LED packaging structure

Abstract

The utility model discloses an LED packaging structure which comprises a substrate, a frame-shaped support, a transparent cover plate and a sealing glue layer, and an LED wafer is arranged on the substrate. The bottom of the frame-shaped support is connected with the substrate in a sealed mode, the LED wafer is located in the frame-shaped support, a step portion is arranged on the inner edge of the top of the frame-shaped support, and a frame-shaped glue containing groove is formed in the step face of the step portion. The transparent cover plate comprises a body and a skirt edge arranged around the body, the skirt edge is arranged close to the bottom of the body, the skirt edge is contained in the step part, and the skirt edge is arranged to be lower than the top face of the frame-shaped support; the sealing glue layer is connected with the transparent cover plate and the frame-shaped support and comprises a first part, a second part and a third part which are sequentially connected, the first part is located between the step face of the step part and the bottom face of the skirt edge, the frame-shaped glue containing groove is filled with partial area of the first part, and the second part is located between the peripheral wall of the skirt edge and the vertical face of the step part. The third portion is located on the top surface of the skirt and contacts the vertical surface of the step portion. The LED packaging structure is good in sealing performance and stable in structure.

Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, and particularly to an LED packaging structure. Background Art

[0002] As Figure 1 shown, the LED packaging structure includes a substrate 1, an LED chip 5 disposed on the substrate, a frame-shaped bracket 2 disposed on the substrate 1, and a transparent cover plate 3 disposed on the frame-shaped bracket 2. The substrate, the frame-shaped bracket, and the transparent cover plate enclose a sealed chamber together, thereby creating a sealed working environment for the LED chip. In the prior art, the cover plate and the frame-shaped bracket are generally bonded and fixed through an adhesive medium. However, the bonding area of the adhesive layer formed by the curing of the adhesive medium with the cover plate and the frame-shaped bracket is small, and the adhesive layer may occasionally separate from the cover plate / frame-shaped bracket, resulting in the problems of poor sealing and poor structural stability of the LED packaging structure. Summary of the Utility Model

[0003] The technical problem solved by the utility model is to provide an LED packaging structure with stable structure.

[0004] In order to solve the above technical problem, the technical solution adopted by the utility model is: an LED packaging structure, including:

[0005] A substrate, on which an LED chip is provided;

[0006] A frame-shaped bracket, the bottom of the frame-shaped bracket is hermetically connected to the substrate, the LED chip is located inside the frame-shaped bracket, a step portion is provided on the inner edge of the top of the frame-shaped bracket, and a frame-shaped glue receiving groove is provided on the step surface of the step portion;

[0007] A transparent cover plate, the transparent cover plate includes a body and a skirt provided around the body, the skirt is provided near the bottom of the body, the skirt is received inside the step portion, and the skirt is lower than the top surface of the frame-shaped bracket;

[0008] A sealing glue layer, the sealing glue layer connects the transparent cover plate and the frame-shaped bracket, the glue layer includes a first part, a second part, and a third part connected in sequence. The first part is located between the step surface of the step portion and the bottom surface of the skirt, and a partial area of the first part fills the frame-shaped glue receiving groove. The second part is located between the peripheral wall of the skirt and the vertical surface of the step portion. The third part is located on the top surface of the skirt and contacts the vertical surface of the step portion.

[0009] In one embodiment, the bottom surface of the skirt is coplanar with the bottom surface of the body.

[0010] In one embodiment, the number of the frame-shaped glue receiving grooves is one or more.

[0011] In one embodiment, the cross-section of the frame-shaped glue-containing groove is in the shape of a superior arc or a dovetail groove.

[0012] In one embodiment, a plurality of through-structures are provided on the skirt, the through-structures are not communicated with the outer peripheral wall of the skirt, the through-structures communicate the top surface and the bottom surface of the skirt, and the sealant layer further includes a connecting portion filling the through-structures, and the connecting portions are respectively connected to the first portion and the third portion.

[0013] In one embodiment, the through-structure is a through-hole or a through-groove.

[0014] In one embodiment, the transparent cover plate is made of glass.

[0015] In one embodiment, the frame-shaped bracket is made of ceramic.

[0016] In one embodiment, the substrate is made of ceramic.

[0017] In one embodiment, a conductive circuit is provided on the substrate, and the LED chip is electrically connected to the conductive circuit.

[0018] The beneficial effects of the present utility model are as follows: The structure of the LED packaging structure is novel, the bonding area between the sealant layer and the transparent cover plate is large, which can effectively improve the separation phenomenon between the sealant layer and the transparent cover plate, thereby avoiding the intrusion of external water vapor and dust into the interior of the LED packaging structure through the bonding surface between the sealant layer and the transparent cover plate; the frame-shaped glue-containing groove provided on the step surface of the frame-shaped bracket can increase the bonding area between the sealant layer and the frame-shaped bracket, and make the path for external water vapor and dust to invade the interior of the LED packaging structure through the bonding surface between the sealant layer and the frame-shaped bracket more complex, effectively improving the sealing performance of the LED packaging structure, making it difficult for the transparent cover plate and the frame-shaped bracket to separate, and being beneficial to improving the structural stability of the LED packaging structure. In addition, the skirt, the body and the top of the frame-shaped bracket jointly enclose a receiving groove for receiving the third portion of the sealant layer, which can improve the glue overflow phenomenon during the bonding process of the transparent cover plate and the frame-shaped bracket, and is beneficial to ensuring the cleanliness of the appearance of the LED packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the structures shown in these drawings.

[0020] Figure 1Cross-sectional view of an LED packaging structure of the prior art;

[0021] Figure 2 Cross-sectional view of the LED packaging structure of Embodiment 1 of the present utility model;

[0022] Figure 3 Is Figure 2 Enlarged view of location A in

[0023] Figure 4 Cross-sectional view of the LED packaging structure of Embodiment 2 of the present utility model;

[0024] Figure 5 Is Figure 4 Enlarged view of location B in

[0025] Explanation of the reference numerals in the drawings:

[0026] 1. Substrate;

[0027] 2. Frame-shaped bracket; 21. Step portion; 22. Step surface; 23. Vertical surface; 24. Frame-shaped glue-containing groove;

[0028] 3. Transparent cover plate; 31. Body; 32. Skirt; 33. Through structure;

[0029] 4. Sealant layer; 41. First part; 42. Second part; 43. Third part; 44. Connection part;

[0030] 5. LED chip. Detailed implementation manners

[0031] The realization of the object, functional features and advantages of the present utility model will be further described with reference to the embodiments and the accompanying drawings.

[0032] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0033] It should be noted that if there are directional indications such as up, down, left, right, front, back... in the embodiments of the present utility model, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture as shown in the drawings. If the specific posture changes, the directional indications will also change accordingly.

[0034] In addition, if the description in the embodiments of the present utility model involves "first", "second", etc., the description of "first", "second", etc. is only for descriptive purposes and should not be construed as indicating or implying its relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature.

[0035] In addition, the meaning of "and / or" appearing throughout the text is that it includes three parallel solutions. Taking "and / or" as an example, it includes the solution of A, or the solution of B, or the solution of both A and B being satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0036] In this application, unless otherwise clearly defined and limited, the terms "installed", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] Embodiment 1

[0038] Please refer to Figure 2 and Figure 3, Embodiment 1 of the present utility model is: an LED packaging structure, including a substrate 1, a frame-shaped bracket 2, a transparent cover plate 3 and a sealant layer 4. The substrate 1 is provided with a conductive circuit and an LED chip 5, and the conductive circuit is electrically connected to the LED chip 5. Optionally, the LED chip 5 is welded to the conductive circuit; the bottom of the frame-shaped bracket 2 is hermetically connected to the substrate 1, the LED chip 5 is located inside the frame-shaped bracket 2, and the inner edge of the top of the frame-shaped bracket 2 is provided with a step portion 21. One or more frame-shaped glue-receiving grooves 24 are provided on the step surface 22 of the step portion 21. In this embodiment, two frame-shaped glue-receiving grooves 24 are provided on the step surface 22. When looking down at the frame-shaped bracket 2, one of the frame-shaped glue-receiving grooves 24 is located within the enclosing area of the other frame-shaped glue-receiving groove 24; the transparent cover plate 3 includes a main body 31 and a skirt 32 arranged around the main body 31. The skirt 32 is arranged near the bottom of the main body 31, and the skirt 32 is received within the step portion 21, and the skirt 32 is arranged lower than the top surface of the frame-shaped bracket 2; the sealant layer 4 connects the transparent cover plate 3 and the frame-shaped bracket 2. The glue layer includes a first part 41, a second part 42 and a third part 43 connected in sequence. The first part 41 is located between the step surface 22 of the step portion 21 and the bottom surface of the skirt 32 and respectively contacts the step surface 22 and the bottom surface of the skirt 32, and a partial area of the first part 41 fills the frame-shaped glue-receiving groove 24. The second part 42 is located between the peripheral wall of the skirt 32 and the vertical surface 23 of the step portion 21 and respectively contacts the peripheral wall of the skirt 32 and the vertical surface 23 of the step portion 21. The third part 43 is located on the top surface of the skirt 32 and contacts the vertical surface 23 of the step portion 21. That is to say, the sealant layer 4 is integrally in a ring shape, and the unilateral cross-section of the sealant layer 4 is approximately in a concave shape rotated by 90°.

[0039] Preferably, the main body 31 and the skirt 32 are an integrally formed one-piece structure, which can facilitate the processing and manufacturing of the transparent cover plate 3. To further facilitate the processing and manufacturing of the transparent cover plate 3, in this embodiment, the bottom surface of the skirt 32 is coplanar with the bottom surface of the main body 31.

[0040] As a preferred implementation manner, the cross-section of the frame-shaped glue-receiving groove 24 is in a superior arc shape or a dovetail groove shape. The frame-shaped glue-receiving groove 24 in a superior arc shape or a dovetail groove shape becomes a glue-gripping structure, which is beneficial to further reducing the risk of accidental separation between the sealant layer 4 and the frame-shaped bracket 2, thereby improving the structural stability and sealing performance of the LED packaging structure.

[0041] In this embodiment, the material of the transparent cover plate 3 is glass, optionally quartz glass; the material of the frame-shaped bracket 2 is ceramic; the material of the substrate 1 is ceramic.

[0042] Embodiment 2

[0043] Please refer to Figure 4 and Figure 5 Embodiment 2 of the present utility model is a further improvement made on the basis of Embodiment 1, specifically: a plurality of through structures 33 are provided on the skirt 32 of the transparent cover plate 3, the through structures 33 are not communicated with the outer peripheral wall of the skirt 32, the through structures 33 communicate the top surface and the bottom surface of the skirt 32, the sealant layer 4 further includes a connecting portion 44 filling the through structures 33, and the connecting portion 44 connects the first portion 41 of the sealant layer 4 and the third portion 43 of the sealant layer 4 respectively. That is to say, a hooking structure is formed between the sealant layer 4 and the skirt 32 of the transparent cover plate 3, so that it is more difficult for the transparent cover plate 3 and the sealant layer 4 to be separated, which is beneficial to further improving the structural stability of the LED packaging structure.

[0044] The through structure 33 is a through hole or a through groove.

[0045] The above are only optional embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. Any equivalent structural transformation made by using the description and drawings of the present utility model under the inventive concept of the present utility model, or direct / indirect application in other related technical fields is included in the patent protection scope of the present utility model.

Claims

1. LED packaging structure, characterized in that: include A substrate, on which an LED chip is arranged; A frame-shaped bracket, the bottom of which is sealed and connected to the substrate, the LED chip is located in the frame-shaped bracket, the inner edge of the top of the frame-shaped bracket is provided with a step portion, and the step surface of the step portion is provided with a frame-shaped glue-containing groove; A transparent cover plate, the transparent cover plate comprising a body and a skirt arranged around the body, the skirt being arranged close to the bottom of the body, the skirt being received in the step portion, and the skirt being arranged lower than the top surface of the frame-shaped bracket; A sealing adhesive layer connecting the transparent cover plate and the frame-shaped bracket, the adhesive layer comprising a first part, a second part and a third part which are connected in sequence, the first part being located between the step surface of the step portion and the bottom surface of the skirt, and a partial area of ​​the first part filling the frame-shaped adhesive groove, the second part being located between the peripheral wall of the skirt and the vertical surface of the step portion, and the third part being located on the top surface of the skirt and contacting the vertical surface of the step portion.

2. The LED packaging structure according to claim 1, characterized in that: The bottom surface of the skirt is coplanar with the bottom surface of the body.

3. The LED packaging structure according to claim 1, characterized in that: The number of the frame-shaped glue containing grooves is one or more.

4. The LED packaging structure according to claim 1, characterized in that: The cross section of the frame-shaped glue containing groove is in an arc shape or a dovetail groove shape.

5. The LED packaging structure according to claim 1, characterized in that: The skirt is provided with a plurality of through structures, which are not connected to the outer peripheral wall of the skirt, and are connected to the top surface and the bottom surface of the skirt. The sealant layer also includes a connecting part filling the through structures, and the connecting part respectively connects the first part and the third part.

6. The LED packaging structure according to claim 5, characterized in that: The through structure is a through hole or a through groove.

7. The LED packaging structure according to claim 1, characterized in that: The transparent cover plate is made of glass.

8. The LED packaging structure according to claim 1, characterized in that: The frame-shaped bracket is made of ceramic.

9. The LED packaging structure according to claim 1, characterized in that: The substrate is made of ceramic.

10. The LED packaging structure according to claim 1, characterized in that: A conductive circuit is arranged on the substrate, and the LED chip is electrically connected to the conductive circuit.

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