Chip three-temperature testing machine and testing system

Abstract

The utility model provides a chip three-temperature test machine and a test system, and relates to the technical field of chip detection. The chip three-temperature test machine comprises a test module, a preheating module and a transfer module, the test module is provided with a plurality of test stations, and the test stations are used for placing chips; wherein the test module can test the chip located at the test station; the preheating module is provided with a plurality of preheating stations, and the preheating stations are used for placing chips; wherein the number of the preheating stations is larger than that of the testing stations; the preheating module can adjust the temperature of the chip located at the preheating station; the transfer module is installed in the test cavity, and the transfer module is configured to be capable of transferring a chip, so that the chip can be at least switched between a test station and a preheating station. The chip three-temperature testing machine provided by the utility model can save the refrigeration and heating time, simplify the process flow, and further improve the testing efficiency.

Description

Technical Field

[0001] The utility model relates to the field of chip detection, in particular to a three-temperature chip tester and a test system. Background Art

[0002] When testing the data of chips at multiple temperatures, the chip testers on the current market often need to temporarily obtain appropriate temperatures by heating and cooling means. When measuring the next temperature, the temperature needs to be changed again, resulting in low test efficiency and long time consumption. Content of the Utility Model

[0003] In view of this, the purpose of the present utility model is to overcome the deficiencies in the prior art, and provide a three-temperature chip tester, which saves the time of refrigeration and heating, simplifies the process flow, and thus improves the test efficiency;

[0004] In addition, a test system applying the above three-temperature chip tester is provided.

[0005] The present utility model provides the following technical solutions:

[0006] In the first aspect, a three-temperature chip tester is provided, which includes:

[0007] A test module, the test module has a plurality of test stations for placing chips; wherein, the test module can test the chips located at the test stations; and

[0008] A preheating module, the preheating module has a plurality of preheating stations for placing chips; wherein, the number of the preheating stations is greater than that of the test stations; wherein, the preheating module can adjust the temperature of the chips located at the preheating stations; and

[0009] A transfer module, the transfer module is configured to be able to transfer chips so that the chips can at least switch between the test stations and the preheating stations.

[0010] Further, the three-temperature chip tester further includes:

[0011] A test cabinet, the test cabinet has a test chamber; wherein, the test module, the preheating module and the transfer module are all installed in the test chamber;

[0012] A humidity adjustment module, the humidity adjustment module is connected to the test cabinet, and the humidity adjustment module can adjust the humidity in the test chamber.

[0013] Further, the humidity adjustment module includes:

[0014] Gas source, the gas source is connected to the test cabinet, and the gas source is configured to be able to introduce dry ionic wind into the test chamber and make the test chamber in a positive pressure state.

[0015] Furthermore, the chip three-temperature tester further includes:

[0016] Drive module, the drive module is connected to the preheating module, and the drive module can drive the preheating module to move along a first set path so that the preheating module can enter and exit the test chamber.

[0017] Furthermore, the test module includes:

[0018] Test carrier, the test carrier has a number of test slots, and a probe assembly is installed in the test slot, and the probe assembly can be in contact conduction with the test contacts of the chip located in the test slot;

[0019] Test pressure head and a first driving member, the first driving member is connected to the test pressure head, and the first driving member can drive the test pressure head to move along a second set path so that the test pressure head abuts or disengages from the chip located in the test slot.

[0020] Furthermore, the preheating module includes:

[0021] Preheating carrier, the preheating carrier has a number of preheating slots, and the preheating slots can accommodate the chips;

[0022] Temperature adjusting member, the temperature adjusting member is connected to the preheating carrier, and the temperature adjusting member is configured to be able to at least switch between a heating state and a cooling state;

[0023] Wherein, the preheating carrier is configured to enable heat transfer between the chips located in the preheating slots and the temperature adjusting member.

[0024] Furthermore, the test carrier includes:

[0025] First carrier body, the first carrier body is formed with a number of the test slots;

[0026] First detection sensor, the first detection sensor can detect the posture of the chip located in the test slot;

[0027] First controller, the first detection sensor is electrically connected to the test module through the first controller;

[0028] And / or, the preheating carrier includes:

[0029] Second carrier body, the second carrier body is formed with a number of the preheating slots;

[0030] A second detection sensor, which can detect whether the chip is in the preheating tank;

[0031] A second controller, and the second detection sensor is electrically connected to the transfer module through the second controller.

[0032] Further, the transfer module includes:

[0033] A negative pressure suction part, which can suck the chip by negative pressure;

[0034] A second driving member, which is connected to the negative pressure suction part, and the second driving member can drive the negative pressure suction part to move; where

[0035] The moving range of the negative pressure suction part is configured to be able to cover the test station and the preheating station.

[0036] Further, the negative pressure suction part includes:

[0037] A base, which is connected to the second driving member;

[0038] A plurality of vacuum suction nozzles, and the plurality of vacuum suction nozzles are installed on the base;

[0039] Wherein, a plurality of the preheating tanks form several first array groups, and several of the first arrays are arranged in sequence at a set interval along a first path; a plurality of the test tanks form several second array groups, and several of the second array groups are arranged at the set interval along a second path; a plurality of the vacuum suction nozzles form several third array groups, and several of the third array groups are arranged at the set interval along a third path; the first path, the second path and the third path can coincide, the array parameters of the first array group, the second array group and the third array group are the same, and the number of the first array groups is twice the number of the second array groups; the number of the second array groups is M times the number of the third array groups, M is a natural number, and M≥1.

[0040] Further, the test indenter includes:

[0041] An indenter body, which has a heat-conducting end for abutting against the encapsulation surface of the chip, and the heat-conducting end has a receiving cavity; and

[0042] A temperature detection part, which is installed in the receiving cavity, and the temperature detection part has a detection end that can abut against the encapsulation surface.

[0043] Furthermore, the indenter body further has a wire threading hole communicating with the accommodation cavity; the temperature detection part includes a temperature sensor, and the cable of the temperature sensor is threaded through the wire threading hole; wherein, the wire threading hole communicates with the outside of the indenter body;

[0044] And / or, a hole groove structure is provided at one end of the heat conduction end for abutting against the encapsulation surface, and the hole groove structure communicates with the outside of the indenter body.

[0045] Furthermore, the test indenter further includes an elastic part, and the temperature detection part is connected to the inner wall of the accommodation cavity through the elastic part; wherein, the elastic part is configured to be elastically deformed so that the detection end keeps abutting against the encapsulation surface.

[0046] Furthermore, the indenter body includes:

[0047] A housing, the housing is formed with a heat insulation layer; and

[0048] A heat conduction part, the heat conduction part is installed in the housing, and the heat conduction part has an extending end extending out of the housing, and the extending end forms the heat conduction end; and

[0049] A temperature adjustment part, the temperature adjustment part is installed in the housing, and the temperature adjustment part can adjust the temperature of the heat conduction end.

[0050] Furthermore, the temperature adjustment part includes:

[0051] A semiconductor refrigerator and a radiator, the semiconductor refrigerator has two working ends, wherein, one of the working ends abuts against the heat conduction part, and the other working end is connected to the radiator;

[0052] A power conversion part, the power conversion part is electrically connected to the semiconductor refrigerator, and the power conversion part is configured to: at least adjust the transmission direction of the current accessed to the semiconductor refrigerator.

[0053] Furthermore, the power conversion part includes:

[0054] A direct current power supply, the direct current power supply is used to provide direct current; and

[0055] A commutator, the direct current power supply is electrically connected to the semiconductor refrigerator through the commutator; and

[0056] A temperature controller, the temperature controller is electrically connected to the temperature detection part and the commutator respectively, and the temperature controller can send an instruction to the commutator according to the temperature signal sent by the temperature detection part to switch the transmission direction of the semiconductor refrigerator.

[0057] Furthermore, when the cooling medium of the radiator is liquid, a heat-conducting partition is provided inside the housing. The heat-conducting partition is used to divide the inner cavity of the housing into two chambers, and the radiator and the semiconductor cooler are respectively located in different chambers.

[0058] Furthermore, an annular clamping groove is provided inside the housing. The base of the radiator has an annular flange, and the annular flange is inserted into the annular clamping groove. Wherein, an elastic sealing ring is provided between at least one side of the two opposite sides of the annular flange and the corresponding side wall on the annular clamping groove. The elastic sealing ring, the annular flange and the annular clamping groove form the heat-conducting partition.

[0059] In a second aspect, a testing system is provided, and the testing system includes the chip three-temperature tester described above.

[0060] The embodiments of the present invention have the following advantages:

[0061] For the chip three-temperature tester provided by the present invention, the preheating station of the preheating module is used to pre-adjust the temperature of the next batch of chips when the testing module tests the chips, so as to avoid the heating or cooling time of the chips in the testing station being too long and affecting the detection efficiency. That is to say, when the chips are undergoing high-temperature testing in the testing station, the preheating module preheats the next batch of chips that need to undergo high-temperature testing; or, when the chips are undergoing high-temperature testing in the testing station, the preheating module cools down the next batch of chips that need to undergo normal-temperature or low-temperature testing.

[0062] Therefore, this device can effectively improve the three-temperature testing efficiency of chips to meet the growing market demand.

[0063] In addition, the present invention also relates to a testing system. Since the above-mentioned chip three-temperature tester has the above-mentioned technical effects, the testing system including this chip three-temperature tester should have the same technical effects, which will not be elaborated here.

[0064] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the following specifically enumerates preferred embodiments and, in conjunction with the accompanying drawings, makes the following detailed description. Description of the Drawings

[0065] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0066] Figure 1Shows the structural schematic diagram of the chip three-temperature tester provided by the embodiment of the present utility model;

[0067] Figure 2 Shows the exploded view of the chip three-temperature tester provided by the embodiment of the present utility model;

[0068] Figure 3 Shows the perspective view of the chip three-temperature tester provided by the embodiment of the present utility model;

[0069] Figure 4 Shows Figure 3 The B-B cross-sectional view in

[0070] Figure 5 Shows the structural schematic diagram of the test carrier in the chip three-temperature tester provided by the embodiment of the present utility model;

[0071] Figure 6 Shows the internal structural schematic diagram of a perspective of the chip three-temperature tester provided by the embodiment of the present utility model;

[0072] Figure 7 Shows the internal structural schematic diagram of another perspective of the chip three-temperature tester provided by the embodiment of the present utility model;

[0073] Figure 8 Shows the assembly structural schematic diagram of the test carrier, preheating carrier and transfer module in the chip three-temperature tester provided by the embodiment of the present utility model;

[0074] Figure 9 Shows the structural schematic diagram of the negative pressure suction part in the chip three-temperature tester provided by the embodiment of the present utility model;

[0075] Figure 10 Shows the partial structural schematic diagram of the test carrier in the chip three-temperature tester provided by the embodiment of the present utility model;

[0076] Figure 11 Shows the layout schematic diagram of a perspective of the test slot and preheating slot in the chip three-temperature tester provided by the embodiment of the present utility model;

[0077] Figure 12 Shows the layout schematic diagram of another perspective of the test slot and preheating slot in the chip three-temperature tester provided by the embodiment of the present utility model;

[0078] Figure 13 Shows Figure 12 The partial enlarged view at C in

[0079] Figure 14 Shows Figure 12 The partial enlarged view at D in

[0080] Figure 15 Shows an assembly schematic diagram of a test indenter and a first driving member in a chip three-temperature tester provided by an embodiment of the present invention from one perspective;

[0081] Figure 16 Shows an assembly schematic diagram of a test indenter and a first driving member in a chip three-temperature tester provided by an embodiment of the present invention from another perspective;

[0082] Figure 17 Shows a structural schematic diagram of a test indenter provided by an embodiment of the present invention;

[0083] Figure 18 Shows an exploded view of a test indenter provided by an embodiment of the present invention;

[0084] Figure 19 Shows an internal structural schematic diagram of a test indenter provided by an embodiment of the present invention;

[0085] Figure 20 Shows Figure 19 The partial enlarged view at position A in;

[0086] Figure 21 Shows an internal structural schematic diagram of a radiator of a test indenter provided by an embodiment of the present invention.

[0087] Description of main component symbols:

[0088] 100 - Heat conduction part; 110 - Heat conduction end; 111 - Hole groove structure; 200 - Housing; 210 - Outer shell; 220 - Positioning frame; 230 - End cover; 231 - Concave area; 240 - Annular clamping groove; 250 - Limit protrusion; 300 - Radiator; 310 - Water inlet end; 320 - Water outlet end; 330 - Annular flange; 400 - Elastic sealing ring; 500 - Locking part; 600 - First thermal grease layer; 700 - Temperature adjustment part; 800 - Second thermal grease layer; 900 - Temperature sensor; 910 - Cable; 920 - Detection end; 1000 - Preheating module; 1100 - Preheating carrier; 1110 - Preheating tank; 1120 - Second detection sensor; 2000 - Test cabinet; 3000 - Transfer module; 3100 - Second driving member; 3110 - First linear movement component; 3120 - Second linear movement component; 3200 - Negative pressure suction part; 3210 - Base; 3220 - Vacuum suction nozzle; 4000 - Test module; 4100 - Test carrier; 4110 - Test tank; 4120 - First detection sensor; 4200 - Test indenter; 4300 - First driving member; 5000 - Humidity adjustment module; 6000 - Temperature controller; 7000 - Driving module; 7100 - Rack; 7200 - Third driving member; 7300 - Guide rail. Detailed implementation manners

[0089] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation of the present utility model.

[0090] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. On the contrary, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0091] In the present utility model, unless otherwise clearly defined and limited, terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0092] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality of" means two or more unless otherwise clearly and specifically defined.

[0093] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the specification of this template herein are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0094] In the related art, the test device of a three-temperature chip tester uses a manipulator to separately clamp multiple chips to multiple test mechanisms to simultaneously test and detect multiple chips in three temperature ranges: low temperature (-55°C to 0°C), normal temperature (1°C to 24°C), and high temperature (25°C to 125°C). Among them, the test mechanisms are arranged on the test machine table in a flat-laying manner.

[0095] In recent years, the market demand for high-power chips such as automotive-grade chips and enterprise-level chips has been growing rapidly. When testing the data of chips at various temperatures with chip testers on the market, it is often necessary to temporarily obtain the appropriate temperature through heating and cooling means. When measuring the temperature of the next step, the temperature needs to be changed again. The test efficiency is low and the time consumption is long, so that the detection efficiency of the chip tester cannot meet the market demand.

[0096] Such as Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As shown, to solve the above technical problems, on the one hand, a preferred embodiment provided by the present utility model provides a chip three-temperature tester. The chip three-temperature tester includes a test module 4000, a preheating module 1000, and a transfer module 3000. The test module 4000 has a plurality of test stations for placing chips. Among them, the test module 4000 can test the chips located at the test stations; and the preheating module 1000 has a plurality of preheating stations for placing chips. Among them, the number of preheating stations is greater than the number of test stations. Among them, the preheating module 1000 can adjust the temperature of the chips located at the preheating stations; and the transfer module 3000 is installed in the test chamber and is configured to be able to transfer chips so that the chips can at least switch between the test stations and the preheating stations.

[0097] Specifically, the number of test stations and preheating stations is set to be multiple, so as to be able to pre-adjust the chip temperature and detect multiple chips simultaneously. That is to say, the temperature of multiple chips can be pre-adjusted to prepare for the subsequent test module 4000 to test the parameters of the chips in high-temperature, normal-temperature, and low-temperature environments, thereby improving the detection efficiency.

[0098] Obviously, the chips to be tested can be placed in the preheating stations of the preheating module 1000 respectively to adjust the temperature of the chips to be tested. For example, in the high-temperature test stage, the temperature of the chips located at the preheating stations can be increased through the preheating module 1000. That is to say, during the process of using the transfer module 3000 to transfer the chips at the preheating stations to the test stations for testing, the preheating module 1000 can continuously heat the chips, which is convenient for the subsequent transfer module 3000 to transfer the preheated chips to the test stations, so as to reduce the heating time of the chips by the test module 4000. It should be noted that when the last chip in the preheating module 1000 is tested in the high-temperature stage, the temperature of the chips in the preheating stations can be reduced by the preheating module 1000 to prepare for the subsequent normal-temperature test and low-temperature test.

[0099] Exemplarily, the number of preheating stations can be set to an integer multiple of the number of testing stations, so that some chips can be retained in the preheating stations during the testing of other chips.

[0100] Alternatively, the number of testing stations is equal to the number of preheating stations. Thus, during the process of testing chips at the testing stations, the next batch of chips can be placed in the preheating stations for preheating. Among them, the chips that have completed testing at the testing stations are directly taken out and transported to the next sorting process for classification.

[0101] It should be noted that the transfer module 3000 is used to transfer chips between the testing stations and the preheating stations to replace manual picking and placing. The transfer module 3000 can be a manipulator, and the end effector of the manipulator is a vacuum suction nozzle 3220.

[0102] Exemplarily, the transfer module 3000 can also be used to directly transfer the chips in the testing stations to the transfer equipment, and the transfer equipment can be a collection tray to receive the tested chips.

[0103] Applying the chip three-temperature testing machine provided by the present utility model, the preheating stations of the preheating module 1000 are used to pre-adjust the temperature of the next batch of chips when the testing module 4000 is testing chips, so as to avoid the heating or cooling time of the chips in the testing stations being too long and affecting the detection efficiency. That is to say, when the chips in the testing stations are undergoing high-temperature testing, the preheating module 1000 preheats the next batch of chips that need to undergo high-temperature testing; or, when the chips in the testing stations are undergoing high-temperature testing, the preheating module 1000 cools down the next batch of chips that need to undergo normal-temperature or low-temperature testing.

[0104] Therefore, this device can effectively improve the three-temperature testing efficiency of chips to meet the growing market demand.

[0105] It should be noted that, as the prior art, the testing module 4000 has the function of adjusting the temperature of the chips and can perform secondary heating or secondary cooling on the chips to cooperate with the preheating module 1000. This combination can achieve rapid adjustment of the chip temperature, improve the detection efficiency, and can ensure accurate control of the temperature during chip testing, thereby improving the accuracy of the test results.

[0106] As Figure 2 and Figure 6 shown, on the basis of the above embodiments, the chip three-temperature testing machine further includes a testing cabinet 2000 and a humidity adjustment module 5000. The testing cabinet 2000 has a testing chamber; among them, the testing module 4000, the preheating module 1000, and the transfer module 3000 are all installed in the testing chamber; the humidity adjustment module 5000 is connected to the testing cabinet 2000, and the humidity adjustment module 5000 can adjust the humidity in the testing chamber.

[0107] That is to say, installing the test module 4000, the preheating module 1000, and the transfer module 3000 in the test chamber can ensure the tightness of the test chamber to reduce the interference of the external temperature. Furthermore, it can make the chip reach the preset temperature state before testing or reach the normal temperature state after low-temperature testing of the chip. The preheating module 1000 with the above functions is inside the test chamber. When the chip is placed on the preheating station to return to room temperature after low-temperature testing in a dry and low dew point environment, it can ensure that the chip will not condense during the rapid heating process.

[0108] In addition, during the low-temperature testing of the chip, the built-in humidity adjustment module 5000 can continuously adjust the humidity of the test chamber to prevent low-temperature condensation and frosting on the hardware circuits of the chip and the chip tester.

[0109] As shown in Figure 5 and Figure 6 Based on the above embodiments, the humidity adjustment module 5000 includes a gas source. The gas source is connected to the test cabinet 2000 and is configured to be able to introduce dry ionized air into the test chamber and make the test chamber in a positive pressure state.

[0110] Exemplarily, the gas source is a dry ionized air supply system. The dry ionized air supply system can continuously check the humidity of the internal cavity air and continuously control the humidity of the air in the test chamber at a stable value. It can prevent static electricity due to overly dry air in the test chamber or condensation and frosting problems due to too high humidity of the internal cavity air. In addition, since the test chamber is in a positive pressure state, it can prevent external impurities from entering.

[0111] As shown in Figure 3 and Figure 10 Based on the above embodiments, the three-temperature chip tester further includes a driving module 7000. The driving module 7000 is connected to the preheating module 1000, and the driving module 7000 can drive the preheating module 1000 to move along a first set path so that the preheating module 1000 can enter and exit the test chamber.

[0112] That is to say, the driving module 7000 can drive the preheating module 1000 into the test chamber to receive the chip to be detected or send out the tested chip.

[0113] Exemplarily, the test cabinet 2000 has an inlet and outlet communicating with the test chamber, and an openable and closable cabinet door is installed at the inlet and outlet. The cabinet door needs to be closed during testing to avoid affecting the test.

[0114] Exemplarily, the driving module 7000 includes a rack 7100, a gear, and a third driving member 7200. The third driving member 7200 is used to drive the gear to rotate, and the third driving member 7200 is installed on the test cabinet 2000. The rack 7100 is fixed to the preheating module 1000 and extends along a first set path. The gear meshes with the rack 7100. Then, by driving the gear to rotate with the third driving member 7200, the preheating module 1000 can be driven to move along the first set path. Optionally, to ensure the stability of the movement of the preheating module 1000, the preheating module 1000 is connected to the test cabinet 2000 through a guide rail 7300.

[0115] As Figure 6 , Figure 7 , Figure 15 and Figure 16 shown, on the basis of the above embodiment, the test module 4000 includes a test carrier 4100, a test head 4200, and a first driving member 4300. The test carrier 4100 has a plurality of test slots 4110. A probe assembly is installed in the test slot 4110, and the probe assembly can be in contact conduction with the test contacts of the chip located in the test slot 4110; the first driving member 4300 is connected to the test head 4200, and the first driving member 4300 can drive the test head 4200 to move along a second set path so that the test head 4200 abuts against or disengages from the chip located in the test slot 4110.

[0116] The inner contour of the test slot 4110 is adapted to the outer shape of the chip and can position the chip; a probe assembly is provided at the bottom of the test slot 4110 corresponding to the position of the test contacts of the chip; the test head 4200 of the test carrier 4100 can press or disengage from the chip located in the test slot 4110, thereby holding the chip to keep the probe assembly and the test contacts in close connection.

[0117] Among them, the probe assembly is electrically connected to the chip test circuit board, and the first carrier body has an installation cavity for accommodating the chip test circuit board. The installation cavity can continuously provide dry air for the chip test circuit board to prevent condensation and frosting on the chip test circuit board during the low-temperature or low-temperature-rise high-temperature test of the chip, which may cause a short circuit of the test circuit board; exemplarily, a dehumidifier is installed in the installation cavity to remove moisture and prevent condensation and frosting.

[0118] The main function of the chip test circuit board is to implement various performance test functions of the chip. The main function of the first carrier body is to position the position of the chip to be tested and conduct the power supply and signal transmission between the chip to be tested and the chip test circuit board. The probes of the chip test circuit board are installed at the bottom of the test slot 4110. Then, when the chip is placed flat in the test slot 4110 and the package surface of the chip is away from the bottom of the slot, the chip test circuit board can be connected to the chip.

[0119] When the chip is located in the test slot 4110, the test probe 4200 is driven by the second driving member 3100 to move along the second set path until the test probe 4200 presses against the packaging surface of the chip, thereby clamping the chip and enabling the chip to be stably located in the test slot 4110, and maintaining stable contact and conduction between the chip and the probe assembly. Additionally, the temperature of the probe can be adjusted to lower or raise the temperature of the chip through heat exchange, thereby performing high-temperature, low-temperature, or normal-temperature tests.

[0120] As Figure 6 and Figure 8 shown, on the basis of the above embodiments, the preheating module 1000 includes a preheating carrier 1100 and a temperature regulating member. The preheating carrier 1100 has a plurality of preheating slots 1110 that can accommodate the chips; the temperature regulating member is connected to the preheating carrier 1100 and is configured to be able to switch at least between a heating state and a cooling state; wherein, the preheating carrier 1100 is configured to enable heat transfer between the chips located in the preheating slots 1110 and the temperature regulating member.

[0121] Exemplarily, the preheating carrier 1100 has a preheating chamber, the temperature regulating member is installed in the preheating chamber, and the temperature regulating member has a heat exchange end that contacts the preheating carrier 1100, thereby enabling heat exchange between the temperature regulating member and the chips located in the preheating slots 1110, and thus regulating the temperature of the chips, such as heating or cooling.

[0122] Exemplarily, the preheating carrier 1100 includes a preheating drawer, a preheating tray is installed at the upper opening of the preheating drawer, the preheating slots 1110 are provided on the preheating tray, and the preheating tray contacts the heat exchange end. To ensure efficient heat conduction between the preheating tray and the heat exchange end, the preheating tray is made of a high thermal conductivity material, such as aluminum, steel, ceramic, etc. Additionally, a preheating chamber is formed between the preheating drawer and the preheating tray.

[0123] Exemplarily, as Figure 11 and Figure 12 shown, the preheating tray and the preheating drawer are detachably connected, thereby facilitating the replacement of different types of preheating trays. The size specifications of the preheating slots 1110 on different types of preheating trays are different and correspond to chips of different size specifications. Then, by quickly replacing the preheating tray, the applicable range can be increased.

[0124] As Figure 12 and Figure 13As shown, based on the above embodiments, the test carrier 4100 includes a first carrier body, a first detection sensor 4120 and a first controller, and the first carrier body is formed with a plurality of test slots 4110; the first detection sensor 4120 can detect the posture of the chip located in the test slot 4110; the first detection sensor 4120 is electrically connected to the test module 4000 through the first controller.

[0125] That is to say, a hole groove is opened on the first carrier body to form the above-mentioned test groove 4110, and the clearance between the chip and the test groove 4110 needs to be kept matched to ensure that the probe assembly and the chip are accurately docked.

[0126] Exemplarily, before the test head 4200 presses down the chip, the first detection sensor 4120 is used to obtain the posture and position of the chip in the test slot 4110, that is, to check whether the position of the chip in the test slot 4110 is skewed, so as to prevent the chip from being damaged when the test head 4200 is pressed down. Optionally, the first detection sensor 4120 can be a visual image module, such as a camera. Alternatively, the first detection sensor 4120 can be a through-beam optical fiber sensor, and if the chip blocks the light of the through-beam optical fiber sensor, it means that the position and posture of the chip are correct.

[0127] For example, multiple test slots 4110 are divided into multiple rows, and the test slots 4110 in the same row are located on the same straight line. Then, the transmitting module and the receiving module of the through-beam optical fiber sensor can be installed at both ends of the test slots 4110 in the same row, and the light emitted by the through-beam optical fiber sensor is slightly higher than the chip located in the test slots 4110. It can be seen that when the chip position in any test slot 4110 in the same row is skewed, the skewed chip will block the light, so it can be determined that there is an abnormality in the test slots 4110 in the same row. Obviously, through this layout setting, the number of through-beam optical fiber sensors used can be saved, and the volume of the test carrier 4100 can be reduced.

[0128] It should be noted that if the chip in the test slot 4110 is lower than the upper end of the test slot 4110, a first hole can be opened in the first carrier body, and the first hole runs through the test slots 4110 in the same row, so that the light of the through-beam optical fiber sensor can pass through the first hole. Optionally, two through-beam optical fiber sensors arranged side by side are installed in each row of test slots 4110.

[0129] like Figure 12 and Figure 14As shown, on the basis of the above embodiments, the preheating carrier 1100 includes a second carrier body, a second detection sensor 1120, and a second controller. The second carrier body is formed with a plurality of preheating grooves 1110; the second detection sensor 1120 can detect whether there is a chip in the preheating groove 1110; the second detection sensor 1120 is electrically connected to the transfer module 3000 through the second controller.

[0130] Similarly, the second carrier body is provided with a hole to form a preheating groove 1110, and the second detection sensor 1120 is arranged to detect whether there is a chip in the preheating groove 1110, so as to avoid chip suction failure during material taking.

[0131] Exemplarily, the second detection sensor 1120 is a vision image module, such as a camera. Alternatively, the second detection sensor 1120 can be a transmissive fiber optic sensor. If the chip blocks the light of the transmissive fiber optic sensor, it means that there is a chip in the preheating groove 1110.

[0132] As described above, the multiple preheating grooves 1110 are divided into multiple rows, and the preheating grooves 1110 in the same row are located on the same straight line. Then, the transmitting module and the receiving module of the transmissive fiber optic sensor can be installed at both ends of the preheating grooves 1110 in the same row respectively, and the light emitted by the transmissive fiber optic sensor is slightly located between the lower end and the upper end of the chip in the test groove 4110. Thus, it can be known that when there is a chip in any one of the preheating grooves 1110 in the same row, the chip will block the light, so it can be determined that there is an abnormal situation in the preheating grooves 1110 in the same row. Obviously, through this layout setting, the number of transmissive fiber optic sensors used can be saved, and the volume of the preheating carrier 1100 can be reduced.

[0133] It should be noted that if the chip located in the preheating groove 1110 is lower than the upper end of the preheating groove 1110, a second hole can be opened in the second carrier body, and the second hole penetrates the preheating grooves 1110 in the same row, so that the light of the transmissive fiber optic sensor can pass through the second hole.

[0134] As Figure 8 and Figure 9 shown, on the basis of the above embodiments, the transfer module 3000 includes a negative pressure suction part 3200 and a second driving part 3100. The negative pressure suction part 3200 can suck the chip by negative pressure; the second driving part 3100 is connected to the negative pressure suction part 3200, and the second driving part 3100 can drive the negative pressure suction part 3200 to move; wherein, the moving range of the negative pressure suction part 3200 is configured to be able to cover the test station and the preheating station.

[0135] That is to say, after the negative pressure suction part 3200 contacts the chip, negative pressure suction is formed to suck the chip. Then, the second driving part 3100 is used to drive the negative pressure suction part 3200 to move, so as to move the chip to the target position, which is the test slot 4110 or the preheating slot 1110.

[0136] Obviously, by reasonably configuring the second driving part 3100, the moving range of the negative pressure suction part 3200 can be adjusted. That is to say, as long as it is at any position within its moving range, the negative pressure suction part 3200 can reach. If both the test station and the preheating station are set within the moving range of the negative pressure suction part 3200, the chip can be transferred between the test station and the preheating station.

[0137] As Figure 9 、 Figure 11 and Figure 12 shown, on the basis of the above embodiment, the negative pressure suction part 3200 includes a base 3210 and a plurality of vacuum suction nozzles 3220. The base 3210 is connected to the second driving part 3100; a plurality of vacuum suction nozzles 3220 are installed on the base 3210; wherein, a plurality of the preheating slots 1110 form several first array groups, and several first arrays are arranged in sequence at a set interval along a first path; a plurality of test slots 4110 form several second array groups, and several second array groups are arranged at a set interval along a second path; a plurality of vacuum suction nozzles 3220 form several third array groups, and several third array groups are arranged at a set interval along a third path; the first path, the second path and the third path can coincide, the array parameters of the first array group, the second array group and the third array group are the same, and the number of the first array groups is twice the number of the second array groups; the number of the second array groups is M times the number of the third array groups, M is a natural number, and M≥1.

[0138] Exemplarily, M = 1. A plurality of preheating slots 1110 form two first array groups, a plurality of test slots 4110 form one second array group, and a plurality of vacuum suction nozzles 3220 form one third array group. The array parameters of the first array group, the second array group and the third array group are all the same. That is to say, the number and layout of the preheating slots 1110 in the first array group, the number and layout of the test slots 4110 in the second array group, and the number and layout of the vacuum suction nozzles 3220 in the third array group are kept consistent.

[0139] Obviously, by driving the base 3210 to move once by the second driving part 3100, multiple chips can be sucked at one time, and the multiple chips sucked at one time can be synchronously placed in the corresponding preheating slots 1110 or test slots 4110, thereby improving the feeding and discharging efficiency.

[0140] It is easy to understand that the number of test slots 4110 is set to 16, the number of preheating slots 1110 is set to 32, and the number of vacuum suction nozzles 3220 is set to 16. Correspondingly, the test slots 4110 form a second array group, with 16 test slots 4110 in each second array group; the preheating slots 1110 form two first array groups, with 16 in each first array group; and the vacuum suction nozzles 3220 form a third array group, with 16 in each third array group. Thus, by controlling the movement of the base 3210 through the second driving member 3100, 16 chips can be taken out from 16 test slots 4110 or 16 preheating slots 1110 at a time, or 16 chips can be sequentially placed into 16 test slots 4110 or 16 preheating slots 1110. The picking and placing efficiency is high, which is conducive to improving the detection efficiency.

[0141] Exemplarily, the number of the first array groups is set to be twice the number of the second array groups. That is to say, multiple first array groups are evenly divided into a first detection area and a second detection area. During operation, the chips are placed in the preheating slots 1110 in the first detection area, and the preheating slots 1110 are used to preheat the chips to be tested. Then, the transfer module 3000 is used to transfer the chips in the preheating slots 1110 in the first preheating area to the test slots 4110 for high-temperature stage, normal-temperature stage, and low-temperature stage tests in sequence. Then, the chips that have completed the low-temperature test in the test slots 4110 are transferred to the preheating slots 1110 in the second detection area, and at the same time, the temperature of the tested chips is raised to normal temperature by using the preheating slots 1110. At the same time, since new chips to be detected are replenished in the preheating slots 1110 in the first detection area, the temperature of the chips to be detected in the preheating slots 1110 is raised, which can improve the detection efficiency.

[0142] Alternatively, by way of example, in other embodiments, during operation, chips to be tested are placed in both the first detection area and the second detection area. First, the transfer module 3000 picks up the chip to be tested in the first detection area and clamps it into the test slot 4110 for secondary heating and completion of high-temperature testing. The transfer module 3000 transfers the chip that has completed high-temperature testing to the first detection area, and then uses the transfer module 3000 to transfer the chip to be tested in the second detection area to the test slot 4110 for high-temperature testing. At the same time, the chip that has completed high-temperature testing in the preheating slot 1110 is cooled to room temperature. After the chip in the second detection area has completed the high-temperature stage testing, the transfer module 3000 transfers the chip back to the second detection area, cools it through the preheating slot 1110, and then uses the transfer module 3000 to transfer the chip that has completed high-temperature testing in the first detection area to the test slot 4110 for room-temperature testing. After the room-temperature testing is completed, it is transferred to the first detection area for further cooling. At the same time, the chip that has been cooled in the second detection area is transferred to the test slot 4110 for room-temperature testing. After the room-temperature testing is completed, it is transferred to the second detection area for further cooling. Also, the chip in the first detection area is transferred to the test slot 4110 for low-temperature testing. After the low-temperature testing is completed, it is transferred to the first detection area to be heated to room temperature through the preheating slot 1110. And the chip in the second detection area is transferred to the test slot 4110 for low-temperature testing. After the low-temperature testing is completed, it is transferred to the preheating slot 1110 to be heated to room temperature.

[0143] It should be noted that the vacuum suction nozzle 3220 is a prior art. The vacuum suction nozzle 3220 is connected to a negative pressure suction system, and the negative pressure suction system can be controlled to enable the vacuum suction nozzle 3220 to pick up and place chips. The structure and principle of the vacuum suction nozzle 3220 will not be elaborated here.

[0144] Based on the above embodiments, the second driving member 3100 can be a robotic arm to drive the base 3210 to move within the test chamber using the robotic arm, thereby enabling the transfer of chips between the test slot 4110 and the preheating slot 1110.

[0145] Exemplarily, such as Figure 8As shown in the figure, the second driving member 3100 includes a first linear movement assembly 3110 and a second linear movement assembly 3120. The test slot 4110 and the preheating slot 1110 are arranged in sequence in the first direction. The first linear movement assembly 3110 is connected to the base 3210 through the second linear movement assembly 3120. The first linear movement assembly 3110 can drive the second linear movement assembly 3120 and the base 3210 to move in the first direction, and the second linear movement assembly 3120 can drive the base 3210 to move in the second direction, so that the vacuum suction nozzle 3220 can enter the corresponding test slot 4110 or preheating slot 1110. For example, the first direction is the horizontal direction, the second direction is the vertical direction, and the test slot 4110 and the preheating slot 1110 are both arranged in the horizontal plane. Then, by driving the base 3210 to rise and fall through the second linear movement assembly 3120, the vacuum suction nozzle 3220 can contact the chip.

[0146] Exemplarily, the first linear movement assembly 3110 adopts a servo motor cooperating with a lead screw transmission mechanism. That is to say, the main shaft of the servo motor is connected to the power input end of the lead screw transmission mechanism to drive the nut seat of the lead screw transmission mechanism to move along the lead screw, and the lead screw extends in the first direction; the second linear movement assembly 3120 is a guide rail 7300 cylinder. However, it is not limited to the above structures, and other structures that can achieve the same effect are also acceptable.

[0147] As Figure 17 and Figure 18 As shown in the figure, on the basis of the above embodiment, the test indenter 4200 includes an indenter body and a temperature detection part. The indenter body has a heat conduction end 110, and the heat conduction end 110 is used to abut against the encapsulation surface of the chip, and the heat conduction end 110 has a receiving cavity; the temperature detection part is installed in the receiving cavity, and the temperature detection part has a detection end 920, and the detection end 920 can abut against the encapsulation surface.

[0148] To ensure that the heat conduction end 110 can perform efficient heat transfer on the chip, the heat conduction end 110 is set as a planar structure, and the heat conduction end 110 and the encapsulation surface of the chip can be completely fitted, and the heat conduction end 110 can cover the encapsulation surface, then it can be achieved.

[0149] Optionally, the receiving cavity can be opened at the edge of the heat conduction end 110 or arranged in the middle of the heat conduction end 110. There is no specific limitation here, and both can improve the accuracy of detecting the temperature of the chip; the difference is that since the edge of the chip is in an exposed state and has a high heat exchange efficiency with the environment, the middle of the chip can be completely covered and blocked by the heat conduction end 110 and has a low heat exchange efficiency with the environment. Obviously, relatively speaking, by installing the temperature detection part in the middle of the heat conduction end 110, the temperature of the middle of the chip can be measured more accurately.

[0150] Of course, setting the heat conduction end 110 to be able to cover the packaging surface of the chip can enable the chip to be evenly heated everywhere, which is conducive to improving the accuracy of the detection results. For example, the heat conduction end 110 can be set to be square, circular, or polygonal, etc., and no specific limitation is made here.

[0151] Among them, keeping the detection end 920 of the temperature detection part in contact with the packaging surface of the chip can ensure that the temperature of the chip is directly obtained. Exemplarily, the detection end 920 can be set to be flush with the heat conduction end 110, so that the detection end 920 and the heat conduction end 110 can contact the chip synchronously.

[0152] It should be noted that the temperature detection part needs to have high-temperature and low-temperature resistance characteristics to adapt to the high-temperature and low-temperature tests of the chip. Or, only the detection end 920 can be set in the receiving groove to avoid the influence of high temperature or low temperature on the body of the temperature detection part.

[0153] It is easy to understand that the indenter body exchanges heat with the chip through the heat conduction end 110, so as to achieve the purpose of reducing or increasing the temperature of the chip. For example, during high-temperature testing, the temperature of the heat conduction end 110 can be increased to heat the chip; during low-temperature testing, the temperature of the heat conduction end 110 can be reduced to absorb the temperature of the chip and synchronously reduce the temperature of the chip. Generally, the temperature range of the chip is regulated to be in the interval of -55°C to 125°C.

[0154] That is to say, by providing a receiving cavity for installing the temperature detection part on the heat conduction end 110 of the indenter body, when the heat conduction end 110 fits and abuts against the packaging surface of the chip, the temperature detection part can be separated from the external environment to reduce the influence of the external environment on the temperature detection part; in addition, since the detection end 920 of the temperature detection part can keep in contact with the packaging surface, the accurate temperature of the chip can be obtained in time, and the temperature value deviation range of the chip is within ±1°C; of course, since the detection end 920 can detect the position in the middle of the chip, the situation of inaccurate temperature measurement at the edge of the chip can be avoided, which is caused by the heat exchange between the edge of the chip and the external environment; obviously, due to the temperature difference between the middle and the edge of the chip, the temperature in the middle of the chip is relatively higher than the temperature at the edge of the chip, so by detecting the temperature in the middle of the chip, the maximum temperature of the chip can be limited to avoid burning the chip due to exceeding the temperature limit.

[0155] As Figure 19 shown, on the basis of the above embodiments, the indenter body further has a wire passing hole communicating with the receiving cavity, and the cable 910 of the temperature detection part is passed through the wire passing hole; among them, the wire passing hole communicates with the outside of the indenter body.

[0156] That is to say, by setting a wire passing hole, the cable 910 connecting the temperature detection part and an external device can be installed. The external device can be a control terminal, such as a controller, a computer, etc. In addition, since the wire passing hole communicates with the receiving groove, the receiving groove and the wire passing hole form an air passage, so that the receiving groove can be connected to the external environment to realize gas circulation, thereby reducing the influence of the high-temperature environment formed by the gas in the receiving groove on the detection end 920.

[0157] Obviously, since the receiving groove can communicate with the outside, it can avoid the formation of a vacuum environment between the heat conduction end 110 and the chip packaging surface after the heat conduction end 110 contacts the chip packaging surface, which is similar to an adhesion effect and is not conducive to the separation between the heat conduction end 110 and the chip when the detection is completed.

[0158] It should be noted that after the temperature detection part is installed in the receiving groove, an air passage is formed between the gap between the temperature detection part and the receiving groove and the wire passing hole.

[0159] Of course, in other embodiments, a hole can be provided to communicate the outside with the middle part of the heat conduction end 110.

[0160] As Figure 17 shown, on the basis of the above-mentioned embodiment, a hole groove structure 111 is provided at the end of the heat conduction end 110 for abutting against the packaging surface, and the hole groove structure 111 communicates with the outside of the pressing head body.

[0161] Exemplarily, the hole groove structure 111 provided at the end of the heat conduction end 110 can be in the shape of a straight line, a T shape, a cross shape, etc., without specific limitation, as long as it can communicate the middle part of the heat conduction end 110 with the outside, so as to avoid the formation of a vacuum between the heat conduction end 110 and the chip.

[0162] As Figure 19 and Figure 20 shown, on the basis of the above-mentioned embodiment, the temperature detection part includes a temperature sensor 900, and the temperature sensor 900 is installed in the receiving cavity. However, it is not limited to the temperature sensor 900, and other devices capable of realizing temperature detection can be used, such as a contact thermometer, etc. Among them, the installation and principle of the temperature sensor 900 are common knowledge in the field and will not be elaborated here.

[0163] On the basis of the above-mentioned embodiment, the test pressing head 4200 further includes an elastic part, and the temperature detection part is connected to the inner wall of the receiving cavity through the elastic part; wherein, the elastic part is configured to be elastically deformed so that the detection end 920 can keep abutting against the packaging surface.

[0164] That is to say, the elastic part can keep the detection end 920 in close contact with the packaging surface of the chip, thereby ensuring the detection accuracy. Generally, due to installation errors, it is easy to cause the detection end 920 to not be accurately aligned with the end of the heat conduction end 110, and a great deal of workload and time are required to adjust the position of the detection piece. However, after long-term use, there are still use errors, resulting in the detection end 920 being unable to maintain close contact with the chip.

[0165] Furthermore, this problem can be eliminated through the elastic part. By utilizing the characteristic of the elastic part having elastic deformation, the installation position of the temperature sensor 900 can be adjusted. In the initial state, the detection end 920 (i.e., the probe of the temperature sensor 900) slightly protrudes from the end face of the heat conduction end 110. Then, when the heat conduction end 110 contacts the packaging surface of the chip, the detection end 920 will be squeezed, and the squeezing force will be transmitted to the elastic part, causing the elastic part to undergo elastic deformation, so that the detection end 920 and the heat conduction end 110 are flush and maintain close contact with the packaging surface of the chip. Thus, problems such as installation errors do not need to be considered, and the situation where the detection end 920 is damaged due to extrusion can be effectively avoided. In addition, the difficulty of later assembling the temperature sensor 900 can be reduced.

[0166] Based on the above embodiments, the elastic part includes an elastic glue layer, and the temperature detection part is bonded to the inner wall of the accommodation cavity through the elastic glue layer.

[0167] That is to say, the temperature detection part is fixed in the accommodation cavity by gluing. Among them, the applied glue forms an elastic glue layer after drying and solidifying. The advantage of this method is that it can not only facilitate and quickly install and fix the temperature detection part, but also form an elastic part, reducing the space occupied by installing the elastic part. In other embodiments, the elastic part can also be formed by setting an elastic pad to enable the temperature detection part to move in the depth direction of the accommodation groove, such as a rubber elastic pad or a silicone pad, etc.; of course, the elastic part can also be set as a spring, etc.

[0168] Exemplarily, the temperature sensor 900 is cured in the accommodation groove through thermal conductive silica gel, and the detection end 920 of the temperature sensor 900 protrudes 0.05 mm from the end face of the heat conduction end 110. Of course, it can also be set to protrude 0.04 mm, 0.06 mm, 0.07 mm, 0.08 mm, etc. from the end face of the heat conduction end 110.

[0169] As Figure 19 shown, based on the above embodiments, the pressing head body includes a housing 200, a heat conduction part 100, and a temperature adjustment part 700. The housing 200 is formed with a heat insulation layer; the heat conduction part 100 is installed in the housing 200, and the heat conduction part 100 has an extending end extending out of the housing 200, and the extending end forms the heat conduction end 110; the temperature adjustment part 700 is installed in the housing 200, and the temperature adjustment part 700 can adjust the temperature of the heat conduction end 110.

[0170] Among them, the housing 200 has an inner cavity, and both the heat conduction part 100 and the temperature adjustment part 700 are installed in the inner cavity; by contacting the heat conduction part 100 and the temperature adjustment part 700, the temperature of the heat conduction part 100 can be adjusted through the temperature adjustment part 700. Obviously, to ensure that the heat conduction part 100 has excellent heat conduction performance, the heat conduction part 100 can be made of heat-conducting metal, that is, a low thermal resistance medium material, such as iron, aluminum, copper, etc. Optionally, a coating layer, such as a nickel plating layer, is provided on the surface of the heat conduction part 100 to avoid oxidation. Exemplarily, the heat conduction part 100 can be made of nickel-plated red copper material.

[0171] Exemplarily, the heat conduction part 100 can be provided with a protruding end to form a heat conduction end 110, and the heat conduction end 110 is used to contact the chip to enable heat exchange with the chip. It should be noted that for those skilled in the art, a hole can be opened in the housing 200 so that the heat conduction end 110 can extend out of the housing 200 through the hole. The hole can be set to be circular, square, diamond-shaped or polygonal, etc. Obviously, setting the shape of the hole to be adapted to the shape of the heat conduction end 110 can reduce the gap between the heat conduction end 110 and the hole, so as to reduce the heat dissipation from the inside of the housing 200 to the air and cause heat loss.

[0172] Of course, through the heat insulation layer formed by the housing 200, the heat exchange efficiency between the housing 200 and the outside can be further blocked, heat loss can be reduced, and the temperature can be accurately controlled. Exemplarily, the housing 200 is made of a low thermal resistance material; or, a heat insulation layer is provided inside the housing 200, and the heat insulation layer has high temperature resistance and flame retardant properties to be able to adapt to high temperature environments.

[0173] It should be noted that the temperature adjustment part 700 can be a heat exchanger, such as a small plate heat exchanger, etc., and heat exchange is carried out using a gas medium or a liquid medium. But it is not limited to this one kind.

[0174] As Figure 19 shown, on the basis of the above embodiment, the temperature adjustment part 700 includes a semiconductor refrigerator and a radiator 300. The semiconductor refrigerator has two working ends. Among them, one working end abuts against the heat conduction part 100, and the other working end is connected to the radiator 300.

[0175] That is, by energizing the semiconductor refrigerator, the electric energy is used for cooling or heating, thereby adjusting the temperature of the heat-conducting part 100 in contact with the semiconductor refrigerator for heat conduction. Among them, in order to ensure the heat conduction efficiency between the heat-conducting part 100 and the semiconductor refrigerator, the heat-conducting part 100 and the semiconductor refrigerator can be set to be in surface contact, and the area size of one end of the heat-conducting part 100 contacting the semiconductor refrigerator is set to be not less than the area size of one end of the semiconductor refrigerator contacting the heat-conducting part 100, so as to ensure that the heat-conducting part 100 can cover the semiconductor refrigerator and improve the heat conduction efficiency. In addition, in order to ensure the fit between the semiconductor refrigerator and the heat-conducting part 100, a second thermally conductive silicone grease layer 800 can be set between the two to increase the contact area and further improve the thermal conductivity. The second thermally conductive silicone grease can avoid hard contact between the semiconductor refrigerator and the heat-conducting part 100, so as to protect the semiconductor refrigerator.

[0176] Of course, a first thermal grease layer 600 may also be provided between the heat sink 300 and the semiconductor refrigerator. The specific reasons are the same as above and will not be repeated here.

[0177] On the basis of the above embodiment, the pressure head body also includes a power conversion unit, which is electrically connected to the semiconductor cooler, and the power conversion unit is configured to at least provide a first current flowing in a forward direction and a second current flowing in a reverse direction to the semiconductor cooler.

[0178] It is easy to understand that a semiconductor cooler is a device that uses the thermal-electric effect of a semiconductor to produce cooling energy, also known as a thermoelectric cooler. When a conductor is used to connect two different metals and direct current is applied, the temperature at one end decreases and the temperature at the other end increases.

[0179] That is to say, by changing the direction of the direct current of the semiconductor cooler, the end of the semiconductor cooler contacting the heat conducting part 100 can be selected to cool or heat, so as to adapt to the low temperature, normal temperature or high temperature test of the chip. It can be understood that if the power supply is reversed, the temperature of the end of the semiconductor cooler contacting the heat conducting part 100 changes in the opposite direction. This phenomenon is called the Peltier effect, also known as the thermo-electric effect.

[0180] Different from the traditional low-temperature refrigeration technology, when the pressure head is set at a temperature below zero, there is no need to circulate any low-temperature refrigerant or compressor inside it. It only needs to provide room temperature liquid water to supply the heat sink 300 built into the pressure head for heat exchange. By exchanging heat and cold with the working state TEC, the pressure head can reach any temperature value in the range of -℃. In other words, when cooling, the end of the semiconductor refrigerator in contact with the heat conducting part 100 cools, and the other end of the semiconductor refrigerator away from the heat conducting part 100 heats, and then the heat sink 300 cools the heating end of the semiconductor refrigerator.

[0181] Based on the above embodiments, the power conversion unit includes a DC power supply and a commutator. The DC power supply is used to provide a direct current; the DC power supply is electrically connected to the semiconductor cooler through the commutator.

[0182] That is to say, the commutator is used to change the DC transmission direction of the DC power supply flowing into the semiconductor cooler. For example, when the direct current flows forward, one end of the semiconductor cooler in contact with the heat conduction part 100 cools; when the direct current flows backward, one end of the semiconductor cooler in contact with the heat conduction part 100 heats up. Among them, the DC power supply can be set to be formed by converting alternating current into direct current, which will not be elaborated here.

[0183] Based on the above embodiments, the temperature adjustment member and the temperature adjustment unit 700 have the same structure. A temperature sensor 900 can also be provided at the temperature adjustment member to adjust the temperature of the preheating tank 1110. For example, refrigeration or heating, etc.

[0184] Based on the above embodiments, one end of the heat conduction part 100 opposite to the heat conduction end 110 abuts against the temperature adjustment unit 700; wherein, a limiting part is provided in the housing 200, and the limiting part can at least limit the movement of the heat conduction part 100 in the direction close to the temperature adjustment unit 700, so that the limiting part can bear the extrusion force transmitted from the heat conduction part 100.

[0185] That is to say, by providing a limiting part in the inner cavity of the housing 200 to limit the heat conduction part 100, a hard contact is formed among the heat conduction part 100, the housing 200 and the limiting part, so that the limiting part can bear the reverse force generated by the chip on the heat conduction end 110 during the process of the heat conduction end 110 being pressed and contacted with the chip. Most of this reverse force is transmitted to the housing 200, avoiding the concentration of the reverse force on the TEC and causing damage to the TEC.

[0186] As Figure 19 shown, based on the above embodiments, the limiting part includes a limiting protrusion 250. The limiting protrusion 250 is connected to the heat conduction part 100, and the housing 200 has a limiting groove. The limiting protrusion 250 is inserted into the limiting groove; wherein, the limiting protrusion 250 can at least abut against the side wall of the limiting groove far from the heat conduction end 110.

[0187] Optionally, the limiting groove is provided on the side wall of the housing 200, and the limiting protrusion 250 fixed to the heat conduction part 100 is inserted into the limiting groove to realize the limitation of the heat conduction part 100 in the approaching or departing direction. Among them, the limiting groove can be set as a blind hole to reduce the heat loss in the housing 200.

[0188] Exemplarily, the limiting groove is set as a tapered blind hole. Correspondingly, the limiting protrusion 250 is set as a cone, and the two are matched through a conical surface to enable precise limitation.

[0189] Of course, a ring groove can also be provided in the housing 200 to form a limiting groove; the heat conducting part 100 is provided with a ring skirt to form a limiting protrusion 250, thereby increasing the contact area between the heat conducting part 100 and the limiting part and being able to withstand a greater reverse force.

[0190] On the basis of the above embodiments, a heat conducting partition is provided in the housing 200, and the heat conducting partition is used to divide the inner cavity of the housing 200 into two chambers, and the radiator 300 and the semiconductor refrigerator are respectively located in different chambers.

[0191] It is easy to understand that if the cooling medium of the radiator 300 is liquid, the housing 200 is separated by the heat conducting partition to respectively install the radiator 300 and the semiconductor refrigerator, so as to isolate the two and avoid short - circuit damage of the semiconductor refrigerator caused by water leakage of the radiator 300.

[0192] The radiator is connected with a liquid - cooled heat dissipation circulation shunt pipeline, and the liquid - cooled heat dissipation circulation shunt pipeline is composed of a coolant input pipeline and a coolant return pipeline. The main function of the liquid - cooled heat dissipation circulation shunt pipeline is to supply coolant for heat dissipation to 16 groups of chip test heads 4200. A large amount of heat energy is generated when the test heads 4200 are in operation state. By connecting with the coolant input pipeline and the coolant return pipeline, the external transfer of heat energy is realized. The 16 groups of test heads 4200 are arranged in 2 columns in the chip three - temperature tester. The coolant input pipeline and the coolant return pipeline adopt a main pipe divided into 2 sub - pipes, and then the sub - pipes are divided into 8 branch pipes. The main pipe and the sub - pipes are welded into a shape with a stainless - steel rectangular pipe. The sub - pipes and the chip three - temperature test heads 4200 are connected by PUA hoses and quick - change pipe joints. Quick - change pipe joints are arranged on the outside of the test cabinet 2000 for the coolant input pipeline and the coolant return pipeline to realize the connection with the pipelines of the production site or the laboratory.

[0193] As Figure 19 shown, on the basis of the above embodiments, a ring - shaped clamping groove 240 is provided in the housing 200, and the base of the heat exchanger has a ring - shaped flange 330, and the ring - shaped flange 330 is inserted into the ring - shaped clamping groove 240; wherein, an elastic sealing ring 400 is provided between at least one side of the opposite sides of the ring - shaped flange 330 and the corresponding side wall on the ring - shaped clamping groove 240.

[0194] The ring - shaped flange 330 can increase the contact area between the radiator 300 and the heat conducting part 100, improve the heat dissipation efficiency, and the ring - shaped flange 330 can be integrally provided with the radiator 300.

[0195] Exemplarily, a groove for installing the elastic sealing ring 400 is opened on the upper side wall of the ring - shaped clamping groove 240. The elastic sealing ring 400 is pre - installed in the groove, and then the ring - shaped flange 330 is inserted into the ring - shaped clamping groove 240, and the elastic sealing ring 400 is kept in contact with the ring - shaped flange 330, thereby realizing sealing.

[0196] Of course, it is not limited to this sealing method only, and sealant can also be used for sealing. The difference lies in that the method of using the elastic sealing ring 400 for sealing is convenient for disassembly and assembly.

[0197] As Figure 19 shown, on the basis of the above-mentioned embodiment, the housing 200 is at least formed by enclosing an outer shell 210, a positioning frame 220 and an end cover 230; wherein, the end cover 230 is provided with a process hole, the heat conduction end 110 passes through the process hole, and a concave area 231 is provided at one end of the end cover 230 in contact with the heat conduction part 100.

[0198] It can be understood that by setting the concave area 231, the contact area between the heat conduction part 100 and the end cover 230 can be reduced, so as to reduce the heat transferred from the heat conduction part 100 to the end cover 230. Of course, a number of protrusions can also be provided at one end of the heat conduction part 100 in contact with the end cover 230, which can also reduce the contact area between the two.

[0199] On the basis of the above-mentioned embodiment, an annular card slot 240 is formed between the outer shell 210 and the positioning frame 220; and / or, a limiting slot is formed between the positioning frame 220 and the cover plate.

[0200] By setting the housing 200 as a split type, it is convenient to install internal devices; in addition, by setting the annular card slot 240 between the outer shell 210 and the positioning frame 220, the heat exchanger can be pre-placed on the first annular sunk platform at the upper end of the positioning frame 220, and then the elastic sealing ring 400 can be installed in the groove on the second annular sunk platform at the lower end of the outer shell 210, and then by installing the outer shell 210 on the upper end of the positioning frame 220, an annular card slot 240 is formed between the first annular sunk platform and the second annular sunk platform, which is convenient for assembly.

[0201] In addition, the same principle as the annular card slot 240 can also be adopted to form a limiting slot between the lower end of the positioning frame 220 and the upper end of the cover plate, which is also beneficial to pre-processing and post-assembly. Of course, the annular card slot 240 and the limiting slot can also be formed in other ways, which are not specifically limited here.

[0202] On the basis of the above-mentioned embodiment, the temperature adjustment part 700 further includes a thermostat 6000, and the thermostat 6000 is electrically connected to the temperature detection part and the commutator respectively. The thermostat 6000 can send an instruction to the commutator according to the temperature signal sent by the temperature detection part to switch the transmission direction of the semiconductor refrigerator.

[0203] The thermostat 6000 is electrically connected to the temperature detection unit, and the thermostat 6000 is different from traditional temperature controllers. The thermostat 6000 is connected with a PID algorithm and a commutator to achieve high and low temperature control of one end of the TEC contact heat conduction part 100 by changing the transmission direction. That is to say, if the temperature of one end of the TEC contact heat conduction part 100 is too high, the current transmission direction is changed to cool one end of the TEC contact heat conduction part 100, thereby reducing the temperature; if the temperature of one end of the TEC contact heat conduction part 100 is too low, the current transmission direction is changed to heat one end of the TEC contact heat conduction part 100, thereby increasing the temperature. The indenter realizes the temperature control accuracy of the test indenter 4200 within ±1°C through the detection and control of the cooperation between the thermostat 6000 and the radiator 300.

[0204] As Figure 16 , Figure 17 and Figure 21 shown, on the basis of the above embodiment, the radiator 300 has a cooling channel for the cooling medium to flow through. The water inlet end 310 and the water outlet end 320 of the radiator 300 are respectively connected to the water inlet pipe and the water outlet pipe for transporting the cooling medium. The cooling medium can be a liquid, such as cooling water. A number of turbulence protrusions are provided in the cooling channel, and the number of turbulence protrusions are arranged at intervals along the extension direction of the cooling channel, so that a turbulent flow can be formed in the cooling channel, the flow rate can be reduced, so as to fully perform heat exchange, avoid the formation of a boundary layer on the inner wall of the cooling channel, and improve the heat dissipation efficiency.

[0205] As Figure 18 shown, on the basis of the above embodiment, a locking part 500 can be provided at the upper end of the housing 210 to facilitate connection with the first driving part 4300. The first driving part 4300 drives the test indenter 4200 to move to perform the pressing and releasing actions. Among them, the setting of the locking part 500 can facilitate later disassembly, installation and maintenance. Exemplarily, the locking part 500 can be a locking bolt or the like.

[0206] The chip three-temperature testing machine realizes the chip performance testing, chip quality testing or chip reliability testing of multiple chips at any working temperature between -55°C and +125°C through the built-in test indenter 4200, dry ion wind supply system, chip test circuit board and test base 3210.

[0207] The chip three-temperature testing machine is built with a communication network port and is connected to an external computer to achieve communication and interconnection. By operating the computer software, the firmware burning of the chip test circuit board, the real-time monitoring and retrieval of chip test data, and the temperature setting and monitoring of the test indenter 4200 can be realized.

[0208] During testing, when the chip contacts the test slot 4110 on the test circuit board, a fixed pressing force needs to be provided by the test head 4200 built in the chip three-temperature tester. The pressing force of the test head 4200 can be set in advance according to the pressing force requirements of chips with different specifications. When the chip test socket is worn or there is an installation height difference, resulting in a difference in the height position of the chip in the test slot 4110, the test head 4200 automatically adapts to the height deviation of the chip position while maintaining the set pressing force, ensuring that after the chip is pressed with the test slot 4110, the test signal of the chip test circuit board can pass through the test slot 4110 normally, and the power supply and each signal of the chip under test in the test slot 4110 can be conducted normally.

[0209] In a second aspect, in an embodiment, a test system is provided, and the test system includes a chip three-temperature tester.

[0210] Since the above chip three-temperature tester has the above technical effects, the test system including the chip three-temperature tester should have the same technical effects, which will not be elaborated here.

[0211] In all the examples shown and described here, any specific value should be construed as merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiments may have different values.

[0212] It should be noted that similar reference numerals and letters denote similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0213] The above-described embodiments merely represent several implementation manners of the present utility model. The description is relatively specific and detailed, but it should not be construed as a limitation to the scope of the present utility model. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model.

Claims

1. A chip three-temperature tester, characterized in that: The chip three-temperature tester comprises: A test module, wherein the test module has a plurality of test stations, wherein the test stations are used to place chips; wherein the test module is capable of testing the chips located at the test stations; and A preheating module, wherein the preheating module has a plurality of preheating stations, wherein the preheating stations are used to place chips; wherein the number of the preheating stations is greater than the number of the test stations; wherein the preheating module is capable of adjusting the temperature of the chips located at the preheating stations; and A transfer module is configured to be able to transfer chips so that the chips can at least be switched between the testing station and the preheating station.

2. The chip three-temperature tester according to claim 1, characterized in that: The chip three-temperature tester also includes: A test cabinet, wherein the test cabinet has a test cavity; wherein the test module, the preheating module and the transfer module are all installed in the test cavity; A humidity regulating module is connected to the test cabinet, and the humidity regulating module can regulate the humidity in the test chamber.

3. The chip three-temperature tester according to claim 2, characterized in that: The humidity adjustment module comprises: An air source is connected to the test cabinet, and the air source is configured to introduce dry ion wind into the test chamber and make the test chamber in a positive pressure state.

4. The chip three-temperature tester according to claim 3, characterized in that: The chip three-temperature tester also includes: A driving module is connected to the preheating module, and the driving module can drive the preheating module to move along a first set path so that the preheating module can enter and exit the test cavity.

5. The chip three-temperature tester according to claim 1, characterized in that: The test module comprises: A test carrier, the test carrier having a plurality of test slots, the test slots being equipped with probe assemblies, the probe assemblies being able to contact and conduct with test contacts of the chip located in the test slots; A test pressure head and a first driving member, wherein the first driving member is connected to the test pressure head, and the first driving member can drive the test pressure head to move along a second set path so that the test pressure head abuts against or disengages from the chip located in the test slot.

6. The chip three-temperature tester according to claim 5, characterized in that: The preheating module comprises: A preheating carrier, wherein the preheating carrier has a plurality of preheating slots, and the preheating slots can accommodate the chips; A temperature regulating member, the temperature regulating member being connected to the preheating carrier, the temperature regulating member being configured to be switchable at least between a heating state and a cooling state; The preheating carrier is configured to enable heat transfer between the chip in the preheating tank and the temperature adjustment member.

7. The chip three-temperature tester according to claim 6, characterized in that: The test vehicle comprises: A first carrier body, wherein the first carrier body is formed with a plurality of the test slots; a first detection sensor, wherein the first detection sensor is capable of detecting a posture of the chip located in the test slot; A first controller, wherein the first detection sensor is electrically connected to the test module through the first controller; And / or, the preheating carrier comprises: A second carrier body, wherein the second carrier body is formed with a plurality of the preheating grooves; a second detection sensor, wherein the second detection sensor is capable of detecting whether the chip is in the preheating tank; A second controller, the second detection sensor is electrically connected to the transfer module through the second controller.

8. The chip three-temperature tester according to claim 6, characterized in that: The transfer module comprises: A negative pressure suction part, wherein the negative pressure suction part can suck the chip under negative pressure; A second driving member, the second driving member is connected to the negative pressure suction part, and the second driving member can drive the negative pressure suction part to move; The moving range of the negative pressure suction portion is configured to cover the testing station and the preheating station.

9. The chip three-temperature tester according to claim 8, characterized in that: The negative pressure suction part comprises: a base, the base being connected to the second driving member; A plurality of vacuum nozzles, wherein the plurality of vacuum nozzles are mounted on the base; Among them, the plurality of preheating slots form a plurality of first array groups, and the plurality of first arrays are arranged in sequence along the first path at set intervals; the plurality of test slots form a plurality of second array groups, and the plurality of second array groups are arranged along the second path at the set intervals; the plurality of vacuum nozzles form a plurality of third array groups, and the plurality of third array groups are arranged along the third path at the set intervals; the first path, the second path and the third path can overlap, the array parameters of the first array group, the second array group and the third array group are the same, and the number of the first array group is twice the number of the second array group; the number of the second array group is M times the number of the third array group, M is a natural number, and M≥1.

10. The chip three-temperature tester according to claim 5, characterized in that: The test pressure head comprises: A pressure head body, the pressure head body having a heat-conducting end, the heat-conducting end is used to abut against the packaging surface of the chip, and the heat-conducting end has a receiving cavity; and A temperature detection part is installed in the accommodating cavity, and the temperature detection part has a detection end, and the detection end can abut against the packaging surface.

11. The chip three-temperature tester according to claim 10, characterized in that: The pressure head body also has a threading hole connected to the accommodating cavity; the temperature detection part includes a temperature sensor, and the cable of the temperature sensor is passed through the threading hole; wherein the threading hole is connected to the outside of the pressure head body; And / or, a hole structure is provided at an end of one end of the heat-conducting end for abutting against the packaging surface, and the hole structure is communicated with the outside of the pressure head body.

12. The chip three-temperature tester according to claim 10, characterized in that: The test pressure head further includes an elastic portion, and the temperature detection portion is connected to the inner wall of the accommodating cavity through the elastic portion; wherein the elastic portion is configured to be elastically deformable so that the detection end remains in contact with the packaging surface.

13. The chip three-temperature tester according to claim 10, characterized in that: The pressure head body comprises: a housing formed with a heat-insulating layer; and a heat conducting portion, the heat conducting portion being installed in the housing and having an extended end extending out of the housing, the extended end forming the heat conducting end; and A temperature regulating part is installed in the shell and can regulate the temperature of the heat conducting end.

14. The chip three-temperature tester according to claim 13, characterized in that: The temperature regulating unit comprises: A semiconductor refrigerator and a heat sink, wherein the semiconductor refrigerator has two working ends, wherein one of the working ends abuts against the heat conducting portion, and the other working end is connected to the heat sink; A power conversion unit is electrically connected to the semiconductor cooler, and the power conversion unit is configured to at least adjust the transmission direction of the current connected to the semiconductor cooler.

15. The chip three-temperature tester according to claim 14, characterized in that: The power conversion unit includes: a DC power supply for providing a DC current; and A commutator, wherein the DC power supply is electrically connected to the semiconductor refrigerator via the commutator; and A thermostat is electrically connected to the temperature detection unit and the commutator respectively, and the thermostat can send instructions to the commutator according to the temperature signal sent by the temperature detection unit to switch the transmission direction of the semiconductor refrigerator.

16. The chip three-temperature tester according to claim 14, characterized in that: When the cooling medium of the radiator is liquid, a heat-conducting partition is provided in the shell, and the heat-conducting partition is used to divide the inner cavity of the shell into two chambers. The radiator and the semiconductor refrigerator are respectively located in different chambers.

17. The chip three-temperature tester according to claim 16, characterized in that: An annular groove is provided in the shell, and the base of the radiator has an annular flange, which is inserted into the annular groove; wherein, an elastic sealing ring is provided between at least one of the two opposite sides of the annular flange and the corresponding side wall of the annular groove, and the elastic sealing ring, the annular flange and the annular groove form the heat-conducting partition part.

18. A testing system, characterized in that: The test system comprises a chip three-temperature tester as claimed in any one of claims 1 to 17.

Images