Communication module and communication rod

Abstract

The utility model discloses a communication module and a communication rod. The communication module comprises a circuit board, a support member and an FPC board. The circuit board comprises a board body and a radio frequency module, and the radio frequency module is arranged on the board body; the supporting piece is arranged on the surface of the circuit board, the supporting piece is provided with a first surface deviating from the circuit board, and a preset distance is reserved between the first surface and the surface of the circuit board; the FPC board is at least partially arranged on the first surface, and the FPC board is electrically connected with the radio frequency module so as to be at least used for transmitting electric signals of the radio frequency module. The communication module at least solves the problems that the communication module of an existing Wifi communication rod occupies a large installation area and is poor in electromagnetic wave radiation effect.

Description

Technical Field

[0001] The utility model relates to the technical field of antennas, and in particular to a communication module and a communication rod. Background Art

[0002] The FPC (Flexible Printed Circuit) antenna of the communication module of the traditional Wifi communication stick is generally a 2D planar type, that is, the FPC antenna is directly pasted on the PCB (Printed Circuit Board). Such a design not only takes up space on the PCB, but also has poor electromagnetic wave radiation effect. If the 2D FPC antenna is to achieve excellent electromagnetic wave radiation effect, the antenna size needs to be large enough and keep a sufficient distance from the metal devices on the PCB. This requires that the PCB has a large enough installation area reserved for the 2D FPC antenna during layout and wiring. Therefore, the 2D FPC antenna is not convenient to install on some products with miniaturized structures.

[0003] Although the electromagnetic wave radiation effect of the 3D steel sheet antenna is good, it is necessary to reserve a welding position on the PCB board, and fix the 3D steel sheet antenna on the PCB board by welding. Such a design is not only costly, but also increases the production links of the factory, and the welding consistency is also difficult to ensure. Utility Model Content

[0004] The main purpose of the utility model is to provide a communication module and a communication stick, which at least improve the problems of the existing Wifi communication stick that the communication module occupies a large installation area and has a poor electromagnetic wave radiation effect.

[0005] According to one aspect of the present utility model, a communication module is provided, comprising:

[0006] A circuit board, the circuit board comprising a board body and a radio frequency module, the radio frequency module being arranged on the board body;

[0007] A support member, the support member is disposed on a surface of the circuit board, and the support member has a first surface facing away from the circuit board, and the first surface is spaced a predetermined distance from the surface of the circuit board;

[0008] An FPC board, wherein the FPC board is at least partially disposed on the first surface, and the FPC board is electrically connected to the RF module to at least transmit electrical signals of the RF module.

[0009] Further, the support member includes an outer peripheral side surface and a second surface, the second surface is located on a side of the support member close to the circuit board and connected to the circuit board, and two ends of the outer peripheral side surface extend to the first surface and the second surface respectively;

[0010] Wherein, the FPC board is bent from the first surface to the outer peripheral side surface.

[0011] Furthermore, the support member is a cuboid, the length of the cuboid is 29 mm to 32 mm, the width of the cuboid is 6 mm to 9 mm, and the height of the cuboid is 9 mm to 12 mm.

[0012] Furthermore, a first adhesive layer is provided on the support member, and the first adhesive layer is located between the support member and the circuit board.

[0013] Furthermore, a second adhesive layer is provided on the support member, and the second adhesive layer is located between the FPC board and the support member.

[0014] Furthermore, the support member includes foam, and a hollow structure is arranged on the foam.

[0015] Furthermore, the communication module also includes a connecting wire, one end of which is electrically connected to the FPC board, and the other end of which is electrically connected to the RF module.

[0016] Furthermore, a connection terminal is provided at one end of the connecting wire connected to the RF module, one end of the connection terminal is electrically connected to the connecting wire, and the other end of the connection terminal is electrically connected to the RF module.

[0017] Furthermore, a wiring seat is provided on the circuit board, the wiring seat is electrically connected to the radio frequency module, and the wiring terminal is detachably connected to the wiring seat.

[0018] According to another aspect of the present application, a communication stick is provided, and the communication stick includes the above-mentioned communication module.

[0019] In the present application, the FPC board of the communication module can be supported by a support member, so that the FPC board can be away from the surface of the board body, and a part of the FPC board can be installed on the first surface of the support member, and the rest can be installed on other surfaces adjacent to the first surface. Such an arrangement can reduce the area on the surface of the board body used to install the FPC board. When the communication module of the present application is working, the FPC board can emit the electromagnetic waves output from the radio frequency module, and at the same time, the FPC board can also transmit the electromagnetic waves received from the outside to the radio frequency module. Because the communication module of the present application sets the FPC board away from the surface of the board body by setting a support member, the electromagnetic waves emitted by the FPC board are not easily absorbed by other metal devices set on the board body, and the electromagnetic waves from the outside are also more likely to propagate to the FPC board and be received by the FPC board. Therefore, installing the communication module of the present application on a communication stick can enhance the electromagnetic wave radiation effect of the communication stick.

[0020] That is to say, compared with the existing communication modules, the communication module of the present application sets a support between the board body and the FPC board so that the FPC board is not tightly attached to the surface of the board body. The communication module of the present application is installed on the communication stick, which can solve the problem that the communication module of the existing Wifi communication stick occupies a large installation area and has poor electromagnetic wave radiation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0022] Figure 1 A structural diagram of a communication module disclosed in an embodiment of the utility model;

[0023] Figure 2 This is a structural diagram of an FPC board installed on a support member disclosed in an embodiment of the utility model.

[0024] The above drawings include the following reference numerals:

[0025] 10. Circuit board; 11. Board body; 12. RF module; 13. Terminal block; 20. Support member; 21. Foam; 211. First surface; 212. Second surface; 213. Peripheral side; d. Predetermined distance; 30. FPC board; 40. Connecting wire; 41. Terminal block. DETAILED DESCRIPTION

[0026] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0027] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the utility model. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0028] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps described in these embodiments do not limit the scope of the utility model. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0029] In order to solve the problem that the communication module of the existing Wifi communication stick occupies a large installation area and has poor electromagnetic wave radiation effect, according to an embodiment of the present application, a communication module is provided. The communication module of the present application will be described in detail below with reference to the accompanying drawings.

[0030] See also Figure 1 to Figure 2 As shown, according to an embodiment of the present invention, a communication module is provided. The communication module includes a circuit board 10 , a support member 20 and an FPC board 30 .

[0031] The circuit board 10 includes a board body 11 and a radio frequency module 12, and the radio frequency module 12 is arranged on the board body 11. The support member 20 is arranged on the surface of the circuit board 10, and the support member 20 has a first surface 211 away from the circuit board 10, and the first surface 211 is separated from the surface of the circuit board 10 by a predetermined distance d (i.e., the height of the support member 20). The FPC board 30 is at least partially arranged on the first surface 211, and the FPC board 30 is electrically connected to the radio frequency module 12 to at least transmit the electrical signal of the radio frequency module 12.

[0032] In the present application, the FPC board 30 of the communication module can be supported by the support member 20, so that the FPC board 30 can be away from the surface of the board body 11, and a part of the FPC board 30 can be installed on the first surface 211 of the support member 20, and the rest can be installed on other surfaces adjacent to the first surface 211. Such a setting can reduce the area on the surface of the board body 11 for installing the FPC board 30. When the communication module of the present application is working, the FPC board 30 can emit the electromagnetic waves output from the RF module 12, and at the same time, the FPC board 30 can also transfer the electromagnetic waves received from the outside to the RF module 12. Because the communication module of the present application makes the FPC board 30 away from the surface of the board body 11 by setting the support member 20, the electromagnetic waves emitted by the FPC board 30 are not easily absorbed by other metal devices set on the board body 11, and the electromagnetic waves from the outside are also more likely to propagate to the FPC board 30 and be received by the FPC board 30. Therefore, installing the communication module of the present application on the communication stick can enhance the electromagnetic wave radiation effect of the communication stick.

[0033] That is to say, compared with the existing communication module, the communication module of the present application sets a support member 20 between the board body 11 and the FPC board 30, so that the FPC board 30 is not close to the surface of the board body 11. The communication module of the present application is installed on the communication stick, which can solve the problem that the communication module of the existing Wifi communication stick occupies a large installation area and has a poor electromagnetic wave radiation effect.

[0034] Further, see Figure 1 to Figure 2 As shown, the support member 20 of the present application includes an outer peripheral side surface 213 and a second surface 212, the second surface 212 is located on a side of the support member 20 close to the circuit board 10 and connected to the circuit board 10, and both ends of the outer peripheral side surface 213 extend to the first surface 211 and the second surface 212 respectively. Among them, the FPC board 30 is bent from the first surface 211 to the outer peripheral side surface 213.

[0035] Exemplarily, the support member 20 may be a regular or irregular shape such as a cylinder, a cuboid, a cube, and a prism. When the shape of the support member 20 is a cylinder, the first surface 211 and the second surface 212 of the support member 20 are both circular, and the peripheral side surface 213 of the support member 20 is a curved surface. When the shape of the support member 20 is a cuboid, the first surface 211 and the second surface 212 of the support member 20 are both rectangular, and the peripheral side surface 213 of the support member 20 is formed by four rectangles connected end to end. In addition, the FPC board 30 can be bent from the first surface 211 to a part of the peripheral side surface 213 and covered on the surface of the support member 20, and the FPC board 30 can also be bent from the first surface 211 to the peripheral side surface 213 and cover the entire peripheral side surface 213. Compared with the prior art method of directly installing the FPC board 30 close to the surface of the board body 11, the arrangement method of the present application can directionally enhance the electromagnetic wave radiation effect of the FPC board 30 on the first surface 211, the second surface 212 and the peripheral side surface 213. It avoids the embarrassing situation that the electromagnetic wave radiation effect of the communication rod is poor after the electromagnetic wave is absorbed by other metal devices on the board body 11.

[0036] Further, see Figure 1 to Figure 2 As shown, the support member 20 of the present application is a rectangular parallelepiped, the length of the rectangular parallelepiped is 29 mm to 32 mm, the width of the rectangular parallelepiped is 6 mm to 9 mm, and the height of the rectangular parallelepiped is 9 mm to 12 mm.

[0037] Specifically, if the length of the cuboid is less than 29 mm, the width of the cuboid is less than 6 mm, and the height of the cuboid is less than 9 mm, the size of the support member 20 is too small, which is not convenient for processing the support member 20, nor is it convenient to install the FPC board 30 on the support member 20, and is even more unfavorable for the radiation of electromagnetic waves. Because the size of the support member 20 is too small at this time, the FPC board 30 installed on the support member 20 is very close to the surface of the board body 11, so the electromagnetic waves emitted by the FPC board 30 are easily absorbed by other metal devices on the board body 11, which is not conducive to the radiation of electromagnetic waves. If the length of the cuboid is greater than 32 mm, the width of the cuboid is greater than 9 mm, and the height of the cuboid is greater than 12 mm, the size of the support member 20 is too large. Although it is convenient for processing the support member 20, the large-sized support member 20 will increase the size of the board body 11, thereby occupying too much internal space of the communication stick.

[0038] In the present application, the size of the support member 20 can be reasonably adjusted according to the size of the area reserved on the board 11 and the size range allowed by the support member 20, so as to meet the purpose of not occupying too much installation area for the FPC board 30 and improving the radiation effect of electromagnetic waves. In addition, the support member 20 needs to be fixed to the board 11 by a reliable connection method. In the present application, the support member 20 can be fixed to the board 11 by bonding, snap connection or connection with a fixing member. This embodiment shows the situation where the support member 20 is fixed to the board 11 by bonding.

[0039] Further, see Figure 1 As shown, a first adhesive layer (not shown in the figure) is provided on the support member 20, and the support member 20 is adhered to the surface of the circuit board 10 through the first adhesive layer.

[0040] Exemplarily, the first adhesive layer may be a material such as glue or strong double-sided tape, and the first adhesive layer is specifically provided at the connection between the support member 20 and the plate body 11. If the first adhesive layer is glue, the worker may evenly apply a layer of glue on the area where the support member 20 is connected to the plate body 11, and then fix the support member 20 to the plate body 11. If the first adhesive layer is double-sided tape, the worker may cut the double-sided tape into a desired shape according to the shape of the connection between the support member 20 and the plate body 11, and then paste the double-sided tape on the support member 20, and then fix the support member 20 to the plate body 11.

[0041] Further, see Figure 1 and Figure 2 As shown, a second adhesive layer (not shown in the figure) is also provided on the support member 20, and the FPC board 30 is adhered to the support member 20 through the second adhesive layer.

[0042] Exemplarily, the second adhesive layer may be an adhesive such as an acrylic adhesive, an epoxy adhesive, and a pressure-sensitive adhesive, or may be a double-sided adhesive made of an acrylic adhesive, an epoxy adhesive, and a pressure-sensitive adhesive. This embodiment shows the case where the second adhesive layer is a double-sided adhesive made of an epoxy adhesive. During installation, a double-sided adhesive is affixed to the area on the support 20 where the FPC board 30 is affixed, and then the FPC board 30 is affixed to the support 20. In order to prevent the FPC board 30 from being detached from the support 20 by the portion of the FPC board 30 that is bent from the first surface 211 to the outer peripheral side surface 213, a buckle may be provided at the corresponding position on the support 20 where the FPC board 30 is installed, or a fixing member may be used to further fix the FPC board 30 to the support 20. In addition, the support 20 may be a solid structure made of materials such as plastic or rubber, or may be a hollow structure made of materials such as plastic or rubber.

[0043] Further, see Figure 1 and Figure 2As shown, the support member 20 includes a foam 21, and a hollow structure (not shown in the figure) is arranged on the foam 21.

[0044] Specifically, the support member 20 of the present application is made of foam 21 because foam 21 has significant advantages: first, the electromagnetic wave penetration of foam 21 is strong, which is conducive to the propagation of electromagnetic waves; second, foam 21 has the advantages of good insulation, light weight, waterproof and fireproof; third, the price of foam 21 is cheap, which can save a certain amount of production cost for the manufacture of the communication module of the present application. The setting of the hollow structure can further improve the electromagnetic wave penetration of foam 21, thereby improving the communication stick signal of the present application.

[0045] Further, see Figure 1 and Figure 2 As shown, the communication module further includes a connecting wire 40 , one end of the connecting wire 40 is electrically connected to the FPC board 30 , and the other end of the connecting wire 40 is electrically connected to the RF module 12 .

[0046] Specifically, the specific length of the connecting wire 40 can be reasonably adjusted according to the needs. The worker can use a conductive adhesive to electrically connect the connecting wire 40 to the FPC board 30, or use welding to electrically connect the connecting wire 40 to the FPC board 30. The connecting wire 40 and the FPC board 30 can also be electrically connected by setting a connecting seat and a connecting end that cooperate with each other. This embodiment shows the situation where the connecting wire 40 is electrically connected to the FPC board 30 by welding. When the communication module transmits electromagnetic waves, the RF module 12 can send out an electrical signal and transmit it to the FPC board 30 through the connecting wire 40, and the FPC board 30 can transmit the electromagnetic wave to the outside of the communication stick. Not only that, the communication module can also receive electromagnetic waves. When the communication module receives electromagnetic waves, the FPC board 30 can also receive electromagnetic waves from the outside of the communication stick and transmit them to the RF module 12 in the form of electrical signals through the connecting wire 40 for the communication stick to work.

[0047] Further, see Figure 1As shown, a terminal 41 is provided at one end of the connecting wire 40 connected to the RF module 12, one end of the terminal 41 is electrically connected to the connecting wire 40, and the other end of the terminal 41 is electrically connected to the RF module 12. In addition, a wiring seat 13 is provided on the circuit board 10, the wiring seat 13 is electrically connected to the RF module 12, and the terminal 41 is detachably connected to the wiring seat 13. Specifically, the arrangement of the terminal 41 and the wiring seat 13 facilitates the installation and removal of the FPC board 30 on the board body 11. The existing communication module generally uses welding to electrically connect the FPC board 30 to the RF module 12, and such an arrangement is not conducive to the installation and removal between the FPC board 30 and the RF module 12. In addition, the welding method between the FPC board 30 and the RF module 12 will increase the welding process of the factory, and the consistency of the welding between the FPC board 30 and the RF module 12 and the welding between the other components and the board body 11 is difficult to ensure. The combination of the wiring seat 13 and the wiring terminal 41 allows the FPC board 30 to be quickly replaced when the FPC board 30 is damaged, thus saving time to a certain extent.

[0048] Furthermore, the communication stick includes the above-mentioned communication module. Specifically, after the communication module of the present application is assembled, it is installed in the reserved position in the communication stick, so as to realize the function of the communication stick to transmit and receive electromagnetic waves. The communication module of the present application abandons the existing method of directly installing the FPC board 30 on the surface of the board body 11, but supports the FPC board 30 by setting a support 20, thereby increasing the effect of the communication module transmitting and receiving electromagnetic waves. If the communication stick of the present application is installed on a photovoltaic inverter (not shown in the figure), the data of the photovoltaic inverter can be collected, transmitted and monitored more accurately, further improving the real-time monitoring and management of the operating status of the photovoltaic inverter.

[0049] It can be known from the above statements that the present application can solve the problems of large installation area and poor electromagnetic wave radiation effect occupied by the communication module of the existing Wifi communication stick by setting a communication module composed of a circuit board 10, a support member 20, an FPC board 30 and a connecting line 40. First, the position on the board 11 that fits with the foam 21 is cleared to increase the radiation effect of electromagnetic waves on the surface of the board 11 away from the foam 21. Then the FPC board 30 is pasted on the foam 21 and electrically connected to the radio frequency module 12. Finally, the communication module of the present application is installed in the communication stick. The present application cleverly sets the foam 21, and on the premise of improving the radiation performance of the electromagnetic waves of the communication module, it can also not occupy too much space of the circuit board 10, and can also reduce the interference between the communication module and the outer shell of the communication stick. By adjusting the size of the foam 21, the distance between the FPC board 30 and other metal devices on the board 11 can be adjusted, and the absorption of electromagnetic waves by other metal devices on the board 11 can be reduced, thereby improving the communication effect of the communication stick.

[0050] It can be seen that the communication module of the present application can not only solve the problems of the large installation area occupied by the communication module of the existing Wifi communication stick and the poor electromagnetic wave radiation effect, but also has the advantages of easy installation and low cost.

[0051] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0052] In addition, it should be noted that the use of words such as "first" and "second" to limit components is only to facilitate the distinction between corresponding components. If not otherwise stated, the above words have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0053] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A communication module, characterized in that: include: A circuit board (10), the circuit board (10) comprising a board body (11) and a radio frequency module (12), the radio frequency module (12) being arranged on the board body (11); A support member (20), the support member (20) being arranged on a surface of the circuit board (10), and the support member (20) having a first surface (211) facing away from the circuit board (10), the first surface (211) being spaced a predetermined distance (d) from the surface of the circuit board (10); An FPC board (30), wherein the FPC board (30) is at least partially disposed on the first surface (211), The FPC board (30) is electrically connected to the radio frequency module (12) to at least transmit the electrical signal of the radio frequency module (12).

2. The communication module according to claim 1, characterized in that: The support member (20) comprises an outer peripheral side surface (213) and a second surface (212), wherein the second surface (212) is located on a side of the support member (20) close to the circuit board (10) and connected to the circuit board (10), and two ends of the outer peripheral side surface (213) extend to the first surface (211) and the second surface (212) respectively; Wherein, the FPC board (30) is bent from the first surface (211) toward the outer peripheral side surface (213).

3. The communication module according to claim 1, characterized in that: The support member (20) is a rectangular parallelepiped, the length of the rectangular parallelepiped is 29 mm to 32 mm, the width of the rectangular parallelepiped is 6 mm to 9 mm, and the height of the rectangular parallelepiped is 9 mm to 12 mm.

4. The communication module according to claim 1, characterized in that: A first adhesive layer is provided on the support member (20), and the first adhesive layer is located between the support member (20) and the circuit board (10).

5. The communication module according to claim 2, characterized in that: A second adhesive layer is also provided on the support member (20), and the second adhesive layer is located between the FPC board (30) and the support member (20).

6. The communication module according to claim 1, characterized in that: The support member (20) comprises foam (21), and a hollow structure is provided on the foam (21).

7. The communication module according to claim 1, characterized in that: The communication module also includes a connecting wire (40), one end of the connecting wire (40) is electrically connected to the FPC board (30), and the other end of the connecting wire (40) is electrically connected to the radio frequency module (12).

8. The communication module according to claim 7, characterized in that: One end of the connecting wire (40) connected to the radio frequency module (12) is provided with a connecting terminal (41), one end of the connecting terminal (41) is electrically connected to the connecting wire (40), and the other end of the connecting terminal (41) is electrically connected to the radio frequency module (12).

9. The communication module according to claim 8, characterized in that: A wiring seat (13) is provided on the circuit board (10), the wiring seat (13) is electrically connected to the radio frequency module (12), and the wiring terminal (41) is detachably connected to the wiring seat (13).

10. A communication stick, characterized in that: The communication stick comprises the communication module according to any one of claims 1 to 9.

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