Infrared tester refrigeration module capable of working efficiently

Abstract

The utility model discloses an efficient infrared tester refrigeration module, which comprises an infrared tester body, the bottom of the front side and the bottom of the rear side of the infrared tester body are fixedly connected with mounting plates, the surfaces of the mounting plates are slidably connected with mounting blocks, the right sides of the mounting blocks are fixedly connected with fixing plates, and the right sides of the fixing plates are fixedly connected with the infrared tester body. A cooling box is fixedly connected to the bottom of the fixing plate, a semiconductor chilling plate is fixedly connected to the right side of the bottom of an inner cavity of the cooling box, a conveying pump is fixedly connected to the left side of the bottom of the inner cavity of the cooling box, the water outlet end of the conveying pump communicates with a conveying pipe, and a cooling pipe is fixedly connected to an inner cavity of the infrared tester body. Through the steps, the cooling box can be rapidly installed at the bottom of the infrared tester body, disassembly, assembly and maintenance are convenient, heat in the infrared tester body can be rapidly conducted out in a circulating refrigeration cooling mode, the good cooling effect is achieved, recycling can be achieved, and resource consumption is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigeration modules, and specifically, to a refrigeration module for an infrared tester with high working efficiency. Background Technique

[0002] An infrared tester is a specialized technology that uses the principle of infrared radiation to inspect and measure the surface of equipment, materials, and other objects. It is also a means of collecting the surface temperature information of an object. It receives the infrared radiation energy distribution pattern of the measured target through an infrared detector and an optical imaging objective lens, converts this invisible infrared energy into a visible thermal image, thereby reflecting the thermal distribution field on the surface of the object. Generally speaking, an infrared tester converts the invisible infrared energy emitted by an object into a visible thermal image, and different colors on these thermal images represent different temperatures of the measured object. In addition, infrared testers are widely used in target search, observation, analysis, measurement, aiming, tracking, monitoring, infrared photography, and guiding killing weapons towards targets. Infrared testers are mainly divided into two types: refrigerated and uncooled. Refrigerated infrared testers use refrigeration technology to reduce the working temperature of the detector to improve its sensitivity and performance. The existing refrigeration methods generally use air cooling or heat sinks to cool the infrared tester, but their cooling efficiency is limited in high-temperature environments, resulting in a decrease in sensitivity. Therefore, a refrigeration module for an infrared tester with high working efficiency is proposed to solve the above problems. Content of the Utility Model

[0003] (I) Technical Problems to be Solved

[0004] Aiming at the deficiencies of the existing technology, the purpose of the utility model is to provide a refrigeration module for an infrared tester with high working efficiency, which has the advantage of good refrigeration effect.

[0005] (II) Technical Solutions

[0006] To achieve the above purpose, the utility model provides the following technical solutions. The technical solution adopted by a refrigeration module for an infrared tester with high working efficiency is as follows: It includes an infrared tester body. Installation plates are fixedly connected to the bottoms of the front and rear sides of the infrared tester body. Installation blocks are slidably connected to the surfaces of the installation plates. A fixing plate is fixedly connected to the right side of the installation block. A cooling box is fixedly connected to the bottom of the fixing plate. A semiconductor refrigeration sheet is fixedly connected to the right side of the inner cavity bottom of the cooling box. A delivery pump is fixedly connected to the left side of the inner cavity bottom of the cooling box. The water outlet end of the delivery pump is communicated with a delivery pipe. A cooling pipe is fixedly connected to the inner cavity of the infrared tester body. One end of the cooling pipe is communicated with a circulation pipe. The other end of the circulation pipe is communicated with a spray pipe. Nozzles are communicated with both sides of the bottom of the spray pipe. A protection box is fixedly connected to the right side of the cooling box. A cooling fan is fixedly connected to the inner cavity of the protection box.

[0007] As a preferred solution, fixed blocks are fixedly connected to both the front side and the rear side of the bottom of the right side of the infrared tester body. An anti-movement plate is in contact with the right side of the fixed block. An anti-movement block is fixedly connected to the left side of the anti-movement plate. An anti-movement groove adapted to the anti-movement block is formed in the inner cavity of the fixing plate. The anti-movement plate is fixedly connected to the fixed block by bolts.

[0008] As a preferred solution, the bottom of the mounting block is fixedly connected to the top of the cooling box. Heat dissipation fins are fixedly connected to both the front side and the rear side of the infrared tester body.

[0009] As a preferred solution, temperature sensors are arranged in the inner cavities of both the infrared tester body and the cooling box. The cooling pipes are evenly arranged in a circular ring around the inner cavity of the infrared tester body.

[0010] As a preferred solution, the end of the conveying pipe far from the conveying pump is communicated with the cooling pipe, and the nozzles are designed to be relatively inclined.

[0011] As a preferred solution, the right side of the semiconductor refrigeration chip is the hot end, and the hot end extends to the outside of the cooling box.

[0012] As a preferred solution, the number of both the semiconductor refrigeration chips and the cooling fans is two. An air intake through groove is formed in the top of the protection box, and a dust-proof net is magnetically attracted in the inner cavity of the air intake through groove.

[0013] (III) Beneficial effects

[0014] Compared with the prior art, the present utility model provides an infrared tester refrigeration module with high working efficiency, and has the following beneficial effects.

[0015] 1. By lifting the cooling box to the bottom of the infrared tester body, aligning the mounting block with the mounting plate, pushing the cooling box to the left, making the mounting block slide to the left on the surface of the mounting plate. When the fixing plate contacts the infrared tester body, pick up the anti-movement plate and bring it close to the fixed block, insert the anti-movement block into the inner cavity of the anti-movement groove, and use bolts to fix the anti-movement plate to the fixed block. At this time, the installation of the cooling box is completed. Through the above steps, the cooling box can be quickly installed at the bottom of the infrared tester body, which is convenient for disassembly, installation and maintenance.

[0016] 2. By connecting the delivery pipe to the cooling pipe and the other end of the circulation pipe to the cooling pipe, setting the cooling temperature in the micro control device of the infrared tester body, the temperature sensor inside the infrared tester body detects the internal temperature during use. When the heat dissipation fins cannot meet the heat dissipation requirements and cause the temperature of the infrared tester body to be relatively high, the semiconductor refrigeration chip is turned on to cool the cooling medium in the cooling box. The delivery pump transports the cooled cooling medium through the delivery pipe to the cooling pipe, and heat exchange occurs between the cooling pipe and the heat inside the infrared tester body, enabling the rapid cooling of the inside of the infrared tester body. The cooled cooling medium after heat exchange is transported through the circulation pipe to the injection pipe and sprayed through the nozzle into the cooling box for reuse. During the operation of the semiconductor refrigeration chip, the cooling fan blows air to reduce the temperature of the hot end of the semiconductor refrigeration chip. Through the method of circulating refrigeration and cooling, the heat inside the infrared tester body can be quickly conducted outwards. It not only has a good cooling effect but also can be recycled, reducing resource consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic structural diagram of the present utility model;

[0018] Figure 2 is a schematic internal structure diagram of the cooling box of the present utility model;

[0019] Figure 3 is a schematic internal structure diagram of the protective box of the present utility model;

[0020] Figure 4 is a left view schematic diagram of the mounting plate and the mounting block of the present utility model.

[0021] In the figure: 1. Infrared tester body; 2. Mounting plate; 3. Mounting block; 4. Fixing plate; 5. Cooling box; 6. Semiconductor refrigeration chip; 7. Delivery pump; 8. Delivery pipe; 9. Circulation pipe; 10. Injection pipe; 11. Nozzle; 12. Protective box; 13. Cooling fan; 14. Fixing block; 15. Anti-movement plate; 16. Anti-movement block; 17. Heat dissipation fins; 18. Temperature sensor; 19. Dust-proof net. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] The following further describes in detail the embodiments of the present utility model in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0023] In the description of the present utility model, unless otherwise specified, "a plurality of" means two or more; the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation on the present utility model. In addition, terms such as "first", "second", "third", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0024] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and defined, the terms "connected" and "connected to" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0025] The infrared tester body 1, mounting plate 2, mounting block 3, fixing plate 4, cooling box 5, semiconductor refrigeration sheet 6, delivery pump 7, delivery pipe 8, circulation pipe 9, injection pipe 10, nozzle 11, protective box 12, cooling fan 13, fixing block 14, anti-moving plate 15, anti-moving block 16, heat dissipation fins 17, temperature sensor 18 and dust-proof net 19 components of the present application are all common standard components or components known to those skilled in the art, and their structures and principles can all be known to those skilled in the art through technical manuals or obtained through conventional experimental methods.

[0026] Embodiment 1:

[0027] Please refer to Figures 1-4, in order to achieve the purpose of facilitating the installation of the refrigeration module, the following technical solutions are provided in this embodiment, and specifically disclosed: including the infrared tester body 1, mounting plates 2 are fixedly connected to the bottoms of the front side and the rear side of the infrared tester body 1, a mounting block 3 is slidably connected to the surface of the mounting plate 2, a fixing plate 4 is fixedly connected to the right side of the mounting block 3, a cooling box 5 is fixedly connected to the bottom of the fixing plate 4, fixing blocks 14 are fixedly connected to the front side and the rear side of the bottom right side of the infrared tester body 1, a anti-movement plate 15 is in contact with the right side of the fixing block 14, a anti-movement block 16 is fixedly connected to the left side of the anti-movement plate 15, an anti-movement groove adapted to the anti-movement block 16 is opened in the inner cavity of the fixing plate 4, the anti-movement plate 15 is fixedly connected to the fixing block 14 by bolts, the cooling box 5 is lifted to the bottom of the infrared tester body 1, the mounting block 3 is aligned with the mounting plate 2, the cooling box 5 is pushed to the left, so that the mounting block 3 slides to the left on the surface of the mounting plate 2. When the fixing plate 4 contacts the infrared tester body 1, the anti-movement plate 15 is picked up and close to the fixing block 14, so that the anti-movement block 16 is inserted into the inner cavity of the anti-movement groove, and the anti-movement plate 15 is fixed on the fixing block 14 by bolts. At this time, the installation of the cooling box 5 is completed.

[0028] Embodiment Two:

[0029] Please refer to Figures 1-4, in order to achieve the purpose of rapid cooling, the following technical solutions are provided in this embodiment, which specifically disclose that: on the right side of the bottom of the inner cavity of the cooling box 5, a semiconductor refrigerating sheet 6 is fixedly connected; on the left side of the bottom of the inner cavity of the cooling box 5, a delivery pump 7 is fixedly connected. The water outlet end of the delivery pump 7 is communicated with a delivery pipe 8. A cooling pipe is fixedly connected to the inner cavity of the infrared tester body 1. One end of the cooling pipe is communicated with a circulation pipe 9, and the other end of the circulation pipe 9 is communicated with a spray pipe 10. Both sides of the bottom of the spray pipe 10 are communicated with nozzles 11. On the right side of the cooling box 5, a protective box 12 is fixedly connected. A cooling fan 13 is fixedly connected to the inner cavity of the protective box 12. The bottom of the mounting block 3 is fixedly connected to the top of the cooling box 5. Heat dissipation fins 17 are fixedly connected to the front side and the rear side of the infrared tester body 1. Temperature sensors 18 are arranged in the inner cavities of both the infrared tester body 1 and the cooling box 5. The cooling pipe is evenly wound around the inner cavity of the infrared tester body 1 in a circular ring shape. Temperature sensors 18 are arranged in the inner cavities of both the infrared tester body 1 and the cooling box 5. The cooling pipe is evenly wound around the inner cavity of the infrared tester body 1 in a circular ring shape. The right side of the semiconductor refrigerating sheet 6 is the hot end, and the hot end extends to the outside of the cooling box 5. The number of both the semiconductor refrigerating sheet 6 and the cooling fan 13 is two. An air intake through groove is opened at the top of the protective box 12, and a dust-proof net 19 is magnetically attracted in the inner cavity of the air intake through groove. Connect the delivery pipe 8 to the cooling pipe, and connect the circulation pipe 9 to the other end of the cooling pipe. Set the cooling temperature in the micro control device of the infrared tester body 1. When the infrared tester body 1 is in use, the temperature sensor 18 inside detects the internal temperature. When the heat dissipation fins 17 cannot meet the heat dissipation requirement and the temperature of the infrared tester body 1 is relatively high, then turn on the semiconductor refrigerating sheet 6 to cool the cooling medium in the cooling box 5. The delivery pump 7 transports the cooled cooling medium through the delivery pipe 8 to the cooling pipe. Heat exchange occurs between the cooling pipe and the heat inside the infrared tester body 1, enabling the rapid cooling of the inside of the infrared tester body 1. The cooling medium after heat exchange is transported through the circulation pipe 9 to the spray pipe 10 and sprayed through the nozzles 11 into the cooling box 5 for recycling. During the operation of the semiconductor refrigerating sheet 6, the cooling fan 13 blows air to reduce the temperature of the hot end of the semiconductor refrigerating sheet 6.

[0030] The working principle of the present utility model is as follows: Lift the cooling box 5 to the bottom of the infrared tester body 1, align the mounting block 3 with the mounting plate 2, push the cooling box 5 to the left, so that the mounting block 3 slides to the left on the surface of the mounting plate 2. When the fixing plate 4 contacts the infrared tester body 1, pick up the anti-movement plate 15 and approach the fixing block 14, so that the anti-movement block 16 is inserted into the inner cavity of the anti-movement groove, and use bolts to fix the anti-movement plate 15 on the fixing block 14. At this time, the installation of the cooling box 5 is completed. Connect the delivery pipe 8 with the cooling pipe, and connect the circulation pipe 9 with the other end of the cooling pipe. Set the cooling temperature in the micro control device of the infrared tester body 1. When the temperature sensor 18 inside the infrared tester body 1 detects the internal temperature during use, and when the heat dissipation fins 17 cannot meet the heat dissipation requirements and cause the temperature of the infrared tester body 1 to be relatively high, then turn on the semiconductor refrigeration chip 6 to cool the cooling medium in the cooling box 5. The delivery pump 7 transports the cooled cooling medium through the delivery pipe 8 to the cooling pipe. The cooling pipe exchanges heat with the heat inside the infrared tester body 1, so that the inside of the infrared tester body 1 is quickly cooled. The cooled cooling medium after heat exchange is transported to the spray pipe 10 through the circulation pipe 9 and sprayed through the nozzle 11 into the cooling box 5 for recycling. During the operation of the semiconductor refrigeration chip 6, the cooling fan 13 blows air to reduce the temperature of the hot end of the semiconductor refrigeration chip 6.

[0031] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model, rather than limiting the protection scope of the present utility model. Although the present utility model has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present utility model can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present utility model.

Claims

1. An efficient infrared tester cooling module, comprising an infrared tester body (1), characterized in that: The bottom of the front and rear sides of the infrared tester body (1) are fixedly connected to a mounting plate (2), the surface of the mounting plate (2) is slidably connected to a mounting block (3), the right side of the mounting block (3) is fixedly connected to a fixing plate (4), the bottom of the fixing plate (4) is fixedly connected to a cooling box (5), the right side of the bottom of the inner cavity of the cooling box (5) is fixedly connected to a semiconductor refrigeration plate (6), the left side of the bottom of the inner cavity of the cooling box (5) is fixedly connected to a delivery pump (7), the water outlet end of the delivery pump (7) is connected to a delivery pipe (8), the inner cavity of the infrared tester body (1) is fixedly connected to a cooling pipe, one end of the cooling pipe is connected to a circulation pipe (9), the other end of the circulation pipe (9) is connected to an injection pipe (10), both sides of the bottom of the injection pipe (10) are connected to nozzles (11), the right side of the cooling box (5) is fixedly connected to a protection box (12), and the inner cavity of the protection box (12) is fixedly connected to a cooling fan (13).

2. The high-efficiency infrared tester refrigeration module according to claim 1, characterized in that: The front and rear sides of the right bottom of the infrared tester body (1) are fixedly connected to a fixing block (14); the right side of the fixing block (14) contacts an anti-movement plate (15); the left side of the anti-movement plate (15) is fixedly connected to an anti-movement block (16); the inner cavity of the fixing plate (4) is provided with an anti-movement groove matched with the anti-movement block (16); the anti-movement plate (15) is fixedly connected to the fixing block (14) by bolts.

3. The high-efficiency infrared tester refrigeration module according to claim 1, characterized in that: The bottom of the mounting block (3) is fixedly connected to the top of the cooling box (5), and the front and rear sides of the infrared tester body (1) are fixedly connected with heat dissipation fins (17).

4. The high-efficiency infrared tester refrigeration module according to claim 1 is characterized in that: The inner cavities of the infrared tester body (1) and the cooling box (5) are both provided with temperature sensors (18), and the cooling tube is in a circular shape and evenly surrounds the inner cavity of the infrared tester body (1).

5. The high-efficiency infrared tester refrigeration module according to claim 1, characterized in that: One end of the delivery pipe (8) away from the delivery pump (7) is connected to the cooling pipe, and the nozzle (11) is designed to be relatively inclined.

6. The high-efficiency infrared tester refrigeration module according to claim 1, characterized in that: The right side of the semiconductor refrigeration sheet (6) is a hot end, and the hot end extends to the outside of the cooling box (5).

7. The high-efficiency infrared tester refrigeration module according to claim 1, characterized in that: The number of the semiconductor refrigeration sheet (6) and the number of the cooling fan (13) are both two, and an air intake slot is provided on the top of the protection box (12), and a dustproof net (19) is magnetically attracted to the inner cavity of the air intake slot.

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