Miniature refrigerator

Abstract

The utility model discloses a miniature refrigerator, which comprises a refrigerator main body, a thermocouple, a ceramic panel and a ceramic bottom shell, the ceramic bottom shell is arranged at the bottom end of the refrigerator main body, the thermocouple is arranged in the ceramic bottom shell, the ceramic panel is arranged at the top of the ceramic bottom shell, and the thermocouple is arranged in the ceramic panel. Preformed holes are formed in the four corners of the ceramic panel, mounting holes are formed in the four corners of the top of the ceramic bottom shell, limiting grooves are formed in the portions, on the two sides of the mounting holes, of the ceramic bottom shell, and limiting blocks matched with the limiting grooves are evenly distributed at the edge of the bottom of the ceramic panel. Sealing strips are arranged on the periphery of the bottom of the ceramic panel. By installing the refrigerator body, the thermocouple, the ceramic bottom shell, the ceramic panel, the installing hole, the limiting groove, the limiting block, the sealing strip and the sealing groove, the refrigerator body is detachable and convenient to overhaul, meanwhile, the sealing performance of the refrigerator body is guaranteed, and normal work is not affected.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigeration chips, and particularly relates to a micro cooler. Background Technique

[0002] A micro cooler, also called a semiconductor refrigeration chip, is applied to some occasions where space is limited, reliability requirements are high, and there is no refrigerant pollution. When direct current passes through an electric couple formed by two different semiconductor materials connected in series, heat can be absorbed and released at both ends of the electric couple respectively, so as to achieve the purpose of refrigeration. It is a refrigeration technology that generates negative thermal resistance, and its characteristics are that there are no moving parts and the reliability is relatively high.

[0003] A micro cooler generally consists of a hot end, a cold end and a thermocouple. The hot end and the cold end are both made of ceramic plates and are respectively fixed on the upper and lower sides of the thermocouple. Therefore, the common cooler is usually in an integrated structure form, and it is not easy to repair and maintain when a failure or damage occurs. Content of the Utility Model

[0004] The purpose of the utility model is to provide a micro cooler to solve the problems put forward in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical scheme: A micro cooler includes a cooler main body, a thermocouple, a ceramic panel and a ceramic bottom shell. A ceramic bottom shell is arranged at the bottom end of the cooler main body, and a thermocouple is arranged inside the ceramic bottom shell. Wires are arranged at both ends on one side of the thermocouple. A ceramic panel is arranged on the top of the ceramic bottom shell, and reserved holes are opened at four corners of the ceramic panel. Mounting holes are opened at four corners of the top of the ceramic bottom shell, and limiting grooves are opened on the ceramic bottom shell on both sides of the mounting holes. Limiting blocks matching the limiting grooves are evenly distributed at the edge of the bottom of the ceramic panel. Sealing strips are arranged around the bottom of the ceramic panel, and sealing grooves are opened around the top of the ceramic bottom shell.

[0006] Preferably, the mounting holes and the reserved holes are on the same vertical line, and both the mounting holes and the reserved holes are locked and fixed by fasteners.

[0007] Preferably, the thermocouple includes an N-type semiconductor, a P-type semiconductor, a first metal conductor and a second metal conductor, and the N-type semiconductor and the P-type semiconductor are arranged alternately. The first metal conductor and the second metal conductor are respectively arranged at the upper and lower ends of the N-type semiconductor and the P-type semiconductor.

[0008] Preferably, moisture-proof strips are arranged in the ceramic bottom shell on both sides of the thermocouple, and the moisture-proof strips are all made of silica gel material.

[0009] Preferably, both ends of the moisture-proof strip are provided with clamping blocks, and clamping grooves matching the clamping blocks are respectively formed in the ceramic bottom shells at both ends of the moisture-proof strip.

[0010] Preferably, the sealing strips are all made of rubber material, and the sealing strips are all embedded in the sealing grooves.

[0011] Preferably, a heat conduction plate is arranged at the bottom end of the ceramic bottom shell, heat dissipation fins are evenly distributed on the heat conduction plate, and both the heat conduction plate and the heat dissipation fins are made of copper alloy material.

[0012] Preferably, the heat dissipation fins are distributed at equal intervals, and copper foils are arranged between the heat dissipation fins.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows: The micro cooler is provided with a cooler body, a thermocouple, a ceramic bottom shell, a ceramic panel, mounting holes, a limiting groove, a limiting block, a sealing strip and a sealing groove. The thermocouple is arranged in the ceramic bottom shell, the ceramic panel is arranged on the top of the ceramic bottom shell, mounting holes are arranged at the four corners of the ceramic bottom shell, reserved holes corresponding to the mounting holes are arranged at the four corners of the ceramic panel, and the reserved holes and the mounting holes are locked and fixed by fasteners, so that the cooler body is detachable and convenient for maintenance. At the same time, when the ceramic panel is connected to the ceramic bottom shell, the limiting block is correspondingly connected and positioned with the limiting groove, and the sealing strip is embedded in the sealing groove, improving the sealing performance of the cooler body, playing a role in waterproofing and dustproofing, and not affecting the normal operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0015] Figure 1 is a schematic top cross-sectional structure diagram of the present utility model;

[0016] Figure 2 is a schematic front view structure diagram of the present utility model;

[0017] Figure 3 is of the present utility model Figure 2 enlarged structure diagram at A in;

[0018] Figure 4 is a schematic partial structure diagram of the thermocouple of the present utility model;

[0019] Figure 5 is a schematic structure diagram of the moisture-proof strip of the present utility model.

[0020] In the figure: 1, the main body of the cooler; 2, the mounting hole; 3, the sealing groove; 4, the clamping groove; 5, the limiting groove; 6, the thermocouple; 7, the moisture-proof strip; 8, the wire; 9, the limiting block; 10, the ceramic panel; 11, the sealing strip; 12, the ceramic bottom shell; 13, the heat sink; 14, the heat conduction plate; 15, the copper foil; 16, the N-type semiconductor; 17, the P-type semiconductor; 18, the first metal conductor; 19, the second metal conductor; 20, the clamping block; 21, the reserved hole. Specific implementation mode

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0022] Please refer to Figures 1-5 , an embodiment provided by the present invention: a micro cooler, including the main body 1 of the cooler, the thermocouple 6, the ceramic panel 10 and the ceramic bottom shell 12. The bottom end of the main body 1 of the cooler is provided with the ceramic bottom shell 12, and the thermocouple 6 is arranged inside the ceramic bottom shell 12;

[0023] The thermocouple 6 includes an N-type semiconductor 16, a P-type semiconductor 17, a first metal conductor 18 and a second metal conductor 19, and the N-type semiconductor 16 and the P-type semiconductor 17 are arranged alternately. The first metal conductor 18 and the second metal conductor 19 are respectively arranged at the upper and lower ends of the N-type semiconductor 16 and the P-type semiconductor 17;

[0024] Both ends on one side of the thermocouple 6 are provided with wires 8, and the top of the ceramic bottom shell 12 is provided with the ceramic panel 10;

[0025] Connect the power supply through the wire 8. When direct current passes through the thermocouple 6, heat can be absorbed and released at both ends of the thermocouple 6 respectively, that is, heat is absorbed at the ceramic panel 10 end and heat is released at the ceramic bottom shell 12 end, so that the ceramic panel 10 can achieve refrigeration;

[0026] Reserved holes 21 are opened at the four corners of the ceramic panel 10, and mounting holes 2 are opened at the four corners of the top of the ceramic bottom shell 12;

[0027] The mounting hole 2 and the reserved hole 21 are located on the same vertical line, and both the mounting hole 2 and the reserved hole 21 are locked and fixed by fasteners, so that the main body 1 of the cooler is detachable and convenient for maintenance;

[0028] Limiting grooves 5 are opened on the ceramic bottom shell 12 on both sides of the mounting hole 2, and limiting blocks 9 matching the limiting grooves 5 are evenly distributed at the edge of the bottom of the ceramic panel 10;

[0029] Sealing strips 11 are provided around the bottom of the ceramic panel 10, and sealing grooves 3 are provided around the top of the ceramic bottom shell 12. The sealing strips 11 are all made of rubber material, and the sealing strips 11 are all embedded in the sealing grooves 3;

[0030] At the same time, when the ceramic panel 10 is connected to the ceramic bottom shell 12, the limit block 9 is correspondingly connected and positioned with the limit groove 5, and the sealing strip 11 is embedded in the sealing groove 3, improving the sealing performance of the cooler body 1 and playing a role in waterproofing and dustproofing without affecting normal operation;

[0031] A heat conducting plate 14 is provided at the bottom end of the ceramic bottom shell 12, and heat sinks 13 are evenly distributed on the heat conducting plate 14. Both the heat conducting plate 14 and the heat sinks 13 are made of copper alloy material, which is conducive to evenly dissipating the heat absorbed by the ceramic bottom shell 12

[0032] The heat sinks 13 are distributed at equal intervals, and copper foils 15 are provided between the heat sinks 13 to further improve the heat dissipation efficiency;

[0033] Moisture-proof strips 7 are provided in the ceramic bottom shell 12 on both sides of the thermocouple 6. The moisture-proof strips 7 are all made of silica gel material, playing a role in moisture absorption and moisture prevention and improving the stability of the cooler body 1 during operation

[0034] Blocks 20 are provided at both ends of the moisture-proof strip 7, and clamping grooves 4 matching the blocks 20 are provided in the ceramic bottom shell 12 at both ends of the moisture-proof strip 7, facilitating the limit clamping of the moisture-proof strip 7.

[0035] Working principle: When the embodiment of the present application is in use, the thermocouple 6 is arranged in the ceramic bottom shell 12, the ceramic panel 10 is arranged on the top of the ceramic bottom shell 12, mounting holes 2 are arranged at the four corners of the ceramic bottom shell 12, and reserved holes 21 corresponding to the mounting holes 2 are arranged at the four corners of the ceramic panel 10. The reserved holes 21 and the mounting holes 2 are locked and fixed by fasteners, so that the cooler body 1 is detachable, which is convenient for maintenance. At the same time, when the ceramic panel 10 is connected to the ceramic bottom shell 12, the limiting block 9 is correspondingly connected and positioned with the limiting groove 5, and the sealing strip 11 is embedded into the sealing groove 3, improving the sealing performance of the cooler body 1 and playing a role in waterproofing and dustproofing without affecting the normal operation. The thermocouple 6 is composed of a P-type semiconductor 17 and an N-type semiconductor 16, and is connected to a power supply through a wire 8. When direct current passes through the thermocouple 6, heat can be absorbed and released at both ends of the thermocouple 6 respectively, that is, heat is absorbed at the ceramic panel 10 end and released at the ceramic bottom shell 12 end, so that the ceramic panel 10 can achieve refrigeration. In addition, a heat conducting plate 14 is arranged at the bottom of the ceramic bottom shell 12, and heat sinks 13 are evenly distributed on the heat conducting plate 14. Both the heat conducting plate 14 and the heat sinks 13 are made of copper alloy material, which is beneficial to evenly dissipate the heat absorbed by the ceramic bottom shell 12. At the same time, copper foils 15 are arranged between the heat sinks 13 to further improve the heat dissipation efficiency. In addition, moisture-proof strips 7 are arranged on both sides inside the ceramic bottom shell 12, playing a role in moisture absorption and moisture prevention and improving the stability of the cooler body 1 during operation.

[0036] Obviously, the above-described embodiments are only a part of the embodiments of the present invention, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

Claims

1. A micro refrigerator, characterized in that: The refrigerator comprises a refrigerator body (1), a thermocouple (6), a ceramic panel (10) and a ceramic bottom shell (12); the bottom end of the refrigerator body (1) is provided with a ceramic bottom shell (12), and a thermocouple (6) is provided inside the ceramic bottom shell (12); both ends of one side of the thermocouple (6) are provided with wires (8); the top of the ceramic bottom shell (12) is provided with a ceramic panel (10), and four corners of the ceramic panel (10) are provided with reserved holes (21); the four corners of the top of the ceramic bottom shell (12) are provided with mounting holes (2), and the ceramic bottom shell (12) on both sides of the mounting holes (2) are provided with limiting grooves (5); the edges of the bottom of the ceramic panel (10) are evenly distributed with limiting blocks (9) matching the limiting grooves (5); the bottom of the ceramic panel (10) is provided with sealing strips (11) around the bottom, and the top of the ceramic bottom shell (12) is provided with sealing grooves (3) around the top.

2. A micro refrigerator according to claim 1, characterized in that: The mounting hole (2) and the reserved hole (21) are located on the same vertical line, and the mounting hole (2) and the reserved hole (21) are both locked and fixed by fasteners.

3. A micro refrigerator according to claim 1, characterized in that: The thermocouple (6) comprises an N-type semiconductor (16), a P-type semiconductor (17), a first metal conductor (18) and a second metal conductor (19), wherein the N-type semiconductor (16) and the P-type semiconductor (17) are arranged alternately, and the first metal conductor (18) and the second metal conductor (19) are arranged at upper and lower ends of the N-type semiconductor (16) and the P-type semiconductor (17), respectively.

4. A micro refrigerator according to claim 1, characterized in that: Moisture-proof strips (7) are arranged in the ceramic bottom shells (12) on both sides of the thermocouple (6), and the moisture-proof strips (7) are made of silica gel.

5. A micro refrigerator according to claim 4, characterized in that: Both ends of the moisture-proof strip (7) are provided with a clamping block (20), and both ends of the moisture-proof strip (7) are provided with a clamping slot (4) matching the clamping block (20) in the ceramic bottom shell (12).

6. A micro refrigerator according to claim 1, characterized in that: The sealing strips (11) are all made of rubber material, and the sealing strips (11) are all embedded in the sealing grooves (3).

7. A micro refrigerator according to claim 1, characterized in that: A heat conducting plate (14) is arranged at the bottom end of the ceramic bottom shell (12), and heat sinks (13) are evenly distributed on the heat conducting plate (14), and both the heat conducting plate (14) and the heat sinks (13) are made of copper alloy.

8. A micro refrigerator according to claim 7, characterized in that: The heat sinks (13) are distributed at equal intervals, and copper foils (15) are provided between the heat sinks (13).

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