Vertical clamp applied to semiconductor chilling plate bonding wire

Abstract

The utility model relates to the technical field of semiconductor chilling plates, and discloses a vertical clamp applied to a semiconductor chilling plate bonding wire, which comprises a fixed plate, a mounting block fixedly mounted on the side wall of the fixed plate, a base fixedly mounted at the top of the fixed plate, and a processing assembly arranged at the top of the fixed plate, the machining assembly comprises a clamping mechanism installed at the top of the fixing plate, a stabilizing mechanism is installed at the top of the fixing plate and located above the clamping mechanism, the clamping mechanism comprises a rectangular block, and the rectangular block is fixedly installed at the top of the fixing plate. The semiconductor chilling plate stacking device solves the problems that when an existing device stabilizes semiconductor chilling plates, the semiconductor chilling plates are directly stacked and stabilized through an operator, a limiting device is not arranged in the stacking process, and stacking deviation of the semiconductor chilling plates may occur.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor refrigeration chips, and specifically relates to a vertical fixture applied to wire bonding of semiconductor refrigeration chips. Background Technique

[0002] A semiconductor refrigeration chip, also called a thermoelectric refrigeration chip, is a kind of heat pump with a wide range of applications. Utilizing the Peltier effect of semiconductor materials, when direct current passes through an electric couple formed by two different semiconductor materials connected in series, heat can be absorbed and released at both ends of the electric couple respectively, thus achieving the purpose of refrigeration. It is a refrigeration technology that generates negative thermal resistance and is applied in some occasions where space is limited, reliability requirements are high, and there is no refrigerant pollution.

[0003] For example, as disclosed in Chinese Patent CN219945101U, a vertical fixture applied to wire bonding of semiconductor refrigeration chips. Since there are grooves on the carrier plate for accommodating the semiconductor refrigeration chips, the clamping is stable, which can improve the precision of wire bonding of the refrigeration chips and ensure the wire bonding quality. The fixture can clamp multiple semiconductor refrigeration chips at one time, making the workpiece in the best welding position, which can improve the welding speed. The overall structure is simple, the operation is easy, the labor intensity is reduced, and the work efficiency is improved. The sizes of the grooves for accommodating the semiconductor refrigeration chips on different carrier plates are different, and different carrier plates are replaced to adapt to wire bonding of semiconductor refrigeration chips of different sizes.

[0004] However, there are certain defects in this patent. When stabilizing the semiconductor refrigeration chips, the device directly stacks and stabilizes the semiconductor refrigeration chips by the operator. There is no limit device during the stacking process, and the problem of offset stacking of the semiconductor refrigeration chips may occur. Content of the Utility Model

[0005] The purpose of the utility model is to provide a vertical fixture applied to wire bonding of semiconductor refrigeration chips, so as to achieve the purpose of solving the problems raised in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A vertical fixture applied to wire bonding of semiconductor refrigeration chips, including a fixing plate,

[0007] An installation block fixedly installed on the side wall of the fixing plate;

[0008] A base fixedly installed on the top of the fixing plate;

[0009] And a processing component arranged at the top position of the fixing plate;

[0010] The processing component includes a clamping mechanism installed at the top position of the fixing plate;

[0011] A stabilizing mechanism is installed at the top of the fixing plate, and the stabilizing mechanism is located above the clamping mechanism.

[0012] Preferably, there are four mounting blocks, the shapes and sizes of the four mounting blocks are equal, and the four mounting blocks are respectively fixedly mounted on four sides of the fixing plate, and the position of the entire device can be stabilized by the mounting blocks.

[0013] Preferably, a triangular bracket is fixedly installed on the side wall of the base, the bottom of the triangular bracket is fixedly connected to the top of the fixed plate, a semiconductor refrigeration plate body is provided in contact with the top of the base, and a vertical plate is fixedly installed on the top of the fixed plate.

[0014] Preferably, the clamping mechanism includes a rectangular block, which is fixedly mounted on the top of the fixed plate, a motor is fixedly mounted on the top of the rectangular block, the motor is installed with an arc plate through a rotating shaft transmission at the output end, the side wall of the arc plate is contacted with a side plate, a connecting block is fixedly mounted on the side wall of the side plate, an auxiliary plate is fixedly mounted on the other end of the connecting block, an arc rod is slidably mounted on the inner wall of the auxiliary plate, one end of the arc rod is fixedly connected to the side wall of the base, and an extrusion spring is fixedly mounted on the side wall of the side plate.

[0015] Preferably, the side wall of the auxiliary plate is arranged in contact with the side wall of the semiconductor refrigeration plate body, and the bottom of the auxiliary plate is slidably connected to the top of the base.

[0016] Preferably, there are two auxiliary plates, the two auxiliary plates are equal in shape and size, and the two auxiliary plates are symmetrically arranged relative to the middle surface of the fixed plate in the left-right direction.

[0017] Preferably, the stabilizing mechanism includes a top plate, which is fixedly connected to the side walls of the vertical plate, a cylinder is fixedly installed on the top of the top plate, a telescopic rod is transmission-installed on the output end of the cylinder, a pressure plate is fixedly installed on the bottom of the telescopic rod, and a fixing block is fixedly installed on the inner wall of the pressure plate.

[0018] The utility model provides a vertical clamp for semiconductor cooling plate welding wire.

[0019] Beneficial effects:

[0020] (1) The present utility model enables the operator to stack the semiconductor refrigeration sheet body on the top of the base. Subsequently, the operator can directly turn on the motor. The motor drives the rotation of the position of the arc-shaped plate through the output shaft. After the arc-shaped plate rotates, it can cause the side plate to slide on the surface of the arc-shaped rod. Under the action of the compression spring, the side plate will cause the positions between the two to approach. The side plate drives the movement of the connecting block and the auxiliary plate. Through the auxiliary plate, the two sides of the semiconductor refrigeration sheet body can be squeezed, so as to align the position of the semiconductor refrigeration sheet body, solving the problem that when the existing device stabilizes the semiconductor refrigeration sheet, the semiconductor refrigeration sheet is directly stacked and stabilized by the operator, and there is no limit device during the stacking process, which may cause the problem of offset stacking of the semiconductor refrigeration sheet.

[0021] (2) The present utility model enables the operator to turn on the air cylinder. The air cylinder drives the position of the telescopic rod to descend through the output shaft. The telescopic rod further drives the positions of the pressing plate and the fixing block to descend. Through the pressing plate, the top position of the semiconductor refrigeration sheet body can be effectively stabilized, facilitating the operator to better use the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic diagram of the external structure of the present utility model;

[0023] Figure 2 is a schematic diagram of the side structure of the present utility model;

[0024] Figure 3 is a schematic diagram of the structure of the clamping mechanism of the present utility model;

[0025] Figure 4 is the present utility model Figure 1 partial enlarged view of A in the present utility model.

[0026] In the figure: 1, fixing plate; 2, mounting block; 3, triangular bracket; 4, processing assembly; 41, clamping mechanism; 411, rectangular block; 412, motor; 413, arc-shaped plate; 414, arc-shaped rod; 415, side plate; 416, auxiliary plate; 417, connecting block; 418, compression spring; 42, stabilizing mechanism; 421, top plate; 422, air cylinder; 423, telescopic rod; 424, pressing plate; 425, fixing block; 5, base; 6, semiconductor refrigeration sheet body; 7, vertical plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] In order to have a clearer understanding of the technical features, objectives, and effects of the present utility model, the specific embodiments of the present utility model are now described with reference to the accompanying drawings.

[0028] Embodiment 1

[0029] A preferred embodiment of a vertical clamp for semiconductor cooling plate welding wire provided by the utility model is as follows: Figures 1 to 4 As shown: A vertical fixture used for semiconductor cooling plate welding wire, including a fixing plate 1,

[0030] The mounting blocks 2 are fixedly mounted on the side wall of the fixing plate 1. There are four mounting blocks 2. The four mounting blocks 2 are equal in shape and size. The four mounting blocks 2 are respectively fixedly mounted on the four sides of the fixing plate 1. The mounting blocks 2 can stabilize the position of the entire device.

[0031] A base 5 is fixedly mounted on the top of the fixed plate 1, a triangular bracket 3 is fixedly mounted on the side wall of the base 5, the bottom of the triangular bracket 3 is fixedly connected to the top of the fixed plate 1, a semiconductor cooling plate body 6 is contacted and arranged on the top of the base 5, and a vertical plate 7 is fixedly mounted on the top of the fixed plate 1;

[0032] and a processing assembly 4 disposed at the top of the fixed plate 1;

[0033] The processing assembly 4 includes a clamping mechanism 41 mounted at a top position of the fixed plate 1;

[0034] A stabilizing mechanism 42 is installed at the top of the fixing plate 1 , and the stabilizing mechanism 42 is located above the clamping mechanism 41 .

[0035] The clamping mechanism 41 includes a rectangular block 411, which is fixedly installed on the top of the fixed plate 1. A motor 412 is fixedly installed on the top of the rectangular block 411. The motor 412 is installed with an arc plate 413 through the shaft transmission at the output end. The side wall of the arc plate 413 is contacted with a side plate 415. A connecting block 417 is fixedly installed on the side wall of the side plate 415. An auxiliary plate 416 is fixedly installed on the other end of the connecting block 417. An arc rod 414 is slidably installed on the inner wall of the auxiliary plate 416. One end of the arc rod 414 is fixedly connected to the side wall of the base 5. The side wall of the side plate 415 is fixedly installed with an extrusion spring 418.

[0036] In this embodiment, the side wall of the auxiliary plate 416 is arranged in contact with the side wall of the semiconductor refrigeration plate body 6, and the bottom of the auxiliary plate 416 is slidably connected to the top of the base 5.

[0037] Furthermore, there are two auxiliary plates 416 , the two auxiliary plates 416 are equal in shape and size, and the two auxiliary plates 416 are symmetrically arranged relative to the middle surface of the fixed plate 1 in the left-right direction.

[0038] In the specific implementation process, when the operator uses the device, first stack the semiconductor refrigeration chip body 6 on the top of the base 5, and then the operator can directly turn on the motor 412. The motor 412 drives the rotation of the arc plate 413 through the output shaft. After the arc plate 413 rotates, it can cause the side plate 415 to slide on the surface of the arc rod 414. Under the action of the compression spring 418, the side plate 415 will cause the positions between the two to approach. The side plate 415 drives the connection block 417 and the auxiliary plate 416 to move. Through the auxiliary plate 416, the two sides of the semiconductor refrigeration chip body 6 can be squeezed to align the position of the semiconductor refrigeration chip body 6.

[0039] Embodiment 2

[0040] On the basis of Embodiment 1, a preferred embodiment of a vertical fixture applied to wire bonding of semiconductor refrigeration chips provided by the present utility model is as Figures 1 to 4 shown: The stabilizing mechanism 42 includes a top plate 421, the top plate 421 is fixedly connected to the side wall of the vertical plate 7, a cylinder 422 is fixedly installed on the top of the top plate 421, a telescopic rod 423 is drivingly installed at the output end of the cylinder 422, a pressing plate 424 is fixedly installed at the bottom of the telescopic rod 423, and a fixed block 425 is fixedly installed on the inner wall of the pressing plate 424.

[0041] In the specific implementation process, the operator turns on the cylinder 422. The cylinder 422 drives the telescopic rod 423 to descend through the output shaft. The telescopic rod 423 further drives the pressing plate 424 and the fixed block 425 to descend, and effectively stabilizes the top position of the semiconductor refrigeration chip body 6 through the pressing plate 424.

[0042] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to the embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A vertical clamp for semiconductor cooling sheet welding wire, comprising a fixing plate (1), A mounting block (2) fixedly mounted on a side wall of the fixing plate (1); A base (5) fixedly mounted on the top of the fixing plate (1); and a processing assembly (4) arranged at the top of the fixing plate (1); characterized in that: The processing assembly (4) comprises a clamping mechanism (41) installed at the top of the fixed plate (1); A stabilizing mechanism (42) is installed at the top of the fixing plate (1), and the stabilizing mechanism (42) is located above the clamping mechanism (41).

2. A vertical fixture for semiconductor cooling sheet welding wire according to claim 1, characterized in that: There are four mounting blocks (2), the four mounting blocks (2) are of equal shape and size, and the four mounting blocks (2) are respectively fixedly mounted on four sides of the fixing plate (1).

3. A vertical fixture for semiconductor cooling sheet welding wire according to claim 1, characterized in that: A triangular bracket (3) is fixedly mounted on the side wall of the base (5), the bottom of the triangular bracket (3) is fixedly connected to the top of the fixed plate (1), a semiconductor refrigeration plate body (6) is provided in contact with the top of the base (5), and a vertical plate (7) is fixedly mounted on the top of the fixed plate (1).

4. A vertical fixture for semiconductor cooling sheet welding wire according to claim 1, characterized in that: The clamping mechanism (41) comprises a rectangular block (411), wherein the rectangular block (411) is fixedly mounted on the top of the fixed plate (1), a motor (412) is fixedly mounted on the top of the rectangular block (411), the motor (412) is installed with an arc plate (413) through a rotating shaft transmission at the output end, the side wall of the arc plate (413) is contacted with a side plate (415), a connecting block (417) is fixedly mounted on the side wall of the side plate (415), an auxiliary plate (416) is fixedly mounted on the other end of the connecting block (417), an arc rod (414) is slidably mounted on the inner wall of the auxiliary plate (416), one end of the arc rod (414) is fixedly connected to the side wall of the base (5), and a pressing spring (418) is fixedly mounted on the side wall of the side plate (415).

5. A vertical fixture for semiconductor cooling sheet welding wire according to claim 4, characterized in that: The side wall of the auxiliary plate (416) is arranged in contact with the side wall of the semiconductor refrigeration plate body (6), and the bottom of the auxiliary plate (416) is slidably connected to the top of the base (5).

6. A vertical fixture for semiconductor cooling sheet welding wire according to claim 4, characterized in that: There are two auxiliary plates (416), the two auxiliary plates (416) are equal in shape and size, and the two auxiliary plates (416) are symmetrically arranged relative to the middle surface of the fixed plate (1) in the left-right direction.

7. A vertical fixture for semiconductor cooling sheet welding wire according to claim 1, characterized in that: The stabilizing mechanism (42) comprises a top plate (421), the top plate (421) being fixedly connected to the side wall of the vertical plate (7), a cylinder (422) being fixedly mounted on the top of the top plate (421), a telescopic rod (423) being transmission-mounted on the output end of the cylinder (422), a pressing plate (424) being fixedly mounted on the bottom of the telescopic rod (423), and a fixing block (425) being fixedly mounted on the inner wall of the pressing plate (424).

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