Silicon wafer grinding slurry protection device

Abstract

The utility model discloses a silicon wafer grinding slurry protection device which comprises a rectangular protection device body with an opening in the upper portion. Hollowed-out areas are arranged on two opposite side surfaces and the bottom surface of the protection device body, and filter screens are detachably mounted in the hollowed-out areas. By means of the silicon wafer grinding device, the grinding machining yield and quality of the silicon wafer are improved to a great extent. Therefore, the protective device of the grinding batching equipment has good practical value and technical improvement significance in wafer processing and manufacturing, especially in a wafer grinding process.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor production, and particularly relates to a protective device for silicon wafer grinding slurry. Background Art

[0002] At present, the manufacturing process of silicon wafers in the industry is basically as follows: primary processing of single crystal silicon rods (cutting, cylindrical grinding), adhesion, slicing, chamfering, grinding, etching, backside treatment, polishing, cleaning, etc. As an indispensable step in the entire manufacturing process of silicon wafers, grinding has its unique manufacturing process and technical value. The main technical principle of grinding is: evenly distribute the grinding fluid on the wafer surface, drive it to rotate at a certain speed by a fixture, and use the pressure setting of the grinding machine to generate friction between the grinding powder and the wafer to achieve mechanical processing, so as to remove the saw marks or surface scratches caused during slicing or chamfering, and at the same time obtain the target thickness and flatness required for grinding. Currently, most of the silicon wafer grinding processes in the industry are set in general environmental areas, where there are more dust, broken crystal chips and other foreign impurities. If the above-mentioned dust, broken crystal chips, foreign objects, etc. enter the grinding machine or its auxiliary equipment, grinding platen, and grinding fluid pipeline during the grinding process, under the action of the machine pressure and rotation speed settings, it will cause surface scratches to the wafers being processed, and even more seriously, it may cause the wafers to break or the platen surface to be damaged, resulting in huge manufacturing yield and economic losses.

[0003] Therefore, it is particularly important to avoid non-grinding fluid substances (dust, broken crystal chips, foreign objects, etc.) from entering the grinding environment (machine gaps, slurry preparation equipment, grinding platen, grinding fluid pipeline, wafer surface, etc.) during the grinding process. Therefore, further optimizing and improving the protection method of existing grinding machines and their auxiliary batching equipment, so that it can protect the processing process including the slurry preparation process more comprehensively, without dead angles, stably and safely, has important technical value for improving the quality of silicon wafer grinding. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a protective device for silicon wafer grinding slurry to solve the deficiencies of the prior art.

[0005] The purpose of the utility model is achieved by the following technical solutions:

[0006] A protective device for silicon wafer grinding slurry includes a rectangular protective device body with an upper opening; two opposite sides and the bottom surface of the protective device body are provided with hollow areas, and filter nets are detachably installed in the hollow areas.

[0007] Preferably, the area of the filter net is larger than the area of the hollow area.

[0008] Preferably, the filter screens on two opposite sides and the bottom surface of the protection device body are integrally formed.

[0009] Preferably, the filter screen is fixed to the protection device body by a pressing plate and screws passing through the pressing plate and the protection device body.

[0010] Preferably, there are 4 pressing plates, and two of them are correspondingly arranged on the upper and lower sides of the hollowed-out areas on two opposite sides of the protection device body.

[0011] Preferably, reinforcing plates are provided on the opposite sides of the protection device body where there are no hollowed-out areas.

[0012] Preferably, a handle is provided on the protection device body.

[0013] Preferably, hanging edges are provided around the upper surface of the protection device body for hanging and supporting the protection device on the device to be protected.

[0014] Preferably, the outer side surface of one of the hanging edges is arc-shaped.

[0015] When this application is in use, place the rectangular protection device body on the stirring barrel. When adding grinding fluid into the stirring barrel, it can comprehensively and without dead angles shield and protect the batching stirring barrel, prevent foreign matters such as dust and broken crystal chips in the production environment from entering the grinding fluid system during the operation of adding grinding fluid to the stirring barrel, and at the same time can avoid the splashing of grinding fluid caused by the impact of the grinding fluid on the stirring barrel during the operation of adding grinding fluid to the stirring barrel, and can effectively improve the phenomenon that foreign matters in the form of grinding fluid lumps formed by the splashing of grinding fluid before the use of this device adhere to the batching system. Description of the Drawings

[0016] Figure 1 is a three-dimensional structural schematic diagram of the protection device provided by a preferred embodiment of this application;

[0017] Figure 2 is Figure 1 the exploded structural schematic diagram of

[0018] Figure 3 is a schematic diagram of the cooperation between the protection device and the stirring barrel;

[0019] Figure 4 is a comparison chart of the change in the defective rate of products produced before and after using the protection device provided by this application;

[0020] Among them, 1 - protection device body; 2 - handle; 3 - screw; 4 - reinforcing plate; 5 - pressing plate; 6 - filter screen; 7 - hollowed-out area; 8 - hanging edge; 9 - stirring barrel. Detailed Embodiments

[0021] The silicon wafer grinding slurry protection device provided by this application, as Figures 1 to 3 shown, includes a rectangular protection device body 1 with an upper opening; two opposite sides and the bottom surface of the protection device body are provided with hollow areas 7, and a filter screen 6 is detachably installed in the hollow area 7. The interception particle size of the filter screen can be adjusted according to actual application requirements, so as to be able to intercept non-grinding liquid substances such as dust, broken crystal chips, and other foreign substances generated during the long-term use of grinding equipment, etc., to prevent them from entering the grinding processing environment such as the grinding ingredient system, machine table gaps, grinding platen, grinding liquid pipeline, wafer surface, etc. The filter screens provided on the two sides increase the filtering area and ensure the filtering effect. The detachable design of the filter screen not only facilitates installation but also facilitates disassembly, cleaning, and replacement operations.

[0022] The rectangular protection device body is designed to be shape-matching, and its shape is the same as that of the device to be protected, namely the stirring barrel of the grinding ingredient system, so that the protection device can be fully matched with the stirring barrel for use. Generally, as Figure 3 shown, the stirring barrel 9 is cylindrical, and a feed inlet is reserved on the stirring barrel. The feed inlet is arranged on one side of the stirring barrel, and the edge is arc-shaped. The periphery of the upper surface of the rectangular protection device body is provided with a hanging edge 8, and one of the hanging edges is arc-shaped, which can be completely matched with the outer edge of the feed inlet of the stirring barrel. The entire protection device can be hung on the feed inlet of the stirring barrel. Before the grinding slurry enters the stirring barrel, it must pass through the protection device, thereby effectively preventing large particle impurities in the slurry from entering the stirring barrel and the subsequent grinding system.

[0023] Since the grinding slurry has a certain impact on the protection device when poured, in order to ensure the overall structural strength of the protection device, only two sides of the protection device body are provided with filter screens in this application. If filter screens are provided on all four sides of the protection device body, the protection device is prone to deformation.

[0024] In this application, the protection device body is set to be rectangular instead of cylindrical, which is convenient for setting integrally formed filter screens on two sides and the bottom surface, and is also convenient for cleaning and replacing the filter screens. In addition, a rectangular body is easier to process and form than a cylindrical body.

[0025] When this application is in use, the rectangular protection device body is placed on the stirring barrel. When adding grinding liquid to the stirring barrel, it can provide comprehensive and dead-angle-free shielding protection for the ingredient stirring barrel, prevent foreign substances such as dust and broken crystal chips in the production environment from entering the grinding liquid system during the operation of adding grinding liquid to the stirring barrel, and at the same time can avoid the splashing of grinding liquid caused by the impact of grinding liquid on the stirring barrel during the operation of adding grinding liquid to the stirring barrel, and can effectively improve the phenomenon that the grinding liquid caking-type foreign substances formed by the splashing of grinding liquid before the use of the device adhere to the ingredient system.

[0026] The use of this application has greatly improved the grinding processing yield and quality of silicon wafers. Therefore, the protective device for grinding ingredient equipment provided by this application has good practical value and significance for technological improvement in wafer processing and manufacturing, especially in the wafer grinding process. As Figure 4 shown, after using this application, the defective rate of the product has decreased from 0.376% before use to 0.185%, demonstrating that the protective device provided by this application has a good protective effect.

[0027] Preferably, the area of the filter screen is larger than the area of the hollowed-out area to prevent materials from leaking through the gap between the filter screen and the hollowed-out area, which may affect the filtering effect.

[0028] Filter screens are provided on two opposite sides and the bottom surface of the protective device body. Preferably, these three filter screens are integrally formed, which is convenient for disassembly and installation.

[0029] Preferably, the filter screen 6 is fixed to the protective device body through the pressing plate 5 and the screw 3 that passes through the pressing plate 5 and the protective device body. Through the pressing plate and the screw, the filter screen can be firmly pressed on the protective device body, and at the same time, it is convenient for disassembly.

[0030] Preferably, there are 4 pressing plates, which are arranged in pairs on the upper and lower sides of the hollowed-out areas on two opposite sides of the protective device body.

[0031] Preferably, reinforcing plates 4 are provided on the opposite sides of the protective device body where there are no hollowed-out areas. The reinforcing plates are also fixed to the protective device body through screws, which can enhance the stability of the protective device. In this application, the design of hollowing and adding filter screens on two sides (as Figures 1 to 2 shown, the front and rear sides) and the bottom surface of the protective device not only increases the filtering area and ensures the filtering effect, but also cooperates with the design of the reinforcing plates on the other two sides (as Figures 1 to 2 shown, the left and right sides), thus ensuring the overall structural strength and stability of the device.

[0032] Preferably, handles 2 are provided on the protective device body. Preferably, there are two handles, which are convenient for operation during disassembly, cleaning, and maintenance.

[0033] Although the preferred embodiments of the present invention have been described, those skilled in the art can make additional changes and modifications to these embodiments once they know the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention. Obviously, those skilled in the art can make various changes and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these modifications and variations.

Claims

1. A silicon wafer polishing slurry protection device, characterized in that: The invention comprises a rectangular protective device body with an upper opening; two opposite side surfaces and a bottom surface of the protective device body are provided with hollow areas, and a filter screen is detachably installed in the hollow area.

2. The silicon wafer polishing slurry protection device according to claim 1, characterized in that: The area of ​​the filter screen is larger than the area of ​​the hollow area.

3. The silicon wafer polishing slurry protection device according to claim 1, characterized in that: The two opposite side surfaces of the protective device body and the filter screen on the bottom surface are integrally formed.

4. The silicon wafer polishing slurry protection device as claimed in claim 3, characterized in that: The filter screen is fixed to the protective device body through a pressing plate and screws passing through the pressing plate and the protective device body.

5. The silicon wafer polishing slurry protection device as claimed in claim 4, characterized in that: There are four clamping plates, which are arranged in pairs on the upper and lower sides of the hollow areas on two opposite sides of the protective device body.

6. The silicon wafer polishing slurry protection device as claimed in claim 5, characterized in that: Reinforcement plates are provided on two opposite sides of the protective device body where no hollowing area is provided.

7. The silicon wafer polishing slurry protection device according to claim 1, characterized in that: A handle is provided on the protective device body.

8. The silicon wafer polishing slurry protection device according to claim 1, characterized in that: The upper surface of the protective device body is provided with hanging edges around it, which are used to hang and support the protective device on the device to be protected.

9. The silicon wafer polishing slurry protection device according to claim 8, characterized in that: The outer side surface of the hanging edge on one side is arc-shaped.

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