Horizontal electroplating device
By adopting a combined structure of conductive brushes, substrates, upper conductive sheets, lower conductive sheets and conductive columns in the horizontal electroplating device, the problems of unstable electroplating contact, short effective electroplating distance, high cost and complex deplating in the prior art are solved, and a more efficient and more stable electroplating process is achieved.
Patent Information
- Application Number
- CN202422068257.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-23
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2034-08-23
AI Technical Summary
During the electroplating process, the existing horizontal electroplating devices have problems such as unstable contact between the conductive roller and the battery sheet, shortening the effective electroplating distance, high equipment cost, and complex deplating methods.
The conductive brush, substrate, upper conductive sheet, lower conductive sheet and conductive column combination structure is adopted. The conductive brush is located above the plating tank. The substrate has a through groove to carry the battery cell. The upper conductive sheet comes into contact with the conductive brush. The lower conductive sheet comes into contact with the lower surface of the battery cell through the conductive contacts. The conductive column is connected to the upper and lower conductive sheets to form a circuit closed circuit.
It effectively increases the contact area of electroplating, improves the plating quality, reduces the number of electroplating tanks, reduces the footprint and cost, and simplifies understanding of the plating process.
Smart Images
Figure CN222923305U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of electroplating and relates to a horizontal electroplating device. Background Art
[0002] In the solar energy industry, the horizontal electroplating process of solar cells is widely used, such as BC (Back Contact) solar cells. Since the conductive surface and the electroplating surface of the BC solar cell are the same surface, electroplating can be achieved only when the solar cell contacts the electroplating solution and the conductor simultaneously.
[0003] In the current BC horizontal electroplating process, most electroplating devices use conductive rollers connected in parallel to the negative electrode of a constant current source as the cathode, and titanium rods are connected to the positive electrode of the constant current source and placed in the electroplating solution as insoluble anodes. When the solar cell is transported in the tank, the solar cell contacts the electroplating solution and the conductive roller simultaneously, so that the conductive roller, the electroplating solution, the titanium rod and the solar cell form a closed circuit loop to achieve electroplating.
[0004] However, there are many problems of application limitations in the existing horizontal electroplating devices during the electroplating process, such as:
[0005] First, the contact between the conductive roller and the solar cell is a line contact, which causes the current not to be too large. Once it is too large, the local current will become too high and the coating thickness will be extremely unstable, which is not conducive to electroplating the entire surface.
[0006] Second, the conductive roller needs to be placed in an isolation tank to be isolated from the electroplating solution. Only when the solar cell contacts the electroplating solution can a closed circuit loop be formed for electroplating. Since there is no electroplating solution in the isolation tank, the area where the isolation tank is located cannot be electroplated, which will shorten the effective electroplating distance in the electroplating tank of the same length. This will lead to an increase in the number of electroplating tanks, an increase in the overall length of the equipment, and an occupation of the factory building space.
[0007] Third, once the number of electroplating tanks increases, more components such as constant current sources, insoluble anodes and pumps need to be equipped, which increases the additional cost.
[0008] Fourth, since the conductive roller is located in the isolation tank in the equipment, the method of stripping the plating of the conductive roller is relatively complex. If stripping the plating is required, the equipment needs to be shut down, which will undoubtedly increase the downtime of the equipment and reduce the production capacity.
[0009] Therefore, it is necessary to provide a horizontal electroplating device. Summary of the Utility Model
[0010] In view of the above-mentioned disadvantages of the prior art, the purpose of the utility model is to provide a horizontal electroplating device to solve the above-mentioned series of problems of application limitations existing in the existing horizontal electroplating devices during the electroplating process.
[0011] To achieve the above and other related objectives, the present utility model provides a horizontal electroplating device, which includes:
[0012] A conductive brush, which is located above the electroplating tank;
[0013] A substrate, which has a through groove for carrying solar cells;
[0014] An upper conductive sheet, which is located on the substrate, and in the area where the electroplating tank is located, the upper conductive sheet is in electrical contact with the conductive brush;
[0015] A lower conductive sheet, which is located on the substrate, and the lower conductive sheet has a conductive contact point to be in electrical contact with the lower surface of the carried solar cell through the conductive contact point;
[0016] A conductive column, which is located between the upper conductive sheet and the lower conductive sheet to electrically connect the upper conductive sheet and the lower conductive sheet through the conductive column.
[0017] Optionally, the conductive brush includes a conductive brush fixing part and a conductive brush comb part connected to the conductive brush fixing part, and the conductive brush comb part has an inclined angle with the horizontal plane.
[0018] Optionally, the top end of the conductive brush comb part is arc-shaped.
[0019] Optionally, the range of the inclined angle between the conductive brush comb part and the horizontal plane is 30° to 80°.
[0020] Optionally, the density of the structure formed by combining the substrate, the upper conductive sheet, the lower conductive sheet and the conductive column is greater than the density of the electroplating solution.
[0021] Optionally, it further includes a solar cell cover plate corresponding to the conductive brush and the upper conductive sheet; the solar cell cover plate includes a buffer member, and the buffer member is correspondingly arranged with the conductive contact point.
[0022] Optionally, it further includes a cover plate circulation system, which includes a cover plate manipulator and a cover plate transfer rail connected to the cover plate manipulator.
[0023] Optionally, the substrate, the upper conductive sheet, the lower conductive sheet and the conductive column form an axisymmetric structure.
[0024] Optionally, the surfaces of the upper conductive sheet, the lower conductive sheet and the conductive column all have a passivation layer.
[0025] Optionally, it further includes a substrate circulation system, which includes a substrate manipulator and a substrate transfer rail connected to the substrate manipulator.
[0026] As described above, the horizontal electroplating device of the present invention includes the conductive brush, the substrate, the upper conductive sheet, the lower conductive sheet, and the conductive column; wherein, the conductive brush is located above the electroplating tank; the substrate has a through groove for carrying the battery cells; the upper conductive sheet is located on the substrate, and in the area where the electroplating tank is located, the upper conductive sheet is in electrical contact with the conductive brush; the lower conductive sheet is located on the substrate, and the lower conductive sheet has a conductive contact point to be in electrical contact with the lower surface of the carried battery cell through the conductive contact point; the conductive column is located between the upper conductive sheet and the lower conductive sheet to electrically connect the upper conductive sheet and the lower conductive sheet through the conductive column.
[0027] The horizontal electroplating device of the present invention can effectively increase the electroplating contact area, improve the coating quality, reduce the number of electroplating tanks, reduce the floor area, save costs, and is applicable to BC horizontal electroplating. Description of the Drawings
[0028] Figure 1 It shows a schematic structural diagram of the horizontal electroplating device in the embodiment of the present invention.
[0029] Figure 2 It shows a schematic partial structural diagram of the horizontal electroplating device in the embodiment of the present invention.
[0030] Figure 3 It shows Figure 1 a schematic side view structural diagram of the horizontal electroplating device in
[0031] Figure 4 It shows a schematic structural diagram of the battery cell cover plate in the embodiment of the present invention.
[0032] Figure 5 It shows a schematic structural diagram of the horizontal electroplating device with a substrate circulation system and a cover plate circulation system in the embodiment of the present invention.
[0033] Description of the Reference Numerals
[0034] 100 Conductive brush
[0035] 200 Substrate
[0036] 201 Through groove
[0037] 300 Upper conductive sheet
[0038] 400 Lower conductive sheet
[0039] 401 Conductive contact point
[0040] 500 Conductive posts
[0041] 600 Battery cell cover plate
[0042] 601 Buffer
[0043] 700 Transmission roller
[0044] 800 Battery cell
[0045] 810 Battery cell loading manipulator
[0046] 820 Battery cell unloading manipulator
[0047] 910 Substrate loading manipulator
[0048] 920 Substrate unloading manipulator
[0049] 930 Substrate transmission rail
[0050] 110 Cover plate loading manipulator
[0051] 120 Cover plate unloading manipulator
[0052] 130 Cover plate transmission rail
[0053] Q1 Water washing area
[0054] Q2 Electroplating area
[0055] Q3 Water washing area Detailed implementation manners
[0056] The following uses specific specific examples to illustrate the implementation manners of the present utility model. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. The present utility model can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present utility model.
[0057] It should be noted that the illustrations provided in this embodiment only schematically illustrate the basic concept of the present utility model. Therefore, only the components related to the present utility model are shown in the illustrations, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and ratio of each component in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.
[0058] Such as Figures 1 to 5, this embodiment provides a horizontal electroplating device, which includes a conductive brush 100, a substrate 200, an upper conductive sheet 300, a lower conductive sheet 400, and a conductive column 500. Among them, the conductive brush 100 is located above an electroplating tank (not shown); the substrate 200 has a through groove 201 for carrying a battery cell 800; the upper conductive sheet 300 is located on the substrate 200, and in the area where the electroplating tank is located, the upper conductive sheet 300 is in electrical contact with the conductive brush 100; the lower conductive sheet 400 is located on the substrate 200, and the lower conductive sheet 400 has a conductive contact 401 to be in electrical contact with the lower surface of the carried battery cell 800 through the conductive contact 401; the conductive column 500 is located between the upper conductive sheet 300 and the lower conductive sheet 400 to electrically connect the upper conductive sheet 300 and the lower conductive sheet 400.
[0059] Specifically, the horizontal electroplating device includes an anode (not shown) disposed in the electroplating tank and a transfer roller 700 for transferring the battery cell 800. Among them, since the anode is connected to the positive pole of a constant current source and the conductive brush 100 is connected to the negative pole of the constant current source, when the battery cell 800 is transferred to the electroplating area, the current can be transmitted to the lower surface of the battery cell 800 through the conductive contact 401 via the conductive brush 100, the upper conductive sheet 300, the conductive column 500, and the lower conductive sheet 400 that are electrically connected to the constant current source, and a closed circuit is formed in combination with the electroplating solution to electroplate the battery cell 800.
[0060] The horizontal electroplating device of this embodiment can effectively increase the electroplating contact area, improve the coating quality, reduce the number of electroplating tanks, reduce the floor area, save costs, and is applicable to BC horizontal electroplating through the settings of the upper conductive sheet 300, the lower conductive sheet 400, and the conductive column 500.
[0061] As an example, the conductive brush 100 includes a conductive brush fixing part and a conductive brush comb tooth part connected to the conductive brush fixing part, and there is an inclined angle θ between the conductive brush comb tooth part and the horizontal plane.
[0062] Specifically, as Figure 1, the conductive brush 100 is an elastic metal sheet, and the material can be stainless steel or titanium, etc. When adjusting the conductive brush 100 to have the inclination angle θ with the horizontal plane, it can make the conductive brush 100 have good contact with the upper conductive sheet 300, increase the contact area between the comb teeth part of the conductive brush and the upper conductive sheet 300, and reduce the contact resistance; in the high-speed operation state, designing the inclination angle θ can reduce the resistance of the comb teeth part of the conductive brush to the upper conductive sheet 300; in the inclined state, the deformation amount of the comb teeth part of the conductive brush can be reduced, making the comb teeth part of the conductive brush easy to return to the original state, and the service life of the conductive brush 100 can be extended.
[0063] As an example, the top end of the comb teeth part of the conductive brush is preferably in an arc shape.
[0064] Specifically, the comb teeth part of the conductive brush can be subjected to processes such as curling or bending so that the end of the comb teeth part of the conductive brush is in an arc shape, thereby avoiding direct contact between the tip and the upper conductive sheet 300 and reducing damage to the comb teeth part of the conductive brush and / or the upper conductive sheet 300.
[0065] As an example, the range of the inclination angle θ between the comb teeth part of the conductive brush and the horizontal plane can be 30° to 80°.
[0066] Specifically, it is preferred that the inclination direction of the comb teeth part of the conductive brush is consistent with the running direction of the battery cell 800, such as Figure 1 , the running direction of the battery cell 800 can be regarded as from right to left, and the inclination direction of the comb teeth part of the conductive brush is set to incline to the left. Thus, when the upper conductive sheet 300 contacts the comb teeth part of the conductive brush, good buffering can be formed, reducing the damage probability of the upper conductive sheet 300 and / or the comb teeth part of the conductive brush and forming good electrical contact. Among them, the range of the inclination angle θ between the comb teeth part of the conductive brush and the horizontal plane can be 30°, 60°, 70°, 80°, etc.
[0067] As an example, it is preferred that the density of the structure composed of the substrate 200, the upper conductive sheet 300, the lower conductive sheet 400 and the conductive column 500 is greater than the density of the electroplating solution.
[0068] Specifically, such as Figure 1 and Figure 2 , during the electroplating process, the substrate 200 is placed above the corresponding transmission roller 700, and the rotation of the transmission roller 700 drives the substrate 200 to run. And through the through groove 201, the back surface of the battery cell 800 can be in contact with the electroplating solution, and the electroplating operation is realized by combining the anode electrically connected to the constant current source and the conductive brush 100.
[0069] Among them, when the density of the structure composed of the substrate 200, the upper conductive sheet 300, the lower conductive sheet 400, and the conductive column 500 is preferably greater than the density of the electroplating solution, the position shift of the substrate 200 caused by the buoyancy can be avoided, so that good transmission can be achieved. The material of the substrate 200 may include, for example, PVC, etc. The specific types of the substrate 200, the upper conductive sheet 300, the lower conductive sheet 400, the conductive column 500, and the electroplating solution can be selected according to needs and will not be overly restricted here.
[0070] As an example, it further includes a battery cell cover plate 600 corresponding to the conductive brush 100 and the upper conductive sheet 300; among them, it is preferred that the battery cell cover plate 600 includes a buffer member 601, and the buffer member 601 is correspondingly arranged with the conductive contact 401.
[0071] Specifically, such as Figure 1 and Figure 4 , after placing the battery cell 800 on the substrate 200, the battery cell cover plate 600 can be placed on the upper surface of the battery cell 800, so that the load can be increased through the battery cell cover plate 600, and the back surface of the battery cell 800 can be in full contact with the conductive contact 401 to ensure good electrical connection for electroplating.
[0072] Among them, it is preferred that the battery cell cover plate 600 includes the buffer member 601, and the buffer member 601 is correspondingly arranged with the conductive contact 401, so as to further ensure good contact between the battery cell 800 and the conductive contact 401.
[0073] Furthermore, it is preferred that the buffer member 601 is a flexible member, such as buffer cotton, etc., to avoid hard contact between the battery cell cover plate 600 and the battery cell 800, reduce the damage probability, and ensure the quality.
[0074] As an example, the battery cell cover plate 600 is preferably a patterned battery cell cover plate, and the patterned morphology may include one or a combination of, for example, grid-like, strip-like, and arc-like.
[0075] Specifically, some blind grooves or through grooves can be made on the side of the battery cell cover plate 600 facing the battery cell 800, so as to effectively reduce the contact area between the battery cell cover plate 600 and the battery cell 800 on the premise of providing load, thereby effectively avoiding the adsorption effect between the battery cell cover plate 600 and the battery cell 800 due to surface tension, so as to facilitate the picking and placing operation of the battery cell cover plate 600 on the surface of the battery cell 800. Regarding the pattern morphology on the surface of the battery cell cover plate 600, it will not be overly restricted here.
[0076] As an example, it is preferred that the substrate 200, the upper conductive sheet 300, the lower conductive sheet 400, and the conductive post 500 form an axisymmetric structure.
[0077] Specifically, as Figure 2 , in this embodiment, it is preferred that the substrate 200, the upper conductive sheet 300, the lower conductive sheet 400, and the conductive post 500 form an axisymmetric structure, so that uniform electroplating can be achieved during electroplating, and the uniformity of the plating layer can be improved. The setting of the number and position of the conductive contacts 401 can be selected according to needs, and no excessive limitation is made here.
[0078] As an example, it is preferred that the surfaces of the upper conductive sheet 300, the lower conductive sheet 400, and the conductive post 500 all have a passivation layer.
[0079] Specifically, when a passivation layer is provided on the surfaces of the upper conductive sheet 300, the lower conductive sheet 400, and the conductive post 500, the surfaces of the upper conductive sheet 300, the lower conductive sheet 400, and the conductive post 500 can be effectively prevented from being electroplated, and the passivation layer with corrosion resistance can protect the upper conductive sheet 300, the lower conductive sheet 400, and the conductive post 500. Therefore, in this embodiment, it is preferred that the surfaces of the upper conductive sheet 300, the lower conductive sheet 400, and the conductive post 500 are provided with the passivation layer. Among them, for the convenience of electrical connection, the passivation layer needs to expose the electrical contact surfaces of the upper conductive sheet 300, the lower conductive sheet 400, and the conductive post 500, and it is preferred that the passivation layer adopts a PTFE (polytetrafluoroethylene) layer with relatively stable performance, high temperature resistance, and corrosion resistance, but the type of the passivation layer is not limited thereto.
[0080] As an example, it further includes a substrate circulation system, the substrate circulation system includes a substrate manipulator and a substrate transfer rail connected to the substrate manipulator, and / or it further includes a cover plate circulation system, the cover plate circulation system includes a cover plate manipulator and a cover plate transfer rail connected to the cover plate manipulator.
[0081] Specifically, as Figure 5 , in this embodiment, to improve the process efficiency, the substrate circulation system and the cover plate circulation system are both provided. Among them, the substrate circulation system includes a substrate loading manipulator 910, a substrate unloading manipulator 920, and a substrate transfer rail 930, and the cover plate circulation system includes a cover plate loading manipulator 110, a cover plate unloading manipulator 120, and a cover plate transfer rail 130. However, the setting and structure of the substrate circulation system and the cover plate circulation system are not limited thereto and can be selected according to specific needs.
[0082] Such as Figure 1, the substrate loading manipulator 910 places the substrate 200 at the end of the water washing area Q1. When the solar cell 800 is transported to the end of the water washing area Q1, the solar cell loading manipulator 810 places the solar cell 800 into the substrate 200, and then runs to the next station. The cover plate loading manipulator 110 places the solar cell cover plate 600 above the solar cell 800, and then enters the electroplating area Q2. And in the electroplating area Q2, the conductive brush 100 contacts the upper conductive sheet 300, and electroplating starts; when electroplating ends and the substrate 200 runs to the water washing area Q3, the cover plate unloading manipulator 120 transfers the solar cell cover plate 600 to the cover plate transfer rail 130 to form a cover plate circulation system; when running to the next station, the solar cell unloading manipulator 820 takes out the solar cell 800 and places it at the water washing station; when running to the next station, the substrate unloading manipulator 920 takes out the substrate 200 and transfers it to the substrate transfer rail 930 to form a substrate circulation system.
[0083] In summary, the horizontal electroplating device of the present invention includes the conductive brush, the substrate, the upper conductive sheet, the lower conductive sheet and the conductive column; wherein, the conductive brush is located above the electroplating tank; the substrate has a through groove for carrying the solar cell; the upper conductive sheet is located on the substrate, and in the area where the electroplating tank is located, the upper conductive sheet is in electrical contact with the conductive brush; the lower conductive sheet is located on the substrate, and the lower conductive sheet has a conductive contact point to be in electrical contact with the lower surface of the carried solar cell through the conductive contact point; the conductive column is located between the upper conductive sheet and the lower conductive sheet to electrically connect the upper conductive sheet and the lower conductive sheet through the conductive column.
[0084] The horizontal electroplating device of the present invention can effectively increase the electroplating contact area, improve the coating quality, reduce the number of electroplating tanks, reduce the floor area, save costs, and is applicable to BC horizontal electroplating.
[0085] The above embodiments are only illustrative of the principles and effects of the present invention, and are not used to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed by the present invention should still be covered by the claims of the present invention.
Claims
1. A horizontal electroplating device, characterized in that: The horizontal electroplating device comprises: A conductive brush, wherein the conductive brush is located above the electroplating tank; A substrate having a through groove for carrying a battery cell; An upper conductive sheet, the conductive sheet is located on the substrate, and in the area where the electroplating tank is located, the upper conductive sheet is in electrical contact with the conductive brush; A lower conductive sheet, the lower conductive sheet is located on the substrate, and the lower conductive sheet has a conductive contact, so as to be in electrical contact with the lower surface of the carried battery sheet through the conductive contact; A conductive column is located between the upper conductive sheet and the lower conductive sheet so as to electrically connect the upper conductive sheet and the lower conductive sheet through the conductive column.
2. The horizontal electroplating device according to claim 1, characterized in that: The conductive brush comprises a conductive brush fixing portion and a conductive brush comb-tooth portion connected to the conductive brush fixing portion, and an inclined angle is formed between the conductive brush comb-tooth portion and a horizontal plane.
3. The horizontal electroplating device according to claim 2, characterized in that: The top end of the comb teeth of the conductive brush is in an arc shape.
4. The horizontal electroplating device according to claim 2, characterized in that: The inclined angle between the comb teeth of the conductive brush and the horizontal plane ranges from 30° to 80°.
5. The horizontal electroplating device according to claim 1, characterized in that: The density of the structure formed by the substrate, the upper conductive sheet, the lower conductive sheet and the conductive pillars is greater than the density of the electroplating solution.
6. The horizontal electroplating device according to claim 1, characterized in that: It also includes a battery cell cover plate arranged corresponding to the conductive brush and the upper conductive sheet; the battery cell cover plate includes a buffer, and the buffer is arranged corresponding to the conductive contact.
7. The horizontal electroplating device according to claim 6, characterized in that: It also includes a cover plate circulation system, which includes a cover plate manipulator and a cover plate transmission rail connected to the cover plate manipulator.
8. The horizontal electroplating device according to claim 1, characterized in that: The substrate, the upper conductive sheet, the lower conductive sheet and the conductive pillar form an axisymmetric structure.
9. The horizontal electroplating device according to claim 1, characterized in that: The surfaces of the upper conductive sheet, the lower conductive sheet and the conductive pillars are all provided with a passivation layer.
10. The horizontal electroplating device according to claim 1, characterized in that: It also includes a substrate circulation system, which includes a substrate robot and a substrate transmission rail connected to the substrate robot.