrated circuit board are relatively simple, and the heat dissipation efficiency of its circuit board is low. Therefore, signal interference will be formed during the use of the chip. At this time, the chip cannot be used normally, resulting in poor anti-interference ability of the integrated circuit, thus affecting the electrical stability of the integrated circuit. Moreover, when the integrated circuit works, power signal interference will be formed at the power input end of the integrated circuit, thus affecting the working efficiency of the integrated circuit.

[0005] In view of the above problems, an anti-interference integrated circuit board is proposed. Summary of the Utility Model

[0006] In order to overcome the disadvantages and deficiencies existing in the prior art, the purpose of the utility model is to provide an anti-interference integrated circuit board. By using this device to work, the problems in the above background are solved, that is, the structure and function of the traditional integrated circuit board are relatively simple, the heat dissipation efficiency of its circuit board is low, so signal interference will be formed during the use of the chip. At this time, the chip cannot be used normally, resulting in poor anti-interference ability of the integrated circuit, thus affecting the electrical stability of the integrated circuit. Moreover, when the integrated circuit works, power signal interference will be formed at the power input end of the integrated circuit, thus affecting the working efficiency of the integrated circuit.

[0007] The object of the present utility model is achieved by the following technical solutions: An anti-interference integrated circuit board, comprising a circuit board assembly and an anti-interference component arranged on the upper end of the circuit board assembly. The circuit board assembly includes a circuit support cavity seat, and a lead frame is arranged on the top surface of the circuit support cavity seat. A chip carrier is arranged at the upper end of the lead frame, and a main chip is arranged on the top surface of the chip carrier. A power input terminal is arranged on one side of the circuit support cavity seat. A lead is arranged on one side of the main chip, and one end of the lead passes through the circuit support cavity seat and extends to one side of the power input terminal. The power input terminal is electrically connected to the main chip through the lead. A heat dissipation hole cavity is arranged on one side of the circuit support cavity seat, and multiple groups of the heat dissipation hole cavities are arranged. Multiple groups of the heat dissipation hole cavities penetrate through the upper and lower sides of the circuit support cavity seat. The anti-interference component includes a magnetic isolation anti-interference cover arranged on the upper end of the circuit support cavity seat. Two groups of clamping blocks are arranged at the bottom of the magnetic isolation anti-interference cover. Two groups of clamping grooves are arranged on the top surface of the circuit support cavity seat. The clamping grooves are matched with the clamping blocks. Cavity grooves are arranged on one side of each of the two groups of clamping blocks, and second magnets are arranged inside the two groups of cavity grooves.

[0008] Preferably, the lead frame is arranged on the top surfaces of multiple groups of the heat dissipation hole cavities, and heat dissipation fins are arranged on the bottom surface of the circuit support cavity seat. Multiple groups of the heat dissipation fins are arranged, and multiple groups of the heat dissipation fins correspond to multiple groups of the heat dissipation hole cavities respectively.

[0009] Preferably, a filtering capacitor is arranged on one side of the power input terminal, and a common mode inductor is arranged on the side of the power input terminal far from the filtering capacitor.

[0010] Preferably, the anti-interference component further includes a pulling block slidably connected to one side of the circuit support cavity seat. One side of the pulling block extends into the inner cavity of the circuit support cavity seat, and connecting plates are fixedly connected to both sides of the pulling block.

[0011] Preferably, L-shaped plates are fixedly connected to one side of each of the two groups of connecting plates. The two groups of L-shaped plates are slidably connected inside the circuit support cavity seat, and first magnets are fixedly connected to one side of each of the two groups of L-shaped plates.

[0012] Preferably, the two groups of second magnets are magnetically connected to the two groups of first magnets respectively, and the two groups of clamping grooves communicate with the circuit support cavity seat.

[0013] The beneficial effects of the present utility model are as follows:

[0014] 1. The utility model discloses an anti-interference integrated circuit board. By arranging filter capacitors and common-mode inductors around the power input end of the integrated circuit board, when the integrated circuit is working, the filter capacitors and the power input end work together to eliminate the power signal interference formed on the power input end of the integrated circuit, thereby improving the working efficiency and anti-interference ability of the integrated circuit. And a magnetic isolation anti-interference cover is arranged on the outer periphery of the integrated circuit board. The magnetic isolation anti-interference cover covers the top surface of the circuit support cavity seat and wraps the integrated circuit board. Furthermore, during the working process of the main chip in the integrated circuit, due to the low heat dissipation efficiency, signal interference is formed. The design of the magnetic isolation anti-interference cover can be used to shield the signal interference, thereby improving the anti-interference ability of the integrated circuit board. In order to enable the heat generated by the integrated circuit board to be dissipated quickly during operation, a plurality of heat dissipation hole cavities are arranged on the circuit support cavity seat, and the plurality of heat dissipation hole cavities are located at the bottom of the lead frame. And a heat sink is arranged at the lower end of each corresponding heat dissipation hole cavity. Through the heat dissipation channels formed by the heat sink and the heat dissipation hole cavities, the heat dissipated by the integrated circuit can be quickly dissipated into the surrounding environment by using the heat sink, achieving the purpose of rapid heat dissipation, improving the heat dissipation efficiency, and reducing signal interference. This setting, through the common cooperation of the circuit board component and the anti-interference component, enables the integrated circuit board to have an anti-interference signal effect, thereby extending the service life and working efficiency of the circuit board.

[0015] 2. The utility model discloses an anti-interference integrated circuit board. After the integrated circuit board is used for a long time, maintenance and repair work needs to be carried out. At this time, the operator needs to detach the magnetic isolation anti-interference cover from one side of the circuit support cavity seat for subsequent maintenance work. The user can pull the pulling block in a direction away from the circuit support cavity seat, so that the pulling block drives the connecting plate and the L-shaped plate to move in a direction away from the clamping block. The two L-shaped plates drive the two first magnets to move in a direction away from the clamping block until the first magnets are magnetically separated from the second magnets, and the first magnets are completely pulled out from the cavity grooves in front of the clamping block. At this time, the two clamping blocks lose their fixation. Subsequently, the operator can pull up the magnetic isolation anti-interference cover, and the magnetic isolation anti-interference cover drives the two clamping blocks to be pulled out of the two clamping grooves, and then the magnetic isolation anti-interference cover is detached from the circuit support cavity seat, and the integrated circuit board is exposed to the external environment, facilitating the user to carry out maintenance work. This setting enables the device not only to make the integrated circuit board have an anti-interference signal effect by using the magnetic isolation anti-interference cover, but also the magnetic isolation anti-interference cover is convenient for the user to install and detach, thereby facilitating the operator to carry out maintenance and repair work on the circuit board and improving the practicability of the device. Brief Description of the Drawings

[0016] Figure 1 is the structural schematic diagram of the utility model;

[0017] Figure 2 is the structural schematic diagram of the circuit board component and the anti-interference component of the utility model;

[0018] Figure 3 is a schematic structural diagram of the circuit board assembly of the present utility model;

[0019] Figure 4 is a schematic structural diagram of the internal engaging component of the circuit support cavity seat of the present utility model;

[0020] Figure 5 is a schematic structural diagram of the connection between the clamping block and the L-shaped plate of the present utility model;

[0021] Figure 6 is a sectional view of the circuit support cavity seat of the present utility model.

[0022] The reference numerals in the drawings are: 1, circuit board assembly; 11, circuit support cavity seat; 111, lead frame; 112, main chip; 113, chip carrier; 12, filter capacitor; 13, power input terminal; 14, common mode inductor; 15, heat dissipation hole cavity; 16, heat sink; 2, anti-interference component; 21, magnetic isolation anti-interference cover; 22, clamping block; 221, second magnet; 23, card slot; 24, pulling block; 25, connecting plate; 26, L-shaped plate; 261, first magnet. Detailed implementation manners

[0023] For the convenience of understanding by those skilled in the art, the present utility model will be further described below in conjunction with the embodiments and the drawings. The content mentioned in the implementation manners does not limit the present utility model.

[0024] To further understand the content of the present utility model, the present utility model will be described in detail in conjunction with the drawings.

[0025] Combined with Figure 1-6, An anti-interference integrated circuit board, comprising a circuit board assembly 1 and an anti-interference component 2 disposed on the upper end of the circuit board assembly 1. The circuit board assembly 1 includes a circuit support cavity seat 11, and a lead frame 111 is disposed on the top surface of the circuit support cavity seat 11. A chip carrier 113 is disposed at the upper end of the lead frame 111, and a main chip 112 is disposed on the top surface of the chip carrier 113. A power input terminal 13 is disposed on one side of the circuit support cavity seat 11. A lead is disposed on one side of the main chip 112, and one end of the lead passes through the circuit support cavity seat 11 and extends to one side of the power input terminal 13. The power input terminal 13 is electrically connected to the main chip 112 through the lead. A heat dissipation hole cavity 15 is disposed on one side of the circuit support cavity seat 11, and multiple groups of heat dissipation hole cavities 15 are provided. The multiple groups of heat dissipation hole cavities 15 penetrate through the upper and lower sides of the circuit support cavity seat 11. The anti-interference component 2 includes a magnetic isolation anti-interference cover 21 disposed on the upper end of the circuit support cavity seat 11. A clamping block 22 is disposed at the bottom of the magnetic isolation anti-interference cover 21, and two groups of clamping blocks 22 are provided. A clamping groove 23 is disposed on the top surface of the circuit support cavity seat 11, and two groups of clamping grooves 23 are provided. The clamping grooves 23 are matched with the clamping blocks 22. Cavity grooves are disposed on one side of the two groups of clamping blocks 22, and a second magnet 221 is disposed inside the two groups of cavity grooves.

[0026] The following further describes the present utility model in conjunction with embodiments.

[0027] Embodiment 1

[0028] As Figure 1-3 and Figure 6 shown, an anti-interference integrated circuit board, the lead frame 111 is disposed on the top surface of multiple groups of heat dissipation hole cavities 15, and heat dissipation fins 16 are disposed on the bottom surface of the circuit support cavity seat 11. Multiple groups of heat dissipation fins 16 are provided, and the multiple groups of heat dissipation fins 16 respectively correspond to the multiple groups of heat dissipation hole cavities 15. A filter capacitor 12 is disposed on one side of the power input terminal 13, and a common mode inductor 14 is disposed on the side of the power input terminal 13 away from the filter capacitor 12.

[0029] Embodiment 2

[0030] As Figure 2-5 shown, an anti-interference integrated circuit board, the anti-interference component 2 further includes a pulling block 24 slidably connected to one side of the circuit support cavity seat 11, and one side of the pulling block 24 extends into the inner cavity of the circuit support cavity seat 11. Connecting plates 25 are fixedly connected to both sides of the pulling block 24. L-shaped plates 26 are fixedly connected to one side of the two groups of connecting plates 25. The two groups of L-shaped plates 26 are slidably connected inside the circuit support cavity seat 11. First magnets 261 are fixedly connected to one side of the two groups of L-shaped plates 26. The two groups of second magnets 221 are magnetically connected to the two groups of first magnets 261 respectively. The two groups of clamping grooves 23 communicate with the circuit support cavity seat 11.

[0031] In summary, the working principle of the device of the present utility model: The present utility model discloses an anti-interference integrated circuit board. In the present utility model, filter capacitors 12 and common-mode inductors 14 are arranged around the power input terminal 13 of the integrated circuit board. When the integrated circuit is working, under the joint action of the filter capacitor 12 and the power input terminal 13, the power input terminal 13 of the integrated circuit can eliminate the power signal interference formed thereon, thereby improving the working efficiency and anti-interference ability of the integrated circuit. And a magnetic isolation anti-interference cover 21 is arranged on the outer periphery of the integrated circuit board. The magnetic isolation anti-interference cover 21 covers the top surface of the circuit support cavity seat 11 and wraps the integrated circuit board. Furthermore, during the working process of the main chip 112 in the integrated circuit, signal interference is formed due to the low heat dissipation efficiency. The design of the magnetic isolation anti-interference cover 21 can be used to shield the signal interference, thereby improving the anti-interference ability of the integrated circuit board; when the integrated circuit board is put into use, the circuit board can be installed at a specified position by installing the circuit support cavity seat 11, and at the same time, space should be reserved for multiple heat sinks 16 at the bottom of the circuit support cavity seat 11 to allow air to flow around the multiple heat sinks 16. In order to enable the heat generated by the integrated circuit board to be dissipated quickly during operation, multiple heat dissipation hole cavities 15 are arranged on the circuit support cavity seat 11, and the multiple heat dissipation hole cavities 15 are located at the bottom of the lead frame 111, and a heat sink 16 is arranged at the lower end of each corresponding heat dissipation hole cavity 15. Through the heat dissipation channels formed by the heat dissipation hole cavities 15 for the group of heat sinks 16, the heat dissipated by the integrated circuit can be quickly dissipated to the surrounding environment by using the heat sinks 16, achieving the purpose of rapid heat dissipation, improving the heat dissipation efficiency, and reducing signal interference. This setting, through the joint cooperation of the circuit board assembly 1 and the anti-interference assembly 2, enables the integrated circuit board to have an anti-interference signal effect, thereby extending the service life and working efficiency of the circuit board;

[0032] After long-term use, the integrated circuit board needs to be maintained and repaired. At this time, the operator needs to detach the magnetic isolation and interference protection cover 21 from one side of the circuit support cavity base 11 to facilitate subsequent maintenance work. The user can pull the pulling block 24 in a direction away from the circuit support cavity base 11, so that the pulling block 24 drives the connecting plate 25 and the L-shaped plate 26 to move in a direction away from the clamping block 22. The two L-shaped plates 26 drive the two first magnets 261 to move in a direction away from the clamping block 22 until the first magnets 261 are magnetically separated from the second magnets 221, and the first magnets 261 are completely pulled out from the cavity grooves in front of the clamping blocks 22. At this time, the two clamping blocks 22 lose their fixation. Subsequently, the operator can pull up the magnetic isolation and interference protection cover 21, and the magnetic isolation and interference protection cover 21 drives the two clamping blocks 22 to be pulled out from the two card slots 23. Thus, the magnetic isolation and interference protection cover 21 is detached from the circuit support cavity base 11, and the integrated circuit board is exposed to the external environment, facilitating the user to carry out maintenance work. If the magnetic isolation and interference protection cover 21 needs to be reinstalled subsequently, cover the magnetic isolation and interference protection cover 21 back on the top surface of the circuit support cavity base 11, and make the two clamping blocks 22 correspondingly inserted into the two card slots 23. At the same time, the two L-shaped plates 26 are respectively corresponding to the two clamping blocks 22. The worker pushes the pulling block 24 towards the inside of the circuit support cavity base 11, so that the pulling block 24 drives the L-shaped plate 26 to move towards the clamping block 22 until the two first magnets 261 are inserted back into the cavity grooves in front of the two clamping blocks 22 again. The second magnet 221 is magnetically connected and fixed to the first magnet 261, and the two L-shaped plates 26 fix the two clamping blocks 22 and the magnetic isolation and interference protection cover 21 again, making the magnetic isolation and interference protection cover 21 firmly fixed on the top surface of the circuit support cavity base 11 and continuing to protect the integrated circuit board. This setting enables the device not only to make the integrated circuit board have an anti-interference signal effect by using the magnetic isolation and interference protection cover 21, but also the magnetic isolation and interference protection cover 21 is convenient for the user to install and detach, thereby facilitating the operator to carry out maintenance and repair work on the circuit board and improving the practicality of the device.

[0033] The above embodiments are the preferred implementation solutions of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present invention is within the protection scope of the present invention.

Claims

1. An anti-interference integrated circuit board, comprising a circuit board assembly (1), and an anti-interference assembly (2) arranged on the upper end of the circuit board assembly (1), characterized in that: The circuit board assembly (1) comprises a circuit support cavity seat (11), and a lead frame (111) is arranged on the top surface of the circuit support cavity seat (11), and a chip carrier (113) is arranged on the upper end of the lead frame (111), and a main chip (112) is arranged on the top surface of the chip carrier (113), and a power input terminal (13) is arranged on one side of the circuit support cavity seat (11), and a lead wire is arranged on one side of the main chip (112), and one end of the lead wire passes through the circuit support cavity seat (11) and extends to the side of the power input terminal (13), and the power input terminal (13) is electrically connected to the main chip (112) through the lead wire, and a power supply input terminal (13) is arranged on one side of the circuit support cavity seat (11). A heat dissipation hole cavity (15), and the heat dissipation hole cavity (15) is provided with multiple groups, and the multiple groups of heat dissipation hole cavities (15) penetrate the upper and lower sides of the circuit support cavity seat (11); the anti-interference component (2) comprises a magnetic isolation and anti-interference cover (21) arranged at the upper end of the circuit support cavity seat (11), a card block (22) is arranged at the bottom of the magnetic isolation and anti-interference cover (21), and the card block (22) is provided with two groups, the top surface of the circuit support cavity seat (11) is provided with a card slot (23), and the card slot (23) is provided with two groups, and the card slot (23) matches the card block (22), one side of the two groups of the card blocks (22) is provided with a cavity groove, and the two groups of the cavity grooves are provided with a second magnet (221).

2. The anti-interference integrated circuit board according to claim 1, characterized in that: The lead frame (111) is arranged on the top surface of the plurality of groups of heat dissipation hole cavities (15), and the bottom surface of the circuit support cavity seat (11) is provided with a heat sink (16), and the heat sink (16) is provided in a plurality of groups, and the plurality of groups of heat sinks (16) respectively correspond to the plurality of groups of heat dissipation hole cavities (15).

3. The anti-interference integrated circuit board according to claim 2, characterized in that: A filter capacitor (12) is provided on one side of the power input end (13), and a common mode inductor (14) is provided on the side of the power input end (13) away from the filter capacitor (12).

4. The anti-interference integrated circuit board according to claim 3, characterized in that: The anti-interference component (2) further comprises a pulling block (24) slidably connected to one side of the circuit support cavity seat (11), and one side of the pulling block (24) extends into the inner cavity of the circuit support cavity seat (11), and both sides of the pulling block (24) are fixedly connected with connecting plates (25).

5. The anti-interference integrated circuit board according to claim 4, characterized in that: One side of the two groups of connecting plates (25) is fixedly connected to an L-shaped plate (26), and the two groups of L-shaped plates (26) are slidably connected to the inside of the circuit support cavity seat (11), and one side of the two groups of L-shaped plates (26) is fixedly connected to a first magnet (261).

6. The anti-interference integrated circuit board according to claim 5, characterized in that: The two groups of second magnets (221) are magnetically connected to the two groups of the first magnets (261) respectively, and the two groups of the card slots (23) and the circuit support cavity seat (11) are interconnected.

Citation Information

Patent Citations

  • Integrated circuit board

    CN109874225B