Chip packaging dispensing table

Abstract

The utility model discloses a chip packaging dispensing table which comprises an X-axis moving mechanism, a first mounting plate, a Y-axis sliding rail and a connecting plate which are sequentially arranged from bottom to top, and a Y-axis moving mechanism, a second mounting plate, an X-axis sliding rail and a carrying table which are sequentially arranged from bottom to top, and the Y-axis moving mechanism is arranged at one end of the X-axis moving mechanism; the first mounting plate is in driving connection with the X-axis moving mechanism, the Y-axis sliding rail is mounted on the first mounting plate, and the connecting plate is in sliding fit with the Y-axis sliding rail; the second mounting plate is in driving connection with the Y-axis moving mechanism, and the X-axis sliding rail is mounted on the second mounting plate; the carrying table is in sliding fit with the X-axis sliding rail, and the carrying table is fixedly connected with the connecting plate. According to the chip packaging dispensing table, the X-axis moving mechanism and the Y-axis moving mechanism are arranged in a staggered mode, so that the carrier plate can be driven by the moving mechanisms and the Y-axis moving mechanism to move in the X-axis direction and the Y-axis direction, meanwhile, the overall height is reduced, the chip packaging dispensing table can be suitable for a highly compact space, and the gravity center can be lowered to improve the dispensing position precision.

Description

Technical Field

[0001] The utility model relates to the technical field of chip dispensing, in particular to a chip encapsulation dispensing table. Background Art

[0002] Chip encapsulation refers to placing a chip in encapsulation materials and completing the assembly and use of the chip through the protection of the encapsulation materials and pin connection. The main purpose of chip encapsulation is to protect the chip from the external environment, provide good electrical and mechanical properties, and facilitate the connection of the chip with other circuits. In the existing dispensing process of chip encapsulation, the chip is often placed on a dispensing table, and the position is adjusted by the X-axis moving mechanism and Y-axis moving mechanism of the dispensing table. Subsequently, the dispensing head is made to contact the chip for dispensing encapsulation. Since the existing dispensing table generally includes a carrier table and the X-axis moving mechanism and Y-axis moving mechanism arranged below the carrier table, the height of the dispensing table is relatively high, which is not suitable for a highly compact space, and the center of gravity of the dispensing table is relatively high, and it is easy to cause a slight deviation in the position of the chip during the movement, resulting in a decrease in the position accuracy of the dispensing. Summary of the Utility Model

[0003] The technical problem to be solved by the utility model is to provide a chip encapsulation dispensing table that can be applicable to a space with a relatively small height and is beneficial to improving the dispensing accuracy.

[0004] To solve the above technical problem, the technical solution adopted by the utility model is: a chip encapsulation dispensing table, including an X-axis moving mechanism, a first mounting plate, a Y-axis slide rail, a connecting plate, a Y-axis moving mechanism, a second mounting plate, an X-axis slide rail, and a carrier table;

[0005] The X-axis moving mechanism, the first mounting plate, the Y-axis slide rail, and the connecting plate are arranged in sequence from bottom to top. The first mounting plate is drivingly connected to the X-axis moving mechanism. The Y-axis slide rail is installed on the first mounting plate. The connecting plate is slidably matched with the Y-axis slide rail;

[0006] The Y-axis moving mechanism is arranged at one end of the X-axis moving mechanism. The Y-axis moving mechanism, the second mounting plate, the X-axis slide rail, and the carrier table are arranged in sequence from bottom to top. The second mounting plate is drivingly connected to the Y-axis moving mechanism. The X-axis slide rail is installed on the second mounting plate. The carrier table is slidably matched with the X-axis slide rail, and the carrier table is fixedly connected to the connecting plate.

[0007] Further, the connecting plate is fixedly connected to the carrier table by screws.

[0008] Further, the connecting plate is in an inverted L shape, including a first connecting portion extending in the horizontal direction and a second connecting portion extending in the vertical direction. The carrier table is fixedly connected to a surface of the second connecting portion away from the first connecting portion.

[0009] Further, the number of the X-axis slide rails is multiple, and the multiple X-axis slide rails are arranged in parallel.

[0010] Further, the number of the Y-axis slide rails is multiple, and the multiple Y-axis slide rails are arranged in parallel.

[0011] Further, the number of the X-axis moving mechanisms is multiple, and the multiple X-axis moving mechanisms are arranged in parallel.

[0012] Further, the number of the Y-axis moving mechanisms is multiple, and the multiple Y-axis moving mechanisms are arranged in parallel.

[0013] Further, the X-axis moving mechanism is a linear motor.

[0014] Further, the Y-axis moving mechanism is a linear motor.

[0015] The beneficial effects of the present utility model are as follows: The chip encapsulation dispensing table of the present utility model arranges the X-axis moving mechanism and the Y-axis moving mechanism staggeredly. The X-axis moving mechanism drives and connects the carrier plate through the connecting plate, so that the carrier plate can move along two directions of the X-axis and the Y-axis respectively under the drive of the X-axis moving mechanism and the Y-axis moving mechanism. At the same time, it avoids the high height of the dispensing table caused by the upper and lower stacking and assembly of the X-axis moving mechanism and the Y-axis moving mechanism, which is beneficial to making the chip encapsulation dispensing table applicable to a highly compact space and reducing the center of gravity to improve the position accuracy of dispensing. Description of the Drawings

[0016] Figure 1 It is a schematic structural diagram of the chip encapsulation dispensing table according to Embodiment 1 of the present utility model.

[0017] Label Description:

[0018] 1. X-axis moving mechanism;

[0019] 2. First mounting plate;

[0020] 3. Y-axis slide rail;

[0021] 4. Connecting plate; 41. First connecting portion; 42. Second connecting portion;

[0022] 5. Y-axis moving mechanism;

[0023] 6. Second mounting plate;

[0024] 7. X-axis slide rail;

[0025] 8. Carrier stage. Detailed Embodiment

[0026] To describe in detail the technical content, the achieved purpose and the effects of the present utility model, the following is described in conjunction with the embodiments and with reference to the drawings.

[0027] Please refer to Figure 1 , a chip packaging dispensing station, comprising an X-axis moving mechanism 1, a first mounting plate 2, a Y-axis slide rail 3, a connecting plate 4, a Y-axis moving mechanism 5, a second mounting plate 6, an X-axis slide rail 7 and a carrier 8;

[0028] The X-axis moving mechanism 1, the first mounting plate 2, the Y-axis slide rail 3 and the connecting plate 4 are arranged in sequence from bottom to top, the first mounting plate 2 is drivingly connected to the X-axis moving mechanism 1, the Y-axis slide rail 3 is installed on the first mounting plate 2, and the connecting plate 4 is slidingly matched with the Y-axis slide rail 3;

[0029] The Y-axis moving mechanism 5 is arranged at one end of the X-axis moving mechanism 1, and the Y-axis moving mechanism 5, the second mounting plate 6, the X-axis slide rail 7 and the carrier 8 are arranged in sequence from bottom to top, the second mounting plate 6 is drivingly connected to the Y-axis moving mechanism 5, the X-axis slide rail 7 is installed on the second mounting plate 6, the carrier 8 is slidingly matched with the X-axis slide rail 7, and the carrier 8 is fixedly connected to the connecting plate 4.

[0030] From the above description, it can be seen that the beneficial effect of the utility model is that the chip packaging dispensing station staggers the X-axis moving mechanism 1 and the Y-axis moving mechanism 5, and drives the X-axis moving mechanism 1 to connect the carrier through the connecting plate 4, so that the carrier can be driven by the X-axis moving mechanism 1 and the Y-axis moving mechanism 5 to move along the X-axis and Y-axis directions respectively, while avoiding the high height of the dispensing station caused by the upper and lower stacking assembly of the X-axis moving mechanism 1 and the Y-axis moving mechanism 5, which is conducive to making the chip packaging dispensing station suitable for highly compact spaces and lowering the center of gravity to improve the position accuracy of dispensing.

[0031] Furthermore, the connecting plate 4 is connected and fixed to the carrier 8 by screws.

[0032] It can be seen from the above description that the connection method between the connecting plate 4 and the carrier 8 is simple and stable.

[0033] Furthermore, the connecting plate 4 is in an inverted L-shape, including a first connecting portion 41 extending in a horizontal direction and a second connecting portion 42 extending in a vertical direction, and the carrier 8 is fixedly connected to a side of the second connecting portion 42 away from the first connecting portion 41 .

[0034] It can be seen from the above description that the structure of the connecting plate 4 is simple, and the second connecting portion 42 can provide a sufficient area for connecting the connecting plate 4 with the substrate.

[0035] Furthermore, there are multiple X-axis slide rails 7, and the multiple X-axis slide rails 7 are arranged in parallel.

[0036] As can be seen from the above description, setting multiple X-axis slide rails 7 can prevent the stage 8 from tilting to one side, which is beneficial to improving the dispensing position accuracy.

[0037] Furthermore, the number of the Y-axis slide rails 3 is multiple, and the multiple Y-axis slide rails 3 are arranged in parallel.

[0038] As can be seen from the above description, setting multiple Y-axis slide rails 3 can prevent the connecting plate 4 from tilting to one side, which is beneficial to improving the dispensing position accuracy.

[0039] Furthermore, the number of the X-axis moving mechanisms 1 is multiple, and the multiple X-axis moving mechanisms 1 are arranged in parallel.

[0040] As can be seen from the above description, setting multiple X-axis moving mechanisms 1 can prevent the first mounting plate 2 from tilting to one side, which is beneficial to improving the dispensing position accuracy.

[0041] Furthermore, the number of the Y-axis moving mechanisms 5 is multiple, and the multiple Y-axis moving mechanisms 5 are arranged in parallel.

[0042] As can be seen from the above description, setting multiple Y-axis moving mechanisms 5 can prevent the second mounting plate 6 from tilting to one side, which is beneficial to improving the dispensing position accuracy.

[0043] Furthermore, the X-axis moving mechanism 1 is a linear motor.

[0044] As can be seen from the above description, the X-axis moving mechanism 1 is easy to obtain and use, and the position control is accurate.

[0045] Furthermore, the Y-axis moving mechanism 5 is a linear motor.

[0046] As can be seen from the above description, the Y-axis moving mechanism 5 is easy to obtain and use, and the position control is accurate.

[0047] Please refer to Figure 1 , Embodiment 1 of the present utility model is: a chip packaging dispensing platform, including an X-axis moving mechanism 1, a first mounting plate 2, Y-axis slide rails 3, a connecting plate 4, a Y-axis moving mechanism 5, a second mounting plate 6, X-axis slide rails 7 and a stage 8; the X-axis moving mechanism 1, the first mounting plate 2, the Y-axis slide rails 3 and the connecting plate 4 are arranged in sequence from bottom to top, the first mounting plate 2 is drivingly connected to the X-axis moving mechanism 1, the Y-axis slide rails 3 are installed on the top surface of the first mounting plate 2, and the connecting plate 4 is slidably engaged with the Y-axis slide rails 3; the Y-axis moving mechanism 5 is arranged at one end of the X-axis moving mechanism 1, the Y-axis moving mechanism 5, the second mounting plate 6, the X-axis slide rails 7 and the stage 8 are arranged in sequence from bottom to top, the second mounting plate 6 is drivingly connected to the Y-axis moving mechanism 5, the X-axis slide rails 7 are installed on the top surface of the second mounting plate 6, the stage 8 is slidably engaged with the X-axis slide rails 7, and the side surface of the stage 8 is fixedly connected to the side surface of the connecting plate 4.

[0048] Specifically, the first mounting plate 2, the second mounting plate 6, and the stage 8 are all rectangular plates; the X-axis moving mechanism 1 and the Y-axis moving mechanism 5 are both linear motors. The connecting plate 4 is fixedly connected to the stage 8 by screws. The bottom surface of the connecting plate 4 is provided with a Y-axis slider that slidably cooperates with the Y-axis slide rail 3; the bottom surface of the stage 8 is provided with an X-axis slider that slidably cooperates with the X-axis slide rail 7. In other embodiments, the first mounting plate 2, the second mounting plate 6, or the stage 8 may be provided as a circular or other polygonal plate; the X-axis moving mechanism 1 or the Y-axis moving mechanism 5 may be provided as a lead screw slider module driven by a motor; it is also feasible that the bottom surface of the connecting plate 4 is provided with a Y-axis chute that cooperates with the Y-axis slide rail 3; it is also feasible that the bottom surface of the stage is provided with an X-axis chute that cooperates with the X-axis slide rail 7.

[0049] It is easy to understand that in this chip encapsulation dispensing table, the X-axis moving mechanism 1 and the Y-axis moving mechanism 5 are staggeredly arranged. The X-axis moving mechanism 1 drives and connects the stage through the connecting plate 4, so that the stage can move in two directions along the X-axis and the Y-axis respectively under the drive of the X-axis moving mechanism 1 and the Y-axis moving mechanism 5. At the same time, it avoids the high height of the dispensing table caused by the upper and lower stacking and assembly of the X-axis moving mechanism 1 and the Y-axis moving mechanism 5, which is beneficial to making this chip encapsulation dispensing table used in a highly compact space and reducing the center of gravity to improve the position accuracy of dispensing.

[0050] Specifically, the connecting plate 4 is in an inverted L shape, including a first connecting portion 41 extending in the horizontal direction and a second connecting portion 42 extending in the vertical direction. The stage 8 is fixedly connected to the surface of the second connecting portion 42 away from the first connecting portion 41 by screws.

[0051] In order to make the forces on both sides of the stage 8 balanced and prevent the stage 8 from tilting to one side, the number of X-axis slide rails 7 is multiple, and multiple X-axis slide rails 7 are arranged in parallel. In this embodiment, the number of X-axis slide rails 7 is three, and the number of X-axis slide rails 7 corresponds to the number of X-axis sliders one by one. In other embodiments, the number of X-axis slide rails 7 can be set to two, four, or more.

[0052] In this embodiment, the number of Y-axis slide rails 3 is one, and the bottom surface of the first connecting portion 41 of the connecting plate 4 slidably cooperates with the Y-axis slide rail 3. In other embodiments, it is also feasible that the number of Y-axis slide rails 3 is multiple, and multiple Y-axis slide rails 3 are arranged in parallel.

[0053] In order to make the forces on both sides of the first mounting plate 2 balanced and prevent the first mounting plate 2 from tilting to one side, the number of X-axis moving mechanisms 1 is multiple, and multiple X-axis moving mechanisms 1 are arranged in parallel. In this embodiment, the number of X-axis moving mechanisms 1 is two. In other embodiments, the number of X-axis moving mechanisms 1 can be set to three or more.

[0054] In order to balance the forces on both sides of the second mounting plate 6 and prevent the second mounting plate 6 from tilting to one side, the number of Y-axis moving mechanisms 5 is multiple, and the multiple Y-axis moving mechanisms 5 are arranged in parallel. In this embodiment, the number of Y-axis moving mechanisms 5 is two. In other embodiments, the number of Y-axis moving mechanisms 5 can be set to three or more.

[0055] In summary, the chip encapsulation dispensing table provided by the present utility model has the X-axis moving mechanism and the Y-axis moving mechanism arranged staggeredly. The X-axis moving mechanism drives and connects the carrier plate through the connecting plate, so that the carrier plate can move along the X-axis and Y-axis directions respectively under the drive of the X-axis moving mechanism and the Y-axis moving mechanism. At the same time, it avoids the high height of the dispensing table caused by the stacked assembly of the X-axis moving mechanism and the Y-axis moving mechanism up and down, which is beneficial to making this chip encapsulation dispensing table applicable to a highly compact space and reducing the center of gravity to improve the position accuracy of dispensing.

[0056] The above are only the embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. All equivalent transformations made by using the content of the specification and drawings of the present utility model, or directly or indirectly applied in the relevant technical fields, are equally included in the patent protection scope of the present utility model.

Claims

1. Chip packaging dispensing station, characterized in that: It includes an X-axis moving mechanism, a first mounting plate, a Y-axis slide rail, a connecting plate, a Y-axis moving mechanism, a second mounting plate, an X-axis slide rail and a carrier; The X-axis moving mechanism, the first mounting plate, the Y-axis slide rail and the connecting plate are arranged in sequence from bottom to top, the first mounting plate is drivingly connected to the X-axis moving mechanism, the Y-axis slide rail is mounted on the first mounting plate, and the connecting plate is slidingly matched with the Y-axis slide rail; The Y-axis moving mechanism is arranged at one end of the X-axis moving mechanism. The Y-axis moving mechanism, the second mounting plate, the X-axis slide rail and the carrier are arranged in sequence from bottom to top. The second mounting plate is drivingly connected to the Y-axis moving mechanism, the X-axis slide rail is installed on the second mounting plate, the carrier is slidably matched with the X-axis slide rail, and the carrier is fixedly connected to the connecting plate.

2. The chip packaging dispensing station according to claim 1, characterized in that: The connecting plate is connected and fixed to the carrier by screws.

3. The chip packaging dispensing station according to claim 2, characterized in that: The connecting plate is in an inverted L-shape, and includes a first connecting portion extending in a horizontal direction and a second connecting portion extending in a vertical direction. The carrier is fixedly connected to a side of the second connecting portion away from the first connecting portion.

4. The chip packaging dispensing station according to claim 1, characterized in that: The number of the X-axis slide rails is multiple, and the multiple X-axis slide rails are arranged in parallel.

5. The chip packaging dispensing station according to claim 1, characterized in that: The number of the Y-axis slide rails is multiple, and the multiple Y-axis slide rails are arranged in parallel.

6. The chip packaging dispensing station according to claim 1, characterized in that: The number of the X-axis moving mechanisms is multiple, and the multiple X-axis moving mechanisms are arranged in parallel.

7. The chip packaging dispensing station according to claim 1, characterized in that: The number of the Y-axis moving mechanisms is multiple, and the multiple Y-axis moving mechanisms are arranged in parallel.

8. The chip packaging dispensing station according to claim 1, characterized in that: The X-axis moving mechanism is a linear motor.

9. The chip packaging dispensing station according to claim 1, characterized in that: The Y-axis moving mechanism is a linear motor.

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